JPH0226234U - - Google Patents

Info

Publication number
JPH0226234U
JPH0226234U JP1988105232U JP10523288U JPH0226234U JP H0226234 U JPH0226234 U JP H0226234U JP 1988105232 U JP1988105232 U JP 1988105232U JP 10523288 U JP10523288 U JP 10523288U JP H0226234 U JPH0226234 U JP H0226234U
Authority
JP
Japan
Prior art keywords
integrated circuit
package
view
absorb
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1988105232U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988105232U priority Critical patent/JPH0226234U/ja
Publication of JPH0226234U publication Critical patent/JPH0226234U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10W72/884—

Landscapes

  • Die Bonding (AREA)
JP1988105232U 1988-08-09 1988-08-09 Pending JPH0226234U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105232U JPH0226234U (cg-RX-API-DMAC10.html) 1988-08-09 1988-08-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105232U JPH0226234U (cg-RX-API-DMAC10.html) 1988-08-09 1988-08-09

Publications (1)

Publication Number Publication Date
JPH0226234U true JPH0226234U (cg-RX-API-DMAC10.html) 1990-02-21

Family

ID=31337660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105232U Pending JPH0226234U (cg-RX-API-DMAC10.html) 1988-08-09 1988-08-09

Country Status (1)

Country Link
JP (1) JPH0226234U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010205893A (ja) * 2009-03-03 2010-09-16 Nec Corp 半導体装置及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010205893A (ja) * 2009-03-03 2010-09-16 Nec Corp 半導体装置及びその製造方法

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