【発明の詳細な説明】
Ｌｌ一立■月】！
本発明は電磁遮蔽障壁に関し、とくに不要電磁波や静電
気による障害を防止する屋内仕切壁に適する電磁遮蔽障
壁に関する．
良友立韮遣
情報化の進展に伴なっていわゆるインテリジェントビル
やＩＣ工場などにおける不要電磁波及び静電気による障
害が重大な問題になっている．外部から進入する不要電
磁波や静電気の影響によって制御装置が誤動作した例や
誤った制御信号により機器等が不意に作動し著しい場合
には破壊に至った実例も報告されている．
このような障害を防止するため、所要の空間を電磁波や
静電気に対して遮蔽する各種遮蔽構造が提案されている
．例えば、特開昭８２− ２２９１）９８号公報は，電
磁遮蔽材を用いた同一サイズの２枚の板を２方向にずら
して重ね合わせ一体に構成した電磁遮蔽構造を教示して
いる．
しかし，従来の電磁遮蔽構造はいずれも複雑で材料費や
工事費の嵩む欠点がある．例えば上記特開昭８２ −
２２９９９８号公報の場合には、同一サイズの２枚の板
を重ね合わせるので重ね合わせない時に比して材料が２
倍必要となり、重ね合わせの手間も必要である．この重
ね合わせを避けるため、隣接する電磁遮蔽材を電気的に
接続するための接続材を用いると，表面に凹凸が生ずる
ので表面を平滑に仕上げるための手段が別途必要となる
問題が生′ずる．
従って，本発明の目的は構造が簡単でしかも表面を平滑
に仕上げることができる電磁遮蔽障壁を提供し、もって
従来技術の上記欠点を解決するにある．
第１図の実施例を参照するに、本発明の電磁遮蔽障壁は
、導電性接着剤が塗布された導電性薄膜からなる下地テ
ープ２を所定間隔（Ｐ）で壁体１の表面に接着７し、隣
接下地テープ２の間に跨がる導電性薄Ｈ５を下地テープ
２に接続し、前記導電性薄膜５上に仕上材４を取付けて
なる構成を用いる．
好ましくは、下地テープ２の厚さｔ１及び導電性薄Ｈ５
の厚さｔ２がそれぞれ約３０μ麿以下となる様にテープ
２及び薄ｌｌｉ５を金属箔製とし、導電性接着剤（図示
せず）を下地テープ３の両面に塗布する．
隣接下地テープ２間の間隔は必ずしも一定である必要は
なく，同一の電磁遮蔽壁において各種の異なる間隔を用
いてもよい．また，下地テープ２を一方向のみでなく例
えば直交する方向に格子状に貼付けてもよい．図示例で
は，導電性薄膜５が仕上材４の裏面に予め接着されてい
るが、導電性薄Ｍ５を下地テープ２に接続した後に仕上
材４を取付けてもよい．
正月
本発明による電磁遮蔽障壁の導電性薄膜５は、下地テー
プ２によって相互に電気的に接続されて電磁遮蔽障壁の
全体を覆う導電性膜を構成するので、大きな電界減衰即
ち高い電磁波遮蔽効果及び静電気遮蔽効果を示す．しか
も下地テープ２及び導電性薄膜５の両者が薄膜からなる
ので、それらの存在が電磁波障壁の表面に凹凸を与えず
、電磁波障壁に平滑な表面を形成することができる．本
発明者は、床構造に本発明の電磁遮蔽障壁を用いた遮蔽
試験室１０を試作し、財団法人無線設備検査検定協会に
委託してその遮蔽効果を実際に測定した．第４図及び第
５図は遮蔽試験室ｌＯの側面図及び平面図を示し、第６
図は第５図の線Ｖｌ−ＶＩにおける断面構造を図式的に
示す．
遮蔽試験室１０の床構造は、壁体１に下地テープ２を接
着し、その上に導電性薄膜５を接着し、仕上材としてベ
ースランナー２０を導電性薄膜５の上に取付けたもので
ある．下地テープ２及び導電性薄＠５を厚さ約３０μ閣
の鉄箔製とした．側面及び天井の遮蔽壁１ｌは，鉄箔２
！を下貼りボード２２と上貼りボード２３とによって挟
んだ構造とし、その鉄箔２ｌを導電性シール２４によっ
て床構造の導電性薄１１１１５に電気的に接続した．第
６図において，下地テープ２と導電性薄膜５とを区別す
るためその間に間隙を示したが，両者は密着して電気的
に接続されている．側壁１１は輻木２５により確実に保
持される．
さらに遮蔽試験室ｌＯには市販の電磁遮蔽形の遮蔽窓ｌ
３及び遮蔽扉ｌ４並びに銅メッシュで覆われた換気口ｌ
５を設けた．
測定結果を第１表に示す．
第１表から明らかなように本発明による電磁遮蔽障壁は
優れた電磁波遮蔽効果を与える．また相互に接続された
導電性薄膜５を有するので静電気に対する遮蔽効果をも
与える．しかも構成が極め弟」Ｌ表
て簡単で資材が少なく取付けも容易であり、薄膜による
遮蔽であるので表面Ｋ凹凸が現れず平滑な仕上り面を得
ることができる．
こラして本発明の目的である「構造が簡単でしかも表面
を平滑に仕上げることができる電磁遮蔽障壁」の提供が
達成される．
支墓ｌ
第２図は、屋内空間を仕切るための水平及び垂直壁の構
造に本発明の電磁遮蔽障壁を適用した実施例の平面図を
示し、第３図は第２図の゛線！！！−ＩＩＩにおける断
面図を示す．簡明のため、両図において仕上材４及び導
電性薄７１！４の一部を省略してある．この実施例では
、下地テープ２を接地線３により対地電位に接続してい
る．
１１二Ｊｌ
以上詳細に説明した如く本発明の電磁遮蔽障壁は、導電
性接着剤が塗布された導電性薄膜からなる下地テープを
所定間隔で壁体表面に接着し、隣接下地テープ間に跨が
る導電性薄膜を下地テープに接着し、前記導電性薄膜上
に仕上材を取付けてなる構成を用いるので、次の効果を
奏する．（イ）高い電磁遮蔽性能を有する障壁を少ない
資材により簡単な構造のものとして提供することができ
る．
（口）遮蔽部材としては薄膜からなる下地テープ及び導
電性薄膜のみであるから．凹凸のない平滑な仕上面を得
ることができる．
（ハ）構成が簡単で取付けが容易であるから、インテリ
ジェントビル等における屋内の電磁遮蔽障壁を容易に形
成することができる．[Detailed Description of the Invention] Ll Ichiri ■Moon]! The present invention relates to an electromagnetic shielding barrier, and more particularly to an electromagnetic shielding barrier suitable for indoor partition walls to prevent disturbances caused by unnecessary electromagnetic waves and static electricity. With the progress of computerization, interference caused by unnecessary electromagnetic waves and static electricity in so-called intelligent buildings and IC factories has become a serious problem. There have been reports of cases where control devices malfunctioned due to the effects of unnecessary electromagnetic waves or static electricity entering from the outside, and cases where equipment etc. operated unexpectedly due to erroneous control signals, leading to destruction in severe cases. In order to prevent such disturbances, various shielding structures have been proposed to shield the required space from electromagnetic waves and static electricity. For example, Japanese Unexamined Patent Publication No. 82-2291)98 teaches an electromagnetic shielding structure in which two plates of the same size using electromagnetic shielding materials are stacked and integrated by being shifted in two directions. However, all conventional electromagnetic shielding structures have the drawback of being complex and requiring high material and construction costs. For example, the above-mentioned JP-A-82-
In the case of Publication No. 229998, since two plates of the same size are overlapped, the amount of material is reduced by 2 compared to when they are not overlapped.
This requires twice as much work, and the effort of superimposing them is also necessary. In order to avoid this overlap, if a connecting material is used to electrically connect adjacent electromagnetic shielding materials, unevenness will occur on the surface, creating the problem that a separate means is required to smooth the surface. ．． Therefore, an object of the present invention is to provide an electromagnetic shielding barrier having a simple structure and a smooth surface, thereby solving the above-mentioned drawbacks of the prior art. Referring to the embodiment shown in FIG. 1, the electromagnetic shielding barrier of the present invention includes a base tape 2 made of a conductive thin film coated with a conductive adhesive and bonded to the surface of a wall 1 at predetermined intervals (P). However, a configuration is used in which a conductive thin film H5 spanning between adjacent base tapes 2 is connected to the base tape 2, and a finishing material 4 is attached on the conductive thin film 5. Preferably, the thickness t1 of the base tape 2 and the conductive thin layer H5
The tape 2 and the thin film 5 are made of metal foil so that the thickness t2 of each is about 30 μm or less, and a conductive adhesive (not shown) is applied to both sides of the base tape 3. The spacing between adjacent base tapes 2 does not necessarily have to be constant, and various different spacings may be used in the same electromagnetic shielding wall. Further, the base tape 2 may be applied not only in one direction but also in a grid pattern, for example, in orthogonal directions. In the illustrated example, the conductive thin film 5 is bonded in advance to the back surface of the finishing material 4, but the finishing material 4 may be attached after the conductive thin film M5 is connected to the base tape 2. The conductive thin films 5 of the electromagnetic shielding barrier according to the present invention are electrically connected to each other by the base tape 2 to constitute a conductive film covering the entire electromagnetic shielding barrier, so that it has a large electric field attenuation, that is, a high electromagnetic shielding effect and This shows the electrostatic shielding effect. In addition, since both the base tape 2 and the conductive thin film 5 are made of thin films, their presence does not give unevenness to the surface of the electromagnetic wave barrier, and a smooth surface can be formed on the electromagnetic wave barrier. The present inventor prototyped a shielding test chamber 10 using the electromagnetic shielding barrier of the present invention in the floor structure, and commissioned the Radio Equipment Inspection and Certification Association to actually measure its shielding effect. Figures 4 and 5 show a side view and a top view of the shielded test chamber lO;
The figure schematically shows the cross-sectional structure taken along the line Vl-VI in Fig. 5. The floor structure of the shielding test chamber 10 is such that a base tape 2 is adhered to a wall 1, a conductive thin film 5 is adhered thereon, and a base runner 20 is attached as a finishing material on top of the conductive thin film 5. ．． Base tape 2 and conductive thin layer 5 were made of iron foil with a thickness of about 30 μm. The side and ceiling shielding walls 1l are made of iron foil 2
! was sandwiched between a bottom board 22 and a top board 23, and the iron foil 2L was electrically connected to the conductive thin layer 11115 of the floor structure by a conductive seal 24. In Fig. 6, a gap is shown between the base tape 2 and the conductive thin film 5 to distinguish them, but the two are in close contact and electrically connected. The side wall 11 is securely held by the crosspieces 25. In addition, the shielding test room 1O has a commercially available electromagnetic shielding window.
3 and screening door l4 and ventilation opening l covered with copper mesh
5 was set. The measurement results are shown in Table 1. As is clear from Table 1, the electromagnetic shielding barrier according to the present invention provides an excellent electromagnetic shielding effect. Furthermore, since it has conductive thin films 5 that are interconnected, it also provides a shielding effect against static electricity. Moreover, the structure is extremely simple, requires few materials, and is easy to install.Since it is shielded by a thin film, no surface irregularities appear and a smooth finished surface can be obtained. In this way, the purpose of the present invention is to provide an electromagnetic shielding barrier that has a simple structure and can have a smooth surface. Figure 2 shows a plan view of an embodiment in which the electromagnetic shielding barrier of the present invention is applied to a structure of horizontal and vertical walls for partitioning indoor spaces, and Figure 3 shows the line 1 in Figure 2. ! ! A cross-sectional view at -III is shown. For the sake of clarity, the finishing material 4 and a portion of the conductive thin film 71!4 are omitted in both figures. In this embodiment, the base tape 2 is connected to the ground potential by a grounding wire 3. 112 Jl As explained in detail above, the electromagnetic shielding barrier of the present invention is constructed by bonding base tapes made of conductive thin films coated with conductive adhesive to the wall surface at predetermined intervals, and making sure that there is no straddling between adjacent base tapes. The present invention uses a structure in which a conductive thin film is adhered to a base tape, and a finishing material is attached on top of the conductive thin film, so the following effects are achieved. (b) A barrier with high electromagnetic shielding performance can be provided with a simple structure using less materials. (Example) The only shielding members are the base tape made of thin film and the conductive thin film. A smooth finished surface with no unevenness can be obtained. (c) Since it has a simple configuration and is easy to install, it can easily form an indoor electromagnetic shielding barrier in intelligent buildings, etc.
【図面の簡単な説明】[Brief explanation of the drawing]
第１図は本発明による電磁遮蔽障壁の構造を示す斜視図
、第２図は一実施例の平面図，第３図は第２図の線ＩＩ
Ｉ−ＩＩＩにおける断面図、第４図及び第５図は遮蔽試
験室の側面図及び平面図、第６図は第５図の線Ｖｌ−Ｖ
ｌにおける断面の図式的説明図である．
１・・・壁体、 ２・・・下地テープ、 ３・・・接
地線，４・・・仕上材、 ５・・・導電性薄膜、 １０
・・・遮蔽試験室、 ｌ１・・・遮蔽壁、 ｌ２・・・
遮蔽床、 ｌ３・・・遮蔽窓、 ！４・・・遮蔽扉、
１５・・・換気口、 ２０・・・ベースランナー ２
ｌ・・・鉄箔、 ２２・・・下貼リボード，２３・・・
上貼りボード、 ２４・・・導電性シール、 ２５・
・・幅木．
第２図Fig. 1 is a perspective view showing the structure of an electromagnetic shielding barrier according to the present invention, Fig. 2 is a plan view of one embodiment, and Fig. 3 is a line II of Fig. 2.
4 and 5 are a side view and a plan view of the shielded test chamber, and FIG. 6 is a cross-sectional view taken along the line Vl-V in FIG. 5.
FIG. DESCRIPTION OF SYMBOLS 1... Wall body, 2... Base tape, 3... Grounding wire, 4... Finishing material, 5... Conductive thin film, 10
...shielding test chamber, l1... shielding wall, l2...
Shielding floor, l3...shielding window, ! 4...shielding door,
15... Ventilation vent, 20... Base runner 2
l...iron foil, 22...bottom reboard, 23...
Top board, 24... conductive seal, 25.
··Baseboard. Figure 2