JPH02262302A - 電気部品の樹脂封止方法及びその構造 - Google Patents
電気部品の樹脂封止方法及びその構造Info
- Publication number
- JPH02262302A JPH02262302A JP1081576A JP8157689A JPH02262302A JP H02262302 A JPH02262302 A JP H02262302A JP 1081576 A JP1081576 A JP 1081576A JP 8157689 A JP8157689 A JP 8157689A JP H02262302 A JPH02262302 A JP H02262302A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- inner case
- terminal plate
- arrester
- varistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 29
- 239000011347 resin Substances 0.000 title claims abstract description 29
- 238000007789 sealing Methods 0.000 title claims abstract description 13
- 238000000034 method Methods 0.000 title claims abstract description 10
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 14
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 230000008878 coupling Effects 0.000 abstract description 3
- 238000010168 coupling process Methods 0.000 abstract description 3
- 238000005859 coupling reaction Methods 0.000 abstract description 3
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 239000004677 Nylon Substances 0.000 abstract description 2
- -1 P.B.T. and P.C. Polymers 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 229920001778 nylon Polymers 0.000 abstract description 2
- 239000005011 phenolic resin Substances 0.000 abstract description 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 2
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 11
- 238000001746 injection moulding Methods 0.000 description 5
- 210000000078 claw Anatomy 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001721 transfer moulding Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000002689 soil Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1081576A JPH02262302A (ja) | 1989-04-03 | 1989-04-03 | 電気部品の樹脂封止方法及びその構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1081576A JPH02262302A (ja) | 1989-04-03 | 1989-04-03 | 電気部品の樹脂封止方法及びその構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02262302A true JPH02262302A (ja) | 1990-10-25 |
| JPH0563082B2 JPH0563082B2 (OSRAM) | 1993-09-09 |
Family
ID=13750133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1081576A Granted JPH02262302A (ja) | 1989-04-03 | 1989-04-03 | 電気部品の樹脂封止方法及びその構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02262302A (OSRAM) |
-
1989
- 1989-04-03 JP JP1081576A patent/JPH02262302A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0563082B2 (OSRAM) | 1993-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4976634A (en) | Means and method of securing an insert in a shell | |
| CN100495821C (zh) | 形成在玻璃面上的导体用的电气连接结构 | |
| US6393698B1 (en) | Coaxial connector and method of manufacturing thereof | |
| EP0649197A2 (en) | Method of producing connector and connector | |
| US6128195A (en) | Transfer molded PCMCIA standard cards | |
| EP0938247A1 (en) | Holder equipped with an anisotropically conductive rubber connector and method for manufacturing the same | |
| KR20030036937A (ko) | 제품의 외장체 형성방법 및 그 장치 | |
| JP3198376B2 (ja) | 電解コンデンサの製造方法 | |
| US5183412A (en) | Connector for coaxial cable | |
| US5689137A (en) | Method for transfer molding standard electronic packages and apparatus formed thereby | |
| JP3766001B2 (ja) | バッテリーとその製造方法 | |
| JP2002166447A (ja) | 樹脂封止成形装置 | |
| CN113453430B (zh) | 电子模组及其制造方法 | |
| JPH02262302A (ja) | 電気部品の樹脂封止方法及びその構造 | |
| US20030181088A1 (en) | Electrical connector | |
| KR102627621B1 (ko) | 소켓쉘리스형 전자기기용 소켓커넥터의 제조방법 | |
| US5205977A (en) | Method of securing an insert in a shell | |
| JP2919178B2 (ja) | モールドチップ型固体電解コンデンサ | |
| CN212162130U (zh) | 一种装配式屏蔽套lightning连接端子 | |
| JP2001162644A (ja) | モールド樹脂による端子の基板への接続固定方法及び接続固定構造 | |
| JPS58115894A (ja) | 電子機器用匣体およびその製造法 | |
| JPS5847693Y2 (ja) | 樹脂ケ−ス封止形コンデンサ | |
| JP2728519B2 (ja) | 固体電解コンデンサの製造方法 | |
| CN210723454U (zh) | 一种充电插头连接器 | |
| JPS62194693A (ja) | 基板付き電気電子部品 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |