JPH02236428A - Heat detector - Google Patents

Abstract

PURPOSE: To detect temperature rising and dropping continuously by forming this device out of at least one supporting structural body and at least one conductor fixed onto the supporting structural body. CONSTITUTION: This device is provided with the first supporting structural body 110 serving as a main member, an optional supporting structural body 130 and a conductor 120. The conductor 120 is fixed onto the structural body 110 and connected to a mesh. The conductor 120 fixed between the structural body 110 and 130 is composed of various conductive mediums. The conductor 120 expands or shrinks with its own conductivity retained as a result of the structural bodies 110, 130 expanding or shrinking with heat increase or decrease. When the conductor 120 is expanded or shrunk, the resistance/conductivity associated with the conductor 120 changes. The change in resistance/conductivity is monitored immediately by an electron monitoring instrument, for example, an electric circuit, which is calibrated exactly so as to monitor temperature associated with thermal expansion of the structural bodies 110, 130 precisely.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates generally to automatic thermal detection apparatus and methods. In particular, the present invention relates to a thermal detection apparatus and method for continuously detecting increases and decreases in temperature.

BACKGROUND OF THE INVENTION Fire damage has been and continues to be a major problem today. This tremendous loss from fire has prompted businesses, insurance companies, and individuals to pay large sums of money each year to detect and prevent fires and the losses that result from them. The amount is astonishing. Approximately 5 residential fires occur each year.
It is estimated that 1 in 4 households will be affected by a fire in the kitchen. Losses account for almost 1% of the country's gross domestic product. Damage to property alone is estimated to amount to approximately 650 billion yen ($35 (a)) each year.
It is reported that there are up to 10,000 cases. It is estimated that as many as 6,000 people die and as many as 32,000 people are injured each year. It is also predicted that more injured people than the number of injured people and shrines have not been reported. The largest fire losses reported were to residential buildings. In fact, all home fires are caused by malfunctioning fireplaces, cooking, and smoking.

Fires are a social and demographic phenomenon in the United States.
It has a negative impact on all demographic groups. The public has embraced fire detectors, as evidenced by the use of household smoke detectors. The popularity of fire detection devices has increased at an alarming rate in recent years, and this trend is expected to continue.

The market for existing fire sensors in the US is generally 7I.
! It is 1.2 billion yen to 1.2 billion yen (5 to 8 million dollars), and continues to grow at a rate of 25% every year.

There are approximately 45 large companies that manufacture fire detection equipment in the United States. This market has established vertical relationships along the manufacturing and maintenance service chain.

Generally, this market combines manufacturing, management, motor display and installation services. Some of the multi-billion yen companies earn profits both domestically and internationally.

In general, fire detection devices are characterized by cost effectiveness and reliability.
eliabilales (V) have been further enhanced. This high cost efficiency and reliability were achieved primarily through the use of semiconductor technology and the listing of codes and performance specifications. However, the sensors installed in these fire detection devices currently in use are based on smoke, flame or fire gases. Thermal sensors are of limited use because they detect secondary events, such as differential expansion, the melting point of insulation materials, and the melting point of conducting media. A typical thermal detection device is activated only when the temperature of the detection device itself, rather than the surrounding air, reaches a predetermined temperature. The difference between the ambient temperature and the detection device temperature is due to the thermal lag (th
permanent lag). This thermal lag results from the transfer of heat from the ambient air to the sensing device to raise the temperature of the sensing device to the operating temperature.

The heat transfer associated with this thermal delay takes a considerable amount of time. Current sensing techniques have also experienced a thermal lag between the air temperature and the temperature of the sensing device. Two major factors must be considered when using thermally actuated sensors. At the time a fixed temperature or rate of rise detection device is activated, the surrounding air is always hotter than the detection device. This thermal lag, or delay, is proportional to the rate of rise in temperature of the surrounding air.

Two types of rate-of-rise detection devices are commonly used: pneumatic and thermoelectric.

Pneumatic detection devices are based on the principle that an increase in temperature increases the pressure of a trapped gas. This pressure acts on a switch which sends an electrical signal to a. l
Send it to the I control department to activate alarm devices, etc. Thermoelectric detection devices measure small changes in electrical current. This change in current is generated when heat is applied to the junction of two dissimilar metals. The curved, linear thermoelectric detection device consists of two pairs of wires that are covered by a sheath to protect them from physical damage. One wire in each pair has a high coefficient of thermal resistance. Wires with the same thermal resistance coefficient (
One wire in each pair) is insulated. The other wires are left open to temperature effects inside the protected space.

These wires are connected to a device for measuring resistance. The temperature increase in the protected space appears as a disproportion to the resistance of the wire.

If the degree of imbalance is significant, an alarm will be raised.

A combination of fixed temperature and rate-of-rise devices can be activated when the temperature increases at a predetermined rate of increase or faster. If the temperature rises slowly and continuously, this rate-of-rise device will not operate. Therefore, as a result of this, the fixed temperature equation 81
The device will issue an alarm. The main advantage of such a combination device is that it provides additional protection. Fixed-temperature tams also respond to slow Uljt increases that would not cause rate-of-rise equipment to operate. The rising type device in this detection device can reset itself, but the fixed temperature type device cannot reset itself.

In general, fire detection devices have been made more cost effective and versatile by using inexpensive semiconductor electronic components. however,
The sensors incorporated into fire detection devices used to date have typically been based on existing technology.

Existing smoke detection devices are ineffective and ineffective in many residential and industrial applications. The main operational difficulty lies in false alarms. Improper placement and improper use in industrial applications can result in ineffectiveness, inoperability, or false alarms. Therefore, most conventional uses have focused on residential smoke detection devices. Two major obstacles to using smoke detection devices are the inability to identify the "familiar smoke" emanating from the kitchen and the severe response time to recognition. Smoke detection devices have been described as being responsive, providing an alarm in response to an ongoing fire. Noxious gases resulting from combustion can be detected by the emission of particulates or by photoelectric differences. However, this detection is activated only as a function of a fire that is already in progress. While there is no doubt that these devices are useful and can save lives, they can result in significant property damage and loss if unprotected.

Industrial sectors such as coal mining and waste disposal pose particular challenges in using conventional, readily available sensors for fire detection. In this way, in many cases, No. 15 received from older sensors was evaluated. Although signal detection technology has advanced rapidly, the same thermal sensors have been commercially available and used in residential applications for many years.

Efforts have been made to maximize warning time for evacuation as well as reduce property damage. International Fire Protection Organization (
Theta oral fire protection
n^gency) strongly recommends using both a heat sensor and a smoke sensor so that they perform complementary functions.

Most recently, two patents were granted that are specifically related to the present invention. One of the richest was granted to Yuzo Kitagawa [Japanese Unexamined Patent Publication No. 53-1 446 entitled "Fire Detection Sheet"
It is No. 99. JP-A-53144699 provides a fire detection sheet having a layered pattern printed with conductive ink on a bidirectionally oriented plastic film. This sheet has a concave portion formed in a checkered pattern, and when the film is heated and softened, it contracts to create a hole, thereby interrupting the ¥# electric circuit and emitting a +II signal. A patent relating to the present invention was also granted to Willard A. Dominque [U.S. Pat. No. 5.52 entitled Fire Alarm Device and Method J]
It is No. 0.352. This patent specification No. 5.520.3
No. 52 describes a thermal sensor having a continuous wire fixed to one sheet or sandwiched between two or more sheets. The sheet is made of heat-transfer plastic whose brass snacks, when exposed to heat, contract and cut the wires, which then melt and trigger the alarm.

Also relevant to the present invention with respect to detecting heat are:
U.S. Patent Nos. 4.388.267 and 4,408,9 to Richard D.
No. 04, all of which are entitled "Diast state detection device." No. 4,408,904 describes a plurality of fusible segments spaced apart from one another along the length of the conductor. Each segment is made in the same manner from a conductive material having a predetermined heat of fusion below the melting point of the wire. Electrical insulating material attached along the conductor restricts the molten R material flowing from each segment, and positions the molten material at specific locations along the length of the conductor at the crossing contact points between the conductors. It is supposed to be done.

Therefore, the temperature state of the associated components can be obtained by monitoring the resistance change between the terminals at opposite ends of the conductor.

U.S. Patent No. 4.388.2 to Tocarz
No. 67 also describes a temperature state detection device. The detection device described uses a pair of long electrical leads that are spaced apart from each other. When one conductor melts and spans the space between each conductor, a change in resistance occurs in the conductors. This change in resistance will be related to temperature changes. Thus, one-time states can be obtained from changes in the conductance of the molten wire.

There are typically two types of readily available sensors on the market used for fire detection.

Fire detection devices can therefore be classified into two categories.

(1) a thermally activated sensor, and a +21 smoke activated sensor. Both heat-actuated and smoke-actuated sensors continue to be developed with their respective technologies. Still, most of the sensors currently in use on the market have been in use for 20 years or more. The development of electronic devices using low-cost semiconductors has given the electronic detection devices currently in use more leeway to provide increasingly complex and diverse alarm mechanisms. Sensing technology related to electronic devices has not advanced as rapidly as technological advances in electronic devices.

Both types of sensors, heat-activated and smoke-activated, are activated by the progression of a fire to conditions of high heat and heavy smoke, respectively.

Also, in most cases there is heat and/or heat in the immediate vicinity of the sensor.
or a concentration of smoke is required for operation. Therefore, the air surrounding the sensor at the boundary must be either hot, saturated with smoke-based particles, or electrically charged, such as many fine smoke particles.

In an effort to simplify the measurement of heat, and therefore the potential hazards, the present invention makes use of the thermal expansion and elastic offset effects associated with the conductor and the air supply circuit. Most substances increase in size and/or volume when heated. This increase in length or volume is called thermal expansion. The application of thermal energy to an object tends to increase thermal agitation if the material is composed of atomic and molecular bonds. This kinetic energy competes directly with the energy that binds the materials together and holds them in their original shape. Simply put, the constituent particles, atoms, and molecules are pulled apart more at higher temperatures than at lower temperatures. This "interparticle distance" corresponds to the overall expansion of the object. Thermal expansion properties are roughly defined as linear thermal expansion coefficients.

The linear coefficient of thermal expansion is defined as the ratio of the change in quality per degree centigrade to the change in quality in 0°C. As explained, the physical properties of expanding materials tend to change with increasing volume or length. A particularly important fact is that as the volume increases, the density or mass density per unit volume decreases. Similarly, the number of atoms per unit volume decreases with increasing volume. These physical properties have previously deterred practitioners from using materials that expand under thermal action. For example, US Patent No. 11i! issued to Domingue!
! No. 4.520,352, and rice lli granted to Tokartu! In both Patent Mei 18 No. 4.388,267 and Machibun Sho 53-144369, as the density or volume increases, the density or number of atoms per unit volume decreases. Discusses the fact that the heated material is pulled apart. especially,
1 requirement for "foil rupture" in U.S. Pat. No. 4,520,352, and in U.S. Pat. Refer to the requirement that "the air space between the conductors be crossed." In particular, 1f'tl No. 53-1 44369 clearly states, ``When the film is heated, holes are formed, which break the conductive path and cause a buzzer to sound.''

If the principles of thermal expansion are well controlled and combined with electrical conductivity, unique and innovative accurate detection sensors are possible. Elasticity is roughly defined by the empirical observation that forces associated with it tend to cause the elastic material to return to its original geometry. This elastic force, which tends to restore a material to its original geometry, is proportional to the displacement of an elastic material, based on a well-known physical theorem known as Hooke's law. Obviously, such properties are limited to a range of forces and distances υ1 that do not permanently deform the elastic material. Hooke's law is stress,
That is, it is defined as the relationship between force per unit area and strain, or a fraction of elongation.

This stress is proportional to a constant strain called Young's modulus. Young's modulus is related only to the material, not the shape.

The basic idea of the present invention is to combine the well-known physics of thermal expansion with the physics of elasticity to provide a thermal detection device that can instantly detect single-degree conditions in both ascent and descent. It is to be.

Therefore, it is a feature of the present invention that, during normal use, the ferrous metal compound undergoes a number of non-destructive repeated expansion operations without creating stress in the base thermoplastic film or metal conductor. An object of the present invention is to provide a heat detection device that does the following.

Another feature of the invention is that it provides an unaffected temperature coefficient of resistance that is not changed by physical stress and can only be controlled by temperature.

Yet another feature of Kihatsuro is that heat transfer to the conductive metal occurs through a thermoplastic resin made to have intermediate thermal conductivity. This allows instantaneous response and eliminates lag time, allowing the change in resistance, or rate of change in resistance, to be accurately measured.

Yet another feature of the invention is the use of very thin metal or inorganic conductors that are placed in contact with a thermoplastic support structure that is not exposed to heat. This is done so that physical properties such as these do not adversely affect this adhesion when they come into play.

Still other features of the present invention provide a thermal detection device capable of detecting temperature changes without significantly adversely affecting the device.
That's true.

Yet another feature of the present invention is to provide a thermal sensing device that can determine the physical properties of a resilient support structure.

Yet another feature of the invention is its use in hostile environments where the sensor is adversely affected, such as dust, ultraviolet light, volatile gases, vacuum, "familiar" smoke, etc., such as in coal mining, waste treatment facilities, etc. An object of the present invention is to provide a heat detection device capable of detecting heat.

Yet another feature of the present invention is to provide a heat detection device that detects repeated increases and decreases in heat.

A further additional feature of the present invention is to provide a thermal sensing device having thermal expansion and elastic properties.

Yet another feature of the invention is to provide a linear thermal sensing device that is in direct direct contact with a hot surface.

Yet another feature of the present invention is to provide a heat detection device that does not suffer from thermal delays due to heating of ambient air or the like.

Yet another feature of the invention is to provide a thermal sensing device that is mounted in direct contact with a heated surface.

Yet another feature of the invention is to provide a thermal detection device that is easy and inexpensive to manufacture.

Additional features and advantages of the invention will be set forth in part in the description that follows, and in part will be apparent from the description, or may be learned by practice of the invention. These features of the invention! and the advantages are realized by the combinations and steps specifically mentioned in the Scope of Patent Claims section.

Means for Accomplishing the Problem In order to achieve the objects, features and advantages set forth above as intended by this statement, as hereby embodied and broadly described, the rise and fall in temperature is measured. A heat detection device is provided for. The thermal detection device is constructed with at least one support structure and at least one electrical wire secured to the support structure. The conductor imparts thermal properties to itself by knowing the physical properties of the supporting structure, and those properties are directly proportional to the conductor's low resistance/conductivity, and they further reduce the temperature to the supporting structure. It is directly proportional to the impact. The conductor is
For example, for metals, amorphous llI3 and crystalline conductors, electronic, optical fibers 3! ! Regarding lines, photons,
The ultrasonic conductor can be adapted to transmit any physical element such as a sound wave.

Efforts to make thermal measurements more accurate, to more accurately measure changes in temperature rise rate, and to reduce alarm response times 1. :P! The present invention is based on the heat dissipation reaction, thermal conductivity coefficient,
It takes advantage of dielectric strength, resistivity, and thermoplastic polymeric chemicals.

Thermoplastic polymer I is a long chain polymeric material that softens when heated. These are cross linking
) consists of linear branched polymeric materials with little or no As a thin film! When manufactured, the resulting product is lightweight and highly resistant to chemical corrosion. Due to such a chemical structure, thermoplastic polymer materials have excellent electrical resistance, dielectric strength, and thermal resistance. The chemical properties of thermoplastic polymeric materials can be formulated to respond to very small temperature changes or 1 degree changes. Such responsivity or reaction has a chemical and physical effect on the film support k'y I structure.

Resistance opposes the flow of electrons. The value of the resisting current flowing through a material is a function of the number of available free electrons it contains, as well as the obstacles those electrons encounter chemically as they move through the material under the influence of the potential difference. Depends on the form of the molecule. Electrons are atoms in conducting or non-conducting materials and reactive chemicals ( r
eacttveCheNCal sight). The attraction effect of a given material occurs when thermoplastics react chemically and physically to heat.

In the present invention, the conductive wire is attached to the support structure at 100.degree.
It is given in thickness of 000 people or less. This is provided so that the guiding powder is adhered to the support structure and responds to changes caused by temperature. The electric potential applied across a conductor has a special state of measurable resistance that changes at a constant rate as it rises and falls. This makes it possible to measure the resistance value or the rate of change in state.

Heat, and measurement of a specific temperature or indicated temperature rise 1! ! In an effort to simplify, the present invention uses and combines thermal properties to measure electron flow and dielectric properties of the interface. This measurement is performed to ensure that physical stresses, such as pull-apart effects or constraining the chemical and physical properties of the thermoplastic material, do not cause random changes in the performance of the conductor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The accompanying drawings, which are incorporated into and constitute a part of the present invention, illustrate a preferred embodiment of the invention, as well as the general description of the invention set forth above and the detailed description of the preferred embodiments set forth below. The drawings serve to illustrate the principles of the invention.

Reference will now be made in detail to the preferred embodiments of the invention, as illustrated in the accompanying drawings.

FIG. 1 shows a preferred embodiment of one wire sensor 100 incorporated into the thermal detection system IS of the present invention. This one '4I! The sensor 100 has as its main components a first support structure 110, an optional support structure 130, and a conductor 120. The conductor 120 is connected to the first support structure 1
10 and are arranged in a mesh pattern. This fixed and mesh attachment allows the conductor 120 to experience expansion and contraction of the first support structure 110. The conductive wire 120 is attached to the first support structure 110
and an optional support structure 130. A conductor 124 is assembled to this lead wire 120. The conductor 124 is attached to the conductor 120 by contacts 122.

The procedure for securing the conductor 120 to the support structure 110 depends on the support structure and the materials used and also for the conductor, and on the results to be achieved. For example, if the conductor 120 is metallized (mcta+l
iZation), lamination, pressure sensitivity
e sensitized), thermosetting, thermoplastic WA!
Mesh attachment is performed to support structure 130 using I1 UV curing, printing and electroplating techniques.

In one embodiment, first support structure 110 and optional support structure 130 are plastic substrates. For example, the first support 110 and optional support structure 130 can be polyethylene, boribiropyrene, polyester, nylon, polycarbonate, mixed plastics, and various fire-resistant plastics. First support structure 110 and optional support structure 13
0 is, for example, approximately 0. 0 1 2 7M (0.5a
+il) ~ about 0. 38 1am (1 5mil
) can be varied within the range of thickness. Also, first support structure 110 and optional support structure 130 can be of different thicknesses or materials depending on the desired results.

The conductive wire 120 attached between the first support structure 110 and the optional support structure 130 can be made of a variety of electrically conductive media. For example, conductor 12o may be made of vacuum metallized aluminum, printed with silver, nickel, copper, or gold conductive ink, made of thin gold or aluminum foil, or made of the most commonly available lead, nickel, copper, gold and Conductive coatings, such as conductive pigments, have been found to work adequately.

A fundamental aspect of the present invention is that the conductor 120 "takes on" the physical properties associated with the first support structure 110 and the properties associated with any support structure 130.
)It is to be. Thus, as the first and optional support structures 110 and 130 expand and contract in response to increases and decreases in heat, the S-wire 120 expands and contracts while retaining its electrical conductivity. However, as the conductor 120 undergoes expansion and contraction, the resistance/conductivity associated with the conductor 120 changes. This change in resistance/conductivity is immediately monitored by an electronic monitoring device, such as an electrical circuit. This is also very accurately supported.
It is calibrated to accurately monitor the temperature associated with the thermal expansion of the eight structures 110 and 130.

FIG. 2 is a schematic diagram of a preferred embodiment of the thermal detection device 10 of the present invention. The main components of this heat detection device 1o according to the present invention are an electric circuit 200, a sensor 400, and a sensor 4.
It is 00. As shown in FIG. 3, this sensor 400 is a plurality of *'IiA sensors. Therefore, serious circuit 2
A portion of 00 can be combined with each characteristic of sensor 400.

The sensor 400 includes a first conductor 1410, a second conductor 420, and a third conductor 430.

Preferably, the support structure is operatively associated with each conductor (not shown in FIG. 2).

Electrical circuit 200 includes three basic circuit components. These basic circuit members are subcircuit (A), subcircuit (B) and subcircuit (C).

These subcircuits (A) and (8) in the electric circuit 200
ml240 and switch 250 are assembled to all of (C) and (C). Historically, subcircuit (A) comprises a first variable resistor 212, a first transistor 214, and a first diode 216. Similarly, subcircuit (B) includes a first variable resistor 222, a first transistor 224, and a first diode 226. The subcircuit (C) includes a resistor 232 and a third transistor 2
Contains 34.

Each subcircuit (A), (B) and (C) is connected to the first conductor 1!2
410, and are operatively associated with a second conductor 420 and a third conductor 430, respectively.

The conductivity of each of conductors 410, 420 and 430/
Resistances can be monitored more accurately by specific circuits that work with them. Thus, as shown in FIG. 2, the thermal detection device 10 has a multi-conductor sensor 400 forming a transducing mechanism and a detection ti@ as monitored by the electrical circuit 200. Therefore,
The thermal detection device 110 can be set so that the electrical circuit 200 sounds a warning signal 1300 in response to the absolute conductivity value associated with a particular temperature. Also, the thermal sensing device 10 can be set to match a particular resistance value associated with a particular temperature, which in turn can be associated with a particular thermal expansion characteristic. Conductors 410, 420 and 43
0 can each be activated independently. This thermal detection device 1110 can be used for $11111 to evaluate changes in resistance using a "microchip" or the like.

FIG. 3 shows a perspective cutaway view of the multi-conductor sensor 400 assembled into the thermal detection device 110 shown in FIG.

As stated again, this sensor 400 includes a first conductor 41
0, the second conducting wire 420 and the third conducting wire 430 are assembled. First conductor 410 is connected to first conductor 414 by first contact 412 . A second conductor 420 is connected to a second conductor 424 by a second contact 422 . The third conducting wire 430 is then connected to the second conductor 434 by a second contact 432.

The auxiliary conductor 442 connects the sensor 40 with the auxiliary contact 440.
Connected to 0.

All of the various components of the present invention are known or known in the art, some of which have been patented at some point in the past. Therefore, the novel combinations of the elements constituting the invention are made so that they interact in unrelated ways to achieve unique results and features.

DESCRIPTION OF OPERATION In operation, the thermal sensing device 10 of the present invention allows continuous rises and falls in temperature to be measured. The sensor assembled in the thermal sensing device 10 of the present invention is a flexible, easily deployable thermal sensor that acts as a transducer for electronic monitoring equipment.

This sensor reflects changes in resistance and conductivity that occur due to increases or decreases in temperature that occur in its vicinity.

FIG. 2 shows an embodiment of the heat detection device 2f10 of the present invention. As already explained, separate subcircuits (A), (B) and (C) can be used to evaluate separate temperature characteristics. Also, one of these sub-circuits is a simple wire connection so that it can be used without utilizing changes in resistance characteristics.

This wired subcircuit can be used as a monitoring device against which other subcircuits can be compared and evaluated.

FIG. 4 is a graph of resistance versus wetness for the thermal sensor shown in FIG. The abscissa shows the increase in temperature away from the origin, and the ordinate shows the increase in resistance away from the origin. The direct proportional relationship between sensor resistance and temperature obtained in the practice of the present invention facilitates its use in alarm systems.

Figure 5 shows a diagram of one thermal sensor as shown in Figure 4.
2 is a graph of resistance and temperature.

The vertical axis shows an increase in ohms in a direction away from the origin. The horizontal axis shows the passage of time away from the origin, and also shows the rise and fall of temperature with respect to time obtained throughout the experiment. What is particularly interesting about this thermal detection device 10 of the present invention is that it is trimodal (t
This means that the curve 600 is a curve 600 that has an average value of 1. This trimodal curve 6oo has a first beak 6101, a second beak 620, and a third beak 630.
Contains. Of particular interest is each beak 61.
The fact is that 0, 620 and 630 are directly connected to the heating time as reflected over time. At the beginning or base of each peak, the temperature is 19
The temperature rose to 3°C (below 380°C). This temperature increase occurred as a stepwise temperature function. In this way, the temperature is @ extremely 1
The temperature rose to 93°C (below 380°C), and from that point on, it began to climb towards the first peak. After a certain amount of time has passed,
The temperature dropped to room temperature and the first peak 610 immediately dropped. After the waiting time had elapsed, the temperature rose again near the heat detection device. Temperature immediately reached 193℃ (below 380℃)
It rose to 620, and fell to the second beak 620. After a certain period of time, the temperature drops to room temperature and the second peak 6
20 dropped immediately. After waiting again, a stepwise heat function was applied with the same result. One interesting thing about FIG. 5 is the fact that heat is continuously applied to the heat detector stomach for short periods of time. Therefore, as expected, the peak is continuously reduced in full width to half its maximum width.

By varying the chemistry, thickness, and combination with the plastic support structure, the coefficient of thermal expansion can be adjusted to affect the conductor to change its resistance/IX conductivity. When the support structure is expanded, the wires are stretched and their resistance/conductivity changes. In a preferred embodiment, the support structure and conductivity are equally expanded. Changes in resistance/conductivity are measured and related to temperature increases or decreases. The material of the support structure and the material of the conductive wire are selected based on the particular situation in which the thermal sensing device is to be used. sI! Properties to be considered when selecting a material or supporting structure material are the linear thermal expansion coefficient of the material, the material's elastic modulus, the material's Young's modulus,
These are the bulk modulus of the material, the Boisson's ratio of the material, and the compressibility of the material.

Additionally, other material physical parameters and properties are determined based on the application conditions to which the invention is applied and the desired R4 beam.

In other embodiments, and with reference to FIG. is made to change the low resistance/conductivity state of the conductive wire 120. By using a different material for the first support structure than that used for the second support structure,
An expansion bias force is generated. This expansion bias force is S line 120
change the expansion or contraction characteristics of Support structure 1
These changes in 10 and 130 indicate that sensor 1
4 and 5 by significantly changing the electrical characteristics of 0o.
This changes the resistance/conductivity state as shown in the figure.

Thermoplastic film is 0.00635m~0.635jM
The thermoplastic material is cast as a film having a thickness of + (0.25 to 2.5 mils). The gold fi conductor can be applied 88 by vacuum evaporation, ion sputtering, chemical vapor plating, and glow discharge, as well as other similar methods.

In vacuum assisted conductors, a thin one or more layer coating is formed on the support structure by deposition of the coating metal from its vapor phase. Most metals, as well as some primarily conductive non-metals, such as silicon oxide, can be deposited. Vacuum deposited or air-blown metallized films of aluminum, silver and gold are the most common. Vacuum laminated films are produced by vaporizing the metal under high vacuum pressure and then coating the vaporized metal onto the film. It is formed. Vacuum metallized films are O. OOO05am~0.00762am+(0.
002~0. The thickness is in the extremely thin range of 3g+il).

In addition to vacuum-coated films, vacuum-treated films can be made by ion sputtering, chemical vapor plating, and glow discharge processing. In ion sputtering, a high voltage blasts the coating material in an ionized gaseous medium toward a target, causing the ions (atoms) to deposit on a base or support structure and collect as a sputtered coating. Eggplant.

In chemical vapor plating, the film is applied when the metal-carrying gas is decomposed by contact with the heated surface of the base or support structure. In glow discharge treatment, which is applicable only to films of polymeric material, a gas discharge causes the plastic film to adhere and polymerize onto the base or support structure. Also, conductive ink can also be used. Conductive ink is silver, indium,
These include S-conductive pigments such as tin, nickel, iron, and materials with similar electrical properties.

Temperature affects the resistance of the conductor. As the temperature of the material increases, the atoms of the material become more active, causing more intense collisions of electrons and creating greater disturbances in the flow of electrons.

For most materials, the higher the temperature of the material, the greater the resistance of that material when used as a conductor. As the temperature increases, the atoms increase the concentration of their materials and cause them to collide with electrons, which causes them to flow through the materials. With such materials, the resistance increases as the temperature rises. Because the support structure is thick, heat transfer is almost instantaneous. The thermoplastic support structure begins to react and transfer thermal energy into the plastic along its length. This phenomenon is called heat dissipation. The metal coating itself reacts with the thermoplastic material in response to heat transfer, changing its electrical resistance. Due to the properties of the metal coating, the material ultimately remains in contact with the support film and continues to transmit electrons until melting begins and the film is pulled away. The support film cannot respond as quickly and interferes with the conductivity of the metal. However, at molecular interfaces, electron transport occurs and the dielectric properties of both the metal and thermoplastic film must be considered. Certain plastics change their physical properties, their electrical properties, and their electrical properties with changes in temperature.
Synthesized in such a way that it has almost no effect on Such materials are said to have a m degree coefficient of zero or near zero.

Additional advantages and modifications will readily occur to those skilled in the art. The invention is therefore not to be broadly limited to the illustrative devices particularly described in detail, but may be expanded from such details without departing from the spirit and scope of the generally described inventive concept. It is.

6A, 6B, and 6C are plan views, side views, and partially enlarged cross-sectional views, respectively, showing thermal sensors according to other embodiments of the present invention.

Further, FIG. 7 schematically shows an embodiment of a heat detection device using the heat sensors shown in FIGS. 6A, 6B, and 6C.

[Brief explanation of drawings]

FIG. 1 is a cutaway plan view showing a preferred embodiment of the assembled single conductor sensor of the heat detection device of the present invention. FIG. 2 is a schematic diagram of a preferred embodiment of the heat detection device of the present invention. FIG. 3 is a cutaway perspective view of a preferred embodiment of a multi-conductor sensor incorporated into the thermal detection device of the present invention. FIG. 4 is a graph of resistance-m degrees of the heat detection device of the present invention. FIG. 5 is a graph of resistance and temperature in the heat sensor incorporated in the heat detection device of the present invention. FIGS. 6A, 6B, and 6C are a plan view, a side view, and a partially enlarged cross-sectional view, respectively, showing other embodiments of the thermal sensor incorporated in the thermal detection device of the present invention. FIG. 7 is a schematic diagram showing an embodiment of a heat detection device using the heat sensors shown in FIGS. 6A, 6B, and 6C. 10... Heat detection device, 100... Heat detection sensor 110... First support structure, 120...
...Conductor, 122...Contact, 124...
・Conductor, 130... Neglected support structure, 200
...Electric circuit, 212.222...Variable resistance, 214,224
．． 234...Transistor 216.226.
...Diode, 232 ...Resistor, 24
0...Power supply, 250...Switch, 3
00...Buzzer, 400...Sensor 410,420.430...Conductor, 412,4
22.432...Contact, 414,424.43
4...Conductor, 440...Auxiliary contact, 442...Auxiliary conductor, 600...Curve, 610, 620, 630...Peak .

Claims (1)

[Scope of Claims] (1) A thermal detection device for directly and continuously measuring increases and decreases in temperature, the device comprising: (a) sufficient to expand and contract repeatedly in response to changes in temperature; (b) operatively associated with said support structure to expand and contract integrally with said support structure, said expansion and contraction providing resistance/ 1. A heat detection device comprising a conductive wire whose conductivity is changed so that a temperature state (temperature profile) can be determined. (2) The heat detection device according to claim 1, wherein the support structure includes a plastic member. (3) The heat detection device according to claim 2, wherein the plastic member is made of polyethylene, polypropylene, polyester, nylon, polycarbonate, mixed plastic, fireproof plastic, or the like. . (4) The heat detection device according to claim 1, wherein the conductive wire is made of a metal medium. (5) The heat detection device according to claim 4, wherein the metal medium is aluminum, silver, gold, lead, nickel, copper,
A heat detection device characterized by containing a conductive pigment, etc. (6) The heat detection device according to claim 1, wherein the conductive wire is metallized, laminated,
pressure sensitization
n) A thermal detection device, characterized in that it is fixed to the support structure by thermosetting, thermoplastic lamination, UV curing, printing techniques, electrodeposition, etc. (7) The heat detection device according to claim 1, wherein the conductive wire is fixed to the support structure with an adhesive serving as a binder and a fire retardant. (8) The heat detection device according to claim 7, wherein the adhesive is a lamination adhesive. (9) The heat detection device according to claim 7, wherein the adhesive is a pressure sensitive adhesive. (10) A thermal sensing device for measuring increases and decreases in temperature, the device comprising a structure having sufficient elastic and thermal expansion properties to repeatedly expand and contract in response to changes in temperature; The structure includes a conducting wire, the conducting wire is for obtaining the properties of the structure, and expansion and contraction of the structure causes a change in the properties of the conducting wire, and the temperature changes based on the change. A thermal detection device whose condition is made known. (11) The heat detection device according to claim 10,
A heat detection device characterized in that the structure includes a plastic medium. (12) The heat detection device according to claim 10,
A heat detection device characterized in that the structure includes a metal medium. (13) A heat detection device for directly and continuously measuring increases and decreases in temperature, which (a) is a sensor for converting temperature, (1)
a support structure having sufficient elastic and thermal expansion properties to expand and contract repeatedly in response to changes in temperature; (2) a support structure configured to expand and contract integrally with the support structure; (b) a sensor comprising a conductive wire operatively associated with the wire whose resistance/conductivity is changed by its expansion and contraction, thereby making it possible to determine the temperature state (temperature profile); A thermal detection device comprising: means for energizing and evaluating to determine a temperature state. (14) The heat detection device according to claim 13,
A heat detection device further comprising a plurality of sensors. (15) The heat detection device according to claim 13,
A heat detection device characterized in that the support structure includes a plastic member. (16) The heat detection device according to claim 15,
A heat detection device characterized in that the plastic member is made of polyethylene, polypropylene, polyester, nylon, polycarbonate, mixed plastic, fireproof plastic, or the like. (17) The heat detection device according to claim 13,
A heat detection device characterized in that the conductive wire is made of a metal medium. (18) The heat detection device according to claim 17,
The metal medium is aluminum, silver, gold, lead, nickel,
A heat detection device characterized by containing copper, a conductive pigment, etc. (19) The heat detection device according to claim 13,
Thermal detection characterized in that the conductive wire is fixed to the support structure by metallization, lamination, pressure sensitization, thermosetting, thermoplastic lamination, UV curing, printing techniques, electrodeposition, etc. Device. (20) The heat detection device according to claim 13,
A thermal detection device characterized in that the conductive wire is fixed to the support structure by an adhesive that is a binder and a fire retardant.