JPH0224545U - - Google Patents
Info
- Publication number
- JPH0224545U JPH0224545U JP10133688U JP10133688U JPH0224545U JP H0224545 U JPH0224545 U JP H0224545U JP 10133688 U JP10133688 U JP 10133688U JP 10133688 U JP10133688 U JP 10133688U JP H0224545 U JPH0224545 U JP H0224545U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- container
- syringe
- supply device
- sucks
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/743—Apparatus for manufacturing layer connectors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10133688U JPH0224545U (de) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10133688U JPH0224545U (de) | 1988-07-29 | 1988-07-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224545U true JPH0224545U (de) | 1990-02-19 |
Family
ID=31330234
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10133688U Pending JPH0224545U (de) | 1988-07-29 | 1988-07-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224545U (de) |
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1988
- 1988-07-29 JP JP10133688U patent/JPH0224545U/ja active Pending