JPH02232400A - Electrolytic treatment device - Google Patents
Electrolytic treatment deviceInfo
- Publication number
- JPH02232400A JPH02232400A JP5410989A JP5410989A JPH02232400A JP H02232400 A JPH02232400 A JP H02232400A JP 5410989 A JP5410989 A JP 5410989A JP 5410989 A JP5410989 A JP 5410989A JP H02232400 A JPH02232400 A JP H02232400A
- Authority
- JP
- Japan
- Prior art keywords
- power supply
- electrolytic treatment
- work
- power
- workpiece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 19
- 230000000873 masking effect Effects 0.000 claims abstract description 14
- 239000000615 nonconductor Substances 0.000 claims abstract description 7
- 238000003825 pressing Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 2
- 239000000463 material Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 206010011224 Cough Diseases 0.000 description 3
- 238000007517 polishing process Methods 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 241001474791 Proboscis Species 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
条材等の被処理物を電解処理する場合の装置に関し、
電解処理の槽の中で条材状の被処理物に給電することに
より、導電性の低い被処理物を、連続的に電解処理を可
能とし、該被処理物の電解処理における生産性を高める
ことを目的とし、処理槽の処理液中に、給電面以外の面
を不導体のマスキング部材で覆った給電部と、該給電部
には、不導体のマスキング部材で覆われた給電板と、該
給電面に被処理物を押圧するための不導体のバックアッ
プ用スプリングと、給電面に該被処理物を接触させなが
ら処理液中を搬送するための搬送機構とを備えるよう構
成する。[Detailed Description of the Invention] [Summary] Regarding an apparatus for electrolytically treating a workpiece such as a strip, it is capable of electrolytically treating a workpiece with low conductivity by supplying power to the workpiece in the form of a strip in an electrolytic treatment tank. In order to enable continuous electrolytic treatment of objects to be treated and to increase productivity in the electrolytic treatment of objects to be treated, a non-conductive masking member is added to the surface other than the power supply surface in the processing solution of the processing tank. The power feeding part includes a power feeding plate covered with a non-conductive masking member, a non-conducting backup spring for pressing the object to be processed on the power feeding surface, and a power feeding part covered with a non-conductive masking member. The apparatus is configured to include a transport mechanism for transporting the processing object through the processing liquid while bringing it into contact with the processing object.
本発明は、条材等の被処理物を電解処理する場合の装置
に関する。The present invention relates to an apparatus for electrolytically treating objects to be treated such as strips.
・〔従来の技術〕 第７図は条材等の被処理物を説明する図である。・[Conventional technology] FIG. 7 is a diagram illustrating objects to be processed such as strips.
同図は条材の一例を示す図で、テープ状の金属部材等を
、プレス加工によって連続的に打ち抜いたものである。This figure shows an example of a strip material, which is made by continuously punching out a tape-shaped metal member or the like by press working.
この場合、被処理物１にはプレス加工時のパリが発生ず
るが、このパリを除去するために電解研磨処理が多用さ
れる。In this case, burrs are generated on the workpiece 1 during press working, and electrolytic polishing is often used to remove these burrs.
第８図は、従来の電解処理装置の平面図と断面図である
。FIG. 8 is a plan view and a sectional view of a conventional electrolytic treatment apparatus.
貯藏槽７の処理液１２を、ポンブ８によって汲み上げ、
該処理液１２を複数の供給口９を通して処理槽２に供給
する。また、該処理液１２はスリントｌ１ａと１ｌｂか
ら溢れ出し、貯蔵槽７に還流する。The processing liquid 12 in the storage tank 7 is pumped up by the pump 8,
The processing liquid 12 is supplied to the processing tank 2 through a plurality of supply ports 9. Further, the processing liquid 12 overflows from the slints l1a and 1lb and flows back into the storage tank 7.
他方、処理槽２内にはカソード４が設けられ、条材等の
被処理物１は、スリット１０ａ， ｌｌａ． ｌｌｂ．
１０ｂを通り、処理槽２の処理液１２中を連続的に搬
送される。また、咳被処理物１が処理槽２内を移動する
ときは、レール状の下部ガイド５と上部ガイド６の間を
移動するので、安定して移動することができる。On the other hand, a cathode 4 is provided in the processing tank 2, and the objects 1 to be processed, such as strips, are passed through slits 10a, lla. llb.
10b, and is continuously conveyed through the processing liquid 12 of the processing tank 2. Further, when the cough object 1 moves within the processing tank 2, it moves between the rail-shaped lower guide 5 and the upper guide 6, so it can move stably.
このとき、該処理槽２の前後位置に給電部３ａ，３ｂを
設け、被処理物ｌに電解処理に必要な電流の供給を行な
っている。At this time, power supply parts 3a and 3b are provided at the front and back positions of the processing tank 2, and supply the current necessary for electrolytic processing to the object to be processed 1.
以上のようにして、被処理物１の電解処理が連続的に行
なわれる。As described above, the electrolytic treatment of the object to be treated 1 is performed continuously.
（発明が解決しようとする課題）
しかし、このような方法では、給電部３ａ．３ｂが処理
槽２の前後に位置しているため、該給電部３ａ，３ｂか
ら供給される電解処理に必要な電流は、被処理物１を通
って処理槽２の中央部に位置している部分の該被処理物
１へも供給される。その結果、咳被処理物１の給電部３
ａ，３ｂ付近の電流密度が高くなる。(Problem to be Solved by the Invention) However, in such a method, the power supply section 3a. 3b are located before and after the processing tank 2, the current necessary for electrolytic treatment supplied from the power supply parts 3a and 3b passes through the object to be processed 1 and is located at the center of the processing tank 2. A portion of the workpiece 1 is also supplied. As a result, the power supply section 3 of the cough treatment object 1
The current density near a and 3b becomes high.
したがって、被処理物１の厚さが薄く、かつプレス加工
後の該被処理ｈｉに幅の狭い部分がある場合などは、該
被処理物１の導電性が低くなり、電解処理に必要な大き
さの電流を流すことができなくなる。Therefore, if the thickness of the workpiece 1 is thin and the workpiece hi after press working has a narrow portion, the conductivity of the workpiece 1 will be low and the size required for electrolytic treatment will be reduced. It becomes impossible to pass current.
そのため、前記のような導電性の低い被処理物は、電解
処理を行なうことが著しく困難となり、幅を狭めた処理
槽を複数設けた、多分割の処理槽を使用し、給電部も各
処理槽間に設けるなどしていた。For this reason, it is extremely difficult to perform electrolytic treatment on objects with low conductivity such as those mentioned above, and a multi-divided treatment tank with multiple narrow width treatment tanks is used, and the power supply section is connected to each treatment. They were installed between tanks.
しかし、このような方法でも、極端に導電性の低い条材
は、連続的な電解処理を行なうことができなかった。However, even with this method, strips with extremely low conductivity could not be subjected to continuous electrolytic treatment.
本発明の技術的課題は、条材等の被処理物の連続的電解
処理におけるこのような問題を解消し、電解処理の槽の
中で、条材状の被処理物に給電することにより、導電性
の低い被処理物を、連続的に電解処理することを可能と
し、咳被処理物の電解処理における生産性を高めること
にある。The technical problem of the present invention is to solve such problems in continuous electrolytic treatment of objects to be treated such as strips, and to supply electricity to the objects to be treated in the form of strips in the electrolytic treatment tank. The object of the present invention is to enable continuous electrolytic treatment of objects with low conductivity, and to increase productivity in the electrolytic treatment of objects to be treated.
第１図は、本発明の基本原理を説明する斜視図である。 FIG. 1 is a perspective view illustrating the basic principle of the present invention.
本発明は、条材状の被処理物１を電解処理する場合にお
いて、処理槽内の処理液中で該被処理物１に給電するも
ので、処理槽の処理液１２中に、給電面１３ａ以外の面
を不導体のマスキング部材１４で覆った給電部１３を設
け、該給電部１３には、不導体のマスキング部材１４で
覆われた給電仮１５を通して給電する。In the present invention, when electrolytically treating a strip-shaped workpiece 1, power is supplied to the workpiece 1 in a processing liquid in a processing tank. A power feeding section 13 whose other surfaces are covered with a non-conductive masking member 14 is provided, and power is supplied to the power feeding section 13 through a temporary power feeding section 15 covered with a non-conducting masking member 14.
また、該給電面１３ａに、被処理物ｌを、不導体のバッ
クアップ用スプリング１６で押圧することにより、該被
処理物１にその接触面を通して給電し、給電面１３ａに
該被処理物１を接触させながら処理液中を搬送すること
により、連続的に給電を行ない電解処理を行なう装置で
ある。Further, by pressing the workpiece l against the power supply surface 13a with a non-conductive backup spring 16, power is supplied to the workpiece 1 through the contact surface, and the workpiece 1 is pressed onto the power supply surface 13a. This is a device that continuously supplies power and performs electrolytic treatment by conveying the treatment liquid while making contact with it.
〔作用］
本発明は、給電部１３の給電面１３ａを除き、給電部１
３と給電板１５の、処理液１２と接する部分を不導体の
マスキング部材１４で覆ってある。[Function] The present invention provides the power supply section 1 with the exception of the power supply surface 13a of the power supply section 13.
3 and the power supply plate 15 that are in contact with the processing liquid 12 are covered with a masking member 14 made of a non-conductor.
また、被処理吻１は、バックアップ用スプリングｌ６で
給電面１３ａに押圧されているので、常に接触状態にあ
る。Furthermore, the proboscis 1 to be treated is always in contact with the power supply surface 13a because it is pressed against the power supply surface 13a by the backup spring l6.
そのため、給電板１５から供給される処理電流は、給電
面１３ａを通して被処理物１へ流れ、咳被処理物１から
のみカソードに流れる。このとき、該被処理物１の電解
処理が行なわれるものである。また、バックアップ用ス
プリング１６は不導体のスプリングを使用しているので
、処理電流は流れない．〔実施例〕
実施例■
第２図は、本発明の実施例を説明する断面図である。Therefore, the processing current supplied from the power supply plate 15 flows to the object to be treated 1 through the power supply surface 13a, and flows only from the object to be treated 1 to the cathode. At this time, the object to be treated 1 is electrolytically treated. Furthermore, since the backup spring 16 uses a non-conducting spring, no processing current flows. [Example] Example 2 FIG. 2 is a sectional view illustrating an example of the present invention.
処理槽２の処理液１２中に、給電面１３ａ以外の面を不
導体のマスキング部材１４で覆った給電部１３を設け、
該給電部１３には、不導体のマスキング部材１４で覆わ
れた給電仮１５を通して給電する。A power supply section 13 whose surface other than the power supply surface 13a is covered with a non-conductor masking member 14 is provided in the processing liquid 12 of the processing tank 2,
Power is supplied to the power supply section 13 through a temporary power supply 15 covered with a masking member 14 made of a non-conductor.
そして、該給電面１３ａに被処理物１を不導体のバンク
アンプ用スプリング１６で押圧することにより、該被処
理物ｌにその接触面を通して給電する。Then, by pressing the workpiece 1 against the power supply surface 13a with a nonconducting bank amplifier spring 16, power is supplied to the workpiece 1 through the contact surface.
また、図に示されない搬送機構により被処理物１を搬送
することにより、給電面１３ａに該被処理物１を接触さ
せながら処理液中を搬送し、連続して給電を行ない電解
処理を行なう装置である。Further, the apparatus is configured to transport the object 1 to be processed by a transport mechanism (not shown) through the processing liquid while bringing the object 1 into contact with the power supply surface 13a, and to perform electrolytic treatment by continuously supplying power. It is.
第３図は、本発明による電解研磨処理装置の平面図と断
面図である。FIG. 3 is a plan view and a sectional view of an electrolytic polishing treatment apparatus according to the present invention.
被処理物１への給電方法を除けば従来の装置と同一の装
置である。This device is the same as the conventional device except for the method of supplying power to the workpiece 1.
貯蔵槽７の処理液１２を、ボンブ８によって汲み上げ、
該処理液１２を複数の供給口９を通して処理槽２に供給
する。また、該処理液１２はスリット１１ａとｌｌｂか
ら溢れ出し、貯藏槽７に還流する。The processing liquid 12 in the storage tank 7 is pumped up by the bomb 8,
The processing liquid 12 is supplied to the processing tank 2 through a plurality of supply ports 9. Further, the processing liquid 12 overflows from the slits 11a and llb and flows back into the storage tank 7.
他方、処理槽２内にはカソード４が設けられ、条材の被
処理物１は、スリット１０ａ， Ｉｌａ， Ｉｌｂ，
ｌ．ｏｂを通り処理槽２の処理液１２中を連続的に移動
する。On the other hand, a cathode 4 is provided in the processing tank 2, and the strip material 1 is formed through slits 10a, Ila, Ilb,
l. It passes through ob and continuously moves in the processing liquid 12 of the processing tank 2.
そして、該被処理物１が処理槽２内を移動するときは、
レール状の上部ガイド６と給電ブラケント１７の間を移
動するので、安定して移動することができる。Then, when the object to be processed 1 moves within the processing tank 2,
Since it moves between the rail-shaped upper guide 6 and the power feeding bracket 17, it can move stably.
また、給電ブラケット１７は、処理槽２内に条材１の移
動方向に沿って連続して設け、複数のバックアップ用ス
プリング１６が条材１を押圧しているので、条材ｌへの
給電が、咳条材１の複数の箇所から並列的に行なわれれ
る。In addition, the power supply bracket 17 is provided continuously in the processing tank 2 along the moving direction of the strip 1, and the plurality of backup springs 16 press the strip 1, so that power cannot be supplied to the strip 1. , are performed in parallel from a plurality of locations on the cough strip material 1.
したがって、被処理物条材１の厚さが薄く、かつプレス
加工後の該被処理物条材１に幅の狭い部分がある場合な
どの、該被処理′１ｙＪｉの導電性が低い場合でも、電
解処理に必要な電流が一部に集中して流れることがなく
なり、前記のような導電性の低い被処理物でも、安定し
た電解処理を連続的に行なえるようになる。Therefore, even when the conductivity of the workpiece '1yJi is low, such as when the workpiece strip 1 is thin and there is a narrow part in the workpiece strip 1 after press working, The current required for electrolytic treatment does not flow concentrated in one part, and stable electrolytic treatment can be continuously performed even on the object to be treated with low conductivity as described above.
実施例■
第４図は、実施例を説明する断面図で、処理槽の断面図
である。Example ■ Fig. 4 is a sectional view for explaining an example, and is a sectional view of a processing tank.
本実施例の場合は、給電部に給電ローラ１８を使用した
もので、その他の構成は実施例■と基本的に同一である
。In the case of this embodiment, a power supply roller 18 is used as the power supply section, and the other configurations are basically the same as in the embodiment (2).
すなわち、給電ローラ１８以外は不導体のマスキング部
材１４で覆い、給電板１５から供給される処理電流は、
給電ローラ１８を介して被処理物１からのみカソード４
に流れる。That is, the parts other than the power supply roller 18 are covered with a non-conductive masking member 14, and the processing current supplied from the power supply plate 15 is
The cathode 4 is supplied only from the workpiece 1 via the power supply roller 18.
flows to
本実施例の場合は、条柱状の被処理物１が給電ローラ１
８にバックアップ用スプリング１６ａで押圧されている
ので、該被処理物１が搬送されるときに、該給電ローラ
１８が回転する仕組みである。In the case of this embodiment, the columnar workpiece 1 is the power supply roller 1
8 by a backup spring 16a, the power feeding roller 18 rotates when the object 1 to be processed is conveyed.
したがって、被処理物１と給電ローラ１８の接触状態が
安定し、処理電流の供給も安定するので、良好な電解研
磨処理を行なうことができる。Therefore, the contact state between the workpiece 1 and the power supply roller 18 is stabilized, and the supply of processing current is also stabilized, so that a good electrolytic polishing process can be performed.
第５図は、実施例の電解研磨処理装置を説明する平面図
である。FIG. 5 is a plan view illustrating the electrolytic polishing treatment apparatus of the example.
給電ブラケット１７に、複数の給電ローラ１８を設け、
該給電ローラ１８に対向する位置にバックア・７プ用ス
プリング１６ａを設ける。A plurality of power supply rollers 18 are provided on the power supply bracket 17,
A backup spring 16a is provided at a position facing the power supply roller 18.
したがって、被処理物１は給電ローラＩ８に押圧されな
がら処理槽２内を搬送され、該被処理＄！７１１の複数
の箇所から安定した処理電流が供給される。Therefore, the workpiece 1 is conveyed within the processing tank 2 while being pressed by the power supply roller I8, and the workpiece $! A stable processing current is supplied from multiple locations of 711.
実施例■
導電性の低い被処理物を電解研磨処理する場合は、該被
処理物への供給電圧を上げ、所定の処理電流を得たい場
合がある。Example (2) When electrolytically polishing a workpiece with low conductivity, it may be necessary to increase the voltage supplied to the workpiece to obtain a predetermined processing current.
このような場合、処理槽内の給電面や給電ローラと被処
理物との間にスパーク現象を生じることがある。In such a case, a spark phenomenon may occur between the power supply surface or the power supply roller in the processing tank and the object to be processed.
しかし、前記のようなスパークが生じると、被処理物に
穴が開くなどの損傷を生じ、電解研磨処理の歩留りを悪
化させるばかりか、処理品質も低下してしまう。However, when such sparks occur, damage such as holes are created in the object to be processed, which not only deteriorates the yield of the electrolytic polishing process but also degrades the quality of the process.
このようなときは、被処理物を間欠的に搬送し、該被処
理物が停止しているときに処理電流を流すと、スパーク
を防止することができる。In such a case, sparks can be prevented by intermittently transporting the object to be processed and applying a processing current while the object is stopped.
第６図は、搬送速度と給電電流の関係を説明するタイム
チャートである。FIG. 6 is a time chart illustrating the relationship between conveyance speed and power supply current.
時間ｔ０〜ｔ．の間は被処理物を搬送し、処理電流は流
さない。しかし、時間ｔ１〜ｔ２の間は被処理物の搬送
を停止し、所定の処理電流Ｉ０を供給する。Time t0-t. During this period, the object to be processed is transported and no processing current is applied. However, between time t1 and t2, the conveyance of the object to be processed is stopped and a predetermined processing current I0 is supplied.
以後同様に、ｔ２〜は搬送と給電を交互に繰り返すよう
にする。Thereafter, similarly, from t2 onwards, transportation and power feeding are alternately repeated.
〔発明の効果］
以上のように、本発明によれば、条材状の被処理物への
給電を処理槽内で行なうことができるので、被処理物１
の厚さが薄く、かつプレス加工後の該被処理物ｌに幅の
狭い部分があるために、導電性の低い被処理物であって
も、連続的に電解処理を行なうことができるようになり
、条材状の被処理物における電解処理の生産性が大きく
向上する。[Effects of the Invention] As described above, according to the present invention, power can be supplied to the strip-shaped workpiece within the processing tank, so that the workpiece 1
Because the thickness of the workpiece is thin and there is a narrow part in the workpiece after press working, even workpieces with low conductivity can be electrolytically treated continuously. Therefore, the productivity of electrolytic treatment of strip-shaped objects to be treated is greatly improved.
第１図は、本発明の基本原理を説明する斜視図、第２図
は、実施例■を説明する断面図、第３図は、実施例■の
電解処理装置の平面図と断面図、
第４図は、実施例■を説明する断面図、第５図は、実施
例■の電解処理装置を説明する平面図、
第６図は、搬送速度と給電電流の関係を説明するタイム
チャート、
第７図は条材の被処理物を説明する正面図、第８図は、
従来の電解処理装置の平面図と断面図である。
図において、１は被処理物（条材）、２は処理槽、３ａ
，３ｂは給電部、４はカソード、５は下部ガイド、６．
６ａは上部ガイド、７は貯蔵槽、８はボンブ、９は供給
口、１０ａ， １０ｂ． Ｉｌａ’， Ｉｌｂはスリッ
ト、ｌ２は処理液、１３は給電部、１４はマスキング部
材、ｌ５は給電板、Ｉ６はバックアップ用スプリング、
１７は給電ブラケント、１８は給電ローラをそれぞれ示
している。FIG. 1 is a perspective view explaining the basic principle of the present invention, FIG. 2 is a sectional view explaining embodiment (2), and FIG. 3 is a plan view and a sectional view of the electrolytic treatment apparatus of embodiment (2). 4 is a cross-sectional view for explaining Example (2), FIG. 5 is a plan view for explaining the electrolytic treatment apparatus of Example (2), FIG. Figure 7 is a front view illustrating a strip material to be processed, and Figure 8 is a
FIG. 2 is a plan view and a cross-sectional view of a conventional electrolytic treatment apparatus. In the figure, 1 is the object to be processed (strip material), 2 is the processing tank, and 3a
, 3b is a power supply unit, 4 is a cathode, 5 is a lower guide, 6.
6a is an upper guide, 7 is a storage tank, 8 is a bomb, 9 is a supply port, 10a, 10b. Ila', Ilb are slits, l2 is a processing liquid, 13 is a power supply part, 14 is a masking member, l5 is a power supply plate, I6 is a backup spring,
Reference numeral 17 indicates a power feeding bracket, and 18 indicates a power feeding roller.
Claims (1)
の処理液（１２）中に、給電面（１３ａ）以外の面を不
導体のマスキング部材（１４）で覆った給電部（１３）
と、 該給電部（１３）には、不導体のマスキング部材（１４
）で覆われた給電板（１５）と、 該給電面（１３ａ）に被処理物（１）を押圧するための
不導体のバックアップ用スプリング（１６）と、給電面
（１３ａ）に該被処理物（１）を接触させながら処理液
中を搬送するための搬送機構とを備えたことを特徴とす
る電解処理装置。[Claims] When electrolytically treating a workpiece such as a strip, the surface other than the power supply surface (13a) is covered with a non-conducting masking member (14) in the treatment liquid (12) of the treatment tank. Power supply section (13)
The power feeding section (13) is provided with a non-conductive masking member (14).
), a non-conductive backup spring (16) for pressing the object to be processed (1) onto the power feeding surface (13a), and a back-up spring (16) made of a non-conductor for pressing the object to be processed (1) onto the feeding surface (13a); An electrolytic treatment apparatus comprising: a conveyance mechanism for conveying a substance (1) through a treatment liquid while bringing it into contact with the substance (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5410989A JPH02232400A (en) | 1989-03-07 | 1989-03-07 | Electrolytic treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5410989A JPH02232400A (en) | 1989-03-07 | 1989-03-07 | Electrolytic treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02232400A true JPH02232400A (en) | 1990-09-14 |
Family
ID=12961433
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5410989A Pending JPH02232400A (en) | 1989-03-07 | 1989-03-07 | Electrolytic treatment device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02232400A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5520764A (en) * | 1978-07-27 | 1980-02-14 | Ugine Kuhlmann | Method of obtaining highly pure 1*55dinitroo anthraquinone |
| JPS59177394A (en) * | 1983-03-26 | 1984-10-08 | Fujitsu Ltd | Electrode body |
-
1989
- 1989-03-07 JP JP5410989A patent/JPH02232400A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5520764A (en) * | 1978-07-27 | 1980-02-14 | Ugine Kuhlmann | Method of obtaining highly pure 1*55dinitroo anthraquinone |
| JPS59177394A (en) * | 1983-03-26 | 1984-10-08 | Fujitsu Ltd | Electrode body |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6153064A (en) | Apparatus for in line plating | |
| JP3450333B2 (en) | Method and apparatus for continuous uniform metallization or etching | |
| RU96104583A (en) | SURFACE PROCESSING METHOD AND DEVICE FOR ITS IMPLEMENTATION | |
| TWI586848B (en) | Method and apparatus for electrolytically depositing a deposition metal on a workpiece | |
| EP1573094B1 (en) | Device and method for electrolytically treating an at least superficially electrically conducting work piece | |
| JPH02232400A (en) | Electrolytic treatment device | |
| JP3154267U (en) | Plated material holder | |
| US6531037B2 (en) | Removable electrode | |
| JPH1161495A (en) | Electric plating treatment system which enables uniform plating treatment | |
| DE10043817A1 (en) | Continuous electrochemical plant metallizing, etching, oxidizing and reducing e.g. PCBs, wafers and hybrids, controls electrode approach during conveying | |
| JP2554825B2 (en) | Continuous heating device for paste products | |
| JPH0760553A (en) | Wire cut electric discharge machine | |
| JP2018044249A (en) | Surface treatment apparatus and work holding tool | |
| JPS5881997A (en) | Horizontally conveying type automatic plating apparatus | |
| JPS5821626Y2 (en) | Electrolytic treatment equipment | |
| WO1998052851A1 (en) | A device for holding and carrying objects | |
| CN101346795A (en) | Method and installation for the vacuum colouring of a metal strip by means of magnetron sputtering | |
| JPS6051551B2 (en) | A device that performs coating by electrical explosion of foil | |
| JPH0544080Y2 (en) | ||
| JPH06192886A (en) | Very small part surface treating device | |
| JP2598750B2 (en) | High-speed electrolytic rough finishing method and apparatus | |
| JPH03166400A (en) | High-speed electrolyte rough finishing method | |
| JP2971448B1 (en) | Electrode equipment in continuous plating equipment | |
| JP2008138252A (en) | Method for electroplating tape carrier for semiconductor device, and apparatus for electroplating tape carrier for semiconductor device | |
| JPS5976760A (en) | Work feeding device in double head grinder |