JPH0229522U - - Google Patents

Info

Publication number
JPH0229522U
JPH0229522U JP10773788U JP10773788U JPH0229522U JP H0229522 U JPH0229522 U JP H0229522U JP 10773788 U JP10773788 U JP 10773788U JP 10773788 U JP10773788 U JP 10773788U JP H0229522 U JPH0229522 U JP H0229522U
Authority
JP
Japan
Prior art keywords
thin film
coated
film forming
conductor
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10773788U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP10773788U priority Critical patent/JPH0229522U/ja
Publication of JPH0229522U publication Critical patent/JPH0229522U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Physical Vapour Deposition (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)

Description

【図面の簡単な説明】
第1図はこの考案の実施例を示す平面図、第2
図は第1図の拡大断面図、第3図は絶縁薄膜の付
着状態を示す拡大断面図、第4図は他の実施例を
示す拡大断面図、第5図はスパツタ粒子による薄
膜形成装置を示す断面図である。 10…メツシユ、11…導電材、12…孔、1
3…導電体、15,16…絶縁薄膜。

Claims (1)

    【実用新案登録請求の範囲】
  1. 荷電粒子を用いて絶縁薄膜を着膜対象体に形成
    する薄膜形成装置において、側面が内側に向かつ
    て傾斜する導電材によつて構成したメツシユを、
    前記着膜対象体以外の、他の導電体の表面に付設
    してなる薄膜形成装置。
JP10773788U 1988-08-16 1988-08-16 Pending JPH0229522U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10773788U JPH0229522U (ja) 1988-08-16 1988-08-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10773788U JPH0229522U (ja) 1988-08-16 1988-08-16

Publications (1)

Publication Number Publication Date
JPH0229522U true JPH0229522U (ja) 1990-02-26

Family

ID=31342419

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10773788U Pending JPH0229522U (ja) 1988-08-16 1988-08-16

Country Status (1)

Country Link
JP (1) JPH0229522U (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417672A (ja) * 1990-05-10 1992-01-22 Hitachi Ltd イオンビームスパッタ装置および運転方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0417672A (ja) * 1990-05-10 1992-01-22 Hitachi Ltd イオンビームスパッタ装置および運転方法

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