JPH0226230U - - Google Patents
Info
- Publication number
- JPH0226230U JPH0226230U JP10523488U JP10523488U JPH0226230U JP H0226230 U JPH0226230 U JP H0226230U JP 10523488 U JP10523488 U JP 10523488U JP 10523488 U JP10523488 U JP 10523488U JP H0226230 U JPH0226230 U JP H0226230U
- Authority
- JP
- Japan
- Prior art keywords
- support rod
- semiconductor substrate
- supports
- hot air
- pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
Landscapes
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は同断面図、第３図は使用状態を示す正面図、
第４図は本考案の実施例２を示す斜視図、第５図
は従来例を示す斜視図、第６図は同断面図である
。 １……半導体基板、２……支持棒、３……吸気
口。
図は同断面図、第３図は使用状態を示す正面図、
第４図は本考案の実施例２を示す斜視図、第５図
は従来例を示す斜視図、第６図は同断面図である
。 １……半導体基板、２……支持棒、３……吸気
口。
Claims (1)
- 温風乾燥機に用いるキヤリアにおいて、半導体
基板を支持する支持棒を中空のパイプ状構造とし
、該支持棒を水平面から傾斜させて設置し、さら
に該パイプ状支持棒内に温風を取込む吸気口を有
することを特徴とするキヤリア。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10523488U JPH0226230U (ja) | 1988-08-09 | 1988-08-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10523488U JPH0226230U (ja) | 1988-08-09 | 1988-08-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226230U true JPH0226230U (ja) | 1990-02-21 |
Family
ID=31337664
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10523488U Pending JPH0226230U (ja) | 1988-08-09 | 1988-08-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226230U (ja) |
-
1988
- 1988-08-09 JP JP10523488U patent/JPH0226230U/ja active Pending