JPH02284871A - Grinding metal bond chip and polisher disk having this chip and manufacture thereof - Google Patents

Abstract

PURPOSE:To attain adhesion of a grinding chip layer firmly to a metal bed by integrally forming with the metal bed by sintering to diffusion connect the grinding chip layer to the plating. CONSTITUTION:After a metal bed 12 is placed in a carbon mold of a sintering machine, mixed dust of metal dust with diamond dust is placed in the mold and sintered, diffusion connecting a grinding chip layer 11 to a plated copper on surfaces of the metal bed 12. Thus, the grinding chip layer 11 can adhesively adhere to the metal bed 12 stronger than brazing.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention can be used as abrasive parts for various abrasive machines for grinding stone, etc. The present invention relates to a polishing disk having a tip and used mainly for wet polishing of right-handed materials, and a method for manufacturing the polishing disk.

(Prior Art) A conventional polishing disk mainly used for wet polishing stone moves horizontally as shown in FIG.

That is, it has a structure in which a plurality of chips 1 for directly contacting and polishing stone are bonded by brazing to a plurality of protrusions 2a regularly arranged and formed on one surface of a casting substrate 2. ing. Such a polishing disk 5 is formed as follows. FIG. 11 is a schematic partial cross-sectional view showing a resistance sintering machine 20 for forming the chip 1. FIG.

First, diamond powder, which is an abrasive, is mixed with metal powder such as copper, nickel, or cobalt, and this mixed powder is placed in a square frame-shaped carbon mold 2 of a sintering machine 20, as shown in FIG.
The mixed powder is put into a container and heated while applying pressure from above and below to the mixed powder using a punch 23 driven by an electrode 22 to sinter the mixed powder.

Chip 1 is thus formed.

Next, in FIG. 12, when brazing the chip 1, the molding surface coating and dirt on the surface 1a and the surface 2b when brazing the protrusion 2a are removed.
Scrape off using a grinder or sander, both sides 1a
, 2b is coated with flux, which is an adhesion aid. Then, a plate-shaped silver solder 3 is sandwiched between both surfaces 1a and 2b, and the chip 1 is brazed to the protrusion 2a using a high-frequency heater, a burner, or the like.

(Problems with the prior art) In the polishing plate formed as described above, for example, high heat of approximately 650 to 660°C is applied during brazing to the chip 1, which is heated to approximately 550°C during sintering. As a result, the metal powder in the chip 1 may melt, etc., causing a change in the structure of the chip 1, resulting in a change in performance such as the hardness of the chip 1, or deformation of the chip 1, which may cause the polishing function of the polishing disc 5 to deteriorate. There was a risk of something abnormal happening.

In addition, differences tend to occur in the brazing work time, the force to press the chip 1 for brazing, the dirt condition of the brazing surfaces 1 a s 2 b, the amount of flux applied, etc.
When the silver solder 3 is soldered, the adhesion strength to the surfaces 1a and 2b tends to be uneven, and some of the chips 1 tend to come off from the protrusion 2a, which also causes abnormalities in the polishing function of the polishing disk 5. There was a fear that he might come.

Furthermore, since the substrate 2 is made of cast metal, it is heavy, making handling difficult and dangerous.

In addition, in the manufacturing method described above, brazing is performed on surfaces 1a and 2.
It was troublesome because it required work to scrape off the dirt etc. on b. Furthermore, since brazing requires work with many variations in results, there is a problem of poor production efficiency.

(Object of the Invention) The present invention provides a metal bond chip for grinding that has a grinding chip layer for grinding stones, etc., can be effectively used as polishing parts of various polishing devices, and can be obtained at low cost. Furthermore, the present invention provides a polishing machine that has a metal bond tip for grinding, can perform the polishing function normally, is easy and safe to handle, and manufactures the polishing machine with simple operations and high production efficiency. The purpose of the present invention is to provide a method for manufacturing a polishing disk that can be used.

(Structure of the Invention) The first invention of the present application consists of a metal base whose surface is plated, and a grinding tip layer in which diamond powder is mixed with powder of a metal of the same type as the metal used for plating. , a metal bond chip for grinding, characterized in that the grinding chip layer is diffusion bonded to the plating through sintering and is integrated with the metal base.

The second invention of the present application consists of a metal base whose surface is plated, and a ground chip layer in which diamond powder is mixed with powder of a metal of the same type as the metal used for plating, and the ground chip layer is A plurality of metal bond chips for grinding formed by diffusion bonding with the plating and being integrated with the metal base through sintering are arranged on one surface of a resin substrate and fixed by embedding the metal base respectively. This is a polishing machine characterized by the fact that

In the third invention of the present application, the surface of a metal base is plated, and a grinding chip layer made of powder of the same type of metal as the metal used for plating mixed with diamond powder is baked while in contact with the metal base. A metal bond chip for grinding is formed by bonding the plating and diffusion bonding with the metal base, and a plurality of metal bond chips for grinding are arranged in a mold for forming a resin substrate, and each of the metal bond chips is bonded to the metal base. This method of manufacturing a polishing disk is characterized in that only the metal base is provided so as to protrude into the mold, and a resin substrate is formed by pouring resin into the mold.

(Example) Hereinafter, an example of the present invention will be described based on the drawings. 1st
The figure is a perspective view showing a metal bond tip for grinding according to the first invention of the present application. This metal bond tip 10 for grinding has a grinding tip layer 11 for grinding stones etc. on a metal base 1.
It is glued to one side of 2. The metal stand 12 is made of iron, and its surface is plated with copper. [Grinded chip layer] 1 is formed by mixing metal powder such as copper, cobalt, nickel, etc. with diamond powder and then sintering it, as shown in Figure 2. After the metal base 12 is placed in the carbon mold 21 of the sintering machine 20, a mixed powder of the metal powder and diamond powder is placed and sintered, thereby diffusion bonding with the copper plating on the surface of the metal base 12 is achieved.

Therefore, the grinding chip layer 11 and the metal base 2 are bonded more firmly than by brazing. [Table] shows the comparative data. Note that the plating of the metal base 12 may be nickel plating, an example of which is also shown in the [Table].

[Table] Note that (A) shows the case of conventional silver solder, and (B) and (C) show the case of copper plating and nickel plating of the present invention. The unit of this transverse rupture force is Kg/IDl112. The second transverse rupture strength test is conducted as shown in Figure 3. i.e. 10X1 each
Grinding chip layer 11 and metal stand 12 with a size of 0x40■
Prepare a test piece that is sintered and integrated as described above,
Pressure is applied from above to the support L2 and the bonding surface 13 at a fulcrum 14.14 50+wa+ apart with the bonding surface 13 placed over medium heat using the pressure member 15.

Sintering by the sintering machine 20 is carried out by detecting the temperature inside the carbon mold 21 with a thermal lightning pair 24 attached to the carbon mold 21, and controlling the applied heat and pressure by a computer, so that diffusion bonding can be easily maintained at a substantially constant level. It is done to give strength. That is, even if a plurality of chips 10 are formed, each grinding chip layer 11 is diffusion-bonded to the copper plating of the metal base 12 with substantially the same strength.

In this chip 10, as the plating material on the surface of the metal base 12, ([Since the metal of the same type as the metal used for the grinding chip layer 11, that is, copper is used here, the grinding chip layer 11 has good diffusion bonding to the copper plating. Moreover, since the metal used for the grinding tip layer 11 can be plated, the types of metals that can be used increase.
Since it is possible to use an inexpensive metal different from the metal used for the grinding tip layer 11, the cost is reduced by using iron here.

Such a chip 10 can be effectively used as a polishing component of various polishing devices. An example is shown below. FIG. 4 is a partial view showing a stone cutting blade 30 having a plurality of tips 10. As shown in FIG. Reference numeral 31 denotes a disc-shaped blade body made of iron, and a plurality of notches 32 are formed at equal intervals on the outer periphery of the blade body.

The chip 10 has the copper plating on the surface 12a of the metal base 12 opposite to the ground chip layer ll side removed, and then
is soldered and adhered to the outer layer edge of the blade body 31 between adjacent notches 32 using silver solder 3. Since the blade body 31 and the metal base 12 are made of the same material, that is, iron in this case, they are firmly brazed.
Therefore, a plurality of chips 10 are provided on the outer periphery of the blade body 31.
Even when brazing, there is almost no variation in the adhesive strength of each brazing. In this way, the grinding tip layer 11 is firmly adhered to the metal base 12 which is firmly brazed to the blade body 31 by diffusion bonding, and the strength of the brazing and diffusion bonding is approximately the same for each tip 10. Therefore, if any of the grinding chip layers 11 of the chips 10 come off, the cutting function of the stone cutting blade 30 will not be affected.

Although heat is applied when the tip 10 is brazed to the blade body 31, the ground tip layer 11 is not directly exposed to high heat because of the metal base 12.

Therefore, the grinding chip layer 11 will not undergo structural changes due to melting of the metal powder, resulting in changes in performance such as hardness, or deformation, and this will also prevent abnormalities in the cutting function of the stone cutting blade 30. It will never come.

FIG. 5 is a perspective view showing the polishing disk of the second invention of the present application, and FIG.
The figure is a sectional view showing one step of the method for manufacturing a polishing disk according to the third invention of the present application. This polishing disk 40 has a resin substrate 41
On one surface, a plurality of metal bond chips 10 for grinding according to the first invention are regularly arranged, and each metal stand 12 is embedded and fixed in a substrate 41. FIG. 7 is a cross-sectional view showing a portion where the chip 10 is embedded. As the resin, for example, phenol resin, polyester resin, etc. are used. A through hole 41a, a through hole 41b, and a hole 41c are respectively formed in the substrate 41 when the substrate 41 is molded.

A slightly protruding convex surface 41d is formed in the part of the substrate 41 in which the metal base 12 of the chip 10 is embedded, and the metal base 12 has a boundary surface 11a with the ground chip layer 11 (FIG. 7).
is embedded in the substrate 41 so as to be flush with the surface of the convex surface 41d. Therefore, until the grinding chip layer 11 is worn out and is completely used up, a gap equal to the protruding height of the convex surface 41d is reliably secured between the surface of the substrate 41 and the polishing surface.
The area around the supplied water is secured.

Such a polishing disk 40 is formed in a state as shown in FIG. 51.52 is a substrate 41 made by pressing resin.
The lower mold and the upper mold are used to form. The lower mold 51 is installed on the lower mold frame 53.

As shown in FIG. 8, the lower mold 51 has a plurality of through holes 51a into which the ground chip layer 11 of the chip 10 is inserted. As shown in FIG. 9, which is an enlarged perspective view of the through hole 51a, a notch 51b is formed at the periphery of the upper opening in the figure. The notch 51b is formed by molding resin to form the substrate 4.
This is a portion that becomes a convex surface 41d around the chip 10 when the number 1 is formed. The thickness of the lower mold 51 is such that when the grinding chip layer 11 inserted into the through hole 51a is in contact with the lower mold frame 53,
The interface 11a between the grinding chip layer 11 and the metal base 12 is at the same height as the lower edge of the notch 51b. A knockout bin 54 is provided through the lower mold frame 53 at a position corresponding to the through hole 51 a of the lower mold 51 .

The through hole 51a of the lower mold 51 placed on the lower mold frame 53
After arranging the chips 10 with the ground chip layers 11 inserted therein, resin is poured into the lower mold 51, and the resin is heated and molded while being pressed by the upper mold 52. Thereafter, the chip 10 is removed upward from the lower mold 51 together with the substrate 41 by pushing the knockout bin 54 of the lower mold 53 upward. As a result, a polishing disk 40 in which the chip 10 is embedded in the substrate 41 is formed.

In the polishing disk 40 formed in this way, the grinding chip layer 1
1. For example, after heat of about 550°C is applied during sintering, only about 200°C of heat is added at most during resin molding, and higher heat is not applied during sintering as in the past. Therefore, the grinding chip layer 11 has not undergone any structural changes due to melting of the metal powder, resulting in no change in properties such as hardness, or deformation.

Furthermore, the grinding chip layer 11 is well diffused and bonded to the copper plating on the surface of the metal base 12, and since the metal base 12 is embedded and fixed in the substrate 41, the grinding chip layer 11 is well bonded to the copper plating on the surface of the metal base 12.
1, it is fixed more firmly than brazing. Moreover, the ground chip layer 11 of each chip 10 is diffusion-bonded with approximately the same strength to the copper plating on the surface of the metal base 12, as explained in the first invention. Therefore, each grinding chip layer 11 is firmly fixed to the substrate 41 with substantially the same strength, and if the grinding chip layer 11 of any chip 10 comes off during polishing, the polishing function as the polishing disk 40 is lost. There are no abnormalities occurring.

Moreover, since the substrate 41 is made of resin, the weight of the polishing plate 40 is light, and it is easy to handle and safe. For example, the weight of a conventional 8-inch cast iron MIN2 is about 3.0Kg, but if it is made of phenol resin, it is about 1.5Kg, and if it is made of polyester resin (reinforced with glass iron fiber), it is about 2.0Kg.
It is g.

In addition, in the manufacturing method described above, since there is no brazing work, there is no need to scrape off the deposits on the parts to be brazed, which is the case in the conventional example. 41 and is fixed, the entire work is simplified. Furthermore, since there is no need for brazing, which has a wide range of results, production efficiency is improved.

(Effects of the Invention) As described above, the metal bond tip 10 for grinding according to the first invention of the present application is configured by bonding the grinding tip layer 11 to the metal base 12, so that it can be attached to the main body of various polishing equipment. By attaching it via the stand 12, it can be used as a polishing component for the device. In the chip 10, the ground chip layer 11 is diffusion bonded to the copper plating on the surface of the metal base 12 by sintering, so it is possible to bond the ground chip layer 11 and the metal base 12 more firmly than by brazing. In addition, when forming a plurality of chips 10, the sintering conditions can be easily controlled to make the strength of diffusion bonding in each chip 10 substantially the same. Therefore, according to this chip 10, when a polishing equipment is configured by attaching the chip 10 to the main body of a tIF polishing equipment as a polishing part by brazing or otherwise attaching the metal stand 12, grinding from any of the chips 10 in the polishing equipment is possible. The chip layer 11 will not come off, and the polishing device can perform the polishing normally. Moreover, even if heat is applied when attaching the metal base 12 by brazing, the ground chip layer 11 is not directly exposed to high heat because of the metal base 12, so the quality of the ground chip layer 11 is altered by the heat. This allows the polishing device to properly perform polishing. Further, as the metal used for the grinding chip layer 11, a metal that can be sintered at low temperature can be used.

Further, in this chip 10, the ground chip layer 11 is placed on the metal base 1.
Since the surface of the metal base 12 is plated in order to adhere to the grinding tip layer 11, the metal base 12 can be made of an inexpensive material different from the metal used for the grinding chip layer 11. Therefore, the chip [0] can be obtained at low cost.

Moreover, since the metal used for the grinding chip layer 11 may be any metal that can be plated, the types of metals that can be used are increased.

Therefore, there is flexibility in terms of materials for manufacturing the chip 10,
Cost reduction can be achieved.

Further, according to the polishing disk 40 of the second invention of the present application, the first aspect of the invention is as follows.
A plurality of grinding chips 10 according to the invention are fixed by embedding a metal base 12 in one surface of a substrate 41, and the grinding chip layer 11 is heated at a lower temperature than during sintering during resin molding after sintering. Therefore, in the same way as described above, in the polishing disk 40, from any of the chips 10 to the ground chip layer 1
1 does not come off, the polishing by the polishing disk 40 can be performed normally, and the grinding chip layer 11
can be prevented from deteriorating or deforming due to heat, and this also allows normal polishing by the polishing disk 40.

Furthermore, since the substrate 41 of the polishing disk 40 is made of resin, it is light in weight and therefore easy and safe to handle.

Further, according to the third invention of the present application, it is possible to obtain the polishing disk 40 of the second invention, and also it is possible to eliminate the need for brazing, and also to mold the chip 10 into the resin while simultaneously attaching the metal base 12 to the substrate. Since it can be embedded and fixed in the polishing disk 41, the entire work can be simplified and the production efficiency of the polishing disk 40 can be improved.

[Brief explanation of drawings]

FIG. 1 is a perspective view showing a metal bond chip for grinding according to the first invention of the present application, and FIG. 2 is a cross-sectional schematic diagram showing a resistance sintering machine for forming a grinding chip layer of the chip and its formation state. Fig. 3 is a diagram showing a transverse rupture test method for inspecting the adhesive force between the grinding chip layer and the metal base, Fig. 4 is a partial view showing a stone cutting blade that ladles the chips, and Fig. 5 FIG. 6 is a perspective view showing a polishing disk according to the second invention of the present application, FIG.
The figure is a partial cross-sectional perspective view showing a metal bond tip for grinding fixed to a substrate, FIG. 8 is a perspective view showing a lower die for pressing resin, and FIG. 9 is a partially enlarged view of FIG. 8. 1st
Figure 0 is a perspective view showing a conventional polishing machine, Figure 11 is a schematic diagram of a resistance sintering machine for forming chips of a conventional polishing machine, and a partial schematic diagram showing the state of its formation. FIG. 3 is a partially exploded perspective view. 3...Silver wax, 10...
Metal bond chip for grinding, 11...Grinding chip layer,
] 2... Metal stand, 30... Stone cutting blade, 4
0... Polishing disc, 4]... Substrate, 51... Lower mold, 5
2... Upper mold, 53... Lower form Figure 3 Patent applicant Sanwa Polishing T-gyo Co., Ltd. Figure 4 Stone material type I! l17”VF Fig. 3 Fig. 10 Fig. 11

Claims (3)

[Claims] (1) Consists of a metal base whose surface is plated, and a ground chip layer in which diamond powder is mixed with powder of the same type of metal as the metal used for plating, and the ground chip layer is plated by sintering. A metal bond tip for grinding, characterized in that it is integrated with the metal base by diffusion bonding with the metal base. (2) Consists of a metal base with a plated surface and a ground chip layer in which diamond powder is mixed with powder of the same type of metal as the metal used for plating, and the ground chip layer is plated by sintering. A plurality of metal bond chips for grinding formed by diffusion bonding and being integrated with the metal base are arranged on one surface of the resin substrate and each is fixed by embedding the metal base. Polishing machine. (3) The surface of the metal base is plated, and a grinding chip layer made by mixing diamond powder with powder of the same type of metal as the metal used for plating is sintered in contact with the metal base. A metal bond chip for grinding is formed by diffusion bonding with plating and being integrated with the metal base, and a plurality of metal bond chips for grinding are arranged in a mold for forming a resin substrate, and each metal base is the only one of the molds. A method for manufacturing a polishing disk, characterized in that the polishing disk is provided so as to protrude inward, and a resin substrate is formed by pouring resin into the mold.