JPH02301116A - Solid electrolytic capacitor - Google Patents
Solid electrolytic capacitorInfo
- Publication number
- JPH02301116A JPH02301116A JP12240289A JP12240289A JPH02301116A JP H02301116 A JPH02301116 A JP H02301116A JP 12240289 A JP12240289 A JP 12240289A JP 12240289 A JP12240289 A JP 12240289A JP H02301116 A JPH02301116 A JP H02301116A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- metal
- cap
- solder
- welded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 27
- 239000007787 solid Substances 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 43
- 239000002184 metal Substances 0.000 claims abstract description 43
- 229910000679 solder Inorganic materials 0.000 abstract description 21
- 238000007789 sealing Methods 0.000 abstract description 11
- 238000003466 welding Methods 0.000 abstract description 6
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- POIUWJQBRNEFGX-XAMSXPGMSA-N cathelicidin Chemical compound C([C@@H](C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CO)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H]([C@@H](C)CC)C(=O)NCC(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](C(C)C)C(=O)N[C@@H](CCC(N)=O)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)CC)C(=O)N[C@@H](CCCCN)C(=O)N[C@@H](CC(O)=O)C(=O)N[C@@H](CC=1C=CC=CC=1)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H](CC(N)=O)C(=O)N[C@@H](CC(C)C)C(=O)N[C@@H](C(C)C)C(=O)N1[C@@H](CCC1)C(=O)N[C@@H](CCCNC(N)=N)C(=O)N[C@@H]([C@@H](C)O)C(=O)N[C@@H](CCC(O)=O)C(=O)N[C@@H](CO)C(O)=O)NC(=O)[C@H](CC=1C=CC=CC=1)NC(=O)[C@H](CC(O)=O)NC(=O)CNC(=O)[C@H](CC(C)C)NC(=O)[C@@H](N)CC(C)C)C1=CC=CC=C1 POIUWJQBRNEFGX-XAMSXPGMSA-N 0.000 abstract description 4
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052799 carbon Inorganic materials 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 229910052715 tantalum Inorganic materials 0.000 abstract description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 2
- -1 etc. Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 4
- 238000007689 inspection Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体電解コンデンサに関し、特にコンデンサ素
子を金属ケースに収容し、ハーメチックシールで密閉す
る固体電解コンデンサに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a solid electrolytic capacitor, and particularly to a solid electrolytic capacitor in which a capacitor element is housed in a metal case and sealed with a hermetic seal.
従来、この種の金属ケース入り固体電解コンデンサは、
第４図に示すように外部陰極リード４１が溶接された金
属ケース４２内に気密端子４３のパイプ穴４４を通して
外部陽極リード４５に接続されたコンデンサ素子１１を
半田４６で固着し、金属ケース４２と気密端子外周部を
半田４７でシールしたのち、外部陰極リード４５と該リ
ード線を挿通したパイプ４４間を半田封口することによ
って金属ケース入り固体電解コンデンサを得ていた。Conventionally, this type of solid electrolytic capacitor in a metal case is
As shown in FIG. 4, the capacitor element 11 connected to the external anode lead 45 through the pipe hole 44 of the airtight terminal 43 is fixed with solder 46 into the metal case 42 to which the external cathode lead 41 is welded. After the outer periphery of the hermetic terminal was sealed with solder 47, the external cathode lead 45 and the pipe 44 through which the lead wire was inserted were sealed with solder to obtain a metal cased solid electrolytic capacitor.
しかしながら上述した従来の金属ケース入り固体電解コ
ンデンサは、気密シールに半田を使用しているため気密
不良が発生しやすく、特に陽極引出しリードのパイプ間
の半田封口は難しく、半田量が多すぎると半田がケース
内に落ちたり垂れ下がったりしてショート不良の原因に
なり、又少なすぎると封口が完全に行なわれずピンホー
ルによる気密不良が発生したりする欠点があった。However, since the conventional solid electrolytic capacitors in metal cases mentioned above use solder for airtight sealing, poor airtightness is likely to occur.It is especially difficult to solder seal between the pipes of the anode lead, and if there is too much solder, the solder If the amount is too small, the seal may not be completely sealed, resulting in poor airtightness due to pinholes.
さらに、これらの半田の垂れ下がりやピンホールによる
気密不良の流出を防止するための検査に多大な工数や設
備が必要となり、コスト高となる問題点があった。Furthermore, a large amount of man-hours and equipment are required for inspection to prevent leakage of airtightness due to solder sag or pinholes, resulting in a problem of high costs.
本発明の目的は、従来の金属ケース入り固体電解コンデ
ンサで発生した半田の落ち込みや垂れ下がりがなくなる
共に、封口時の内部空気の膨張による半田の空洞（ピン
ホール）による気密不良の恐れを完全に取り除くことが
でき、ケースの信頼性を高めると共に、半田封口作業で
発生した不良を取り除く検査工数も大幅に削減できる固
体電解コンデンサを提供することにある。The purpose of the present invention is to eliminate the drop-off and sagging of solder that occurs in conventional solid electrolytic capacitors in a metal case, and to completely eliminate the risk of poor airtightness due to solder cavities (pinholes) caused by expansion of internal air during sealing. It is an object of the present invention to provide a solid electrolytic capacitor that can improve the reliability of the case and greatly reduce the number of inspection steps required to remove defects generated during soldering.
本発明の固体電解コンデンサは、金属板に溶接された第
１のリード（外部陰極リード）と、前記金属板の孔を貫
通し絶縁シールされてなる第２のリードを有する金属ス
テム上にコンデンサ素子を搭載、接続し、前記コンデン
サ素子の陽極リードと前記第２のリードを接続したのち
、キャップをかぶせ前記金属ステムと前記キャップの外
周部を気密シールしてなることを特徴として構成される
。The solid electrolytic capacitor of the present invention has a capacitor element mounted on a metal stem having a first lead (external cathode lead) welded to a metal plate and a second lead penetrating a hole in the metal plate and sealed insulatingly. After the anode lead of the capacitor element and the second lead are connected, a cap is placed over the cap to airtightly seal the metal stem and the outer periphery of the cap.
〔実施例〕
次に、本発明について図面を参照して説明する。第１図
は本発明の一実施例の縦断面図であり、第２図は第１図
におけるＡ−Ａ、切断面の上面図である。タンタル等の
弁作用金属からなる陽極体に酸化被膜、二酸化マンガン
、カーボン層、銀ペーストを順次形成し、コンデンサ素
子］１を作る。そして、そのコンデンサ素子１１を円形
の金属板に溶接された第１のリード（外部陰極リード）
１２と、その金属板の孔を貫通しガラスシールされてな
る第２のり一ド（外部陽極リード）］４を有する金属ス
テム１５に導電性接着剤、又は半田１６によって固定す
る。しかるのち前記コンデンサ素子１１の陽極リード１
７と前記外部陽極リード１４を溶接したのち金属キャッ
プ１８をかぶせ、最後にその金属ステム１５とその金属
キャップ１８の外周部を抵抗溶接によりシールして金属
ケース入り固体電解コンデンサを得る。[Example] Next, the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal cross-sectional view of one embodiment of the present invention, and FIG. 2 is a top view of a cross section taken along line A-A in FIG. An oxide film, manganese dioxide, a carbon layer, and a silver paste are sequentially formed on an anode body made of a valve metal such as tantalum to produce a capacitor element]1. Then, the capacitor element 11 is connected to a first lead (external cathode lead) welded to a circular metal plate.
12 and a second glue (external anode lead) 4 which passes through a hole in the metal plate and is sealed with glass.The metal stem 15 is fixed with a conductive adhesive or solder 16. After that, the anode lead 1 of the capacitor element 11
7 and the external anode lead 14 are welded together, then a metal cap 18 is placed over the metal stem 15 and the outer periphery of the metal cap 18 is sealed by resistance welding to obtain a metal cased solid electrolytic capacitor.
前記の金属板及び金属キャップとしてはコバールに半田
メッキしたものを用いる。又外部陰極リードと外部陽極
リードとしては、ニッケル線に半田メッキしたものを用
いる。As the metal plate and metal cap, Kovar plated with solder is used. Further, as the external cathode lead and the external anode lead, nickel wire plated with solder is used.
第３図は本発明の他の実施例を説明するための図で第１
図におけるＡ−Ａ、線相当位置の切断面の上面図である
。この実施例では金属板及び金属キャップが角形となっ
ているため外形の大きさを小さくできるという利点があ
る。FIG. 3 is a diagram for explaining another embodiment of the present invention.
It is a top view of the cut surface of the position corresponding to line A-A in the figure. In this embodiment, since the metal plate and the metal cap are rectangular, there is an advantage that the outer size can be reduced.
なお、実施例においては金属板及びキャップの形状を丸
形、角形の例を示したが他の形状でもよく、キャップの
材質はプラスチックであってもよい。また、シール方法
も抵抗溶接でなくても、レーザビーム溶接、接着剤によ
るシールでも良い。In the embodiments, the shapes of the metal plate and the cap are round and square, but other shapes may be used, and the material of the cap may be plastic. Further, the sealing method does not have to be resistance welding, but may be laser beam welding or sealing using an adhesive.
以上説明したように本発明は、金属板に溶接された第゛
１のリードと金属板の孔を貫通しガラスシールされてな
る第２のリードを有する金属ステム上にコンデンサ素子
を搭載し、金属キャップをかぶせ抵抗溶接によってシー
ルすることにより、作業上非常に難しい半田封口作業が
なくなるため、従来のコンデンサで発生した半田の落ち
込みや垂れ下がりがなくなると共に、封口時の内部空気
の膨張による半田の空洞（ピンホール）による気密不良
の恐れを完全に取り除くことができ、ケースの信頼性を
高めると共に半田封口作業で発生した不良をとり除く検
査工数も大幅に削減できた。As explained above, the present invention has a capacitor element mounted on a metal stem having a first lead welded to a metal plate and a second lead penetrating a hole in the metal plate and sealed with glass. By placing the cap on and sealing with resistance welding, the extremely difficult solder sealing process is eliminated, eliminating the solder drops and sag that occur with conventional capacitors, and also eliminating solder cavities caused by the expansion of internal air during sealing. This completely eliminates the risk of airtightness caused by pinholes, increasing the reliability of the case, and greatly reducing the number of inspection steps necessary to remove defects caused by solder sealing.
図面の簡単な説明
第１図は本発明の固体電解コンデンサの一実施例を示す
縦断面図、第２図は第１図のＡ−Ａ、線切断面の上面図
、第３図は第２の実施例を説明するための図で第１図に
おけるＡ−Ａ、線相当位置の線断面の上面図、第４図は
従来の金属ケース入り固体電解コンデンサの一例の縦断
面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing one embodiment of the solid electrolytic capacitor of the present invention, FIG. FIG. 4 is a vertical sectional view of an example of a conventional solid electrolytic capacitor encased in a metal case.
１１・・・コンデンサ素子、１２・・・第１のリード、
１３・・・絶縁ガラス、１４・・・第２のリード（外部
陽極リード）、１５・・・金属ステム、１６・・・導電
性接着剤又は半田、１７・・・陽極リード、１８・・・
金属キャップ、４１・・・外部陰極リード、４２・・・
金属ケース、４３・・・気密端子、４４・・・パイプ、
４５・・・外部陽極リード、４６〜４８・・・半田、４
９・・・絶縁ガラス。11... Capacitor element, 12... First lead,
13... Insulating glass, 14... Second lead (external anode lead), 15... Metal stem, 16... Conductive adhesive or solder, 17... Anode lead, 18...
Metal cap, 41... External cathode lead, 42...
Metal case, 43... Airtight terminal, 44... Pipe,
45...External anode lead, 46-48...Solder, 4
9...Insulating glass.
Claims (1)
し絶縁シールされてなる第２のリードを有する金属ステ
ム上にコンデンサ素子を搭載，接続し、前記コンデンサ
素子の陽極リードと前記第２のリードを接続したのち、
キャップをかぶせ前記金属ステムと前記キャップの外周
部を気密シールしてなることを特徴とする固体電解コン
デンサ。A capacitor element is mounted on and connected to a metal stem having a first lead welded to a metal plate and a second lead passed through a hole in the metal plate and sealed insulatingly. After connecting the second lead,
A solid electrolytic capacitor characterized in that the metal stem is covered with a cap and the outer periphery of the metal stem and the cap are hermetically sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12240289A JPH02301116A (en) | 1989-05-15 | 1989-05-15 | Solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12240289A JPH02301116A (en) | 1989-05-15 | 1989-05-15 | Solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02301116A true JPH02301116A (en) | 1990-12-13 |
Family
ID=14834909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12240289A Pending JPH02301116A (en) | 1989-05-15 | 1989-05-15 | Solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02301116A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007200950A (en) * | 2006-01-23 | 2007-08-09 | Fujitsu Media Device Kk | Multilayer solid-state electrolytic capacitor |
| US7688571B2 (en) | 2006-10-13 | 2010-03-30 | Nichicon Corporation | Solid electrolytic capacitor |
| US7843681B2 (en) | 2007-03-19 | 2010-11-30 | Nichicon Corporation | Solid electrolytic capacitor element and solid electorlytic capacitor |
| JP2011077501A (en) * | 2009-09-02 | 2011-04-14 | Seiko Instruments Inc | Electrochemical cell and method of manufacturing the same |
-
1989
- 1989-05-15 JP JP12240289A patent/JPH02301116A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007200950A (en) * | 2006-01-23 | 2007-08-09 | Fujitsu Media Device Kk | Multilayer solid-state electrolytic capacitor |
| US7688571B2 (en) | 2006-10-13 | 2010-03-30 | Nichicon Corporation | Solid electrolytic capacitor |
| US7843681B2 (en) | 2007-03-19 | 2010-11-30 | Nichicon Corporation | Solid electrolytic capacitor element and solid electorlytic capacitor |
| JP2011077501A (en) * | 2009-09-02 | 2011-04-14 | Seiko Instruments Inc | Electrochemical cell and method of manufacturing the same |
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