JPH0226238U - - Google Patents
Info
- Publication number
- JPH0226238U JPH0226238U JP1988104311U JP10431188U JPH0226238U JP H0226238 U JPH0226238 U JP H0226238U JP 1988104311 U JP1988104311 U JP 1988104311U JP 10431188 U JP10431188 U JP 10431188U JP H0226238 U JPH0226238 U JP H0226238U
- Authority
- JP
- Japan
- Prior art keywords
- die bond
- die
- spindle
- head body
- hollow part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/0711—Apparatus therefor
- H10W72/07141—Means for applying energy, e.g. ovens or lasers
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104311U JPH0226238U (enExample) | 1988-08-06 | 1988-08-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988104311U JPH0226238U (enExample) | 1988-08-06 | 1988-08-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226238U true JPH0226238U (enExample) | 1990-02-21 |
Family
ID=31335916
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988104311U Pending JPH0226238U (enExample) | 1988-08-06 | 1988-08-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226238U (enExample) |
-
1988
- 1988-08-06 JP JP1988104311U patent/JPH0226238U/ja active Pending