JPH02263877A - Electrically conductive printing paste - Google Patents
Electrically conductive printing pasteInfo
- Publication number
- JPH02263877A JPH02263877A JP1086449A JP8644989A JPH02263877A JP H02263877 A JPH02263877 A JP H02263877A JP 1086449 A JP1086449 A JP 1086449A JP 8644989 A JP8644989 A JP 8644989A JP H02263877 A JPH02263877 A JP H02263877A
- Authority
- JP
- Japan
- Prior art keywords
- conductive paste
- printed conductive
- parts
- weight
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007639 printing Methods 0.000 title abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000000843 powder Substances 0.000 claims abstract description 30
- 239000011230 binding agent Substances 0.000 claims abstract description 26
- 239000007787 solid Substances 0.000 claims abstract description 19
- -1 polytetrafluoroethylene Polymers 0.000 claims abstract description 18
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 16
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 16
- 239000002245 particle Substances 0.000 claims abstract description 13
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 9
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical group C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 17
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 3
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 2
- 229920006026 co-polymeric resin Polymers 0.000 claims 1
- 125000000816 ethylene group Polymers [H]C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
- 238000002156 mixing Methods 0.000 abstract description 8
- 239000000758 substrate Substances 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 19
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 238000010586 diagram Methods 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 8
- 229910052709 silver Inorganic materials 0.000 description 8
- 239000004332 silver Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 239000008096 xylene Substances 0.000 description 7
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 229920006267 polyester film Polymers 0.000 description 4
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 3
- 239000006230 acetylene black Substances 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 3
- 239000006232 furnace black Substances 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 229910000906 Bronze Inorganic materials 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 239000010974 bronze Substances 0.000 description 2
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000012744 reinforcing agent Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000001553 co-assembly Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 150000003738 xylenes Chemical class 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
Landscapes
- Paints Or Removers (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Conductive Materials (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、回転式可変抵抗器やスライド式スイッチ等の
電子部品の基板上に形成される各種パターンとして用い
られる印刷導電ペーストに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a printed conductive paste used as various patterns formed on substrates of electronic components such as rotary variable resistors and slide switches. .
従来、回転式可変抵抗器、回転式スイッチ、スライド式
スイッチ、スライド式可変抵抗器等の電子部品は、基板
上に形成した集電パターンや抵抗体パターンの上に金属
製の摺動子の摺動接点を摺接させることによって、その
電子部品の抵抗値やスイッチのオンオフ状態を変化して
いる。Conventionally, electronic components such as rotary variable resistors, rotary switches, slide switches, and slide variable resistors have been produced by sliding a metal slider over a current collection pattern or resistor pattern formed on a substrate. By sliding the moving contacts, the resistance value of the electronic component and the on/off state of the switch are changed.
この種電子部品の基板として硬質のフェノール系または
エポキシ系あるいはセラミック系のものを用いた場合は
、その上に形成する抵抗体パターンには、フェノール系
の樹脂バインダーと、銀。When a hard phenolic, epoxy, or ceramic substrate is used as the substrate for this type of electronic component, the resistor pattern formed on it requires a phenolic resin binder and silver.
カーボン等の導電粉と、グリコール誘導体等の溶剤を混
合してなる印刷導電ペーストを用いていた。A printed conductive paste made of a mixture of conductive powder such as carbon and a solvent such as a glycol derivative was used.
またこの種電子部品の基板として可撓性を有するポリエ
ステルフィルム等を用いる場合は、その上に形成するパ
ターンには、ポリエステル、ポリウレタン等の可撓性樹
脂バインダーと、銀、カーボン等の導電粉と、グリコー
ル誘導体等の溶剤を混合してなる印刷導電ペーストを用
いていた。In addition, when a flexible polyester film or the like is used as a substrate for this type of electronic component, the pattern formed on it may contain a flexible resin binder such as polyester or polyurethane, and conductive powder such as silver or carbon. , a printed conductive paste made by mixing a solvent such as a glycol derivative was used.
そしてこれらの基板に形成した各種パターン上には、摺
動子の摺動接点が摺接することとなる。The sliding contacts of the sliders come into sliding contact with the various patterns formed on these substrates.
なおこの摺動接点には、銀メツキされたりん青銅等の金
属を用いることが少なくない。Note that this sliding contact is often made of a metal such as silver-plated phosphor bronze.
しかしながらこの種従来の印刷導電ペーストにあっては
、基本的に有機樹脂が主成分であるため、前記金属製の
摺動子の摺動接点との摩擦によって徐々に磨耗し、つい
には要求される性能を維持できなくなるという問題点が
あった。However, in this type of conventional printed conductive paste, since the main component is basically an organic resin, it gradually wears out due to friction with the sliding contact of the metal slider, and eventually the required There was a problem that performance could not be maintained.
特に印刷導電ペーストとして可撓性のある材料を用いた
場合には、その材料が軟弱であるため、その磨耗が激し
いという問題点があった。In particular, when a flexible material is used as the printed conductive paste, there is a problem in that the material is soft and is subject to severe wear.
本発明は上述の点に鑑みてなされたものであり、摺動接
点が頻繁に摺接しても、磨耗しにくく、導電率若しくは
電気的接触が長時間にわたって安定する印刷導電ペース
トを提供することにある。The present invention has been made in view of the above-mentioned points, and an object of the present invention is to provide a printed conductive paste that is resistant to wear even when sliding contacts frequently come into sliding contact and whose conductivity or electrical contact is stable over a long period of time. be.
上記問題点を解決するため本発明は印刷導電ペーストを
、°樹脂バインダー、導電性粉末、溶剤を主成分とする
導電ペーストに、摩擦低減のため平均分子量10000
以下、粒径10t1m以下であってその動摩擦係数が0
.5以下のフッ素樹脂の粉末を、樹脂バインダーの固形
分に対して2重量部乃至30重量部の範囲で配合して構
成した。In order to solve the above problems, the present invention has developed a printed conductive paste that has an average molecular weight of 10,000 to reduce friction.
Below, the particle size is 10t1m or less and the coefficient of kinetic friction is 0.
.. The powder of a fluororesin of 5 or less was blended in an amount of 2 parts by weight to 30 parts by weight based on the solid content of the resin binder.
また本発明は、以上の組成物に、更に補強剤として粒径
10μm以下、モース硬度8以上の金属炭化物粉を前記
樹脂バインダーの固形分に対して2重量部乃至30重量
部の範囲で配合して構成した。Further, the present invention further includes adding metal carbide powder having a particle size of 10 μm or less and a Mohs hardness of 8 or more as a reinforcing agent to the above composition in an amount of 2 parts by weight to 30 parts by weight based on the solid content of the resin binder. It was composed of
上記の如く印刷導電ペーストを構成することにより、こ
れを使用した基板上の各種パターンの摩擦低減が図れ、
この各種パターン上に摺動子の摺動接点が頻繁に摺接し
ても、##flL、にくく、導電率若しくは電気的接触
が長時間にわたって安定する。By configuring the printed conductive paste as described above, it is possible to reduce the friction of various patterns on the substrate using the paste.
Even if the sliding contact of the slider frequently slides on these various patterns, the conductivity or electrical contact remains stable over a long period of time.
以下、本発明の幾つかの実施例を従来例と比較しながら
詳細に説明する。Hereinafter, several embodiments of the present invention will be described in detail while comparing them with conventional examples.
(1)まず実施例1,2を従来例Aと比較して説明する
。(1) First, Examples 1 and 2 will be explained in comparison with Conventional Example A.
■実施例1
まず実施例1の印刷導電ペーストの製造方法を説明する
。■Example 1 First, a method for manufacturing the printed conductive paste of Example 1 will be explained.
この印刷導電ペーストを製造するには、(1)キシレン
#1m5o%含有ブタノール溶液100重量部(このキ
シレン樹脂が樹脂バインダーである)に、(i)アセチ
レンブラック2゜8重量部、ファーネスブラック2.8
重量部、グラファイト0.6重量部(以上が導電性粉末
である)、及び(i)ポリ4フッ化エチレン樹脂粉末(
平均分子量5000.粒径10μm以下)2重量部(従
って前記キシレン樹脂の固形分に対してノールを揮散き
せた後に、(■)ブチルセロソルブ、エチルカルピトー
ルアセテート、メチルエチルケトン(MEK)(その組
成比5:4:1)からなる溶剤30重量部を加えたもの
を3木ロールミルで混練する。これによってこの実施例
にかかる印刷導電ペーストが完成する。To produce this printed conductive paste, (1) 100 parts by weight of a butanol solution containing 50% xylene #1m (this xylene resin is the resin binder), (i) 2.8 parts by weight of acetylene black, 2.5 parts by weight of furnace black. 8
parts by weight, 0.6 parts by weight of graphite (the above is conductive powder), and (i) polytetrafluoroethylene resin powder (
Average molecular weight 5000. (Particle size: 10 μm or less) 2 parts by weight (Therefore, after volatilizing the nol based on the solid content of the xylene resin, (■) butyl cellosolve, ethyl carpitol acetate, methyl ethyl ketone (MEK) (composition ratio 5:4:1) 30 parts by weight of a solvent was added thereto and kneaded using a Miki roll mill.Thus, the printed conductive paste according to this example was completed.
この印刷導電ペーストの面積抵抗値は約80にΩ/口で
あった。The sheet resistance value of this printed conductive paste was about 80 Ω/hole.
そして第1図に示すように、この印刷導電ペースト1を
抵抗体パターンとしてフェノール積層板3上にスクリー
ン印刷によって馬子形状に印刷し、これを190℃にて
15分間焼成することにより、回転式可変抵抗器の基板
を作成した。Then, as shown in FIG. 1, this printed conductive paste 1 is printed as a resistor pattern into a horse-shaped shape by screen printing on a phenol laminate board 3, and is baked at 190°C for 15 minutes to create a rotary variable resistor pattern. I created a resistor board.
なお第1図に示す5は銀ペースト、7はリン青銅に銀メ
ツキを施した摺動子である。In addition, 5 shown in FIG. 1 is a silver paste, and 7 is a slider made of phosphor bronze plated with silver.
■実施例2
次に実施例2の印刷導電ペーストの製造方法を説明する
。Example 2 Next, a method for producing a printed conductive paste of Example 2 will be described.
この印刷導電ペーストを製造するには、(i)キシレン
樹脂50%含有ブタノール溶液100重量部に、(i)
アセチレンブラック2゜8重量部、ファーネスブラック
2.8重量部、グラファイト0.6重量部、及び(i)
ポリ4フッ化エチレン樹脂粉末2重量部(従って前記キ
シレ(iv)ブチルセロソルブ、エチルカルピトールア
セテート、MEK(その組成比5:4:1)からなる溶
剤30重量部を加えたものを3本ロールミルで混°練す
る。To produce this printed conductive paste, (i) 100 parts by weight of a butanol solution containing 50% xylene resin is mixed with (i)
2.8 parts by weight of acetylene black, 2.8 parts by weight of furnace black, 0.6 parts by weight of graphite, and (i)
2 parts by weight of polytetrafluoroethylene resin powder (therefore, 30 parts by weight of a solvent consisting of the above-mentioned xylene (iv) butyl cellosolve, ethyl carpitol acetate, and MEK (composition ratio 5:4:1) was added thereto using a three-roll mill. Knead.
さらにこの実施例においては、上記のように混練した組
成物の中から分量5/100を取り出し、これに(v)
チタンカーバイド(Tic)5重量部(従って前記キシ
レン樹脂の固形分に対しては10重量部ということにな
る)と、 (vi)前後、前記組成物の残りの分量95
/100を加え、これを1時間分散する。Furthermore, in this example, a 5/100 amount was taken out of the composition kneaded as described above, and (v)
5 parts by weight of titanium carbide (Tic) (therefore, 10 parts by weight based on the solid content of the xylene resin), and (vi) the remaining amount of the composition before and after 95 parts by weight.
/100 and dispersed for 1 hour.
これによってこの実施例にかかる印刷導電ペーストが完
成する。This completes the printed conductive paste according to this example.
なおこの実施例において(V)のチタンカーバイド(T
i C)は補強材としての金属炭化物粉である。In this example, (V) titanium carbide (T
i C) is metal carbide powder as reinforcing material.
この印刷導電ペーストの面積抵抗値も約80にΩ/口で
あった。The sheet resistance value of this printed conductive paste was also about 80 Ω/hole.
そして第1図に示すようにこの印刷導電ペースれ、これ
を190℃にて15分間焼成することにより、回転式可
変抵抗器の基板を作成した。Then, as shown in FIG. 1, this printed conductive paste was baked at 190° C. for 15 minutes to produce a substrate for a rotary variable resistor.
■比較例A
次に上記実施例1,2と比較するためにポリ4フッ化エ
チレン樹脂の粉末やチタンカーバイド(TiC)を配合
しない従来の印刷導電ペーストも作成した。Comparative Example A Next, for comparison with Examples 1 and 2, a conventional printed conductive paste containing no polytetrafluoroethylene resin powder or titanium carbide (TiC) was also prepared.
この印刷導電ペーストを製造するには、(i)キシレン
樹内50%含有ブタノール溶液100重量部に、(i)
アセチレンブラック2゜8重量部、ファーネスブラック
2.8重量部、グラファイト0.6重量部を配合する。To produce this printed conductive paste, (i) 100 parts by weight of a butanol solution containing 50% xylene
2.8 parts by weight of acetylene black, 2.8 parts by weight of furnace black, and 0.6 parts by weight of graphite are blended.
次にこれをライカイ機にて一昼夜攪拌し、ブタノールを
揮散させた後に、(i)ブチルセロソルブ、エチルカル
ピトールアセテート、MEK(その組成比5:4:1)
からなる溶剤30重量部を加えたものを3本ロールミル
で混練する。これによってこの比較例にかかる印刷導電
ペーストが完成する。Next, this was stirred in a Raikai machine for a day and night to volatilize the butanol, and then (i) butyl cellosolve, ethyl carpitol acetate, MEK (composition ratio 5:4:1)
30 parts by weight of a solvent consisting of the following ingredients were added and kneaded using a three-roll mill. This completes the printed conductive paste according to this comparative example.
この印刷導電ペーストにあっても面積抵抗値は約80に
Ω/口であった。Even with this printed conductive paste, the sheet resistance value was about 80Ω/hole.
そして第1図に示すようにこの印刷導電ペースれ、これ
を190℃にて15分間焼成することにより、回転式可
変抵抗器の基板を作成した。Then, as shown in FIG. 1, this printed conductive paste was baked at 190° C. for 15 minutes to produce a substrate for a rotary variable resistor.
次に本件発明者は以上のようにして作成した実施例1.
実施例2.比較例Aの各基板上に、第1図に示すような
摺動子7の摺動接点を摺接させて、その摺動回数と抵抗
値(抵抗体パターン両端の最大抵抗値)の変化率との関
係を測定した。Next, the present inventor created Example 1 as described above.
Example 2. The sliding contact of the slider 7 as shown in FIG. 1 was brought into sliding contact with each substrate of Comparative Example A, and the number of times of sliding and the rate of change in resistance value (maximum resistance value at both ends of the resistor pattern) were measured. We measured the relationship between
第2図はその測定結果を示す図である。FIG. 2 is a diagram showing the measurement results.
同図に示すように、比較例Aにおいては、一端抵抗値が
大きく下がった後に再び大きく上昇している。この抵抗
値の上昇はこの抵抗体パターンが劣化していることを示
す。As shown in the figure, in Comparative Example A, the resistance value decreased significantly at one point and then increased significantly again. This increase in resistance value indicates that this resistor pattern has deteriorated.
一方ボリ4フッ化エチレン樹脂を配合した実施例1は、
少し抵抗値が減少した後に再び上昇して抵抗体パターン
が劣化しているが、前記比較例Aさらに実施例1の導?
ES′?−+にチタンカーバイド(Ti C)をも配合
した実施例2は、抵抗値が徐々に減少した後若干上昇す
るのみであり、該抵抗体パターンの劣化はほとんどない
ことがわかった。On the other hand, Example 1 in which polytetrafluoroethylene resin was blended,
The resistance value decreases a little and then increases again, deteriorating the resistor pattern.
ES'? In Example 2, in which titanium carbide (TiC) was also added to -+, the resistance value gradually decreased and then increased only slightly, indicating that there was almost no deterioration of the resistor pattern.
次に本件発明者は上記実施例1.実施例2.比較例Aの
各基板上に、第1図に示すような摺動子の摺動接点を摺
接させて、その摺動回数と集中接触抵抗(JIS C5
2615,8方法Bによる)との関係を測定した。Next, the present inventor described the above-mentioned Example 1. Example 2. A sliding contact of a slider as shown in FIG.
2615,8 method B) was determined.
第3図はその測定結果を示す図である。FIG. 3 is a diagram showing the measurement results.
同図に示すように、比較例Aにおいては、摺動回数が増
えれば増えるほど集中接触抵抗が上昇している。As shown in the figure, in Comparative Example A, the more the number of times of sliding increases, the higher the concentrated contact resistance increases.
これに対して、ポリ4フ・ソ化エチレン樹脂を配合した
実施例1は、集中接触抵抗が上昇1士するが、前記比較
例Aに比べてその増加の程度が力)なイド(Tic)を
も配合した実施例2にあっては、その集中接触抵抗はほ
とんど変化しなり)ことがわ力)つた。On the other hand, in Example 1 in which poly(4-fluoroethylene) resin was blended, the concentrated contact resistance increased by 1 degree, but the degree of increase was smaller than that in Comparative Example A. In Example 2, which also contained a mixture of 1 and 2, the concentrated contact resistance hardly changed.
(2)次に実施例3を従来例Bと比較して説明する。(2) Next, Example 3 will be explained in comparison with Conventional Example B.
■実施例3
まず実施例3の印刷導電ペーストの製造方法を説明する
。■Example 3 First, a method for manufacturing the printed conductive paste of Example 3 will be explained.
この印刷導電ペーストを製造するには、(1)ポリウレ
タン系可撓性印刷導電ペースト(市販のもので樹脂バイ
ンダー含有量が約20〜25%のものである。なおその
内容は例えば樹脂バインダー〔例えばポリウレタン樹脂
とセロソルブ系の溶剤〕と導電性粉末〔例えばカーボン
ブラックとグラファイト〕を配合したものである)5重
量部に、(i)チタンカーバイド(TiC)その後、(
iv)前記(i)の印刷導電ペースト95重量部にポリ
4フッ化エチレン樹脂2重量部ここで(1)のポリウレ
タン系可撓性印刷導電ペースト中には樹脂バインダー固
形分が約20〜25%含まれているので、(i)のチタ
ンカー/<イド(Tic)の樹脂バインダー固形分に対
する配合量は20〜25重量部ということになる。また
(iv)のポリ4フッ化エチレン樹脂の樹脂/くインダ
ー固形分に対する配合量は8〜10重量部ということに
なる。In order to produce this printed conductive paste, (1) a polyurethane flexible printed conductive paste (a commercially available product with a resin binder content of about 20 to 25%); (i) titanium carbide (TiC), and (i) titanium carbide (TiC),
iv) 95 parts by weight of the printed conductive paste of (i) and 2 parts by weight of polytetrafluoroethylene resin, where the solid content of the resin binder in the polyurethane flexible printed conductive paste of (1) is about 20 to 25%. Therefore, the amount of titanium carbide (Tic) in (i) based on the solid content of the resin binder is 20 to 25 parts by weight. The amount of the polytetrafluoroethylene resin (iv) based on the solid content of the resin/ininder is 8 to 10 parts by weight.
これによってこの実施例にかかる印刷導電ペーストが完
成する。This completes the printed conductive paste according to this example.
そして第1図に示すようにこの印刷導電ペース印刷し、
これを150℃にて20分間焼成することにより、回転
式可変抵抗器の可撓性基板を作成した。Then, print this printed conductive paste as shown in Figure 1,
By baking this at 150° C. for 20 minutes, a flexible substrate for a rotary variable resistor was created.
■比較例B
次に上記実施例3と比較するためにポリ4フ・7化エチ
レン樹脂の粉末やチタンカー/<イド(TiC)を配合
しない従来の印刷導電ペーストも作成した。Comparative Example B Next, in order to compare with Example 3, a conventional printed conductive paste containing no polytetrafluoroethylene resin powder or titanium carbide (TiC) was also prepared.
即ちこの印刷導電ペーストを製造するには、(i)上記
実施例3に示す(1)と同一のポリウレタン系可撓性印
刷導電ペースト(市販のもので樹脂バインダー含有量が
約20〜25%のもの)を用意し、これをそのままポリ
エステルフィルム3′上にスクリーン印刷によって馬子
形状に印刷し、これを150℃にて20分間焼成するこ
とにより、可変抵抗器の可撓性基板を作成した。That is, in order to produce this printed conductive paste, (i) a polyurethane flexible printed conductive paste (commercially available, with a resin binder content of about 20 to 25%), which is the same as (1) shown in Example 3 above; A flexible substrate of a variable resistor was prepared by printing a horse-like shape by screen printing onto a polyester film 3' and baking it at 150° C. for 20 minutes.
次に本件発明者は以上のようにして作成した実施例3.
比較例Bの各基板上に、第1図に示すような摺動子の摺
動接点を摺接させて、その摺動回数と抵抗値(抵抗体パ
ターン両端の最大抵抗値)の変化率との関係を測定した
。Next, the present inventor created Example 3 as described above.
A sliding contact of a slider as shown in Fig. 1 was brought into sliding contact with each board of Comparative Example B, and the number of times of sliding and the rate of change in resistance value (maximum resistance value at both ends of the resistor pattern) were measured. We measured the relationship between
第4図はその測定結果を示す図である。FIG. 4 is a diagram showing the measurement results.
同図に示すように、比較例Bにおいては、摺動子の摺動
回数が増せば増すほどその抵抗値が著しく増大し、その
抵抗体パターンの劣化が激しい。As shown in the figure, in Comparative Example B, as the number of times the slider slides increases, its resistance value increases significantly, and the resistor pattern deteriorates more severely.
一方ボリ4フッ化エチレン樹脂とチタンカーバイド(T
iC)を配合した実施例3は、摺動子の摺動回数が増せ
ば増すほどその抵抗値は増大するが、上記従来例Bに比
べてその増大の程度がかなり低く、その抵抗体パターン
の劣化が少ない。On the other hand, polytetrafluoroethylene resin and titanium carbide (T
In Example 3 containing iC), the resistance value increases as the number of times the slider slides increases, but the degree of increase is considerably lower than in Conventional Example B, and the resistance value of the resistor pattern increases. Less deterioration.
次に本件発明者は上記実施例3.比較例Aの各基板上に
、第1図に示すような摺動子の摺動接点を摺接させて、
その摺動回数と集中接触抵抗(JIS C52615,
8方法Bによる)との関係を測定した。Next, the inventor of the present invention described the above-mentioned Example 3. A sliding contact of a slider as shown in FIG. 1 was brought into sliding contact with each substrate of Comparative Example A,
Its sliding number and concentrated contact resistance (JIS C52615,
8 method B) was measured.
第5図はその測定結果を示す図である。FIG. 5 is a diagram showing the measurement results.
同図に示すように、比較例Bにおいては、摺動回数が増
えれば増えるほど集中接触抵抗が上昇している。As shown in the figure, in Comparative Example B, the more the number of times of sliding increases, the higher the concentrated contact resistance increases.
これに対して、ポリ4フッ化エチレン樹脂とチタンカー
バイド(TiC)を配合した実施例3は、集中接触抵抗
が若干上昇するのみであることがわかった。On the other hand, it was found that in Example 3, in which polytetrafluoroethylene resin and titanium carbide (TiC) were blended, the concentrated contact resistance increased only slightly.
(3)次に実施例4を従来例Cと比較して説明する。(3) Next, Example 4 will be explained in comparison with Conventional Example C.
■実施例4
まず実施例4の印刷導電ペーストの製造方法を説明する
。■Example 4 First, a method for manufacturing the printed conductive paste of Example 4 will be explained.
この印刷導電ペーストを製造するには、(1)ポリウレ
タン系可撓性印刷導電ペースト(市販のもので樹脂バイ
ンダー含有量が約20〜25%のものである。なおその
内容は例えば前記実施例3の(i)と同様のものを用い
る)5重量部に、(i)チタンカーバイド(TiC)5
重量その後、(iv)前記(i)の印刷導電ペースト9
5重量部にポリ4フッ化エチレン樹脂5重量部これによ
ってこの実施例にかかる印刷溝1ペーストが完成する。In order to produce this printed conductive paste, (1) polyurethane flexible printed conductive paste (a commercially available product with a resin binder content of about 20 to 25%). 5 parts by weight of (using the same material as in (i)), (i) 5 parts by weight of titanium carbide (TiC)
Weight Then, (iv) the printed conductive paste 9 of the above (i)
5 parts by weight and 5 parts by weight of polytetrafluoroethylene resin.This completes the printing groove 1 paste according to this example.
ここで(+)のポリウレタン系可撓性印刷導電ペースト
中には樹脂バインダー固形分が約20〜25%含まれて
いるので、(i)のチタンカーバイド(Tic)の樹脂
バインダー固形分に対する配合量は20〜25重量部と
いうことになる。また(iv)のポリ4フッ化エチレン
樹脂の樹脂バインダー固形分に対する配合量も20〜2
5重量部ということになる。Here, since the (+) polyurethane-based flexible printed conductive paste contains about 20 to 25% resin binder solid content, the blending amount of (i) titanium carbide (Tic) relative to the resin binder solid content. This means 20 to 25 parts by weight. In addition, the blending amount of the polytetrafluoroethylene resin (iv) with respect to the solid content of the resin binder is also 20 to 2.
This means 5 parts by weight.
そして第6図に示すように、こうして得られた印刷導電
ペースト11を、銀ペースト15を印刷・乾燥させたポ
リエステルフィルム13上に、該銀ペースト15に覆う
ように直線状にスクリーン印刷する。そしてこれを15
0℃にて20分間焼成することにより、同図に示すスラ
イド式スイッチの可撓性基板を作成した。Then, as shown in FIG. 6, the printed conductive paste 11 thus obtained is linearly screen-printed onto the polyester film 13 on which the silver paste 15 has been printed and dried so as to cover the silver paste 15. And this is 15
By baking at 0° C. for 20 minutes, a flexible substrate for the slide type switch shown in the figure was created.
なお17はその摺動接点が導電ペースト11上を摺接す
る金属製の摺動子である。Note that 17 is a metal slider whose sliding contact slides on the conductive paste 11.
■比較例C
次に上記実施例4と比較するためにポリ4フッ化エチレ
ン樹脂の粉末やチタンカーバイド(TiC)を配合しな
い従来の印刷導電ペーストも作成した。Comparative Example C Next, for comparison with Example 4, a conventional printed conductive paste containing no polytetrafluoroethylene resin powder or titanium carbide (TiC) was also prepared.
即ちこの印刷導電ペーストを製造するには、(i)上記
実施例4に示す(1)と同一のポリウレタン系可撓性印
刷導電ペースト(市販のもので樹脂バインダー含有量が
約20〜25%のもの)を用意し、これをそのまま銀ペ
ースト15を印刷・乾燥させたポリエステルフィルム1
3の上に、該銀ペースト15を覆うように直線状に印刷
し、これを150℃にて20分間焼成することにより、
第6図に示すようなスライド式スイッチの可撓性基板を
作成した。That is, in order to manufacture this printed conductive paste, (i) a polyurethane flexible printed conductive paste (commercially available, with a resin binder content of about 20 to 25%), which is the same as (1) shown in Example 4 above; Polyester film 1 is prepared by printing silver paste 15 on it and drying it.
3, by printing in a straight line so as to cover the silver paste 15 and baking this at 150 ° C. for 20 minutes,
A flexible substrate for a sliding switch as shown in FIG. 6 was prepared.
次に本件発明者は以上のようにして作成した実施例4.
比較例Cの各基板上に、第6図に示すような摺動子17
の摺動接点を摺接させて、その摺動回数と接触抵抗(O
N時の接触抵抗)との関係を測定した。Next, the present inventor created Example 4 as described above.
A slider 17 as shown in FIG. 6 was placed on each substrate of Comparative Example C.
The number of sliding contacts and the contact resistance (O
(contact resistance at N) was measured.
第7図はその測定結果を示す図である。FIG. 7 is a diagram showing the measurement results.
同図に示すように、比較例Cにおいては、摺動子の摺動
回数が増せば増すほどその抵抗値が著しく増大し、その
抵抗体パターンの劣化が激しい。As shown in the figure, in Comparative Example C, as the number of times the slider slides increases, its resistance value increases significantly, and the resistor pattern deteriorates more severely.
これに対してポリ4フッ化エチレン樹脂とチタンカーバ
イド(Ti C)を配合した実施例4は、摺動子の摺動
回数が増せば増すほどその抵抗値は増大するが、上記比
較例Cに比べてその増大の程度がかなり低く、その抵抗
体パターンの劣化が少ないことがわかった。On the other hand, in Example 4 in which polytetrafluoroethylene resin and titanium carbide (TiC) were blended, the resistance value increased as the number of times the slider slid increased; It was found that the degree of increase was considerably lower than that of the previous example, and that the deterioration of the resistor pattern was small.
以上本発明にかかる印刷導電ペーストをいくつかの実施
例を用いて説明したが、本発明はこれに限定されるもの
ではなく、配合する各材料及びその比率は所定の範囲で
変更できる。Although the printed conductive paste according to the present invention has been described above using several examples, the present invention is not limited thereto, and the materials to be blended and their ratios can be changed within a predetermined range.
即ち上記実施例においては、フッ素樹脂としてポリ4フ
ッ化エチレン樹脂を用いた場合を説明したが、本発明は
これに限られず、その動摩擦係数が0.5以下のフッ素
樹脂(例えばポリフッ化エチレンプロピレンエーテル樹
脂、ポリフッ化アルコキシエチレン樹脂、ポリ4フッ化
エチレン6フッ化プロピレン共集合樹脂等)であれば、
どのフッ素樹脂でも前記実施例と同等の効果を生ずるこ
とが確認できた。That is, in the above embodiment, a case was explained in which polytetrafluoroethylene resin was used as the fluororesin, but the present invention is not limited thereto. ether resin, polyfluoroalkoxyethylene resin, polytetrafluoroethylene hexafluoropropylene co-assembly resin, etc.),
It was confirmed that any fluororesin produced the same effect as the above example.
なおここで上記動摩擦係数について定義する。Note that the above dynamic friction coefficient will be defined here.
第8図は動摩擦係数の測定方法を示す図である。同図に
示すよう5に、動摩擦係数を測定するには、アルミニウ
ム製の回転テーブル91上に試料であるフッ素樹脂粉を
敷きつめ、内半径r、=1(1)、外半径r、=112
cmの銅製の円筒92を3kgの荷重で押し当てる。こ
の円筒92には中心軸と直角にアーム93が付いている
。FIG. 8 is a diagram showing a method of measuring the coefficient of dynamic friction. As shown in Figure 5, in order to measure the coefficient of dynamic friction, the sample fluororesin powder is spread on an aluminum rotary table 91, and the inner radius r, = 1 (1) and the outer radius r, = 112.
A copper cylinder 92 with a diameter of 1.2 cm is pressed against the cylinder 92 with a load of 3 kg. An arm 93 is attached to this cylinder 92 at right angles to the central axis.
しかる後に回転テーブル91を毎分60回転の速さで回
転許せ、この時に円筒92に伝わるトルクFを、該円筒
92の中心軸から9−4cmの距離におけるアーム93
上にて測定する。After that, the rotary table 91 is allowed to rotate at a speed of 60 revolutions per minute, and the torque F transmitted to the cylinder 92 at this time is applied to the arm 93 at a distance of 9-4 cm from the central axis of the cylinder 92.
Measure at the top.
そしてこれらの値を下式に代入すれば、動摩擦係数μが
得られるのである。Then, by substituting these values into the formula below, the dynamic friction coefficient μ can be obtained.
また上記各実施例においては、金属炭化物粉としてチタ
ンカーバイド(TiC)を用いた場合を説明したが、金
属炭化物粉としてはこれに限られず、タングステンカー
バイド(WC)やシリコンカーバイド(SiC)等の他
の各種の金属炭化物粉でも前記実施例と同等の効果を生
ずることが確認できた。In each of the above embodiments, titanium carbide (TiC) is used as the metal carbide powder, but the metal carbide powder is not limited to this, and other materials such as tungsten carbide (WC) and silicon carbide (SiC) are also used. It was confirmed that the same effects as those of the above-mentioned Examples could be obtained using various metal carbide powders.
また本件発明者は、上記実施例以外に所定のフッ素樹脂
と金属炭化物粉の混合比を変えた各種の印刷導電ペース
トを作成してその性能を測定した。In addition to the above-mentioned examples, the inventor of the present invention also prepared various printed conductive pastes with different mixing ratios of a predetermined fluororesin and metal carbide powder, and measured their performance.
その結果、・樹脂バインダー、導電性粉末、溶剤を主成
分とする印刷導電ペーストに、摩擦低減のために平均分
子量10000以下で粒径10μm以下且つその動摩擦
係数が0.5以下のフッ素樹脂の粉末を、樹脂バインダ
ーの固形分に対して2重量部乃至30重量部の範囲(さ
らに好ましくは4重量部乃至25重量部の範囲)で配合
するものであれば、その配合の比率はどのようにしても
よいことがわかった。As a result, ・In order to reduce friction, fluororesin powder with an average molecular weight of 10,000 or less, a particle size of 10 μm or less, and a coefficient of dynamic friction of 0.5 or less is added to the printed conductive paste, which mainly consists of a resin binder, conductive powder, and solvent. If it is blended in a range of 2 parts by weight to 30 parts by weight (more preferably in a range of 4 parts by weight to 25 parts by weight) based on the solid content of the resin binder, what is the ratio of the blending? It turned out to be good too.
ここで上記フッ素樹脂の分子量が10000を越えると
、印刷導電ペースト中での分散が阻害され、印刷導電ペ
ーストの流動性、平滑性が阻害されて不都合である。な
おこのフッ素樹脂の粒径が10μmを越えると、この印
刷導電ペーストを基板上に印刷したときに、その表面へ
のフ・ノ素樹脂粒子の露出が多く成り過ぎ、電気的接触
を阻害することとなり不都合である。一方フッ素樹脂の
配合量が樹脂バインダーの固形分に対して2重量部以下
の場合は摩擦低減という効果が充分には発揮できない。If the molecular weight of the fluororesin exceeds 10,000, dispersion in the printed conductive paste will be inhibited, and the fluidity and smoothness of the printed conductive paste will be impaired, which is disadvantageous. Note that if the particle size of this fluororesin exceeds 10 μm, when this printed conductive paste is printed on a substrate, too many fluororesin particles will be exposed on the surface, which may impede electrical contact. This is inconvenient. On the other hand, if the amount of the fluororesin blended is less than 2 parts by weight based on the solid content of the resin binder, the effect of reducing friction cannot be sufficiently exhibited.
またフッ素樹脂の配合量が樹脂バインダーの固形分に対
して30重量部以上の場合はこの印刷導電ペーストの電
気的特性を阻害し、また機械的特性も低下する。Furthermore, if the amount of the fluororesin added is 30 parts by weight or more based on the solid content of the resin binder, the electrical properties of the printed conductive paste will be impaired and the mechanical properties will also be degraded.
また以上の範囲のフッ素樹脂を配合した印刷導電ペース
トに、更に補強剤として金属炭化物粉を配合する場合、
その配合の割合は、粒径10μm以下でモース硬度8以
上のものを、樹脂バインダーの固形分に対して2重量部
乃至30重量部の範囲(好ましくは4重量部乃至25重
量部の範囲)で配合すると、耐磨耗性は上記フッ素樹脂
のみを配合した印刷導電ペーストの場合に比べてもかな
り向上することもわかった。In addition, when metal carbide powder is further added as a reinforcing agent to the printed conductive paste containing the fluororesin in the above range,
The blending ratio is 2 to 30 parts by weight (preferably 4 to 25 parts by weight) of particles with a particle size of 10 μm or less and a Mohs hardness of 8 or more based on the solid content of the resin binder. It was also found that when blended, the abrasion resistance was considerably improved compared to the case of a printed conductive paste containing only the above-mentioned fluororesin.
ここで金属炭化物粉の粒径が10μmを越えると、この
印刷導電ペーストを基板−ヒに印刷したときに、その表
面への金属灰化物粉粒子の露出が多く成り過ぎ、電気的
接触の阻害、その表面の平滑性の阻害の原因となる。一
方金属炭化物粉の配合量が樹脂バインダーの固形分に対
して2重量部以下の場合は印刷導電ペーストを補強する
という効果が充分には発揮できない。また金属炭化物粉
の配合量が樹脂バインダーの固形分に対して30重量部
以上の場合はこの印刷導電ペーストの電気的特性を阻害
し、また印刷導電ペーストの機械的特性も低下する。If the particle size of the metal carbide powder exceeds 10 μm, when this printed conductive paste is printed on the substrate, too many metal ash powder particles will be exposed on the surface, inhibiting electrical contact. This causes a disturbance in the smoothness of its surface. On the other hand, if the amount of metal carbide powder is less than 2 parts by weight based on the solid content of the resin binder, the effect of reinforcing the printed conductive paste cannot be sufficiently exhibited. If the amount of metal carbide powder is 30 parts by weight or more based on the solid content of the resin binder, the electrical properties of the printed conductive paste will be impaired and the mechanical properties of the printed conductive paste will also be degraded.
以上詳細に説明したように、本発明に係る印刷導電ペー
ストによれば、これを使用した各種パターンに摺動子の
摺動接点が頻繁に摺接しても、磨耗しにくく、導電率若
しくは電気的接触が長時間にわたって安定するという優
れた効果を有する。As explained in detail above, according to the printed conductive paste of the present invention, even if the sliding contact of the slider frequently comes into sliding contact with various patterns using the paste, it is difficult to wear out, and the conductivity or electrical It has the excellent effect of maintaining stable contact over a long period of time.
第1図は本発明にかかる印刷導電ペーストを用いた回転
式可変抵抗器の基板を示す平面図、第2図は実施例1.
実施例2.比較例Aの各基板上を摺接する摺動子の摺動
回数と抵抗値の変化率との関係を示す図、第3図は実施
例1.実施例2.比較例Aの各基板上を摺動する摺動子
の摺動回数と集中接触抵抗との関係を示す図、第4図は
実施例3、比較例Bの各基板上を摺接する摺動子の摺動
回数と抵抗値の変化率との関係を示す図、第5図は実施
例3.比較例Bの各基板上を摺動する摺動子の摺動回数
と集中接触抵抗との関係を示す図、第6図は本発明にか
かる印刷導電ペーストを用いたスライド式スイッチの基
板を示す平面図、第7図は実施例4.比較例Cの各基板
上を摺接する摺動子の摺動接点の摺動回数と接触抵抗と
の関係を示す図、第8図は動摩擦係数の測定方法を示す
図である。
図中、1,11・・・印刷導電ペーストである。FIG. 1 is a plan view showing a substrate of a rotary variable resistor using a printed conductive paste according to the present invention, and FIG. 2 is a plan view showing a substrate of a rotary variable resistor using printed conductive paste according to the present invention.
Example 2. FIG. 3 is a diagram showing the relationship between the number of times the slider slides on each substrate of Comparative Example A and the rate of change in resistance value. Example 2. A diagram showing the relationship between the number of times the slider slides on each substrate of Comparative Example A and the concentrated contact resistance, and FIG. 4 shows the slider sliding on each substrate of Example 3 and Comparative Example B. FIG. 5 is a diagram showing the relationship between the number of times of sliding and the rate of change in resistance value. A diagram showing the relationship between the number of times the slider slides on each substrate of Comparative Example B and concentrated contact resistance, and FIG. 6 shows a substrate of a sliding switch using the printed conductive paste according to the present invention. The plan view and FIG. 7 are of Example 4. FIG. 8 is a diagram showing the relationship between the number of times the sliding contact of the slider slides on each substrate of Comparative Example C and the contact resistance, and FIG. 8 is a diagram showing the method for measuring the coefficient of dynamic friction. In the figure, 1, 11 are printed conductive pastes.
Claims (4)
ものを主成分とする印刷導電ペーストに、平均分子量が
10000以下且つ粒径が10μm以下であってその動
摩擦係数が0.5以下のフッ素樹脂の粉末を、前記樹脂
バインダーの固形分に対して2重量部乃至30重量部の
範囲で混合したことを特徴とする印刷導電ペースト。(1) A printed conductive paste whose main component is a mixture of a resin binder, a conductive powder, and a solvent is mixed with a fluororesin having an average molecular weight of 10,000 or less, a particle size of 10 μm or less, and a dynamic friction coefficient of 0.5 or less. A printed conductive paste characterized in that the powder is mixed in an amount of 2 parts by weight to 30 parts by weight based on the solid content of the resin binder.
ポリフッ化エチレンプロピレンエーテル樹脂、ポリフッ
化アルコキシエチレン樹脂、またはポリ4フッ化エチレ
ン6フッ化プロピレン共重合樹脂であることを特徴とす
る請求項(1)記載の印刷導電ペースト。(2) The fluororesin is polytetrafluoroethylene resin,
The printed conductive paste according to claim 1, wherein the printed conductive paste is a polyfluorinated ethylene propylene ether resin, a polyfluorinated alkoxyethylene resin, or a polytetrafluorinated ethylene hexafluorinated propylene copolymer resin.
ース硬度8以上の金属炭化物粉を、前記樹脂バインダー
の固形分に対して2重量部乃至30重量部の範囲で混合
したことを特徴とする請求項(1)または(2)記載の
印刷導電ペースト。(3) A metal carbide powder having a particle size of 10 μm or less and a Mohs hardness of 8 or more is mixed in the printed conductive paste in an amount of 2 parts by weight to 30 parts by weight based on the solid content of the resin binder. The printed conductive paste according to claim (1) or (2).
ステンカーバイド、或いはシリコンカーバイドであるこ
とを特徴とする請求項3記載の印刷導電ペースト。(4) The printed conductive paste according to claim 3, wherein the metal carbide powder is titanium carbide, tungsten carbide, or silicon carbide.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1086449A JPH0651859B2 (en) | 1989-04-04 | 1989-04-04 | Printed conductive paste for sliding contact pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1086449A JPH0651859B2 (en) | 1989-04-04 | 1989-04-04 | Printed conductive paste for sliding contact pattern |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02263877A true JPH02263877A (en) | 1990-10-26 |
JPH0651859B2 JPH0651859B2 (en) | 1994-07-06 |
Family
ID=13887239
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1086449A Expired - Fee Related JPH0651859B2 (en) | 1989-04-04 | 1989-04-04 | Printed conductive paste for sliding contact pattern |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0651859B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0971747A (en) * | 1995-07-03 | 1997-03-18 | Zojirushi Corp | Printing ink and print structure formed therewith |
EP0758131A3 (en) * | 1995-07-25 | 1997-08-20 | Tdk Corp | Organic PTC thermistor |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52138528A (en) * | 1976-05-14 | 1977-11-18 | Mitsubishi Electric Corp | Electrically conductive coating |
JPS59182868A (en) * | 1983-04-01 | 1984-10-17 | Canon Inc | Ink composition for screen printing |
JPS6157866A (en) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | Measurement system for semiconductor device |
-
1989
- 1989-04-04 JP JP1086449A patent/JPH0651859B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS52138528A (en) * | 1976-05-14 | 1977-11-18 | Mitsubishi Electric Corp | Electrically conductive coating |
JPS59182868A (en) * | 1983-04-01 | 1984-10-17 | Canon Inc | Ink composition for screen printing |
JPS6157866A (en) * | 1984-08-29 | 1986-03-24 | Toshiba Corp | Measurement system for semiconductor device |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0971747A (en) * | 1995-07-03 | 1997-03-18 | Zojirushi Corp | Printing ink and print structure formed therewith |
EP0758131A3 (en) * | 1995-07-25 | 1997-08-20 | Tdk Corp | Organic PTC thermistor |
Also Published As
Publication number | Publication date |
---|---|
JPH0651859B2 (en) | 1994-07-06 |
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