JPH0229537U - - Google Patents

Info

Publication number

JPH0229537U

JPH0229537U JP10814788U JP10814788U JPH0229537U JP H0229537 U JPH0229537 U JP H0229537U JP 10814788 U JP10814788 U JP 10814788U JP 10814788 U JP10814788 U JP 10814788U JP H0229537 U JPH0229537 U JP H0229537U

Authority

JP

Japan

Prior art keywords

plating

semiconductor device

underlying

treated

exposed

Prior art date

1988-08-17

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000007747 plating Methods 0.000 claims description 3
• 229910000679 solder Inorganic materials 0.000 claims description 3
• 239000004065 semiconductor Substances 0.000 claims description 2
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 239000011889 copper foil Substances 0.000 description 1
• 239000006071 cream Substances 0.000 description 1