JPH0231840Y2 - - Google Patents

Description

[Detailed Description of the Invention] Technical Field The present invention is directed to bending the lead wires of an electronic component having a structure in which the lead wires extend radially from the electronic component body, such as a so-called disk mold type field effect transistor. An object of the present invention is to provide a mounting tool for electronic components that can be mounted on a printed wiring board or the like.

BACKGROUND ART In the assembly process of electronic equipment, an electronic component 1 such as a disk mold type field effect transistor is attached to a mount 2 as shown in FIG. Part 1
Pinch the main body 3 with fingers 5 and remove it from the mount 2.
Next, as shown in Fig. 8(2), the lead wire 4
Fold and shape with fingers 5. Therefore, the lead wire 4 is inserted into the mounting hole of the printed wiring board 6 as shown in FIG. 8(3). In this way, the lead wire 4 is soldered to the printed wiring board 6, and the transistor 1 is mounted.

Problems to be Solved by the Invention In this prior art, since the main body 3 of the transistor 1 is flat, it is difficult to pinch the main body 3 with the fingers 5 and pull it away from the mount 2, as shown in FIG. 8(1). Have difficulty. Furthermore, since the lead wires 4 are bent and molded with fingers 5 as shown in FIG. 8(2), the mutual spacing of the plurality of lead wires 4 varies,
As shown in (3), it becomes difficult to attach the transistor 1 to the printed wiring board 6. The main body 3 of such a transistor 1 is flat and small as described above, so that it is difficult to grasp it with the fingers 5, resulting in poor workability.

An object of the present invention is to provide an electronic component mounting tool that can easily bend the lead wires of small electronic components and mount them on a printed wiring board or the like.

Means for Solving the Problems The present invention has a gripping part that grips an electronic component,
a chuck having a spring force that causes its grip to expand; a sleeve into which the chuck is inserted; a first spring which biases the chuck into the sleeve; a first spring which biases the chuck into the sleeve; a second spring that biases the sleeve to exert a spring force greater than the spring force of the first spring; a pressing operation means that presses the chuck against the first spring force; The main body has a processing cylinder through which the gripping portion and the sleeve are inserted, and a main body that limits the amount by which the sleeve is displaced toward the gripping portion of the chuck, and further includes a receiver for receiving the electronic component gripped by the gripping portion of the chuck. This is an electronic component mounting tool characterized by comprising a processing table having a receiving part and an outer diameter of the receiving part smaller than the inner diameter of the processing cylinder.

Operation By pressing the chuck against the spring force of the first spring by the pressing operation means, the gripping portion of the chuck is expanded, and in this state it is possible to grip the electronic component. Therefore, the electronic component in the gripped state is placed on the receiving part of the processing table, and the main body is pushed down toward the receiving part against the spring force of the second spring. As a result, the lead wires extending radially from the electronic component are bent by the inner circumferential surface of the processing cylinder.

Embodiment FIG. 1 is a sectional view of an embodiment of the present invention.
The main body 11 has a generally cylindrical shape, and its outer periphery is coated with a covering 12 made of a material such as synthetic resin, making it easy to hold by hand. Main body 1
1, a chuck 13 is inserted through it. The chuck 13 consists of a grip part 14 and a base end part 15.

The tip of the grip 14 is shown in FIG.
The grip portion 14 includes four grip pieces 16 and a support piece 17 extending from the grip pieces 16 to the base end 15. The grip piece 16 is cut into four parts in the circumferential direction by notches 18, and the support piece 17 exerts a spring force that causes the grip pieces 16 to separate from each other and the grip part 14 to expand. . In the gripping piece 16, a recess 19 opened downward in FIG. 1 has a bottom 20,
It is defined by the peripheral wall 21. The base end portion 15 is
It is press-fitted and fixed into the mounting hole 23 of the drive rod 22. The chuck 13 and the drive rod 22 are coaxial, and are also coaxial with the main body 11.

On the outer periphery of the gripping piece 16, an inclined surface 24 whose diameter becomes larger downward in FIG. 1 is formed. A cylindrical spring receiving member 26 is provided in the insertion hole 25 of the main body 11.
is inserted. A screw hole 27 facing the insertion hole 25 is formed in the main body 11, and a bolt 28 is screwed into the screw hole 27. By tightening the bolt 28, the spring receiving member 26 is pressed radially inward. As a result, the spring receiving member 26 is fixed within the insertion hole 25 so that its vertical position can be adjusted.

A pressing piece 29 is fixed to the end of the drive rod 22. The first spring 31 surrounds the drive rod 22 and connects the end 30 of the spring receiving member 26 and the end surface 32 of the pressing piece 29.
1, thereby urging the chuck 13 in a direction opposite to that of the gripping portion 14 (upward in FIG. 1). The chuck 13 is inserted into the sleeve 33. This sleeve 33 is inserted into a guide hole 34 formed in the main body 11. A flange 35 is formed on the sleeve 33, and this flange 35 is located within the insertion hole 25. A second spring 3 is disposed between the other end surface 36 of the spring receiving member 30 and the flange 35.
7 is intervened. This second spring 37 urges the sleeve 33 toward the gripping portion 14 of the chuck 13 (downward in FIG. 1). This second spring 37 exerts a spring force greater than the spring force of the first spring 31. The flange 35 of the sleeve 33 has an insertion hole 25 in the main body 11 and a guide hole 34 having a smaller diameter than the insertion hole 25.
In this abutting state, the amount by which the sleeve 33 is displaced toward the gripping portion 14 of the chuck 13 is limited.

The main body 11 has a processing cylinder 40 on the gripping portion 14 side of the chuck 13. The inner circumferential surface 41 of the tip of the processing cylinder 40 is axially inward (the first
It has a conical shape with a smaller diameter at the top of the figure.
The inner diameter d1 of the guide tube 34 formed from the main body 11 to the processing tube 40 is determined by the gripping piece 16 of the gripping portion 14 of the chuck 13, which is the mold of the disc mold type field effect transistor 1 shown in FIG. While holding the main body 3,
The lead wire 4 has a value that allows the lead wire 4 to bend and enter the guide hole 34 as shown in FIG.

FIG. 5 is a perspective view of the processing table 42. The processing table 42 includes a pedestal 43 and a processing member 44 fixed upright to the pedestal 43. The processing member 44 has an upwardly open and recessed receiving portion 45 in which the main body 3 of the transistor 1 is partially received. Outer diameter d2 of the peripheral wall 46 of the receiving part 45 (see Fig. 1)
is the inner diameter of the guide hole 34 formed in the main body 11
It is formed smaller than d1.

A so-called natural state in which the operator does not apply force to the pressing piece 29 with his or her fingers is shown in FIG. The flange 35 of the sleeve 33 is attached to the shoulder 39 of the main body 11.
They are brought into contact by the spring force of the spring 37. The first spring 31 urges the drive rod 22 upward in FIG.
It is in a state where it is in contact with the inner circumferential surface 47 of the tip end of No. 3.

Therefore, as shown in FIG. 6(1), the operator grasps the cover 12 of the main body 11 with the hand 49 and presses the pressing piece 29 with the finger 50 against the spring force of the first spring 31. The state shown in Figure 7 (1) is obtained. As a result, the chuck 13 is displaced downward, and the gripping piece 16 projects from the sleeve 33. The gripping pieces 16 are separated from each other by the elastic force of the support piece 17, and the gripping portion 14 is expanded. Peripheral wall 2 of gripping piece 16 in expanded state
The inner diameter d3 of transistor 1 is the outer diameter of main body 3 of transistor 1.
It is larger than d5 (see Figure 3) (d3>d5).

The gripping piece 16 grips the main body 3 of the transistor 1 attached to the mount 2, and by releasing the pressing force of the pressing piece 29 by the finger 50, the gripping piece 16 grips the main body 3 of the transistor 1. . While holding the main body 3 of the transistor 1 with the gripping piece 16, the main body 11 of the transistor 1 is separated from the mount 2 in the direction of the arrow 51 as shown in FIG. 6(2), thereby removing the transistor 1. It can be peeled off from the mount 2.

Therefore, as shown in FIG. 6(3), a part of the main body 3 of the transistor 1 is placed on the receiving portion 45 of the processing table 42. This state is shown in FIG. 7(2).

Next, as shown in FIG. 6(4), while holding the main body 11 with the hand 49, push it down toward the processing table 42 as shown by the arrow 52 against the spring force of the second spring 37. At this time, as shown in FIG. 7(3), the lead wire 4 of the transistor 1 on the receiving part 45 of the processing table 44 is
is bent by the inner peripheral surface of the processing cylinder 40.

Thereafter, by releasing the pressing force in the direction of the arrow 52 by the hand 49, the gripping piece 16 is moved as shown in FIG.
As shown in (4), the main body 3 of the transistor 1 is held. In this state, as shown in FIG. 6(5), the transistor 1 is placed on the printed wiring board 6, and the lead wire 4 is inserted into the mounting hole formed in the printed wiring board 6.

Finally, as shown in FIG. 6(6), the pressing piece 29
By pressing with the finger 50, the gripping portion 14 of the chuck 13 protrudes significantly downward, and the state of gripping the main body 3 of the transistor 1 by the gripping piece 16 is released. In this way, the transistor 1 is attached to the printed wiring board 6. The lead wire 4 is soldered to the printed wiring board 6, and the mounting of the transistor 1 on the printed wiring board 6 is completed.

The present invention can be widely implemented to make leads not only for disk mold type field effect transistors but also for other electronic components.

Effects As described above, according to the present invention, it is possible to easily handle small electronic components, and the lead wires can be bent accurately, improving work efficiency and improving the performance of electronic devices. Assembling work can be done more efficiently.

In addition, according to the present invention, the sleeve ensures that the chuck grips and releases the component, and also smoothes the movement when forming the lead.
Furthermore, since the spring forces of the first and second springs are well set, smoother work can be achieved.

Furthermore, according to the present invention, since the component is sandwiched, it is possible to hold even a component fixed to tape or the like, and the lead is configured to form before mounting the component on the board. Therefore, there is no possibility of cracking of the board.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of an embodiment of the present invention, FIG. 2 is a perspective view of the vicinity of the grip portion 14, FIG. Figure 4 is a perspective view showing the state in which the lead wire 4 of the transistor 1 is bent by the mounting tool, and Figure 5 is a perspective view of the processing table 42.
, FIG. 6 is a perspective view showing the procedure for attaching the transistor 1 to the printed wiring board 6, FIG. 7 is a sectional view showing the procedure according to the above-described embodiment, and FIG. 8 shows the prior art. It is a diagram. DESCRIPTION OF SYMBOLS 11...Main body, 12...Coating, 13...Chuck, 14...Gripping portion, 15...Proximal end, 18...
... Notch, 22 ... Drive rod, 26 ... Spring receiving member, 29 ... Pressing piece, 31 ... First spring, 33
... Sleeve, 35 ... Flange part, 37 ... Second spring, 39 ... Shoulder part, 42 ... Processing table, 45 ...
...Ukebu.

Claims (1)

[Scope of Claim for Utility Model Registration] A chuck having a gripping part for gripping an electronic component and having a spring force that causes the gripping part to expand; a sleeve through which the chuck is inserted; and a chuck through which the chuck is inserted into the sleeve. a first spring biasing the chuck into the sleeve; a second spring biasing the sleeve such that the chuck is inserted into the sleeve and exerting a spring force greater than the spring force of the first spring; a pressing operation means for pressing against the first spring force; and a main body having a processing tube through which the gripping portion of the chuck and the sleeve are inserted, and limiting the amount by which the sleeve is displaced toward the gripping portion of the chuck. and a processing table, further comprising a receiving part for receiving the electronic component gripped by the gripping part of the chuck, and the outer diameter of the receiving part is smaller than the inner diameter of the processing cylinder. mounting tools.