JPH02292142A - Cutting machine used also for laser heat treatment and cutting tool - Google Patents

Abstract

PURPOSE:To perform heat treatment by irradiating laser beam even to a stepped corner by disposing a laser beam reflecting mirror rotatably on a cutting tool to form incident and reflecting beam paths, disposing a shutter at the beam path opening and disposing a cooling plate on the back surface of the mirror. CONSTITUTION:A laser beam 1 enters from an incident window 7 of a tool holders 2, directed in a different direction with a reflection mirror 4, passes through a hollow portion, directed in a different direction with a reflection mirror 5, comes out of an outlet window 8, and is directed to a surface of a work 13 to be machined. Heat produced during machining at the mirrors 4, 5 and transmitted to a cooling plate 12 is absorbed with cooling water 11 flowing through a cooling water passage 10. The incident angle of the laser beam 1 relative to the work 13 can be changed by loosening the reflection mirror cooling plate 12, rotating it by loosening a tightening screw 9, and tightening the screw 9 again. Laser beam absorbing agent is applied from a nozzle and dried on the portion of the work 13 where heat treatment is required while rotating the work 13 with a shutter 6 closed to prevent machined chips from entering the heat treatment room. Heat treatment is performed by irradiating laser beam on the work 13 while it is rotated and with the shutter 6 open.

Description

[Detailed Description of the Invention] [Industrial Application Field 1] The present invention relates to a laser heat treatment/cutting machine that simultaneously performs cutting of metal materials and laser heat treatment, and also relates to a cutting machine that can be used for laser heat treatment. The present invention relates to a cutting tool.

[Juniorai Fujutsu] For workpieces that require high machining accuracy and surface hardness, such as electrically driven pongee, the cutting process and heat treatment process have conventionally been performed separately. As a result, production efficiency was low due to time consuming setups and lost time due to transportation, etc.

In order to overcome this problem, a laser heat treatment machine tool that performs cutting, etc. and laser heat treatment in-process has been developed.
This is already known from Japanese Patent Application Laid-Open No. 59'-50983.

[Problems to be Solved by the Invention] However, in the known technique, a laser beam condensing lens is installed on the side of the tool rest of the lathe, and the laser beam is directed to the cutting surface of the workpiece through the condensing lens. It was shining vertically. Therefore, for example, when the cut surface of a workpiece has a stepped portion, it is difficult to concentrate the laser beam on a part of the corner on the side of the small diameter stepped portion. For this reason, it was not possible to sufficiently harden the stepped portion, resulting in failure to obtain hardness and causing fatigue failure and cracking.

The present invention has been made in order to solve the above-mentioned problems, and is a laser heat treatment in which cutting by turning g1 etc. for processing workpieces such as metal materials and laser heat treatment are performed in-process. Regarding the dual-purpose cutting machine and the cutting tool used therein, by attaching a laser beam mirror to the cutting tool body, the laser beam can be irradiated to a part of the corner of the stepped part of the workpiece, and the part can be The second purpose is to achieve sufficient heat treatment of

[Means for Solving the Problems 1 To achieve this object, the laser heat treatment and cutting machine of the present invention includes a cutting tool for cutting a workpiece, and a cutting tool arranged to irradiate the cutting surface of the workpiece with a laser beam. The cutting tool is provided with a mirror that reflects the laser beam of the laser oscillator toward the cutting surface of the workpiece. Furthermore, in the above-mentioned laser heat treatment and cutting stone machine, it is preferable that the moeki reflection mirror is provided so as to be movable so that the angle of incidence and reflection of the laser beam can be varied.

Further, in the laser heat treatment and cutting allowance machine, an input/reflection optical path for the laser beam is formed in the cutting tool body, the reflection mirror is disposed in the optical path, and an opening/closing shutter is provided at the opening of the optical path. Good.

Furthermore, it is recommended to install a cooling plate on the back of the above reflecting mirror.
, it is preferable to provide a coolant flow means on the cooling plate [Effect 1 According to the present invention having the above-mentioned configuration, the laser beam oscillated from the laser oscillator can be applied to the workpiece without removing the two objects. Since the object can be irradiated from an oblique force direction, sufficient irradiation can also be performed on some corners of stepped areas.

Further, a shutter provided on the outer surface of the mirror blocks cutting oil and cutting debris flying away from the workpiece.

Further, the mirror, which is heated by heat generated by laser beam irradiation, is cooled by flowing a coolant into the through hole.

[Example] Hereinafter, examples embodying the present invention will be described with reference to the drawings.

FIG. 1 shows the configuration of a cutting clamp bit to which the present invention is applied. A beam entrance window 7 and a beam exit window 8 are opened at both ends of one side of the hollow rectangular parallelepiped cutting tool holder 2 . Furthermore, a throw-away tip 3, which is a replaceable cutting edge, is attached to one end of the bite holder 2 with a screw or the like.

On the other hand, an entrance reflecting mirror 4 is mounted inside the beam entrance window 7 with its mirror surface at an angle of 45 degrees with respect to the beam entrance window 7. Similarly, an exit reflector 5 is attached inside the beam exit window 8. There is a reflector cooling plate 1 on the back of both reflectors.
2 is installed. On the other hand, cooling water channels 10, which are through holes for passing cooling water 11, are provided at both ends of the Beitholg 2, and the cooling plates 12 constitute part of the passage walls of the cooling water channels 10. Further, a shutter 6 having an opening/closing sliding mechanism is attached to the beam exit window 8.

Next, the operation of this embodiment using the above-mentioned groove structure will be explained.

A laser beam 1 emitted from a laser oscillator (not shown) enters the Beitholg 2 through the beam incidence +B7 at the end of the Beitholg 2, changes direction by the input reflector 4, passes through the hollow part of the Beitholg 2, and changes direction again by the exit reflector 5. The beam is irradiated from the beam exit window 8 onto the cut surface of the workpiece 13. Here, the reflector cooling plate 12 removes the heat generated during processing in both the reflectors 4 and 5. Further, the heat is absorbed by the cooling water 11 flowing through the cooling water channel 10 attached to the reflector cooling plate 12.

By the way, when the workpiece 13 is irradiated with the laser beam 1, the angle of incidence on the workpiece 13 can be changed. As shown in Figures fjS2 and 3, it is sufficient to loosen the tightening screw 9 that fixes the reflector cooling plate 12, rotate it to a convenient position, and then tighten it.

Next, a working example using the cutting tool of the present invention will be explained with reference to FIG. After the normal cutting process, the pie }A is moved to the right as shown in FIGS. 4(a) and 4(B). At this time, the shutter 6 is kept closed to prevent chips from entering the beam exit window 8 during processing.

Next, as shown in FIG. 4(b), while the workpiece 13 is being rotated, a black laser beam absorbent 16 is applied using the laser beam absorbent supply nozzle 15 to the portion that requires laser thermal processing. After drying the absorbent, the shutter 6 is opened and the laser beam 1 is applied to the rotating workpiece 13 as shown in FIG. 4(e).
irradiation and heat treatment. As a result, corner part 17
Hardening is applied. Furthermore, the tool holder 2 is moved to the right as shown in FIG. #S4 (d), and the workpiece 13 is hardened over its entire circumference. FIG. 7 shows a sectional view of the hardened workpiece. The part indicated by the @ line is quenched and hardened wJ
21, but (a) is published in Japanese Unexamined Patent Application Publication No. 1989-59-5 0983.
The hardening process was performed using the conventional hardening method used in the above publication, and (b) is the hardening process performed using the cutting tool obtained according to the present invention. In order to quickly dry the applied laser beam absorbent 16, air may be forcibly sent from another nozzle (not shown), or the laser beam 1 with a weakened output may be irradiated.

The cutting tool of the present invention has a right-handed shape with the cutting tool bent to the right, but the same applies to the opposite case where the cutting tool is left-handed. Further, the cutting tool of the present invention can also be applied to cutting tools listed in JIS standard B4105, provided the reflecting mirror is changed. Figure fj45 is an example of this.

Further, the form of the cutting tool of the present invention is not limited to the above-mentioned embodiment. For example, the reflector may be on the external side of the tool holder 2 when attached to the tool. FIG. 6 shows one example of this, in which the laser beam 1 is reflected by an external reflector 19, and then
Side reflection fi 2 0 1: The light is focused and the workpiece 13 is processed.

[Effect of the Invention 1] As is clear from the detailed description above, according to the present invention, not only can cutting and laser heat treatment be performed in-process, but also a portion of the corner of a stepped portion can be sufficiently processed. The required hardness can be obtained by heat treatment. As a result, it is possible to harden the surface of a portion of the corner, which is likely to become a starting point for fatigue failure due to stress concentration, thereby improving the fatigue strength and durability of stepped pongee and the like. Furthermore, by installing a shutter, it is possible to prevent the mirror from being contaminated by cutting oil, etc., and by providing a cooling means, it is possible to prevent the mirror from being heated and deformed by the laser beam, so that the above-mentioned heat treatment can be performed stably.

[Brief explanation of the drawing]

1 to 7 show embodiments embodying the present invention, FIG. 1 is an internal structure diagram of a cutting tool to which the invention is applied, and FIG. 2 and 3 are diagrams of the above-mentioned cutting tool. Fig. 4(a) to (d) are process diagrams for performing complex processing in-process using the above-mentioned cutting tool, and Fig. 5 is an internal structure diagram showing a modified embodiment of the above-mentioned cutting tool. FIG. 6 is a perspective view showing an embodiment in which a mirror is provided on the outer periphery of the cutting tool, and FIG. tJ&7 is a sectional view of a workpiece hardened by a laser beam. 2...Bite holder, 4...Incidence reflector, 5...
Output reflecting mirror, 6...Shutter, 7...Beam entrance window, 8...Beam exit window, 9...Tightening screw, 10...
・Cooling channel, 12... Reflective IR cooling plate, 13... Workpiece, 17... Corner part, Patent applicant Brother Industries, Ltd. Director A. Yasui Figure 4 Figure 2 Figure 6 Figure 117 (a) (b)

Claims (1)

[Scope of Claims] 1. A laser heat treatment/cutting machine comprising a cutting tool for cutting a workpiece and a laser oscillator arranged to irradiate a cutting surface of the workpiece with a laser beam, wherein the cutting tool The method is characterized in that a mirror is provided for reflecting the laser beam from the laser oscillator toward the cutting surface of the workpiece. 2. The laser heat treatment and cutting machine according to claim 1, wherein the reflecting mirror is rotatably provided so that the angle of incidence and reflection of the laser beam is variable. 3. The cutting tool is characterized in that an input/reflection optical path for the laser beam is formed in the tool body, the reflection mirror is disposed in the optical path, and an opening/closing shutter is provided at the opening of the optical path. A laser heat treatment and cutting machine according to claim 1 or 2. 4. The laser heat treatment and cutting machine according to claim 1, wherein a cooling plate is provided on the back surface of the reflecting mirror. 5. The laser heat treatment and cutting machine according to claim 4, wherein the cooling plate is provided with a coolant flow means. 6. A cutting tool which is characterized by having a reflecting mirror provided on the main body of the tool.