JPH0230475Y2 - - Google Patents
Info
- Publication number
- JPH0230475Y2 JPH0230475Y2 JP1985196184U JP19618485U JPH0230475Y2 JP H0230475 Y2 JPH0230475 Y2 JP H0230475Y2 JP 1985196184 U JP1985196184 U JP 1985196184U JP 19618485 U JP19618485 U JP 19618485U JP H0230475 Y2 JPH0230475 Y2 JP H0230475Y2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- parts
- resistant
- synthetic resin
- nonwoven fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 239000004745 nonwoven fabric Substances 0.000 claims description 10
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 239000011230 binding agent Substances 0.000 claims description 5
- 239000010445 mica Substances 0.000 claims description 5
- 229910052618 mica group Inorganic materials 0.000 claims description 5
- 239000000835 fiber Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 239000012209 synthetic fiber Substances 0.000 claims description 4
- 229920002994 synthetic fiber Polymers 0.000 claims description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000004760 aramid Substances 0.000 claims description 3
- 229920003235 aromatic polyamide Polymers 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 239000003779 heat-resistant material Substances 0.000 claims description 2
- 229920006149 polyester-amide block copolymer Polymers 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000002759 woven fabric Substances 0.000 description 2
- 241000872198 Serjania polyphylla Species 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- -1 acrylic ester Chemical class 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Landscapes
- Nonwoven Fabrics (AREA)
Description
【考案の詳細な説明】
産業上の利用分野
本考案は耐熱性を有する半導電性不織布特に電
力ケーブルの外部半導電層に用いる耐熱半導電性
不織布の構成に関するものである。[Detailed Description of the Invention] Industrial Application Field The present invention relates to a structure of a heat-resistant semiconductive nonwoven fabric, particularly for use in an external semiconductive layer of a power cable.
従来の技術およびその問題点
電力ケーブルの外部半導電層は、絶縁層と遮蔽
層との間に生じる空隙の為に発生するコロナ放電
防止の為に形成されているが、従来、この外部半
導電層を構成する材料としては、織布に半導電性
ゴムを塗布したテープ、塩化ビニル、ゴム等の樹
脂に導電性カーボンを混合した半導電性材料が使
用されているが、織布にコーテイングされたテー
プでは絶縁層との密着性が悪く、空隙が生じ易
い。従つてコロナ放電を完全には防ぐことが出来
ない欠点がある。又、半導電性樹脂は絶縁体との
密着性が良く、現在この方法により大半が製造さ
れているが、外部にランピングされる金属テープ
との密着性に劣り、上記問題の発生する要因とな
つていた。従つて半導電樹脂層と金属テープ間に
更に織布コーテイングされたテープがラツピング
されているが金属テープとの密着性に問題が生じ
易いという欠点がある。更に前記問題点を改良す
るため可撓性、クツシヨン性に富む嵩高な不織布
製半導電性テープも開発されているが、嵩高であ
る為、従来問題にされなかつた蓄熱による影響を
受け易く、構成樹脂の軟化により、カーボンブラ
ツク、金属粉等が凝集移行し、安定した電気的特
性を維持出来ないという欠点がある。その為、最
終的には劣化し、半導電層としての機能を停止し
てしまう等の問題点があつた。Conventional technology and its problems The outer semiconducting layer of a power cable is formed to prevent corona discharge that occurs due to the gap between the insulating layer and the shielding layer. The materials used to make up the layers include tape made of woven fabric coated with semiconductive rubber, and semiconductive materials made by mixing conductive carbon with resins such as vinyl chloride and rubber. The tape has poor adhesion to the insulating layer and tends to form voids. Therefore, there is a drawback that corona discharge cannot be completely prevented. In addition, semiconductive resin has good adhesion to insulators, and most of it is currently manufactured using this method, but it has poor adhesion to externally ramped metal tapes, which is a factor in the occurrence of the above problems. was. Therefore, although a tape coated with a woven fabric is wrapped between the semiconductive resin layer and the metal tape, there is a drawback that problems tend to occur in adhesion to the metal tape. Furthermore, to improve the above-mentioned problems, bulky non-woven semiconductive tapes with excellent flexibility and cushioning properties have been developed, but because of their bulk, they are easily affected by heat accumulation, which has not been a problem in the past, Due to the softening of the resin, carbon black, metal powder, etc. aggregate and transfer, making it impossible to maintain stable electrical characteristics. Therefore, there were problems such as the layer eventually deteriorating and ceasing to function as a semiconducting layer.
問題点を解決する為の手段
本考案は上記問題点を解消する為、ポリエステ
ル、芳香族ポリアミド等の200℃以上の耐熱性を
有する方向性の合成繊維ウエブ基材とアクリル、
SBR等の合成樹脂にシリカ、マイカ等耐熱性無
機物質を混合した200℃でも軟化を抑制できる合
成樹脂との組み合せ使用構成することにより、
150℃の温度雰囲気中でも安定した電気特性を発
揮させることにより解決したものである。Means to Solve the Problems In order to solve the above problems, the present invention uses a directional synthetic fiber web base material such as polyester or aromatic polyamide that has a heat resistance of 200°C or more, and acrylic.
By combining synthetic resin such as SBR with heat-resistant inorganic substances such as silica and mica that can suppress softening even at 200℃,
This solution was achieved by exhibiting stable electrical characteristics even in an atmosphere with a temperature of 150°C.
本考案の構成に用いる不織布はその欠点である
引張強度の低い事を補う為、縦横の強度比が1.0
以上であることが必要であり、1.0以下になると
ラツピングに耐える強度は有していても横伸びが
発生し易く、均一な電気的特性を維持出来ないと
いう問題点が発生するので好ましくなく、又導電
性を付与するカーボンブラツク、金属粉等は特に
限定されるものではないが、好ましくは比表面積
800〜1000m2／ｇ、吸油量300〜400ml／100ｇ、粒
子径30mμのケツチエンブラツクが樹脂に対する
添加量が少なくして電気的特性の良好なものが得
られる。 The nonwoven fabric used in the construction of this invention has a vertical and horizontal strength ratio of 1.0 to compensate for its shortcoming of low tensile strength.
If it is less than 1.0, lateral elongation is likely to occur even if it has the strength to withstand wrapping, and uniform electrical characteristics cannot be maintained, so it is not preferable. Carbon black, metal powder, etc. that impart conductivity are not particularly limited, but preferably have a specific surface area.
Ketchen black with an area of 800 to 1000 m 2 /g, an oil absorption of 300 to 400 ml/100 g, and a particle size of 30 mμ can be added in a small amount to the resin, resulting in good electrical properties.
また、本考案に用いる合成樹脂は可撓性、クツ
シヨン性にすぐれたアクリル、SBR等の合成樹
脂エマルジヨンを用い、欠点とされる耐熱性をシ
リカ、マイカ等を混合させることにより皮膜硬度
を大巾に上昇させることなく耐熱性を上げること
が出来る有利性を見出したものである。シリカ、
マイカの添加量は10〜50部、好ましくは20〜40部
が適当である。 In addition, the synthetic resin used in this invention is a synthetic resin emulsion such as acrylic or SBR that has excellent flexibility and cushioning properties, and the film hardness can be greatly improved by mixing silica, mica, etc. to overcome the heat resistance, which is considered a drawback. We have discovered the advantage of being able to increase heat resistance without increasing heat resistance. silica,
The appropriate amount of mica added is 10 to 50 parts, preferably 20 to 40 parts.
以下本考案の１実施例を図面に基いて説明す
る。 An embodiment of the present invention will be described below with reference to the drawings.
実施例
図面は本考案の１実施例を示す正面図であり、
ポリエステル繊維、芳香族ポリアミド等の耐熱性
を有する合成繊維１例えばポリエステル繊維0.5
デニール×38mmカツト100％で形成した目付30
ｇ／m2のパラレルウエブ２である。該ウエブに合
成樹脂結合剤として例えばアクリル酸エステル樹
脂100部に対し、導電性物質としてケツチエンブ
ラツク50部、耐熱性物質としてシリカ30部を混合
した濃度30％の調合液を付着量30ｇ／m2、（D.P.
U＝100％）となる様に含浸付着させることによ
りウエブの繊維間相互を導電性、耐熱性物質３を
含む合成樹脂結合剤４で結合したパラレル不織布
を形成し乾燥後加熱加圧して、目付60ｇ／m2、厚
さ300μ（ラツピング時150μ）の嵩高な耐熱半導電
性不織布を構成した。Embodiment The drawing is a front view showing one embodiment of the present invention.
Synthetic fibers with heat resistance such as polyester fibers and aromatic polyamides 1 For example, polyester fibers 0.5
Fabric weight 30 made of 100% denier x 38mm cut
g/m 2 parallel web 2 . A 30% concentration mixture of 100 parts of acrylic ester resin as a synthetic resin binder, 50 parts of Ketsuen Black as a conductive material, and 30 parts of silica as a heat-resistant material is deposited on the web in an amount of 30 g/m2. 2 , (DP
By impregnating and adhering the web so that U=100%), a parallel nonwoven fabric is formed in which the fibers of the web are bonded with a synthetic resin binder 4 containing a conductive and heat resistant substance 3. After drying, the fabric is heated and pressurized. A bulky heat-resistant semiconductive nonwoven fabric with a weight of 60 g/m 2 and a thickness of 300 μm (150 μm when wrapped) was constructed.
この様にして得られた耐熱半導電性不織布は表
面抵抗率（JIS−Ｋ−6911）4.0×104Ωであり、
常温と110℃のサイクルテストに於ても常に104Ω
の値を示した。 The heat-resistant semiconductive nonwoven fabric thus obtained has a surface resistivity (JIS-K-6911) of 4.0×10 4 Ω,
Always 10 4 Ω even in cycle tests at room temperature and 110℃
The value of
耐熱性は比較例としてシリカを混入しない半導
電性不織布と比較の結果、200℃の雰囲気中で、
100ｇ／cm巾荷重下での伸び率は本考案は５％以
下であつたが比較例とした半導電性不織布は完全
に伸び切つてしまい、耐熱性に劣ることがわかつ
た。 The heat resistance was compared with a semiconductive nonwoven fabric that did not contain silica as a comparative example, and the results showed that in an atmosphere of 200℃,
The elongation rate of the present invention under a load of 100 g/cm width was 5% or less, but the semiconductive nonwoven fabric used as a comparative example was completely elongated, indicating that it was inferior in heat resistance.
考案の効果
本考案は上記の如くシリカ、マイカ等の耐熱性
物質を結合剤として用いる合成樹脂エマルジヨン
に混合もしくはグラフト重合させることにより、
皮膜硬度を大きく高めることなく大巾に耐熱性を
向上させることが可能となつた。従つて150℃の
雰囲気中に於ても不織布構成結合樹脂が軟化する
ことなく安定している為、半導電性を付与する為
に添加したカーボン、金属粉等の凝集を防止し安
定した電気特性（表面抵抗率）が得られるなどの
実用効果を有する考案である。Effects of the invention As mentioned above, the present invention combines or graft-polymerizes heat-resistant substances such as silica and mica into a synthetic resin emulsion using as a binder.
It has become possible to significantly improve heat resistance without significantly increasing film hardness. Therefore, even in an atmosphere of 150℃, the binding resin that makes up the nonwoven fabric remains stable without softening, which prevents the agglomeration of carbon, metal powder, etc. added to impart semiconductivity, resulting in stable electrical properties. This is a device that has practical effects such as the ability to obtain (surface resistivity).
図面は本考案の１実施例である耐熱半導電不織
布の拡大構成正面図である。
１……合成繊維、２……パラレルウエツブ、３
……導電性、耐熱性物質、４……合成樹脂結合
剤。
The drawing is an enlarged front view of a heat-resistant semiconductive nonwoven fabric according to an embodiment of the present invention. 1...Synthetic fiber, 2 ...Parallel web, 3
...Electroconductive, heat-resistant substance, 4...Synthetic resin binder.
Claims (1)
芳香族ポリアミド繊維で形成する方向性を有する
合成繊維ウエブ基材に、アクリル又はSBR合成
樹脂100部に対し、導電物質としてカーボンブラ
ツク、金属粉を30〜200部、耐熱性物質としてシ
リカ又はマイカを10〜50部混合してなる合成樹脂
結合剤を含浸固着させてなる縦／横の強度比が
1.0以上の耐熱半導電性不織布。 Add 30 to 200 parts of carbon black or metal powder as a conductive material to 100 parts of acrylic or SBR synthetic resin on a directional synthetic fiber web base material made of polyester or aromatic polyamide fibers that have heat resistance of 200°C or more. The vertical/horizontal strength ratio is made by impregnating and fixing a synthetic resin binder made by mixing 10 to 50 parts of silica or mica as a heat-resistant material.
Heat-resistant semiconductive nonwoven fabric with a rating of 1.0 or higher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985196184U JPH0230475Y2 (en) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985196184U JPH0230475Y2 (en) | 1985-12-19 | 1985-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62106987U JPS62106987U (en) | 1987-07-08 |
| JPH0230475Y2 true JPH0230475Y2 (en) | 1990-08-16 |
Family
ID=31154771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985196184U Expired JPH0230475Y2 (en) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0230475Y2 (en) |
-
1985
- 1985-12-19 JP JP1985196184U patent/JPH0230475Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62106987U (en) | 1987-07-08 |
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