JPH02248054A - Calculation of angle of bonding component - Google Patents

Calculation of angle of bonding component

Info

Publication number
JPH02248054A
JPH02248054A JP6763089A JP6763089A JPH02248054A JP H02248054 A JPH02248054 A JP H02248054A JP 6763089 A JP6763089 A JP 6763089A JP 6763089 A JP6763089 A JP 6763089A JP H02248054 A JPH02248054 A JP H02248054A
Authority
JP
Japan
Prior art keywords
coordinate
points
data
angle
coordinates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6763089A
Other languages
Japanese (ja)
Other versions
JP2511708B2 (en
Inventor
Kouji Nishimaki
西巻 公路
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marine Instr Co Ltd
Original Assignee
Marine Instr Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marine Instr Co Ltd filed Critical Marine Instr Co Ltd
Priority to JP6763089A priority Critical patent/JP2511708B2/en
Publication of JPH02248054A publication Critical patent/JPH02248054A/en
Application granted granted Critical
Publication of JP2511708B2 publication Critical patent/JP2511708B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To determine the angle of inclination of a bonding component by a method wherein the lengths between a plurality of points along the sides of the bonding component and the reference coordinate point are calculated and the found length to each coordinate point is added. CONSTITUTION:In reference coordinates (R1 to R4) selected from among arbitrary coordinates on each side of a pellet 2 positioned on an X-Y table, coordinate axes x1, x2, y1 and y2 are formed of each line parallel to coordinate axes to pass the origin of the X-Y table in directions X and Y. A plurality of arbitrary points on each side, which is extended from the reference coordinates R1 to R4 to the directions X and Y, are selected and the coordinate points of these points are found. A plurality of similar coordinate points are found on each side. Data on these found coordinate points is stored. The lengths between the reference coordinate points and each selected coordinate point in the directions X and Y are found as data on axes X and Y on the basis of the stored data and the found length to each coordinate point is added in the directions X and Y and the accurate angle of inclination of the pellet can be calculated from each line to pass between the coordinate points.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は半導体集積回路(IC)や大規模集積回路(L
SI)の半導体部品のボンディング装置に関し、特にダ
イボンダーやテープボンダーでベレットをマウントする
際に画像処理装置内の認識装置により検出されたベレッ
トの角度データを用いて正確な角度を算出することので
きるボンディング部品の角度算出方法に関するものであ
る。
[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to semiconductor integrated circuits (IC) and large-scale integrated circuits (L
SI)'s bonding equipment for semiconductor components, especially when mounting a pellet with a die bonder or tape bonder, the bonding system is capable of calculating accurate angles using the angle data of the pellet detected by the recognition device in the image processing device. The present invention relates to a method for calculating angles of parts.

[背景技術] 半導体集積回路(IC)や大規模集積回路(LS I 
)を製造する場合のテープボンディングやダイボンディ
ングなどでは、ウェハーリングまたはトレー上に配列さ
れたベレットを移送し、位置決め台やリードフレーム上
に置く必要がある。
[Background technology] Semiconductor integrated circuits (IC) and large-scale integrated circuits (LSI)
), it is necessary to transport pellets arranged on a wafer ring or tray and place them on a positioning table or lead frame.

このときベレットの中心位置及び回転角度が画像処理装
置により算出される。
At this time, the center position and rotation angle of the pellet are calculated by the image processing device.

第3図はベレットの傾き角を検出する従来例を示してい
る。第3図ではベレットlの任意の辺を選び、この辺の
任意の2点、AI及びA2の座標からベレットlの傾き
を算出する。この傾き角θはAI及びA2の座標がXY
テーブル上の座標(正規の座標は予め画像処理装置の記
憶回路に入力されている。)により読み取ることができ
るから、AI及びA2間のX方向の長さをXとし。
FIG. 3 shows a conventional example of detecting the inclination angle of a belet. In FIG. 3, an arbitrary side of the pellet l is selected, and the inclination of the pellet l is calculated from the coordinates of two arbitrary points on this side, AI and A2. This tilt angle θ is determined by the coordinates of AI and A2 being XY.
Since it can be read from the coordinates on the table (regular coordinates have been input into the storage circuit of the image processing device in advance), let the length in the X direction between AI and A2 be X.

Y方向の長さをYとすると。Let Y be the length in the Y direction.

θ =Tan −鳳 (Y/x )    ・ ・ ・
  (1)により角度θを求めることができる。
θ = Tan − Otori (Y/x) ・ ・ ・
The angle θ can be determined by (1).

[発明が解決しようとする11111 しかしながら、従来のベレットの傾き角検出方法では第
4図に示すように画像処理装置内の認識回路で処理され
るデータはディジタル信号であるため、この信号により
得られる波形は階段状のものとなる。したがって、2つ
の任意の定点の選択箇所1例えばA4若しくはA5を選
択して傾き角θ検出のデータとした場合はθ1若しくは
θ2となり角度誤差を生ずるという欠点がある。この角
度誤差はベレット形成時の辺のカケや認識回路の処理能
力により1画素の値の意味が大きい装置では検出角度の
分解能が低下してしまうという欠点がある。このような
角度誤差はリードの多ビン化、バットまたはバンブの小
ピツチ化が推進される場合には無視できない範囲となり
全自動ボンディングにおいてはボンディングできない可
能性がある。
[Object to be Solved by the Invention] However, in the conventional method for detecting the inclination angle of a belet, the data processed by the recognition circuit in the image processing device is a digital signal, as shown in FIG. The waveform becomes step-like. Therefore, if two arbitrary fixed point selection points 1, for example A4 or A5, are selected as data for detecting the inclination angle θ, the data will be θ1 or θ2, resulting in an angular error. This angular error has the disadvantage that the resolution of the detected angle is reduced in an apparatus in which the value of one pixel has a large meaning due to the chipping of the sides during bullet formation and the processing capacity of the recognition circuit. Such an angular error becomes a non-negligible range when the number of lead bins and the pitch of bats or bumps becomes smaller, and there is a possibility that bonding cannot be performed in fully automatic bonding.

そこで1本発明は上記従来技術の欠点に鑑みなされたも
ので、ベレットの任意の辺を選択し、この辺のX方向及
びY方向における複数の任意の座標点を選択し、基準座
標点より選択されたXY軸上の各座標点までの長さを求
め、求められた各座標点の長さを加算してX方向及びY
方向の各座標点を求めることにより傾き角を検出するこ
とのできるボンディング部品の角度算出方法を提供しよ
うとするものである。
Therefore, the present invention was made in view of the above-mentioned drawbacks of the prior art, and it selects an arbitrary side of the pellet, selects a plurality of arbitrary coordinate points of this side in the X direction and Y direction, and selects a plurality of arbitrary coordinate points from the reference coordinate points. Find the length to each coordinate point on the XY axes, add the lengths of each coordinate point, and calculate the
It is an object of the present invention to provide a method for calculating the angle of a bonding component, which can detect the inclination angle by determining each coordinate point in the direction.

[課題を解決するための手段] 本発明は、位置決め台に配置されたボンディング部品の
任意の辺を選択し、この選択された辺のxy座座上上任
意の点を基準座標点とし、この基準座標上の定点より前
記辺に沿って複数の任意の点を選択し、この選択された
複数の点におけるxY座標を求め、この得られた座標デ
ータを記憶し、該データにより前記定点より複数の選択
された各座標まてのXY軸上の長さを算出し、求められ
たXY軸上の夫々の座標点の長さを加算することにより
ボンディング部品の傾き角を検出するようにしたもので
ある。
[Means for Solving the Problems] The present invention selects an arbitrary side of a bonding component placed on a positioning table, sets an arbitrary point on the xy seat of the selected side as a reference coordinate point, and Select a plurality of arbitrary points along the side from a fixed point on the reference coordinates, find the xY coordinates of the selected points, store the obtained coordinate data, and use the data to select a plurality of points from the fixed point. The inclination angle of the bonding part is detected by calculating the length on the XY axes of each selected coordinate point and adding the lengths of the calculated coordinate points on the XY axes. It is.

[実施例] 次に本発明について図面を用いて詳細に説明す蚤。[Example] Next, the present invention will be explained in detail using the drawings.

第1図は本発明の詳細な説明する図である。FIG. 1 is a diagram illustrating the present invention in detail.

第1図に3いて、2はXYテーブル上の位置決め台に位
置決めされたベレットである。R1。
3 in FIG. 1, 2 is a pellet positioned on a positioning stand on an XY table. R1.

R2、R3、R4はベレット2の各辺の任意の座標を選
択して測定の基準となる基準座標である。
R2, R3, and R4 are reference coordinates that select arbitrary coordinates on each side of the pellet 2 and serve as measurement standards.

この基準座標(R1、R2、R3、R4)は。These reference coordinates (R1, R2, R3, R4) are.

xYテーブルの原点を通る座標軸と平行な線でX方向及
びY方向に座標軸xi 、 x2 、 yl 。
Coordinate axes xi, x2, yl in the X and Y directions with lines parallel to the coordinate axes passing through the origin of the xY table.

y2を形成する。上記基準座標R1乃至R4よりX方向
及びY方向に伸びる各辺の任意の点を複数選択し、これ
らの座標点を求める。同様な座標点を各辺において複数
束める。この求められた座標点のデータを画像処理装置
内の記憶回路に記憶する。この記憶されたデータを基に
して第2図に示すようにX方向及びY方向に基準座標点
より選択された各座標点までの長さをXY軸上のデータ
として求め、求められた各座標点の長さをX方向及びY
方向に加算して各座標点間を通る線より傾き角を検出す
る。
form y2. A plurality of arbitrary points on each side extending in the X direction and Y direction from the reference coordinates R1 to R4 are selected, and these coordinate points are determined. Bundle multiple similar coordinate points on each side. The data of this determined coordinate point is stored in a storage circuit within the image processing device. Based on this stored data, as shown in Figure 2, the length from the reference coordinate point to each selected coordinate point in the X and Y directions is determined as data on the XY axes, and each of the determined coordinates is The length of the point in the X direction and Y direction
The inclination angle is detected from the line passing between each coordinate point by adding in the direction.

この算出方法を以下に具体的に説明する。This calculation method will be specifically explained below.

第1図のベレット2の複数辺より複数の座標点を検出し
、この検出された座標点よりai及びbiを求める。
A plurality of coordinate points are detected from a plurality of sides of the pellet 2 shown in FIG. 1, and ai and bi are determined from the detected coordinate points.

例えば、座標点Pl= (at 、bl )、P2=(
a1+a2.bl+b2)・・・のようにを求める。
For example, coordinate point Pl = (at, bl), P2 = (
a1+a2. bl+b2)... is obtained.

(2)式により求められたデータを最小二乗法により第
2図図示のように平均化して傾きを求める。
The data obtained by equation (2) are averaged by the least squares method as shown in FIG. 2 to obtain the slope.

求められた傾き=Σb/Σa ・・・(3)であるから
、この(3)式の傾き直線を基準としてIα画素に相当
するデータ以内に存在しない座標点(aα、bα)は異
常データとして除外するようにする。
Obtained slope = Σb/Σa ...(3) Therefore, coordinate points (aα, bα) that do not exist within the data corresponding to the Iα pixel based on the slope straight line of equation (3) are treated as abnormal data. Make sure to exclude it.

(3)式より求められた傾きをB/Aとすると、 θ =Ta  n (B/A) ・ ・ ・ (4) より傾き角θを算出することができる。If the slope obtained from equation (3) is B/A, then θ = Ta n (B/A) ・ ・ ・(4) Thus, the tilt angle θ can be calculated.

この傾き角は画像処理装置内で演算処理される。This tilt angle is calculated within the image processing device.

[発明の効果] 以上説明したように本発明によれば、ベレットの任意の
辺を選択し、この辺のX方向及びY方向における複数の
任意の座標点を選択し、基準座標点より選択された各座
標点までの長さを求め、求められた各座標点の長さを加
算してX方向及びY方向の各座標点を求め、得られたデ
ータを平均化することにより傾き角を検出するようにし
たので画像処理装置の画素分解能よりも信頼度の高いデ
ータを得ることかできる。また、本発明によれば得られ
たデータより異常データを除外することによりベレット
の辺のカケ等による誤ったデータより傾きを算出する確
率を防ぐという効果かある。これにより、精度の高いボ
ンディング部品の位置決めができる。
[Effects of the Invention] As explained above, according to the present invention, an arbitrary side of the bellet is selected, a plurality of arbitrary coordinate points of this side in the X direction and Y direction are selected, and Find the length to each coordinate point, add the lengths of each coordinate point to find each coordinate point in the X direction and Y direction, and detect the tilt angle by averaging the obtained data. This makes it possible to obtain data with higher reliability than the pixel resolution of the image processing device. Further, according to the present invention, by excluding abnormal data from the obtained data, there is an effect of preventing the probability of calculating the slope from incorrect data due to chipping of the edges of the pellet, etc. This allows highly accurate positioning of bonding parts.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本発明の一実施例であり、本発明の
詳細な説明図、第3図及び第4図は従来のボンディング
部品の角度算出方法を説明する説明図である。 第1図 1・・・ベレット、2・・・ベレット。
FIG. 1 and FIG. 2 are one embodiment of the present invention, and FIGS. 3 and 4 are detailed explanatory diagrams of the present invention, and FIGS. 3 and 4 are explanatory diagrams illustrating a conventional method for calculating the angle of bonding parts. Figure 1 1...Bellet, 2...Bellet.

Claims (3)

【特許請求の範囲】[Claims] (1)位置決め台に配置されたボンディング部品の任意
の辺を選択し、この選択された辺のXY座標上の任意の
点を基準座標点とし、この基準座標上の定点より前記辺
に沿って複数の任意の点を選択し、この選択された複数
の点におけるXY座標を求め、この得られた座標データ
を記憶し、該データにより前記定点より複数の選択され
た各座標までのXY軸上の長さを算出し、求められたX
Y軸上の夫々の座標点の長さを加算することによりボン
ディング部品の傾き角を検出するようにしたことを特徴
とするボンディング部品の角度算出方法。
(1) Select any side of the bonding part placed on the positioning table, set any point on the XY coordinates of this selected side as the reference coordinate point, and move along the side from the fixed point on this reference coordinate. Select a plurality of arbitrary points, find the XY coordinates of the selected points, store the obtained coordinate data, and use the data to calculate the distance on the XY axis from the fixed point to each of the plurality of selected coordinates. Calculate the length of X
A method for calculating an angle of a bonding component, characterized in that the inclination angle of the bonding component is detected by adding the lengths of respective coordinate points on the Y-axis.
(2)求められた座標データの平均値を算出して記憶す
るようにしたことを特徴とする請求項1記載のボンディ
ング部品の角度算出方法。
(2) The method for calculating the angle of a bonding component according to claim 1, characterized in that an average value of the determined coordinate data is calculated and stored.
(3)求められた座標データの各座標間の平均値を基準
として所定の設定範囲以外のデータを異常データとして
判定するようにしたことを特徴とする請求項1及び2記
載のボンディング部品の角度算出方法。
(3) The angle of the bonding component according to claims 1 and 2, wherein data outside a predetermined setting range is determined as abnormal data based on the average value between each coordinate of the obtained coordinate data. Calculation method.
JP6763089A 1989-03-22 1989-03-22 Bonding component angle calculation method Expired - Fee Related JP2511708B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6763089A JP2511708B2 (en) 1989-03-22 1989-03-22 Bonding component angle calculation method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6763089A JP2511708B2 (en) 1989-03-22 1989-03-22 Bonding component angle calculation method

Publications (2)

Publication Number Publication Date
JPH02248054A true JPH02248054A (en) 1990-10-03
JP2511708B2 JP2511708B2 (en) 1996-07-03

Family

ID=13350498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6763089A Expired - Fee Related JP2511708B2 (en) 1989-03-22 1989-03-22 Bonding component angle calculation method

Country Status (1)

Country Link
JP (1) JP2511708B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031598A (en) * 2001-07-17 2003-01-31 Shibaura Mechatronics Corp Method and device for position detection of rectangular electrical component, and method and device for semiconductor chip bonding using them

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003031598A (en) * 2001-07-17 2003-01-31 Shibaura Mechatronics Corp Method and device for position detection of rectangular electrical component, and method and device for semiconductor chip bonding using them
JP4633973B2 (en) * 2001-07-17 2011-02-16 芝浦メカトロニクス株式会社 Rectangular part position detection method and position detection apparatus, and semiconductor chip bonding method and semiconductor chip bonding apparatus using the same

Also Published As

Publication number Publication date
JP2511708B2 (en) 1996-07-03

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