JPH0229557U - - Google Patents

Info

Publication number

JPH0229557U

JPH0229557U JP10791288U JP10791288U JPH0229557U JP H0229557 U JPH0229557 U JP H0229557U JP 10791288 U JP10791288 U JP 10791288U JP 10791288 U JP10791288 U JP 10791288U JP H0229557 U JPH0229557 U JP H0229557U

Authority

JP

Japan

Prior art keywords

substrate

external connection

pads

integrated circuit

hybrid integrated

Prior art date

1988-08-18

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000000758 substrate Substances 0.000 claims description 4
• 238000005476 soldering Methods 0.000 claims description 3
• 210000000078 claw Anatomy 0.000 description 1
• 239000004020 conductor Substances 0.000 description 1
• 238000010586 diagram Methods 0.000 description 1
• 229910000679 solder Inorganic materials 0.000 description 1