JPH0231197U - - Google Patents
Info
- Publication number
- JPH0231197U JPH0231197U JP10911788U JP10911788U JPH0231197U JP H0231197 U JPH0231197 U JP H0231197U JP 10911788 U JP10911788 U JP 10911788U JP 10911788 U JP10911788 U JP 10911788U JP H0231197 U JPH0231197 U JP H0231197U
- Authority
- JP
- Japan
- Prior art keywords
- electromagnetic shielding
- metal layer
- layer made
- base material
- copper wires
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 229920001169 thermoplastic Polymers 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Description
第１図は本考案による電磁波シールド材の一例
を示す斜視図、第２図はその断面図、第３図は本
考案による電磁波シールド材の他の例を示す斜視
図である。
符号の説明、Ｓ，Ｓ′…電磁波シールド材、１
…金属層、２…シート（基材）、３…接着剤、４
…シート（熱可塑性プラスチツクから成る基材）
。
FIG. 1 is a perspective view showing an example of the electromagnetic shielding material according to the present invention, FIG. 2 is a sectional view thereof, and FIG. 3 is a perspective view showing another example of the electromagnetic shielding material according to the present invention. Explanation of symbols, S, S'...electromagnetic shielding material, 1
...Metal layer, 2... Sheet (base material), 3... Adhesive, 4
...Sheet (base material made of thermoplastic plastic)
.
Claims (1)
寄せ集めて成る金属層が、互いに対面して重着さ
れる少なくとも二枚の基材間に挟まれて定着され
ていることを特徴とする電磁波シールド材。 (2) 適当長さに切断された無数の極細伸銅線を
寄せ集めて成る金属層が、熱可塑性プラスチツク
から成る基材が加熱により軟化している時に、当
該基材に圧着して定着されていることを特徴とす
る電磁波シールド材。[Claims for Utility Model Registration] (1) A metal layer made up of countless ultra-fine copper wires cut to appropriate lengths is sandwiched between at least two substrates that are stacked facing each other. An electromagnetic shielding material that is characterized by being fixed in place. (2) A metal layer made of countless ultra-fine copper wires cut to appropriate lengths is pressed and fixed onto a thermoplastic plastic base material while the base material is softened by heating. An electromagnetic shielding material characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10911788U JPH0231197U (en) | 1988-08-22 | 1988-08-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10911788U JPH0231197U (en) | 1988-08-22 | 1988-08-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0231197U true JPH0231197U (en) | 1990-02-27 |
Family
ID=31345072
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10911788U Pending JPH0231197U (en) | 1988-08-22 | 1988-08-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0231197U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127199A (en) * | 1984-11-26 | 1986-06-14 | 日本精線株式会社 | Conductive composite body and manufacture thereof |
-
1988
- 1988-08-22 JP JP10911788U patent/JPH0231197U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127199A (en) * | 1984-11-26 | 1986-06-14 | 日本精線株式会社 | Conductive composite body and manufacture thereof |
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