JPH02264941A - Resin for molding spool of photographic film cartridge and manufacture of the same - Google Patents
Resin for molding spool of photographic film cartridge and manufacture of the sameInfo
- Publication number
- JPH02264941A JPH02264941A JP8574889A JP8574889A JPH02264941A JP H02264941 A JPH02264941 A JP H02264941A JP 8574889 A JP8574889 A JP 8574889A JP 8574889 A JP8574889 A JP 8574889A JP H02264941 A JPH02264941 A JP H02264941A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- fatty acid
- polystyrene resin
- molding
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 44
- 239000011347 resin Substances 0.000 title claims abstract description 44
- 238000000465 moulding Methods 0.000 title claims abstract description 32
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005990 polystyrene resin Polymers 0.000 claims abstract description 42
- 239000000194 fatty acid Substances 0.000 claims abstract description 32
- 235000014113 dietary fatty acids Nutrition 0.000 claims abstract description 23
- 229930195729 fatty acid Natural products 0.000 claims abstract description 23
- 150000004665 fatty acids Chemical class 0.000 claims abstract description 22
- 239000000203 mixture Substances 0.000 claims abstract description 13
- 238000002156 mixing Methods 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims description 30
- 238000004898 kneading Methods 0.000 claims description 4
- 239000004793 Polystyrene Substances 0.000 abstract description 11
- 229920002223 polystyrene Polymers 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract description 2
- 235000021588 free fatty acids Nutrition 0.000 abstract description 2
- 239000006229 carbon black Substances 0.000 description 20
- 239000000843 powder Substances 0.000 description 19
- 239000008188 pellet Substances 0.000 description 14
- 229920001296 polysiloxane Polymers 0.000 description 13
- 150000001875 compounds Chemical class 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 239000000047 product Substances 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 5
- RKISUIUJZGSLEV-UHFFFAOYSA-N n-[2-(octadecanoylamino)ethyl]octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(=O)NCCNC(=O)CCCCCCCCCCCCCCCCC RKISUIUJZGSLEV-UHFFFAOYSA-N 0.000 description 5
- -1 quality Substances 0.000 description 4
- 238000010557 suspension polymerization reaction Methods 0.000 description 4
- 230000035900 sweating Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010559 graft polymerization reaction Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 206010067482 No adverse event Diseases 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012662 bulk polymerization Methods 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- UQLDLKMNUJERMK-UHFFFAOYSA-L di(octadecanoyloxy)lead Chemical compound [Pb+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O UQLDLKMNUJERMK-UHFFFAOYSA-L 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 230000003472 neutralizing effect Effects 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 229940037312 stearamide Drugs 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、写真フィルムパトローネのスプール用の新規
な成形樹脂及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a novel molding resin for a spool of a photographic film cartridge and a method for manufacturing the same.
写真フィルムのパトローネ用スプールの基材樹脂は、外
観、成形寸法安定性1強度、耐熱性等の点からポリスチ
レン樹脂が使われている。一般にはブタジェンゴム等の
合成ゴムをスチレン系モノマーにグラフト重合した耐衝
撃性ポリスチレン樹脂(以下旧PSということもある)
と一般用ポリスチレン樹脂(以下GPPSということも
ある)をブレンドした樹脂が使われている。Polystyrene resin is used as the base resin for spools for photographic film cartridges due to its appearance, molding dimensional stability, strength, and heat resistance. Generally, impact-resistant polystyrene resin (hereinafter sometimes referred to as old PS) is made by graft polymerizing synthetic rubber such as butadiene rubber to styrene monomer.
A blend of general purpose polystyrene resin (hereinafter also referred to as GPPS) is used.
GPPSだけで構成した場合、堅くてもろい樹脂の物性
により、成形の際の離型時の突出しによるスプールの破
損、フィルム巻込工程への自動搬送時の破損が生じ、ま
たフィルムを使うユーザーが誤って落した時に破損しや
すい等の問題があるため、 GPPSのみではスプール
の樹脂としては不適である。一方、 HIPSのみの場
合は、 GPPSに比べ高価でありコスト上問題である
。When composed only of GPPS, due to the hard and brittle physical properties of the resin, the spool may be damaged due to protrusion during mold release, damage may occur during automatic transport to the film winding process, and the user may accidentally use the film. GPPS alone is not suitable as a spool resin because it is easily damaged when dropped. On the other hand, using only HIPS is more expensive than GPPS and poses a cost problem.
このような理由でGPPSと旧PSの混合品が基材樹脂
として使われている。For this reason, a mixture of GPPS and old PS is used as the base resin.
GPPSと旧PSの混合比率は、写真用スプールの用途
やそれぞれの樹脂のもつ物性、特に旧Psのゴム量、質
9粒径等により変化することから、特に規定されるもの
ではない。The mixing ratio of GPPS and old PS is not particularly specified, as it varies depending on the use of the photographic spool and the physical properties of each resin, especially the amount of rubber, quality, particle size, etc. of old PS.
写真用スプールには光によって被りが生じる感光フィル
ムを装填していることから当然遮光性が必要となり、そ
のためカーボンブラック粉体が添加されている。また2
スプールの外側に設けであるパトローネ各部との摩擦抵
抗によるフィルム引出抵抗力の増加を減らすために実公
昭81−3000号に記載しであるように、成形樹脂に
潤滑剤を練り込む技術があり、特に樹脂にシリコーンを
練り込む場合はを効である。Since a photographic spool is loaded with a photosensitive film that is subject to fogging due to light, it naturally requires light-shielding properties, and for this purpose carbon black powder is added. Also 2
In order to reduce the increase in film pull-out resistance due to frictional resistance with various parts of the cartridge provided on the outside of the spool, there is a technique to knead a lubricant into the molded resin, as described in Utility Model Publication No. 81-3000. This is especially effective when kneading silicone into resin.
特開昭83−318553号公報は、写真フィルムパト
ローネのスプール用成形樹脂製造方法について記載され
ている。この方法で用いられるポリスチレン樹脂は、連
続塊状重合、懸濁重合等により得ることができる。懸濁
重合でのポリスチレンは。JP-A-83-318553 describes a method for manufacturing a molded resin for a spool of a photographic film cartridge. The polystyrene resin used in this method can be obtained by continuous bulk polymerization, suspension polymerization, etc. Polystyrene in suspension polymerization.
プロセス上0.2〜1 mm径の粒子状で得られる。粒
子状のGPPSと旧PSの混合は例えばヘンシェルミキ
サー等の混合機に所定の割合でGPPSと旧PSを入れ
撹拌混合される。その際、混合を均一にする為に高級脂
肪酸の金属塩が添加される。この高級脂肪酸の金属塩は
、混練された樹脂を成形する際の離型剤も兼ねさせると
ころからステアリン酸亜鉛が多用されている。Due to the process, it is obtained in the form of particles with a diameter of 0.2 to 1 mm. Particulate GPPS and old PS are mixed by putting GPPS and old PS at a predetermined ratio into a mixer such as a Henschel mixer, and stirring the mixture. At this time, metal salts of higher fatty acids are added to ensure uniform mixing. Zinc stearate is often used as the metal salt of higher fatty acids because it also serves as a mold release agent when molding the kneaded resin.
しかし、高級脂肪酸の金属塩を含有したスチレン樹脂を
成形すると、高級脂肪酸が金型に付着し、成形品に転着
したり、金型を腐蝕させたりする欠点がある。However, when a styrene resin containing a metal salt of a higher fatty acid is molded, there is a drawback that the higher fatty acid adheres to the mold, transfers to the molded product, or corrodes the mold.
多くの場合、金型付着物は、いわゆるスウエツティング
成分と、高級脂肪酸の金属塩が熱分解した高級脂肪酸の
混合物である。スウエツティング成分とは、樹脂中に含
まれる流動パラフィンや樹脂の低分子量領域成分が加熱
により分解し金型表面で液化したものである。従って、
金型付着物は液状体の外観を示す。スウエツティング成
分は常温においては数時間で蒸発するため、金型付着物
が成形品に転着付着した場合、初めの液状体から次第に
高級脂肪酸が析出してシミ状となって残る。In many cases, mold deposits are a mixture of so-called sweating components and higher fatty acids resulting from thermal decomposition of metal salts of higher fatty acids. The sweating component is liquid paraffin contained in the resin and components in the low molecular weight range of the resin that are decomposed by heating and liquefied on the surface of the mold. Therefore,
Mold deposits give the appearance of a liquid. The sweating component evaporates in a few hours at room temperature, so when mold deposits are transferred and adhered to the molded product, higher fatty acids gradually precipitate from the initial liquid and remain in the form of a stain.
写真フィルム用スプールに転着した金型付着物は、フィ
ルムを巻込む工程において前記スプールより分離し2巻
込機を汚染し、ついには写真フィルムにも再転着し、製
品機能を失なわせるという問題点が生じる。これを防止
するため、金型付着物が成形品に付着しないように頻繁
に金型の表面を掃除すれば生産性が低下するという問題
点が生じる。The mold deposits that have transferred to the photographic film spool separate from the spool during the film winding process, contaminate the winding machine, and eventually transfer to the photographic film again, causing the product to lose its functionality. A problem arises. In order to prevent this, if the surface of the mold is frequently cleaned to prevent mold deposits from adhering to the molded product, a problem arises in that productivity decreases.
本発明の目的は、上記従来技術の問題点を改良した写真
フィルムパトローネのスプール用成形樹脂及びその製造
方法を提供することである。An object of the present invention is to provide a molding resin for a spool of a photographic film cartridge and a method for manufacturing the same, which improves the problems of the prior art described above.
本発明によれば2次の写真フィルムパトローネのスプー
ル用成形樹脂及びその製造方法により上記目的を達成す
ることができる。According to the present invention, the above object can be achieved by a molding resin for a spool of a secondary photographic film cartridge and a method for manufacturing the same.
■ 一般用ポリスチレン樹脂と耐衝撃用ポリスチレン樹
脂の混練物中に、ビス脂肪酸アミドが分散して成ること
を特徴とする写真フィルムパトローネのスプール用成形
樹脂。■ A molded resin for spools of photographic film cartridges, which is characterized by having bis-fatty acid amide dispersed in a mixture of general-use polystyrene resin and impact-resistant polystyrene resin.
■ 一般用ポリスチレン樹脂粒子と耐衝撃用ポリスチレ
ン樹脂粒子をビス脂肪酸アミドとともに混合し溶融混練
してビス脂肪酸アミドが分散したポリスチレン樹脂混練
物を得ることを特徴とする写真フィルムパトローネのス
プール用成形樹脂の製造方法。■ A molding resin for the spool of a photographic film cartridge characterized by mixing general-use polystyrene resin particles and impact-resistant polystyrene resin particles with bis-fatty acid amide and melt-kneading to obtain a polystyrene resin kneaded product in which bis-fatty acid amide is dispersed. Production method.
スプール用成形樹脂中のビス脂肪酸アミドは。 Bis fatty acid amide in the molding resin for spools.
金型で成形する際の離型剤として作用し、加熱時に高級
脂肪酸の金属塩より揮発しにくい。これは、ビス脂肪酸
アミドが、共有結合のみを有しイオン結合を有さず、高
級脂肪酸の金属塩とは構造上で異なっていること、及び
遊離脂肪酸がないことに由来する。その為金型に付着す
るものは前記スウエツティング成分がほとんどとなり揮
発しゃすく又、汚れも少なくなる。It acts as a mold release agent during molding, and is less volatile than metal salts of higher fatty acids when heated. This is because bis fatty acid amides have only covalent bonds and no ionic bonds, and are structurally different from metal salts of higher fatty acids, and also because they do not have free fatty acids. Therefore, most of what adheres to the mold is the sweating component, which evaporates and reduces staining.
また、一般用ボ°リスチレン樹脂粒子と耐衝撃用ポリス
チレン樹脂粒子の混合時には、ビス脂肪酸アミドが前記
粒子の摩擦を減するので十分良好に混合できる。Furthermore, when mixing the general-use polystyrene resin particles and the impact-resistant polystyrene resin particles, the bis fatty acid amide reduces the friction of the particles, so that they can be mixed well.
本発明のスプール用成形樹脂は、カーボンブラック粉体
を含有し、好ましくは、さらにシリコーン化合物を含有
する。The molding resin for a spool of the present invention contains carbon black powder, and preferably further contains a silicone compound.
本発明のスプール用成形樹脂の製造方法においては、カ
ーボンブラック粉体及びシリコーン化合物を添加するこ
とができる。In the method for producing a molded resin for a spool according to the present invention, carbon black powder and a silicone compound can be added.
ビス脂肪酸アミドは、融点140℃以上のものが好まし
く、具体的にはN−N’ −エチレンビスステアロアミ
ド等である。この構造を次に示す。The bis fatty acid amide preferably has a melting point of 140° C. or higher, and specifically includes N-N'-ethylene bis stearamide. This structure is shown below.
CH−NHCO−C17H35
CH−NHCOφC17H35
ビス脂肪酸アミドは、一般用ポリスチレン樹脂粒子と耐
衝撃用ポリスチレン樹脂粒子の混合時に、前記粒子の摩
擦を減じ良好に混合できる範囲の量を添加する。好まし
くは、成形樹脂の総重量において0.03〜0.1重量
%含有するように添加する。0.03重量%未満の場合
にはその作用が明瞭でないことがあり、0.1重量%を
越える場合には混合後の混練及び成形工程で混線機及び
成形機のスクリユーがスリップすることがある。ビス脂
肪酸アミドは1例えば、200メツシユバスの粒子を9
0%以上含有するものを混合させることができる。CH-NHCO-C17H35 CH-NHCOφC17H35 Bis fatty acid amide is added in an amount within a range that reduces friction of the particles and allows good mixing when mixing general polystyrene resin particles and impact-resistant polystyrene resin particles. Preferably, it is added in an amount of 0.03 to 0.1% by weight based on the total weight of the molding resin. If it is less than 0.03% by weight, the effect may not be clear, and if it exceeds 0.1% by weight, the screws of the mixer and molding machine may slip during the kneading and molding processes after mixing. . Bis fatty acid amide is 1. For example, 200 mesh particles are 9
Those containing 0% or more can be mixed.
耐衝撃用ポリスチレン樹脂は1例えばブタジェン、イソ
プレン、クロロブレン等の共役1.3ジ工ン重合体、ス
チレンーブタジェン共重合ゴム2ブチルゴム等のゴムの
1種又は2種以上をスチレン系単量体にグラフト重合し
て得られた樹脂であり、一般用ポリスチレン樹脂に比較
して耐衝撃性を有するポリスチレン樹脂である。一般用
ポリスチレン樹脂は、スチレン系単量体を重合したポリ
スチレン樹脂である。The impact-resistant polystyrene resin is made of one or more rubbers such as conjugated 1.3 diene polymers such as butadiene, isoprene, and chlorobrene, styrene-butadiene copolymer rubber, 2-butyl rubber, etc., and styrenic monomers. It is a resin obtained by graft polymerization of polystyrene resin, and is a polystyrene resin that has higher impact resistance than general polystyrene resin. General-purpose polystyrene resin is a polystyrene resin obtained by polymerizing styrene monomers.
カーボンブラック粉体は遮光性確保のために添加するも
のである。カーボンブラック粉体の添加量はスプール各
部の肉厚の中で最も薄い部分がどの位いかによって決定
されるが、−船釣には成形樹脂の総ffi量に対し0,
1〜1重二%で遮光性は確保される。通常の35mm写
真フィルム用のスプールにおいては、0.2〜1重量%
添加される。好ましいカーボンブラック粉体は、遮光性
、写真フィルムへの悪作用(被りの発生、感度低下、接
着等)のない点から平均粒子径が15〜120mu、
P H5〜9より好ましくはPH6〜8のオイルファ
ーネスカーボンブラック粉体である。Carbon black powder is added to ensure light-shielding properties. The amount of carbon black powder added is determined by the thickness of the thinnest part of each part of the spool.
Light-shielding properties are ensured at 1 to 1% by weight. In a spool for regular 35mm photographic film, 0.2 to 1% by weight.
added. Preferred carbon black powders have an average particle diameter of 15 to 120 mu, from the viewpoint of light blocking properties and no adverse effects on photographic films (occurrence of fogging, decrease in sensitivity, adhesion, etc.).
An oil furnace carbon black powder having a pH of 6 to 8 is more preferable than a pH of 5 to 9.
カーボンブラック粉体は、好ましくは、マスターパッチ
ベレットにして添加できる。このマスターパッチペレッ
トは1例えば、 GPPS粒子と128粒子をビス脂肪
酸アミドとともに混合する際に添加できる。マスターパ
ッチベレットのベース樹脂としては2例えば旧PS又は
GPPSを単独で用いることができ、また、これらの混
合物を用いることもできる。The carbon black powder can preferably be added as a master patch pellet. The master patch pellets can be added, for example, when mixing GPPS particles and 128 particles with bis fatty acid amide. As the base resin for the master patch pellet, 2, for example old PS or GPPS, can be used alone, or a mixture thereof can also be used.
一般用ボリスチレン樹脂粒子としては、懸濁重合等によ
って得られる粒子を用いることができ。As the general-use polystyrene resin particles, particles obtained by suspension polymerization or the like can be used.
この粒子の粒径は例えば0.2〜IIL11程度である
。The particle size of these particles is, for example, about 0.2 to IIL11.
耐衝撃用ポリスチレン樹脂粒子としては、グラフト重合
等によって得られる粒子を用いることができ、この粒子
の粒径は例えば0.2〜工關程度である。As the impact-resistant polystyrene resin particles, particles obtained by graft polymerization or the like can be used, and the particle size of these particles is, for example, about 0.2 to 1.5 mm.
これらの粒子をビス脂肪酸アミドとともに混合する場合
2例えばヘンシェルミキサ等の装置を用いることができ
る。得られた混合物は1例えば一軸又は二軸の混練機に
より溶融混練して、ビス脂肪酸アミドが分散したポリス
チレン樹脂混練物を得る。この混線物は、ベレットとし
て得ることができる。例・えば、直径又は−辺が2〜5
IDIの球状1円柱形状のペレットにすることができる
。When these particles are mixed with the bis fatty acid amide, a device such as a Henschel mixer can be used. The obtained mixture is melt-kneaded using, for example, a single-screw or twin-screw kneader to obtain a kneaded polystyrene resin in which bis fatty acid amide is dispersed. This mixer can be obtained as a pellet. For example, the diameter or side is 2 to 5
IDI can be made into spherical and cylindrical pellets.
前記混線物へカーボンブラック粉体を分散させる場合、
好ましくは、カーボンブラック粉体を含有するマスター
パッチペレットを前記混線物に混合し分散させることに
よって行なう。この場合。When dispersing carbon black powder into the mixed material,
Preferably, this is carried out by mixing and dispersing master patch pellets containing carbon black powder into the mixture. in this case.
カーボンブラック粉体をより良好に分散させるためステ
アリン酸亜鉛等の高級脂肪酸金属塩を添加する場合があ
るが、金型への付着防止のため成形樹脂の総重量に対し
0.05重量%以下(好ましくは0.03重量%以下)
にする。Higher fatty acid metal salts such as zinc stearate may be added to better disperse the carbon black powder, but in order to prevent it from adhering to the mold, it should not exceed 0.05% by weight (based on the total weight of the molding resin). (preferably 0.03% by weight or less)
Make it.
本発明の成形樹脂には、パトローネ各部との摩擦抵抗に
よるフィルム引出抵抗力を減らすためにシリコーン化合
物を含有させることもできる。シリコーン化合物は金型
との離型剤としても作用する。好ましくは、成形樹脂総
重量において0.5〜2重量%含有させる。好ましいシ
リコーン化合物は、ジメチルシロキサン構造のシリコー
ンオイルである。その構造は次のとおりである。The molding resin of the present invention can also contain a silicone compound in order to reduce the resistance force for drawing out the film due to frictional resistance with each part of the cartridge. The silicone compound also acts as a mold release agent. Preferably, it is contained in an amount of 0.5 to 2% by weight based on the total weight of the molding resin. A preferred silicone compound is a silicone oil having a dimethylsiloxane structure. Its structure is as follows.
(nは1以上の整数)
シリコーン化合物の添加は2例えば、ビス詣肪酸アミド
が分散したポリスチレン樹脂(一般用及び耐衝撃用の双
方を含む)混線物に直接添加することができ、また、予
め高濃度に含有させたマスターパッチベレットとして所
定量添加することもできる。あるいは、カーボンブラッ
ク粉体(好ましくはマスターパッチベレットにする)の
分散と同時に前記添加を行ない分散させることができ。(n is an integer of 1 or more) The silicone compound can be added, for example, directly to a polystyrene resin (including both general and impact resistant) mixed materials in which bisamide fatty acid amide is dispersed, and It can also be added in a predetermined amount as a master patch pellet containing a high concentration in advance. Alternatively, the addition can be carried out and dispersed simultaneously with the dispersion of carbon black powder (preferably in the form of master patch pellets).
カーボンブラック粉体の分散後に添加し分散させること
もできる。It can also be added and dispersed after the carbon black powder is dispersed.
本発明の成形樹脂において、一般用ポリスチレン樹脂(
GPPS)と耐衝撃用ポリスチレン樹脂(IIIPs)
の含有率は、耐衝撃用ポリスチレン樹脂の物性によって
変えることができるが、−船釣には旧PSを5重量%以
上含有させる。In the molding resin of the present invention, general polystyrene resin (
GPPS) and impact-resistant polystyrene resin (IIIPs)
Although the content can be changed depending on the physical properties of the impact-resistant polystyrene resin, - for boat fishing, 5% by weight or more of old PS is included.
尚1本発明の成形樹脂中には必要により適宜各種の添加
剤を配合することができる。例えば酸化防止剤、光安定
剤、紫外線吸収剤、核剤、帯電防止剤9分散剤、滑剤、
中和剤、酸捕捉剤、無機充填剤等である。これらの添加
剤は2例えば、カーボンブラック粉体やシリコーン化合
物をマスターパッチベレットにしてポリスチレン樹脂中
に分散させる際に、このマスターパッチベレットに配合
してポリスチレン樹脂中に分散させることができる。Additionally, various additives may be appropriately blended into the molding resin of the present invention, if necessary. For example, antioxidants, light stabilizers, ultraviolet absorbers, nucleating agents, antistatic agents, dispersants, lubricants,
These include neutralizing agents, acid scavengers, and inorganic fillers. For example, when carbon black powder or a silicone compound is made into a master patch pellet and dispersed in a polystyrene resin, these additives can be added to the master patch pellet and dispersed in the polystyrene resin.
実施例1
懸濁重合によって得られた一般用ポリスチレン樹脂粒子
(粒径0.2〜1mm)及び耐衝撃用ポリスチレン樹脂
粒子(粒径0.2〜1關)を7:3の割合でエチレンビ
スステアロアミド(アルフローH−50丁 日本油脂
製)を添加して混合し、2軸押出機にて溶融混線を行な
いエチレンビスステアロアミドが分散したポリスチレン
樹脂ベレットを得た。このポリスチレン樹脂ベレットに
、別途得られたカーボンブラック含有マスターパッチベ
レット及びシリコーン含有マスターパッチベレットを混
合し溶融混練して本発明の成形樹脂を得た。この成形樹
脂には、エチレンビスステアロアミド0.1重量%、カ
ーボンブラック粉体0,5重量%。Example 1 General-purpose polystyrene resin particles (particle size 0.2 to 1 mm) and impact-resistant polystyrene resin particles (particle size 0.2 to 1 mm) obtained by suspension polymerization were mixed with ethylene bis at a ratio of 7:3. Stearamide (Alflo H-50, manufactured by NOF Corporation) was added and mixed, and melt mixing was performed using a twin-screw extruder to obtain polystyrene resin pellets in which ethylene bisstearamide was dispersed. A carbon black-containing master patch pellet and a silicone-containing master patch pellet obtained separately were mixed with this polystyrene resin pellet and melt-kneaded to obtain a molded resin of the present invention. This molding resin contains 0.1% by weight of ethylene bisstearamide and 0.5% by weight of carbon black powder.
ステアリン酸亜鉛0.031ff1%及びシリコーン化
合物1.5重量%が分散していた。なお、前記ステアリ
ン酸亜鉛は1.カーボンブラック粉体を良好に分散させ
るために添加されている。Dispersed were 0.031ff1% zinc stearate and 1.5% by weight silicone compound. Note that the zinc stearate is 1. It is added to disperse carbon black powder well.
実施例2
前記実施例1とほぼ同様の方法により本発明の成形樹脂
を得た。この成形樹脂には、エチレンビスステアロアミ
ド0.05ffiffi%、カーボンブラック粉体0.
5重量%、ステアリン酸亜鉛0.03重量%及びシリコ
ーン化合物1.5重量%が分散していた。Example 2 A molded resin of the present invention was obtained in substantially the same manner as in Example 1 above. This molding resin contains 0.05% ethylene bisstearamide and 0.05% carbon black powder.
5% by weight, 0.03% by weight of zinc stearate and 1.5% by weight of silicone compound.
実施例3
前記実施例1とほぼ同様の方法により本発明の成形樹脂
を得た。この成形樹脂には、エチレンビスステアロアミ
ド0 、051i ffi%、カーボンブラック粉体0
.5重量%、ステアリン酸典鉛0.05重量?6及びシ
リコーン化合物1,5重量%が分散していた。Example 3 A molded resin of the present invention was obtained in substantially the same manner as in Example 1 above. This molding resin contains 0% ethylene bisstearamide, 051i ffi%, and 0% carbon black powder.
.. 5% by weight, 0.05% by weight of lead stearate? 6 and 1.5% by weight of silicone compound were dispersed.
比較例
前記実施例1において、エチレンビスステアロアミドの
かわりにステアリン酸亜鉛を添加して成形樹脂を得た。Comparative Example In Example 1 above, a molded resin was obtained by adding zinc stearate instead of ethylene bisstearamide.
この成形樹脂には、カーボンブラック粉体0.5重量%
、ステアリン酸亜鉛0.08重量%及びシリコーン化合
物1.5重量%が分散していた。This molding resin contains 0.5% by weight of carbon black powder.
, 0.08% by weight of zinc stearate and 1.5% by weight of a silicone compound were dispersed therein.
(比較実験)
前記実施例1〜3及び比較例の成形樹脂を写真フィルム
用スプール成形金型で成形した。成形中2時間毎に金型
付着物の成形品への転着の有無を成形品1000個に対
してチエツクした。金型付着物が転着した成形品の個数
が5個(0,5%)になった時点で成形を止め金型掃除
を行なった。前記各成形樹脂について、成形スタートか
ら成形停止までの時間をまとめた結果を第1表に示す。(Comparative Experiment) The molded resins of Examples 1 to 3 and Comparative Example were molded using a photographic film spool mold. During molding, 1000 molded products were checked every 2 hours for the presence or absence of mold deposits transferred to the molded products. When the number of molded products to which mold deposits were transferred reached 5 (0.5%), molding was stopped and the mold was cleaned. Table 1 shows a summary of the time from the start of molding to the stop of molding for each of the molding resins.
第
表
の混合をビス脂肪酸アミドとともに行なっているので、
前記二種のポリスチレン樹脂粒子を良好に混合できる。Since the mixture shown in Table 1 is carried out together with bis fatty acid amide,
The two types of polystyrene resin particles can be mixed well.
Claims (2)
樹脂の混練物中に、ビス脂肪酸アミドが分散して成るこ
とを特徴とする写真フイルムパトローネのスプール用成
形樹脂。(1) A molded resin for a spool of a photographic film cartridge, characterized in that a bis fatty acid amide is dispersed in a kneaded mixture of a general-purpose polystyrene resin and an impact-resistant polystyrene resin.
レン樹脂粒子をビス脂肪酸アミドとともに混合し溶融混
練してビス脂肪酸アミドが分散したポリスチレン樹脂混
練物を得ることを特徴とする写真フイルムパトローネの
スプール用成形樹脂の製造方法。(2) Molding for a spool of a photographic film cartridge characterized by mixing general-use polystyrene resin particles and impact-resistant polystyrene resin particles with a bis-fatty acid amide and melt-kneading to obtain a polystyrene resin kneaded product in which the bis-fatty acid amide is dispersed. Method of manufacturing resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8574889A JPH02264941A (en) | 1989-04-06 | 1989-04-06 | Resin for molding spool of photographic film cartridge and manufacture of the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8574889A JPH02264941A (en) | 1989-04-06 | 1989-04-06 | Resin for molding spool of photographic film cartridge and manufacture of the same |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02264941A true JPH02264941A (en) | 1990-10-29 |
Family
ID=13867474
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8574889A Pending JPH02264941A (en) | 1989-04-06 | 1989-04-06 | Resin for molding spool of photographic film cartridge and manufacture of the same |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02264941A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5265820A (en) * | 1990-11-26 | 1993-11-30 | Fuji Photo Film Co., Ltd. | Photographic film cassette |
-
1989
- 1989-04-06 JP JP8574889A patent/JPH02264941A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5265820A (en) * | 1990-11-26 | 1993-11-30 | Fuji Photo Film Co., Ltd. | Photographic film cassette |
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