JPH0228363U - - Google Patents
Info
- Publication number
- JPH0228363U JPH0228363U JP10382488U JP10382488U JPH0228363U JP H0228363 U JPH0228363 U JP H0228363U JP 10382488 U JP10382488 U JP 10382488U JP 10382488 U JP10382488 U JP 10382488U JP H0228363 U JPH0228363 U JP H0228363U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- circuit board
- printed circuit
- cream solder
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 239000006071 cream Substances 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10382488U JPH0228363U (fi) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10382488U JPH0228363U (fi) | 1988-08-04 | 1988-08-04 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0228363U true JPH0228363U (fi) | 1990-02-23 |
Family
ID=31334996
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10382488U Pending JPH0228363U (fi) | 1988-08-04 | 1988-08-04 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0228363U (fi) |
-
1988
- 1988-08-04 JP JP10382488U patent/JPH0228363U/ja active Pending