JPH0229559U - - Google Patents
Info
- Publication number
- JPH0229559U JPH0229559U JP10844488U JP10844488U JPH0229559U JP H0229559 U JPH0229559 U JP H0229559U JP 10844488 U JP10844488 U JP 10844488U JP 10844488 U JP10844488 U JP 10844488U JP H0229559 U JPH0229559 U JP H0229559U
- Authority
- JP
- Japan
- Prior art keywords
- double
- sided printed
- circuit board
- copper foil
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10844488U JPH0229559U (en, 2012) | 1988-08-18 | 1988-08-18 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10844488U JPH0229559U (en, 2012) | 1988-08-18 | 1988-08-18 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0229559U true JPH0229559U (en, 2012) | 1990-02-26 |
Family
ID=31343779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10844488U Pending JPH0229559U (en, 2012) | 1988-08-18 | 1988-08-18 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0229559U (en, 2012) |
-
1988
- 1988-08-18 JP JP10844488U patent/JPH0229559U/ja active Pending