JPH0231168U - - Google Patents
Info
- Publication number
- JPH0231168U JPH0231168U JP11020788U JP11020788U JPH0231168U JP H0231168 U JPH0231168 U JP H0231168U JP 11020788 U JP11020788 U JP 11020788U JP 11020788 U JP11020788 U JP 11020788U JP H0231168 U JPH0231168 U JP H0231168U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- dielectric
- upper layer
- lower layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims 3
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11020788U JPH0231168U (zh) | 1988-08-23 | 1988-08-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11020788U JPH0231168U (zh) | 1988-08-23 | 1988-08-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0231168U true JPH0231168U (zh) | 1990-02-27 |
Family
ID=31347155
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11020788U Pending JPH0231168U (zh) | 1988-08-23 | 1988-08-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0231168U (zh) |
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1988
- 1988-08-23 JP JP11020788U patent/JPH0231168U/ja active Pending