JPH0226240U - - Google Patents

Info

Publication number

JPH0226240U

JPH0226240U JP10431088U JP10431088U JPH0226240U JP H0226240 U JPH0226240 U JP H0226240U JP 10431088 U JP10431088 U JP 10431088U JP 10431088 U JP10431088 U JP 10431088U JP H0226240 U JPH0226240 U JP H0226240U

Authority

JP

Japan

Prior art keywords

semiconductor element

resin encapsulation

encapsulation mold

mold

lead frame

Prior art date

1988-08-06

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 239000011347 resin Substances 0.000 claims description 5
• 229920005989 resin Polymers 0.000 claims description 5
• 239000004065 semiconductor Substances 0.000 claims 3
• 238000005538 encapsulation Methods 0.000 claims 2
• 239000002184 metal Substances 0.000 claims 1
• 238000007789 sealing Methods 0.000 description 3
• 238000000465 moulding Methods 0.000 description 1