JPH0226273U - - Google Patents

Info

Publication number

JPH0226273U

JPH0226273U JP10467088U JP10467088U JPH0226273U JP H0226273 U JPH0226273 U JP H0226273U JP 10467088 U JP10467088 U JP 10467088U JP 10467088 U JP10467088 U JP 10467088U JP H0226273 U JPH0226273 U JP H0226273U

Authority

JP

Japan

Prior art keywords

wiring board

printed wiring

flat package

package element

electronic component

Prior art date

1988-08-08

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011810 insulating material Substances 0.000 claims description 2
• 239000011247 coating layer Substances 0.000 description 1

Cited By (1)