JPH0222569U - - Google Patents
Info
- Publication number
- JPH0222569U JPH0222569U JP9951588U JP9951588U JPH0222569U JP H0222569 U JPH0222569 U JP H0222569U JP 9951588 U JP9951588 U JP 9951588U JP 9951588 U JP9951588 U JP 9951588U JP H0222569 U JPH0222569 U JP H0222569U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- metal sleeve
- circumferential grooves
- terminal part
- watertight compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 5
- 150000001875 compounds Chemical class 0.000 claims description 3
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Description
第１図は本考案の一実施例を示す縦断面図、第
２図は従来の導体の接続部を示す縦断面図である
。
１，４……金属スリーブ、２，２……導体、３
……水密コンパウンド、５……周溝。
FIG. 1 is a longitudinal sectional view showing an embodiment of the present invention, and FIG. 2 is a longitudinal sectional view showing a conventional conductor connection. 1, 4...Metal sleeve, 2, 2...Conductor, 3
... Watertight compound, 5 ... Circumferential groove.
Claims (1)
の接続すべき導体の端末部と前記金属スリーブ間
に水密コンパウンドを介在させて挿入し、前記金
属スリーブを圧縮して成る導体の接続部において
、前記金属スリーブの両端部近傍の内周に環状の
周溝がそれぞれ形成されており、これらの周溝に
前記水密コンパウンドがそれぞれ充填されている
ことを特徴とする導体の接続部。 In the connection part of the conductor, the terminal part of the conductor to be connected to the metal sleeve is inserted with a watertight compound interposed between the terminal part of the conductor to be connected and the metal sleeve, and the metal sleeve is compressed. A connecting portion for a conductor, characterized in that annular circumferential grooves are formed on the inner periphery near both ends of the metal sleeve, and each of these circumferential grooves is filled with the watertight compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9951588U JPH0222569U (en) | 1988-07-27 | 1988-07-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9951588U JPH0222569U (en) | 1988-07-27 | 1988-07-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0222569U true JPH0222569U (en) | 1990-02-15 |
Family
ID=31326746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9951588U Pending JPH0222569U (en) | 1988-07-27 | 1988-07-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0222569U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0418967U (en) * | 1990-06-08 | 1992-02-18 | ||
| JPH05135808A (en) * | 1991-11-13 | 1993-06-01 | Yazaki Corp | Waterproof terminal connection structure and its manufacture |
-
1988
- 1988-07-27 JP JP9951588U patent/JPH0222569U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0418967U (en) * | 1990-06-08 | 1992-02-18 | ||
| JPH05135808A (en) * | 1991-11-13 | 1993-06-01 | Yazaki Corp | Waterproof terminal connection structure and its manufacture |
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