JPH0227743U - - Google Patents
Info
- Publication number
- JPH0227743U JPH0227743U JP10556988U JP10556988U JPH0227743U JP H0227743 U JPH0227743 U JP H0227743U JP 10556988 U JP10556988 U JP 10556988U JP 10556988 U JP10556988 U JP 10556988U JP H0227743 U JPH0227743 U JP H0227743U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- coated
- die pad
- insulating material
- flat plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011810 insulating material Substances 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10556988U JPH0227743U (fi) | 1988-08-09 | 1988-08-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10556988U JPH0227743U (fi) | 1988-08-09 | 1988-08-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0227743U true JPH0227743U (fi) | 1990-02-22 |
Family
ID=31338303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10556988U Pending JPH0227743U (fi) | 1988-08-09 | 1988-08-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0227743U (fi) |
-
1988
- 1988-08-09 JP JP10556988U patent/JPH0227743U/ja active Pending