JPH02283716A - Curable epoxy resin composition - Google Patents
Curable epoxy resin compositionInfo
- Publication number
- JPH02283716A JPH02283716A JP10511589A JP10511589A JPH02283716A JP H02283716 A JPH02283716 A JP H02283716A JP 10511589 A JP10511589 A JP 10511589A JP 10511589 A JP10511589 A JP 10511589A JP H02283716 A JPH02283716 A JP H02283716A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- heat resistance
- resin composition
- tbba
- curable epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 42
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 42
- 239000000203 mixture Substances 0.000 title claims abstract description 13
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 claims abstract description 8
- 238000002156 mixing Methods 0.000 claims abstract description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 6
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims abstract description 5
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000000126 substance Substances 0.000 claims 3
- KDVYCTOWXSLNNI-UHFFFAOYSA-N 4-t-Butylbenzoic acid Chemical compound CC(C)(C)C1=CC=C(C(O)=O)C=C1 KDVYCTOWXSLNNI-UHFFFAOYSA-N 0.000 description 15
- 229920005989 resin Polymers 0.000 description 9
- 239000011347 resin Substances 0.000 description 9
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000011888 foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000002966 varnish Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 241000238557 Decapoda Species 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 125000001033 ether group Chemical group 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O ammonium group Chemical group [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- -1 diphenol ketone Chemical class 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000005470 impregnation Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- YMBCJWGVCUEGHA-UHFFFAOYSA-M tetraethylammonium chloride Chemical compound [Cl-].CC[N+](CC)(CC)CC YMBCJWGVCUEGHA-UHFFFAOYSA-M 0.000 description 2
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- 241000282693 Cercopithecidae Species 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Reinforced Plastic Materials (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本発明は、プリント配線板など電気積層板を製造するた
めに用いられる硬化性エポキシ樹脂組成物に関するもの
である。The present invention relates to curable epoxy resin compositions used for manufacturing electrical laminates such as printed wiring boards.
プリント配線板などに加工される電気積層板は、ガラス
布などの基材にエポキシ樹脂などの樹脂を含浸して乾燥
することによってプリプレグを作成し、このプリプレグ
を複数枚重ねると共に必要に応じて銅箔などの金属箔を
重ね、これを加熱加圧成形することによって製造される
。
そして積層板の耐熱性を向上させる試みが種々おこなわ
れており、積層板を構成するエポキシ樹脂の耐熱性を高
めて積層板の耐熱性を向上させることが検討されている
。
Ｉ発明が解決しようとする課題】
耐熱性を高めたエポキシ樹脂としては、臭素化ビスフェ
ノールＡ型エポキシ樹脂が実用化されているが、耐熱性
の向上は十分に達成されていな（１のが現状である。
本発明は上記の点に鑑みて為されたものであり、耐熱性
全般の特性に優れた硬化性エポキシ樹脂組成物を提供す
ることを目的とするものである。Electrical laminates that are processed into printed wiring boards, etc. are made by impregnating a base material such as glass cloth with resin such as epoxy resin and drying it to create prepreg. It is manufactured by stacking metal foils such as foil and molding them under heat and pressure. Various attempts have been made to improve the heat resistance of the laminate, and studies are being conducted to improve the heat resistance of the laminate by increasing the heat resistance of the epoxy resin that constitutes the laminate. I Problems to be Solved by the Invention] As an epoxy resin with improved heat resistance, brominated bisphenol A type epoxy resin has been put into practical use, but the improvement in heat resistance has not been sufficiently achieved (1) The present invention has been made in view of the above points, and an object of the present invention is to provide a curable epoxy resin composition having excellent overall heat resistance characteristics.
【課題を解決するための手段］
本発明に係る硬化性エポキシ樹脂組成物は、一般式が
・・・（Ｉ）式
・・・（ＩＩ）式
で表される少なくとも一種のエポキシ樹脂と、テ）ラプ
ロモビス７１ノールＡ；
とを主成分とし、エポキシ樹脂とテトラブロモビスフェ
ノールＡとの配合比がグリシジルエーテル基とフェノー
ル性ＯＨ基との当量比で１：１〜１：０．７であること
を特徴とするものである。
以下、本発明の詳細な説明する。
本発明においで用いるエポキシ樹脂は、上記（Ｉ）式に
示される、ジフェノールケトンとホルムアルデヒドとの
縮合ノボラックをグリシシールエーテル化したエポキシ
樹脂、上記（ＩＩ）式に示されるジフェノールケトンと
ヒドロキシベンズホルムアルデヒドとの縮合ノボラック
をグリシツールエーテル化したエポキシ樹脂であり、こ
れらはグリシツルエーテル基を４個以上含有する多官能
エポキシ樹脂である１本発明では、これらエポキシ樹脂
を一種単独で使用することも、複数種を混合して使用す
ることもできる。
そしてこのエポキシ樹脂とテトラブロモビスフェノール
Ａ（ＴＢＢＡと略称）とを主成分として本発明に係る硬
化性エポキシ樹脂組成物を得ることができる。エポキシ
樹脂とＴＢＢＡとはそれぞれを全重量の０〜５０重量％
の溶媒に溶解して用いられるものであり、溶解後に５０
〜１５０℃に加熱してエポキシ樹脂とＴＢＢＡとを反応
させる。ＴＢＢＡはエポキシ樹脂のグリシジルエーテル
基に７二ノール性ＯＨ基が反応して付加し、エポキシ樹
脂の耐熱性を高めることができるのである。溶媒として
はケトン類やセロソルブ類を用いるのが好ましく、ジメ
チルホルム７ミド（Ｄ Ｍ Ｆ ）やジメチル７セト７
ミド（Ｄ Ｍ Ａｃ）は使用するのに不適当である。
エポキシ樹脂に対するＴＢＢＡとの配合比はエポキシ樹
脂のグリシジルエーテル基とＴＢＢＡのフェノール性Ｏ
Ｈ基との当量比で１：１〜１：０゜７の範囲に設定され
るものである。ＴＢＢＡの配合比が０．７未満であると
ＴＢＢＡの成分が不足し、ガラス転移温度やオープン耐
熱性などの特性の面で耐熱性が低下するおそれがあり、
またＴＢＢＡの配合比が１を超えるとＴＢＢＡが過剰に
なって７エノール性ＯＨ基が余り、吸湿性が悪くなると
共に却って耐熱性も低下するおそれがある。
またエポキシ樹脂とＴＢＢＡの硬化反応を促進するため
に、硬化剤としてイミダゾール類、アミン類、アンモニ
ウム類のうち少なくとも一種を用いるのがよい。イミダ
ゾール類としては２−メチルイミダゾール、２−エチル
−４−メチルイミダゾール、１−ベンツルー２−メチル
イミダゾールなどを、アミン類としてはベンジルツメチ
ルアミンなどを、アンモニウム類としてはテトラエチル
アンモニウムクロライドやテトラエチルアンモニウムク
ロライドなどを使用することができる。
上記のようにして得られる硬化性エポキシ樹脂組成物の
ワニスを含浸装置に供給し、ガラス布などの基材を浸漬
して基材に硬化性エポキシ樹脂組成物を含浸させる。そ
してこれをオープン等で加熱乾燥することによってプリ
プレグを得ることがで終る。さらにこのようにして得ら
れたプリプレグを数枚重ねると共に必要に応じて銅箔な
どの金属箔を重ね、これを常法に従って加熱加圧成形す
ることによって、電気用の積層板を得ることがでさるも
のである。
【実施例】
以下本発明を実施例によって例証する。
火１虜」ユ影
第１表の配合でエポキシ樹脂とＴＢＢＡをメチルエチル
ケトン（Ｍ Ｅ Ｋ ）とフェニルセロンルフ（ＰＣ）
との１：１混合溶剤に溶解し、これを第１表の反応条件
の欄に示す条件で加熱することによってエポキシ樹脂と
ＴＢＢＡとを反応させ、さらに硬化剤を配合して硬化性
エポキシ樹脂組成物の７ニスを得た。ここで第１表にお
いて、［？ｊ（脂１］はラフエノールケトン−ホルムア
ルデヒド縮合／ボラックのグリシジルエーテル化樹脂（
一般式（１）の樹脂）、「樹脂２」はノフェノールケト
ンーヒドロキシベンズアルデヒド縮合ノボラックのグリ
シツルエーテル化樹脂（一般式（ＩＩ）の０４脂）であ
る。上記のようにして得たワニスの１７０℃でのゲルタ
イムを第１表に示す。尚、第１表においてエポキシ樹脂
とＴＢＢＡの配合量は、両者のグリシツールエーテル基
と７二／−ル性ＯＨ基の当量の比で示し、２Ｅ４ＭＺ（
２−エチル−４−メチルイミダゾール）の配合量は樹脂
分に対する百分率で示す。
穀１九
エポキシ樹脂に硬化剤と硬化促進剤とを配合して上記実
施例１．２と同様に溶剤に溶解し、エビ板用の厚み１．
６ａ＋ｍの銅張り積層板を得た。
上記のようにして得た積層板について、オーブン耐熱性
、＃！箔引剥し強さ、２８８°Ｃの半田耐熱性、２気圧
・１３１℃・１５０分の条件でプレッシャークッカーラ
ス）（ＰＣＴ）をおこなったのちの２８８℃の半田耐熱
性をそれぞれ測定した。結においでエポキシ樹脂とＤｉ
ＣＹ（ノシアンジアミド）の配合量は重量部数で示す。
上記のように実施例１，２及び比較例で調製したワニス
に７６２８タイプのがラス基材を浸漬して、ガラス基材
に４１重量％（固形０換Ｗ、）の含浸量で含浸した。こ
れを１５５°Ｃのオーブンで８分間乾燥することによっ
て、プリプレグを得た。このプリプレグを８枚重ねると
共に、その上下にそれぞれ厚み１８μの銅箔を重ね、こ
れを成形圧力３０ ｋＦｉ／ ｃｍ２、成形温度１７０
℃、成形時間９０分の条件で成形することによって、プ
リント配線斗シ樹脂 エビキン当量５１０ｇ／ｅｑ第１
表の結果にみちれるように、各実施例のものは耐熱性が
全般的に優れているのに対して、エポキシ樹脂として臭
素化ビスフェノールＡ型エポキシ樹脂を用いた比較例の
ものでは耐熱性が不十分であることが確認される。[Means for Solving the Problems] The curable epoxy resin composition according to the present invention comprises at least one epoxy resin whose general formula is represented by the formula (I) or the formula (II); ) lapromobis71nol A; and that the blending ratio of epoxy resin and tetrabromobisphenol A is 1:1 to 1:0.7 in equivalent ratio of glycidyl ether group and phenolic OH group. This is a characteristic feature. The present invention will be explained in detail below. The epoxy resin used in the present invention is an epoxy resin obtained by converting a condensed novolac of diphenol ketone and formaldehyde into a glycysyl ether represented by the above formula (I), and a diphenol ketone and hydroxybenz resin represented by the above formula (II). These are epoxy resins obtained by converting novolak condensed with formaldehyde into glycituru ethers, and these are polyfunctional epoxy resins containing four or more glycituru ether groups.1 In the present invention, these epoxy resins may be used alone. , a mixture of multiple types can also be used. A curable epoxy resin composition according to the present invention can be obtained using this epoxy resin and tetrabromobisphenol A (abbreviated as TBBA) as main components. Epoxy resin and TBBA each account for 0 to 50% by weight of the total weight.
It is used by dissolving it in a solvent of 50% after dissolution.
Heat to ~150°C to react the epoxy resin and TBBA. TBBA is added to the glycidyl ether group of the epoxy resin through the reaction of the 7-dinol OH group, and can improve the heat resistance of the epoxy resin. As a solvent, it is preferable to use ketones or cellosolves, such as dimethylform7mide (DMF) or dimethyl7set7.
Mido (DM Ac) is unsuitable for use. The blending ratio of TBBA to epoxy resin is the glycidyl ether group of the epoxy resin and the phenolic O of TBBA.
The equivalent ratio with H group is set in the range of 1:1 to 1:0°7. If the blending ratio of TBBA is less than 0.7, there is a risk that the TBBA component will be insufficient and the heat resistance will decrease in terms of properties such as glass transition temperature and open heat resistance.
Furthermore, if the blending ratio of TBBA exceeds 1, TBBA will be excessive and there will be an excess of 7 enolic OH groups, which may result in poor hygroscopicity and even lower heat resistance. Further, in order to promote the curing reaction between the epoxy resin and TBBA, it is preferable to use at least one of imidazoles, amines, and ammoniums as a curing agent. Imidazoles include 2-methylimidazole, 2-ethyl-4-methylimidazole, and 1-bentrue-2-methylimidazole, amines include benzylmethylamine, and ammoniums include tetraethylammonium chloride and tetraethylammonium chloride. can be used. The varnish of the curable epoxy resin composition obtained as described above is supplied to an impregnation device, and a base material such as a glass cloth is immersed to impregnate the base material with the curable epoxy resin composition. Then, by heating and drying this in an open oven or the like, a prepreg is obtained. Furthermore, an electrical laminate can be obtained by stacking several sheets of the prepreg obtained in this way and, if necessary, layering metal foil such as copper foil, and then heating and press-forming this according to a conventional method. It is a monkey. EXAMPLES The present invention will now be illustrated by examples. Epoxy resin and TBBA are combined with methyl ethyl ketone (M E K ) and phenylceronulf (PC) in the formulation shown in Table 1
The epoxy resin and TBBA are reacted by dissolving the TBBA in a 1:1 mixed solvent and heating it under the conditions shown in the reaction conditions column of Table 1, and then a curing agent is added to form a curable epoxy resin composition. Got 7 varnishes of things. Here, in Table 1, [? j (fat 1) is roughenol ketone-formaldehyde condensation/borac glycidyl etherification resin (
Resin of general formula (1)), "Resin 2" is a glycytyl etherified resin of nophenol ketone-hydroxybenzaldehyde condensed novolak (04 resin of general formula (II)). Table 1 shows the gel time at 170°C of the varnish obtained as described above. In addition, in Table 1, the compounding amounts of the epoxy resin and TBBA are shown as the equivalent ratio of the glycitul ether group and the 72/- OH group of both, and 2E4MZ (
The amount of 2-ethyl-4-methylimidazole) is expressed as a percentage of the resin content. A curing agent and a curing accelerator are blended with grain 19 epoxy resin, dissolved in a solvent in the same manner as in Example 1.2 above, and a thickness of 1.
A 6a+m copper-clad laminate was obtained. Regarding the laminate obtained as above, oven heat resistance, #! Foil peeling strength, soldering heat resistance at 288°C, and soldering heat resistance at 288°C after pressure cooker lath (PCT) under conditions of 2 atmospheres, 131°C, and 150 minutes were measured. Epoxy resin and Di
The amount of CY (nocyandiamide) is expressed in parts by weight. A glass base material of type 7628 was immersed in the varnishes prepared in Examples 1 and 2 and Comparative Example as described above to impregnate the glass base material at an impregnation amount of 41% by weight (solid 0% W). A prepreg was obtained by drying this in an oven at 155°C for 8 minutes. 8 sheets of this prepreg were stacked, and copper foil with a thickness of 18μ was stacked on top and bottom of each sheet, and this was molded at a molding pressure of 30 kFi/cm2 and a molding temperature of 170 μm.
By molding under the conditions of ℃ and molding time of 90 minutes, the printed wiring dowel resin shrimp equivalent weight 510g/eq 1st
As can be seen from the results in the table, the heat resistance of each example is generally excellent, whereas the heat resistance of the comparative example using brominated bisphenol A type epoxy resin as the epoxy resin is poor. It is confirmed that this is insufficient.
上述のように本発明のエポキシ樹脂組成物は、一般式が
上記（１）式または（ＩＩ）式で表される少なくとも一
種のエポキシ樹脂と、テトラブロモビスフェノールＡと
を主成分とし、エポキシ樹脂とテトラブロモビス７エ／
−ルＡとの配合比がグリシツルエーテル基とフェノール
性ＯＨ基との当量比で１：１〜１：０．７となるよ）に
配合したものであり、エポキシｍｓのグリシツルエーテ
ル基に７エノール性ＯＨ基が反応してテ１ラプロモピス
フェノールＡが付加し、エビ斗シｍ脂の耐熱性の全般的
な特性を高めることができるものである。As mentioned above, the epoxy resin composition of the present invention contains at least one kind of epoxy resin whose general formula is represented by the above formula (1) or (II), and tetrabromobisphenol A, and contains an epoxy resin and tetrabromobisphenol A. Tetrabromobis7e/
- The equivalent ratio of the glycityl ether group to the phenolic OH group is 1:1 to 1:0.7. The 7-enolic OH group reacts to add teilpromopisphenol A, which can improve the overall heat resistance properties of shrimp and shrimp fat.
Claims (1)
▼） で表される少なくとも一種のエポキシ樹脂と、テトラブ
ロモビスフェノールＡとを主成分とし、エポキシ樹脂と
テトラブロモビスフェノールＡとの配合比がグリシジル
エーテル基とフェノール性ＯＨ基との当量比で１：１〜
１：０．７であることを特徴とする硬化性エポキシ樹脂
組成物。(1) The general formula is expressed as ▲There are mathematical formulas, chemical formulas, tables, etc.▼ or ▲There are mathematical formulas, chemical formulas, tables, etc.▼ (n is 0 to 10, B is ▲There are mathematical formulas, chemical formulas, tables, etc.▼) The main components are at least one kind of epoxy resin and tetrabromobisphenol A, and the blending ratio of the epoxy resin and tetrabromobisphenol A is from 1:1 to the equivalent ratio of glycidyl ether group and phenolic OH group.
A curable epoxy resin composition characterized in that the ratio is 1:0.7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1105115A JPH0641506B2 (en) | 1989-04-25 | 1989-04-25 | Curable epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1105115A JPH0641506B2 (en) | 1989-04-25 | 1989-04-25 | Curable epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02283716A true JPH02283716A (en) | 1990-11-21 |
| JPH0641506B2 JPH0641506B2 (en) | 1994-06-01 |
Family
ID=14398833
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1105115A Expired - Lifetime JPH0641506B2 (en) | 1989-04-25 | 1989-04-25 | Curable epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0641506B2 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889614A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for flame-retardant laminates |
| JPS58122927A (en) * | 1982-01-19 | 1983-07-21 | Yuka Shell Epoxy Kk | Production of prepreg |
| JPS606720A (en) * | 1983-06-03 | 1985-01-14 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | Novel polyglycidyl ether, manufacture and use as thermosettable coating composition |
| JPS61192720A (en) * | 1985-02-22 | 1986-08-27 | Nippon Oil Co Ltd | Resin composition for laminated sheet |
-
1989
- 1989-04-25 JP JP1105115A patent/JPH0641506B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5889614A (en) * | 1981-11-24 | 1983-05-28 | Shin Kobe Electric Mach Co Ltd | Resin composition for flame-retardant laminates |
| JPS58122927A (en) * | 1982-01-19 | 1983-07-21 | Yuka Shell Epoxy Kk | Production of prepreg |
| JPS606720A (en) * | 1983-06-03 | 1985-01-14 | シエル・インタ−ナシヨネイル・リサ−チ・マ−チヤツピイ・ベ−・ウイ | Novel polyglycidyl ether, manufacture and use as thermosettable coating composition |
| JPS61192720A (en) * | 1985-02-22 | 1986-08-27 | Nippon Oil Co Ltd | Resin composition for laminated sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0641506B2 (en) | 1994-06-01 |
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