JPH0229562U - - Google Patents

Info

Publication number
JPH0229562U
JPH0229562U JP10843388U JP10843388U JPH0229562U JP H0229562 U JPH0229562 U JP H0229562U JP 10843388 U JP10843388 U JP 10843388U JP 10843388 U JP10843388 U JP 10843388U JP H0229562 U JPH0229562 U JP H0229562U
Authority
JP
Japan
Prior art keywords
subunit
motherboard
support piece
supports
guide rail
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10843388U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10843388U priority Critical patent/JPH0229562U/ja
Publication of JPH0229562U publication Critical patent/JPH0229562U/ja
Pending legal-status Critical Current

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  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の好適な実施例の説明図、第2
図は従来例の説明図、第3図は本考案の他の実施
例の説明図である。 1…マザーボード(プリント基板)、2…サブ
ユニツト、3…ガイドレール、3a…支持片、3
b…脚部、3c…支持溝、6…ネジ。
Fig. 1 is an explanatory diagram of a preferred embodiment of the present invention;
The figure is an explanatory diagram of a conventional example, and FIG. 3 is an explanatory diagram of another embodiment of the present invention. 1...Motherboard (printed circuit board), 2...Subunit, 3...Guide rail, 3a...Support piece, 3
b...Legs, 3c...Support grooves, 6...Screws.

Claims (1)

【実用新案登録請求の範囲】 マザーボード上面との間に所定のスペースをお
いて配設されるサブユニツトにおいて、 該サブユニツトはサブユニツトを着脱自在に支
持するガイドレールによつてマザーボード上に配
設され、該ガイドレールはサブユニツトを支持す
る支持片と、支持片から突設されてマザーボード
上に立設される脚部とから成り、該支持片には該
サブユニツトを着脱自在に支持する係止部が形成
されていることを特徴とするプリント基板に対す
るサブユニツトの取付構造。
[Claims for Utility Model Registration] In a subunit that is arranged with a predetermined space between it and the top surface of the motherboard, the subunit is arranged on the motherboard by a guide rail that supports the subunit in a detachable manner. The guide rail consists of a support piece that supports the subunit, and a leg part that projects from the support piece and stands on the motherboard, and the support piece has a locking part that detachably supports the subunit. A subunit mounting structure for a printed circuit board, characterized by:
JP10843388U 1988-08-18 1988-08-18 Pending JPH0229562U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10843388U JPH0229562U (en) 1988-08-18 1988-08-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10843388U JPH0229562U (en) 1988-08-18 1988-08-18

Publications (1)

Publication Number Publication Date
JPH0229562U true JPH0229562U (en) 1990-02-26

Family

ID=31343756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10843388U Pending JPH0229562U (en) 1988-08-18 1988-08-18

Country Status (1)

Country Link
JP (1) JPH0229562U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014120739A (en) * 2012-12-19 2014-06-30 Shindengen Electric Mfg Co Ltd Surface mounted type electric device, mother board equipped with the same, and manufacturing method of mother board equipped with the same

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628690B2 (en) * 1982-01-19 1987-02-24 Sanyo Electric Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS628690B2 (en) * 1982-01-19 1987-02-24 Sanyo Electric Co

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014120739A (en) * 2012-12-19 2014-06-30 Shindengen Electric Mfg Co Ltd Surface mounted type electric device, mother board equipped with the same, and manufacturing method of mother board equipped with the same

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