JPH0224545U - - Google Patents
Info
- Publication number
- JPH0224545U JPH0224545U JP1988101336U JP10133688U JPH0224545U JP H0224545 U JPH0224545 U JP H0224545U JP 1988101336 U JP1988101336 U JP 1988101336U JP 10133688 U JP10133688 U JP 10133688U JP H0224545 U JPH0224545 U JP H0224545U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- container
- syringe
- supply device
- sucks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/011—Apparatus therefor
- H10W72/0113—Apparatus for manufacturing die-attach connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101336U JPH0224545U (enExample) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988101336U JPH0224545U (enExample) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224545U true JPH0224545U (enExample) | 1990-02-19 |
Family
ID=31330234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988101336U Pending JPH0224545U (enExample) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224545U (enExample) |
-
1988
- 1988-07-29 JP JP1988101336U patent/JPH0224545U/ja active Pending