JPH02268815A - Membrane module - Google Patents
Membrane moduleInfo
- Publication number
- JPH02268815A JPH02268815A JP8864489A JP8864489A JPH02268815A JP H02268815 A JPH02268815 A JP H02268815A JP 8864489 A JP8864489 A JP 8864489A JP 8864489 A JP8864489 A JP 8864489A JP H02268815 A JPH02268815 A JP H02268815A
- Authority
- JP
- Japan
- Prior art keywords
- membrane module
- resin
- porous
- potting
- porous membrane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012528 membrane Substances 0.000 title claims abstract description 58
- -1 alicyclic amine Chemical class 0.000 claims abstract description 27
- 238000004382 potting Methods 0.000 claims abstract description 23
- 229920005989 resin Polymers 0.000 claims abstract description 23
- 239000011347 resin Substances 0.000 claims abstract description 23
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 150000008117 polysulfides Polymers 0.000 claims abstract description 8
- 229920001021 polysulfide Polymers 0.000 claims abstract description 7
- 239000005077 polysulfide Substances 0.000 claims abstract description 7
- 229920002492 poly(sulfone) Polymers 0.000 claims abstract description 4
- 239000004698 Polyethylene Substances 0.000 claims description 10
- 229920000573 polyethylene Polymers 0.000 claims description 10
- 239000004743 Polypropylene Substances 0.000 claims description 7
- 229920001155 polypropylene Polymers 0.000 claims description 7
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 21
- 239000007788 liquid Substances 0.000 description 15
- 239000012510 hollow fiber Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 9
- 238000001914 filtration Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 238000011417 postcuring Methods 0.000 description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 3
- DMYOHQBLOZMDLP-UHFFFAOYSA-N 1-[2-(2-hydroxy-3-piperidin-1-ylpropoxy)phenyl]-3-phenylpropan-1-one Chemical compound C1CCCCN1CC(O)COC1=CC=CC=C1C(=O)CCC1=CC=CC=C1 DMYOHQBLOZMDLP-UHFFFAOYSA-N 0.000 description 2
- GQWWGRUJOCIUKI-UHFFFAOYSA-N 2-[3-(2-methyl-1-oxopyrrolo[1,2-a]pyrazin-3-yl)propyl]guanidine Chemical compound O=C1N(C)C(CCCN=C(N)N)=CN2C=CC=C21 GQWWGRUJOCIUKI-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 229920001079 Thiokol (polymer) Polymers 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- DZIHTWJGPDVSGE-UHFFFAOYSA-N 4-[(4-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CC(N)CCC1CC1CCC(N)CC1 DZIHTWJGPDVSGE-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- IMUDHTPIFIBORV-UHFFFAOYSA-N aminoethylpiperazine Chemical compound NCCN1CCNCC1 IMUDHTPIFIBORV-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010828 elution Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 229920005862 polyol Polymers 0.000 description 1
- 150000003077 polyols Chemical class 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000002964 rayon Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Landscapes
- Separation Using Semi-Permeable Membranes (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は液体又は気体の纏適用の膜モジュールに関する
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a membrane module for application to a liquid or gas envelope.
流体濾過能力を有する膜モジュールは医療分野、液体及
び気体処理分野などに多く用すられており、最近では耐
熱性、耐薬品性を要求される分野への使用も拡がりつつ
ある。耐熱性の膜としては、例えばポリエーテルスルホ
ン、ポリプロピレンなどがあげられる。しかしながらポ
リエーテルスルホンを素材とした中空糸膜は強伸度に劣
るため激しい液流の中では破断するおそれがある。又、
ポリプロピレン製の膜は熱水を長時間透水すると酸化劣
化によって脆化する。Membrane modules with fluid filtration ability are widely used in the medical field, liquid and gas processing fields, etc., and recently, their use is expanding to fields that require heat resistance and chemical resistance. Examples of the heat-resistant membrane include polyether sulfone and polypropylene. However, hollow fiber membranes made of polyether sulfone are inferior in strength and elongation, so there is a risk of breakage in intense liquid flow. or,
Polypropylene membranes become brittle due to oxidative deterioration when hot water passes through them for a long time.
これらの多孔質ｇｌ／Ｃ対してポリエチレンを素材とし
た多孔質膜は熱水濾過性、耐薬品性に優れている。In contrast to these porous GL/C membranes, porous membranes made of polyethylene have excellent hot water filtration properties and chemical resistance.
しかしポリエチレンは比較的低融点であるため従来はポ
ツティング剤として発熱量の少ないウレタン樹脂しか使
用できず、耐熱性、耐薬品性に優れたエポキシ樹脂等の
ポッテイング剤は硬化発熱温度がポリエチレンの融点近
傍以上となり使用できなかった。この一方、ウレタン樹
脂は耐薬品性に劣るという欠点を有していた。However, since polyethylene has a relatively low melting point, conventionally only urethane resins with a low calorific value could be used as potting agents.Potting agents such as epoxy resins, which have excellent heat and chemical resistance, have curing exothermic temperatures close to the melting point of polyethylene. This made it impossible to use. On the other hand, urethane resins have the disadvantage of poor chemical resistance.
従って、ポリエチレン多孔質膜にもポッテイングでき、
耐熱性、耐薬品性に優れた樹脂の開発が望まれていた。Therefore, it can be potted even on polyethylene porous membranes.
There was a desire to develop a resin with excellent heat resistance and chemical resistance.
本発明はこのよう表状況に鑑みなされたものである。The present invention was made in view of this situation.
本発明の要旨は、膜モジュールケース内に収納された多
数本の多孔質膜の端部と膜モジュールケースとがポッテ
イングされてなる多孔質膜モジュールにおりで、ポッテ
イング剤が分子中にポリサルファイド結合を有するエポ
キシ樹脂反へ′
と脂環式アミンとのＭ物からなる樹脂液であることを特
徴とする多孔質膜モジュールにある。The gist of the present invention is to provide a porous membrane module in which the ends of a large number of porous membranes housed in a membrane module case are potted together, and a potting agent forms a polysulfide bond in the molecule. The present invention provides a porous membrane module characterized in that the resin liquid is composed of an epoxy resin having an epoxy resin and an alicyclic amine.
本発明において分子中〈ポリサルファイド結合を有する
エポキシ樹脂とはポリサルファイド骨格（−８８−）を
主鎖に持つエポキシ樹脂であり、例えば、
（但し、Ｒ：アルキル基Ｃ−＝ｔ〜１０）等の構造式を
持つものを挙げることができる。この樹脂はビスフェノ
ール型エポキシ樹脂に比較して、伸びが大きく接着性の
よい硬化物が得られ、耐熱性、耐薬品性にも優れている
。In the present invention, an epoxy resin having a polysulfide bond in the molecule is an epoxy resin having a polysulfide skeleton (-88-) in the main chain, for example, a structure such as (where R: alkyl group C-=t~10). We can list things that have formulas. Compared to bisphenol-type epoxy resins, this resin has greater elongation and yields a cured product with good adhesive properties, and also has excellent heat resistance and chemical resistance.
上記エポキシ樹脂との硬化剤としては種々のアミン、ア
ミド、酸無水物等が考えられるが、これら硬化剤の中で
脂環式アミンがその硬化挙動（硬化時間、発熱温度等）
忙おいて優れた特性を有しており、ポリエチレン多孔質
膜のポツティング剤としても優れている。Various amines, amides, acid anhydrides, etc. can be considered as curing agents for the above-mentioned epoxy resin, but among these curing agents, alicyclic amines have curing behavior (curing time, exothermic temperature, etc.)
It has excellent properties and is also excellent as a potting agent for polyethylene porous membranes.
脂環式アミンとしては、メンセンジアミン、イソ水ロン
ジアミン、Ｎ−アミノエチルピペラジン、４９−ビス（
３−アミノプロピル）Ｚ４゜ａｌＯ−テトラオキシスピ
ロ（５，５）ウンデカナダクト、ビス（４−アミノ−３
−メチルシクロヘキシル）メタン、ビス（４−アミノシ
クロヘキシル）メタン、４−アミノ−（２，２，４６テ
トラメチル）ピペリジンなどを挙げることができ、これ
らは単独あるいは混合して用いられる。Examples of alicyclic amines include menzendiamine, isohydrondiamine, N-aminoethylpiperazine, and 49-bis(
3-aminopropyl) Z4゜alO-tetraoxyspiro(5,5) undecanacact, bis(4-amino-3
Examples include -methylcyclohexyl)methane, bis(4-aminocyclohexyl)methane, and 4-amino-(2,2,46tetramethyl)piperidine, which may be used alone or in combination.
これらエポキシ樹脂と脂環式アミンとの混合比は分子中
に存在するエポキシ基数とアミン基〜４．０の範囲にあ
ることが好ましく、［１４〜２．５の範囲にあることが
より好ましい。アミン基の混合比が少ないと常温におけ
る硬化時間が長くなり、アミン基の混合比が多すぎると
未反応のアミンが残り溶出等の問題がおこるので好まし
くない。The mixing ratio of these epoxy resins and alicyclic amines is preferably in the range of 4.0 to 4.0, more preferably 14 to 2.5, to the number of epoxy groups present in the molecule. If the mixing ratio of amine groups is too low, the curing time at room temperature will be long, and if the mixing ratio of amine groups is too high, unreacted amines will remain and problems such as elution will occur, which is not preferable.
このようなエポキシ樹脂と脂環式アミンからなる混合液
は初期粘度が２５℃において２０００〜２０００００Ｆ
８程度のものであって、硬化時間は２０時間以内程度で
常温硬化が可能であり、発熱量も低く、ポリエチレン多
孔質膜に対しても容易にポッテイングすることができる
。該樹脂液を常温で硬化したものはそのままでも耐熱性
、耐薬品性はあるが、更に後硬化により架橋構造を密に
すると耐熱性、耐薬品性等を向上させることができる。Such a mixed liquid consisting of an epoxy resin and an alicyclic amine has an initial viscosity of 2,000 to 200,000 F at 25°C.
It can be cured at room temperature within about 20 hours, has a low calorific value, and can be easily potted onto polyethylene porous membranes. Although the resin liquid cured at room temperature has heat resistance and chemical resistance as it is, heat resistance, chemical resistance, etc. can be improved by further making the crosslinked structure denser by post-curing.
尚、後硬化はポリエチレン等の多孔質膜の融点以下の温
度で行うことができる。Note that post-curing can be performed at a temperature below the melting point of the porous membrane such as polyethylene.
膜モジュールケースの素材は特に限定されないが耐熱水
性、耐薬品性に良好なポリプロピレン樹脂、ポリスルホ
ン樹脂等を用することが好ましい。ポリプロピレン樹脂
を膜モジュールケースとして用いる場合は、接着性向上
のためポッテイング部の内表面を表面処理することが望
ましい。The material for the membrane module case is not particularly limited, but it is preferable to use polypropylene resin, polysulfone resin, etc., which have good hot water resistance and chemical resistance. When polypropylene resin is used for the membrane module case, it is desirable to surface-treat the inner surface of the potting part to improve adhesion.
表面処理としては、プラズマ放電処理、コロナ放電処理
、火炎処理、紫外線処理、オゾン処理、クロム混酸処理
、ｎ−ヘキサン処理、ブライマー塗付、表面粗面化、な
どがあυ、これらは単独あるいは併用して用いられる。Surface treatments include plasma discharge treatment, corona discharge treatment, flame treatment, ultraviolet treatment, ozone treatment, chromium mixed acid treatment, n-hexane treatment, brusher coating, surface roughening, etc.These can be used alone or in combination. It is used as
本発明に周込られる多孔質膜としてけ平膜等の多孔質シ
ート状物、中空糸膜等を挙げることができ、膜モジユー
ル構造としては公知のものを挙げることができる。中空
糸膜の場合は、直線状に配置された両端開口型中空糸膜
束の両端部もしくは一端閉鎖型中空糸膜束の開口端部が
ポッテイングされた膜モジュールを、あるｂは８字状に
配置された中空糸膜束の端部がポッテイングされた膜モ
ジュールを挙げることができる。Examples of porous membranes included in the present invention include porous sheet-like materials such as Keira membranes, hollow fiber membranes, etc., and examples of membrane module structures include known ones. In the case of hollow fiber membranes, a membrane module in which both ends of a linearly arranged hollow fiber membrane bundle with both ends open or the open end of a hollow fiber membrane bundle with one end closed are potted is used in a figure 8 shape. Examples include membrane modules in which the ends of arranged hollow fiber membrane bundles are potted.
又、ポッテイング方法としては公知の方法を用いること
ができ、例えば樹脂液を静置下で流しこむ方法、遠心力
を作用させつつ流しこむ方法等を挙げることができる。Further, as the potting method, a known method can be used, such as a method of pouring the resin liquid while standing still, a method of pouring the resin liquid while applying centrifugal force, and the like.
以下、実施例により本発明を説明する。The present invention will be explained below with reference to Examples.
実施例又は比較例において水漏れ検査としては、中空糸
膜の外側からまず水圧１ ｋｇ／ｅｗｒ”を３分間かけ
、次いで２ ｋｇ７ｃｍ”、３に９／ｌｙ＊”、４ゆ／
ｃｒｎ！、５ｋｌｌ／ｍ” と上昇させて各３分間ず
つ保持する方法を採用した。In the Examples and Comparative Examples, water leakage was tested by first applying a water pressure of 1 kg/ewr for 3 minutes from the outside of the hollow fiber membrane, then applying a water pressure of 2 kg/ewr, 3 to 9/ly*, and 4 y/e
crn! , 5 kll/m'' and held for 3 minutes each.
実施例１
内径２０ＩＩＩｌｌφ、長さ１００ｍのポリプロピレン
製ケース内にポリエチレン製多孔質中空糸膜ＫＥＩＦ−
４１００（三菱レイヨン■製）を８字状に束ねて収納し
、遠心力作用下その端部に樹脂液を流した。樹脂液とし
ては分子中にポリサルファイド結合を有するエポキシ樹
脂として東しチオコール■製フレツブ１０（エポキシ当
量１６０）３６０重量部と、脂環式アミンとして日本化
薬■製カヤポンドｃ−９ｏｏ（アミン当量４５）４５重
量部からなる樹脂液を用いた。Example 1 A polyethylene porous hollow fiber membrane KEIF- was placed in a polypropylene case with an inner diameter of 20IIIllφ and a length of 100 m.
4100 (manufactured by Mitsubishi Rayon ■) were bundled into a figure-eight shape and stored, and a resin liquid was poured into the ends under the action of centrifugal force. As the resin liquid, 360 parts by weight of Fretsubu 10 (epoxy equivalent weight 160) manufactured by Toshi Thiokol ■ is used as an epoxy resin having a polysulfide bond in the molecule, and Kayapon C-9oo manufactured by Nippon Kayaku ■ (amine equivalent weight 45) is used as the alicyclic amine. A resin liquid consisting of 45 parts by weight was used.
ポッテイングの幅は１５ｍとし、モジュールケースはポ
ッテイングされる部分の内表面を予め火炎処理して使用
した。樹脂は室温で２４時間放置して硬化させ、続いて
６０℃で５時間、更に９０℃で５時間保持して後硬化を
行った。次いでポッテイング部をカットして膜モジュー
ルを得、漏れ検査を実施したところ５ ｋｇ／ｃｒｍ！
まで水の漏れは全く見られなかった。The width of the potting was 15 m, and the inner surface of the module case to be potted was treated with flame in advance. The resin was left to cure at room temperature for 24 hours, then held at 60° C. for 5 hours and then at 90° C. for 5 hours for post-curing. Next, the potting part was cut to obtain a membrane module, and a leakage test was performed and the result was 5 kg/cr!
No water leakage was observed at all.
又、ポッテイング剤中に固定されたポリエチレン多孔質
膜は溶融しておらず、従来のウレタン樹脂によるポッテ
イングと同等の性状を示していた。Moreover, the polyethylene porous membrane fixed in the potting agent was not melted, and exhibited properties equivalent to those of conventional potting with urethane resin.
この膜モジュールを用いて水温９０℃の水を差８Ｅ１
ｋｇ／ｃｍ”で２００時間濾過した後膜モジュールを乾
燥させ、再度水漏れ検査を行ったが、水の漏れは全く見
られなかった。Using this membrane module, water at a temperature of 90°C is heated to 8E1.
After filtration for 200 hours at "kg/cm", the membrane module was dried and tested for water leakage again, but no water leakage was observed.
実施例２〜９
第１表に示すエポキシ樹脂と脂環式アミンからなる樹脂
液と、ポリスルホン製又は′ポッテイング部が表面処理
されたポリプロピレン製の膜モジュールケースを周込、
実施例１と同様にしてポッテイング処理し、膜モジュー
ルヲ得り。Examples 2 to 9 A resin liquid consisting of an epoxy resin and an alicyclic amine shown in Table 1 was enclosed in a membrane module case made of polysulfone or polypropylene whose potting part had been surface-treated,
A membrane module was obtained by potting treatment in the same manner as in Example 1.
尚、実施例２ではポリサルファイド結合を有するエポキ
シ樹脂として東しチオコール■製フレツデ５０（エポキ
シ当量３３０）を、又、実施これらの膜モジュールにつ
いて水漏れ検査を実施したところ水漏れは全くなかった
。In Example 2, Fretsude 50 (epoxy equivalent: 330) manufactured by Toshi Thiokol ■ was used as the epoxy resin having a polysulfide bond, and a water leakage test was performed on these membrane modules, and no water leakage was found.
続いて第１表の右欄に示す濾過条件、即ち、９０℃の水
（蒸留水）、６０℃の２０４ ＮａＯＨ液（実施例７）
６０℃の２０係Ｈ鵞ＳＯ４液（実施例８）、もしくは２
５℃の９８憾エタノール液（実施例９）を差圧’ ｋｇ
７ｃｍ”で２００時間濾過するととによって、耐熱水性
、耐薬品性等を評価した。又、実施例５では１２１℃、
３０分間のスチーム滅菌処理を１０回繰り返した。Next, the filtration conditions shown in the right column of Table 1 were applied, namely, water at 90°C (distilled water), 204 NaOH solution at 60°C (Example 7)
20% H-SO4 solution at 60°C (Example 8) or 2
The 98% ethanol solution (Example 9) at 5°C was heated to a differential pressure of 'kg'.
Hot water resistance, chemical resistance, etc. were evaluated by filtering for 200 hours at 7 cm". In addition, in Example 5, 121 ° C.
Steam sterilization treatment for 30 minutes was repeated 10 times.
これらの処理後に再度水漏れ検査を実施したところ水漏
れは全くなかった。After these treatments, a water leak test was conducted again and no water leaks were found.
比較例１
日本ポリウレタン■製のコロネート４４０３（イソシア
ネート）５８重量部とニラポラン４２２１ （ポリオー
ル）４２重量部からなるポリウレタン系の樹脂液を用い
実施例１と同様にしてポツティング処理して膜モジュー
ルを得た。Comparative Example 1 A membrane module was obtained by potting in the same manner as in Example 1 using a polyurethane resin liquid consisting of 58 parts by weight of Coronate 4403 (isocyanate) manufactured by Nippon Polyurethane and 42 parts by weight of Niraporan 4221 (polyol). .
９０℃の熱水濾過後、水漏れ検査を実施したところ水圧
１ ｋｇ７ｃｍ”で水漏れが生じた。After filtration with hot water at 90°C, a water leak test was conducted and water leakage occurred at a water pressure of 1 kg 7 cm.
比較例２
油化シェルエポキシ■製エピコート８２８（エポキシ当
−１に１９Ｑ、ビスフェノールＡ５エポキシ樹脂）１９
０重量部とカヤボンドＣ−９００，４５重量部からなる
樹脂液を用い、その他の条件は実施例１と同様にして常
温でポッテイング処理したところ、その途中で中空糸膜
が溶融した。Comparative Example 2 Epicoat 828 manufactured by Yuka Shell Epoxy ■ (19Q in epoxy weight-1, bisphenol A5 epoxy resin) 19
When potting treatment was carried out at room temperature under the same conditions as in Example 1 using a resin liquid consisting of 0 parts by weight and 45 parts by weight of Kayabond C-900, the hollow fiber membranes melted during the potting process.
比較例３
フレツブ１０．５６０重量部と油化シェルエポキシ■製
エピキュアＴ−１（アミン当ｉ７０、脂肪族アミン）７
３重量部からなる樹脂液を用い、その他の条件は実施例
１と同様にして常温でポッテイング処理したところ、そ
の途中で中空糸膜が溶融した。Comparative Example 3 10.560 parts by weight of Fretub and Epicure T-1 manufactured by Yuka Shell Epoxy ■ (i70 per amine, aliphatic amine) 7
When potting was carried out at room temperature using a resin liquid containing 3 parts by weight and under the same conditions as in Example 1, the hollow fiber membranes melted during the potting process.
実施例の結果から明らかなように、本発明の膜モジュー
ルはポツティング部の接着性が良好であり、耐熱性、耐
薬品性が優れている。As is clear from the results of the Examples, the membrane module of the present invention has good adhesion at the potting part and excellent heat resistance and chemical resistance.
Claims (1)
膜の端部と膜モジュールケースとがポッテイングされて
なる多孔質膜モジュールにおいて、該ポツテイング剤が
分子中にポリサルファイド結合を有するエポキシ樹脂と
脂環式アミンとの反応物からなる樹脂であることを特徴
とする多孔質膜モジュール。 ２）膜モジュールケースがポリスルホン樹脂製又はポツ
テイング部が表面処理されたポリプロピレン樹脂製であ
ることを特徴とする請求項１の多孔質膜モジュール。 ３）多孔質膜がポリエチレンである請求項１の多孔質膜
モジュール。[Claims] 1) In a porous membrane module in which the ends of a large number of porous membranes housed in a membrane module case are potted together with the membrane module case, the potting agent has a polysulfide bond in the molecule. A porous membrane module characterized in that the resin is made of a reaction product of an epoxy resin having the following and an alicyclic amine. 2) The porous membrane module according to claim 1, wherein the membrane module case is made of polysulfone resin or the potting portion is made of surface-treated polypropylene resin. 3) The porous membrane module according to claim 1, wherein the porous membrane is polyethylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8864489A JPH02268815A (en) | 1989-04-07 | 1989-04-07 | Membrane module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8864489A JPH02268815A (en) | 1989-04-07 | 1989-04-07 | Membrane module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02268815A true JPH02268815A (en) | 1990-11-02 |
Family
ID=13948530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8864489A Pending JPH02268815A (en) | 1989-04-07 | 1989-04-07 | Membrane module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02268815A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000342934A (en) * | 1999-04-02 | 2000-12-12 | Mitsubishi Rayon Co Ltd | Hollow fiber membrane module, potting agent thereof and degassing method for chemical solution |
| JP2003164735A (en) * | 2001-11-29 | 2003-06-10 | Nok Corp | Hollow fiber membrane module |
| JP6094678B2 (en) * | 2014-06-04 | 2017-03-15 | 三菱レイヨン株式会社 | Potting material for membrane module and hollow fiber membrane module using the same |
| JPWO2018030356A1 (en) * | 2016-08-08 | 2019-04-25 | 旭化成株式会社 | Membrane module for gas separation |
-
1989
- 1989-04-07 JP JP8864489A patent/JPH02268815A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000342934A (en) * | 1999-04-02 | 2000-12-12 | Mitsubishi Rayon Co Ltd | Hollow fiber membrane module, potting agent thereof and degassing method for chemical solution |
| JP4550216B2 (en) * | 1999-04-02 | 2010-09-22 | 三菱レイヨン株式会社 | Hollow fiber membrane module, potting material thereof and method for degassing chemical solution |
| JP2003164735A (en) * | 2001-11-29 | 2003-06-10 | Nok Corp | Hollow fiber membrane module |
| JP6094678B2 (en) * | 2014-06-04 | 2017-03-15 | 三菱レイヨン株式会社 | Potting material for membrane module and hollow fiber membrane module using the same |
| JPWO2015186705A1 (en) * | 2014-06-04 | 2017-04-20 | 三菱レイヨン株式会社 | Potting material for membrane module and hollow fiber membrane module using the same |
| US10005041B2 (en) | 2014-06-04 | 2018-06-26 | Mitsubishi Chemical Corporation | Potting material for membrane modules and hollow fiber membrane module using same |
| JPWO2018030356A1 (en) * | 2016-08-08 | 2019-04-25 | 旭化成株式会社 | Membrane module for gas separation |
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