JPH0226269U - - Google Patents

Info

Publication number

JPH0226269U

JPH0226269U JP10444288U JP10444288U JPH0226269U JP H0226269 U JPH0226269 U JP H0226269U JP 10444288 U JP10444288 U JP 10444288U JP 10444288 U JP10444288 U JP 10444288U JP H0226269 U JPH0226269 U JP H0226269U

Authority

JP

Japan

Prior art keywords

circuit board

integrated circuit

electronic components

hybrid integrated

regions

Prior art date

1988-08-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 238000004806 packaging method and process Methods 0.000 claims description 5
• 238000010586 diagram Methods 0.000 description 2
• 238000004519 manufacturing process Methods 0.000 description 2
• 239000011347 resin Substances 0.000 description 1
• 229920005989 resin Polymers 0.000 description 1