JPH0226941U - - Google Patents
Info
- Publication number
- JPH0226941U JPH0226941U JP10539588U JP10539588U JPH0226941U JP H0226941 U JPH0226941 U JP H0226941U JP 10539588 U JP10539588 U JP 10539588U JP 10539588 U JP10539588 U JP 10539588U JP H0226941 U JPH0226941 U JP H0226941U
- Authority
- JP
- Japan
- Prior art keywords
- plate
- resin
- molded product
- embedded
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 10
- 229920005989 resin Polymers 0.000 claims description 10
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Turning (AREA)
- Instrument Panels (AREA)
Description
第１図は、本考案による樹脂成形品の一実施例
としてのインストルメントパネルを示すもので、
そのインストルメントパネルの要部の断面図。第
２図は、そのインストルメントパネルに埋設され
ている部品取付用ブラケツトの斜視図。第３図は
、本考案を適用したインストルメントパネルの他
の例を示す要部の断面図。第４図は、第３図のイ
ンストルメントパネルに埋設されている部品取付
用ブラケツトの斜視図である。
１……インストルメントパネル（樹脂成形品）
、３……樹脂層、３ｂ……突出部（薄肉部）、６
……部品取付用ブラケツト（板状部材）、９，９
′……樹脂流通孔。
FIG. 1 shows an instrument panel as an example of a resin molded product according to the present invention.
FIG. 3 is a cross-sectional view of the main parts of the instrument panel. FIG. 2 is a perspective view of a component mounting bracket embedded in the instrument panel. FIG. 3 is a sectional view of main parts showing another example of an instrument panel to which the present invention is applied. 4 is a perspective view of a component mounting bracket embedded in the instrument panel of FIG. 3. FIG. 1...Instrument panel (resin molded product)
, 3...Resin layer, 3b...Protrusion part (thin wall part), 6
...Bracket for mounting parts (plate-shaped member), 9, 9
'...Resin flow hole.
Claims (1)
ようにして埋設した樹脂成形品であつて； 前記板状部材の露出部近傍を埋設する前記樹脂
層が薄肉とされている、 板状部材を埋設した樹脂成形品。 (2) 前記板状部材の露出部近傍の、前記樹脂層
に埋設されている部分に、その板状部材の両面間
を連通させる樹脂流通孔が設けられている、 請求項１記載の樹脂成形品。[Claims for Utility Model Registration] (1) A resin molded product in which a plate-like member is embedded in a resin layer so that a part of the plate-like member is exposed; A resin molded product with a thin layer and embedded plate-like members. (2) The resin molding according to claim 1, wherein a resin flow hole that communicates between both surfaces of the plate-like member is provided in a portion buried in the resin layer near the exposed part of the plate-like member. Goods.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539588U JPH0226941U (en) | 1988-08-11 | 1988-08-11 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10539588U JPH0226941U (en) | 1988-08-11 | 1988-08-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226941U true JPH0226941U (en) | 1990-02-21 |
Family
ID=31337970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10539588U Pending JPH0226941U (en) | 1988-08-11 | 1988-08-11 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226941U (en) |
-
1988
- 1988-08-11 JP JP10539588U patent/JPH0226941U/ja active Pending
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