JPH0222049A - Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet - Google Patents

Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet

Info

Publication number
JPH0222049A
JPH0222049A JP1131582A JP13158289A JPH0222049A JP H0222049 A JPH0222049 A JP H0222049A JP 1131582 A JP1131582 A JP 1131582A JP 13158289 A JP13158289 A JP 13158289A JP H0222049 A JPH0222049 A JP H0222049A
Authority
JP
Japan
Prior art keywords
unsaturated polyester
paper
polyester resin
halogen
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1131582A
Other languages
Japanese (ja)
Inventor
Ryuzo Nakatsuka
中塚 隆三
Takeshi Yoshioka
吉岡 斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP1131582A priority Critical patent/JPH0222049A/en
Publication of JPH0222049A publication Critical patent/JPH0222049A/en
Pending legal-status Critical Current

Links

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To form a fire-retardant laminated sheet by laminating a specific unsaturated polyester resin to a paper base material treated with aqueous varnish containing a fire retardant and further laminating a copper foil to the formed laminate through an adhesive layer before curing. CONSTITUTION:A liquid unsaturated polyester resin containing halogen and phosphorus, having viscosity of 20 poise/20 deg.C or less and a thixotropy index of 1.2-2.5 and containing organonitrogen and/or an inorg. fire-retardant aid is laminated to a paper base material treated with aqueous varnish of a thermosetting resin containing one or more kind of a component selected from a nitrogen-containing type phosphorous and/or halogen-containing org. compound and an inorg. fire retardant. Next, a copper foil or cover film is laminated to the formed laminate through an adhesive layer and the laminated structure is continuously passed through a heating/drying oven under contact pressure by a roll laminator to be cured and integrated to prepare an unsaturated polyester/paper/copper clad laminated sheet.

Description

【発明の詳細な説明】 〔産業上の利用分野] 本発明の難燃性の不飽和ポリエステル樹脂−紙−銅張積
層板の連続製造法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for continuous production of a flame-retardant unsaturated polyester resin-paper-copper clad laminate.

〔従来技術] 最近の電子工業の急激な発展に伴い、プリント配線回路
の銅張積層板の需要が急上昇し、難燃タイプのものの比
重は著しく増大している。従ってその能率的な大量生産
方式に対する業界の要望は大きいものがあるが、これに
対する従来の乾式プリプレグの高圧プレスを用いた積層
成型による製造方式では、装置コストが著しく大きくな
ると共に製造工数を多く必要とすることもあり、その改
善が情実に望まれている。
[Prior Art] With the recent rapid development of the electronics industry, the demand for copper-clad laminates for printed wiring circuits has rapidly increased, and the proportion of flame-retardant types has increased significantly. Therefore, there is a strong demand in the industry for an efficient mass production method, but the conventional manufacturing method of dry prepreg by lamination molding using a high-pressure press increases the equipment cost significantly and requires a large number of manufacturing man-hours. Therefore, improvement is desperately desired.

一方、液状の不飽和ポリエステル系樹脂を用いる所謂湿
式の連続積層方法は、従来はあまりにも大量生産向きの
製造方法であり、これに見合うだけのごく限られた分野
に適用されているに過ぎなかった。しかし近年のエレク
トロニクス技術の著しい発展に伴い省エネ化、省力化の
立場よりも評価されるようになって来た。今やプリント
配線回路用の銅張積層板の需要量の巨大化がこの分野に
も連続積層方式の導入を有利ならしめるようになったも
のである。
On the other hand, the so-called wet continuous lamination method using liquid unsaturated polyester resin has traditionally been a manufacturing method suitable for mass production, and has only been applied to a very limited number of fields. Ta. However, with the remarkable development of electronics technology in recent years, it has come to be valued more for its energy and labor savings. Nowadays, the huge demand for copper-clad laminates for printed wiring circuits has made it advantageous to introduce the continuous lamination method in this field as well.

不飽和ポリエステル樹脂は、樹脂自体がフェノール樹脂
に比し−Cに燃焼し易い欠点があるために、その難燃化
は困難とされて来たのである。しかも本発明のように連
続積層方法を前提としている場合には運転条件の自動調
節のし易さと両立させることが必要となるのでより一層
困難であった。
It has been difficult to make unsaturated polyester resins flame retardant because the resin itself has the disadvantage of being more easily combustible by -C than phenol resins. Moreover, when the present invention is based on a continuous lamination method, it is even more difficult to achieve both ease of automatic adjustment of operating conditions.

〔発明の目的〕[Purpose of the invention]

本発明者らはこれらの点について種々検討した結果、積
層板の成分に於いてハロゲン系、窒素系、燐系の3者の
難燃化作用を有するものをバランスよく、しかもできる
だけ少なく含んでいることが必要条件であることを見出
し、本発明をなすに至ったものである。
As a result of various studies on these points, the inventors of the present invention found that the components of the laminate include halogen-based, nitrogen-based, and phosphorus-based substances that have flame retardant effects in a well-balanced manner, and in as little amount as possible. We have discovered that this is a necessary condition, and have arrived at the present invention.

(発明の構成〕 本発明は、液状の不飽和ポリエステル樹脂を予め下塗り
処理した紙基材に含浸し、カバー用フィルムを用いて接
触圧下銅張積層板を連続製造する方法に於いて、紙基材
積層板(銅箔を除外した重量に換算)に対するハロゲン
含有量(Brに換算)として5,0〜20.0%(重量
、以下同じ)、窒素含有量として0.8〜8.0%、燐
含有量として0.4〜2.0%に上記各成分の配合量を
調整することを特徴とする難燃性不飽和ポリエズテル樹
脂−紙−銅張積層板の製造方法である。
(Structure of the Invention) The present invention impregnates a paper base material that has been undercoated in advance with a liquid unsaturated polyester resin, and uses a cover film to continuously produce a contact pressure copper-clad laminate. The halogen content (converted to Br) of the material laminate (converted to the weight excluding copper foil) is 5.0 to 20.0% (weight, the same hereinafter), and the nitrogen content is 0.8 to 8.0%. , a method for producing a flame-retardant unsaturated polyester resin-paper-copper-clad laminate, characterized in that the blending amount of each of the above components is adjusted to a phosphorus content of 0.4 to 2.0%.

一般に、離燃性不飽和ポリエステル樹脂−低調張板の連
続製造方法としては、1段法(第1図参照)含浸基材を
積層する際、一方をカバー用フィルム、他方を銅箔で被
覆し、1段の工程で銅張板となす方法である。
In general, the continuous manufacturing method for combustible unsaturated polyester resin low tensile strength plates is a one-step method (see Figure 1). When laminating impregnated base materials, one layer is covered with a cover film and the other layer is covered with copper foil. This is a method for producing copper-clad boards in one step.

本発明に於いては、得られた紙基材積層板に難燃性を付
与するためには、ハロゲン含有量(Br換算)を5.0
〜20.0%、窒素含を量を0.8〜8.0%、燐含有
量を0.4〜2.0%になるように調節することが必要
である(銅箔を除外した積層板重量を基準としたもの)
In the present invention, in order to impart flame retardancy to the obtained paper base laminate, the halogen content (in terms of Br) must be set to 5.0.
~ 20.0%, it is necessary to adjust the nitrogen content to 0.8 to 8.0%, and the phosphorus content to 0.4 to 2.0% (laminated layer excluding copper foil). (Based on board weight)
.

このような値の範囲に調節するには、Φ樹脂中のハロゲ
ン、燐、窒素の含有量、O下塗り樹脂中のハロゲン、燐
、窒素の含を量、0下塗り処理紙基材中の下塗り樹脂含
有量、及び@含浸基材中の樹脂含有量をそれぞれの関連
に於いて考慮することが必要である。
To adjust to such a value range, the content of halogen, phosphorus, and nitrogen in the Φ resin, the content of halogen, phosphorus, and nitrogen in the O undercoat resin, and the undercoat resin in the O undercoat treated paper base material must be adjusted. content and the resin content in the impregnated substrate need to be considered in each context.

このように3種の元素の組合せの相乗効果により難燃性
をはかるのは、電気的特性や耐熱性(特に高温、長時間
の耐久性)などについて最も悪い影響を及ぼすハロゲン
の量をできるだけ減少すること並びにその安定性の向上
をはかることがねらいである。特ζこ連続積層法に於い
ては、工程の自動化、連続化をはかるために、通常の加
圧プレス法のようなバッチ式の積層法に比較して、硬化
を極めて短時間に定常的に行わせることが重要なポイン
トとなり、そのために、樹脂の熱安定性の優れているこ
とが必要とされる。
In order to achieve flame retardancy through the synergistic effect of the combination of three types of elements, we reduce the amount of halogen as much as possible, which has the most negative effect on electrical properties and heat resistance (especially high-temperature, long-term durability). The aim is to improve the stability of the system. Special feature: In this continuous lamination method, in order to automate and make the process continuous, curing can be done in an extremely short period of time and steadily compared to batch lamination methods such as the normal pressure press method. The important point is to ensure that the resin is heat-stable.

本発明に用いる不飽和ポリエステル樹脂は、ハロゲン及
び燐を含有するものである。
The unsaturated polyester resin used in the present invention contains halogen and phosphorus.

先ず本発明に於いて不飽和ポリエステル系樹脂に含まれ
るハロゲンは樹脂の主要成分をなすものであることが好
ましい。即ちハロゲン含有不飽和ポリエステル樹脂とし
ては、ハロゲンを含む2塩基酸(またはその酸無水物)
及びハロゲンを含まないα、β不飽和2塩基酸のそれぞ
れの酸残基を含む所謂含ハロゲン不飽和ポリエステルオ
リゴマー(数平均分子量として800乃至5,000)
をスチレン及び/又はハロゲン基を含むスチレン誘導体
を主成分とする液状の重合性単量体に熔解した液状樹脂
である。
First, in the present invention, it is preferable that the halogen contained in the unsaturated polyester resin constitutes the main component of the resin. That is, as the halogen-containing unsaturated polyester resin, a halogen-containing dibasic acid (or its acid anhydride)
and a so-called halogen-containing unsaturated polyester oligomer (800 to 5,000 in number average molecular weight) containing acid residues of α and β unsaturated dibasic acids that do not contain halogen.
This is a liquid resin obtained by melting the above into a liquid polymerizable monomer whose main component is styrene and/or a styrene derivative containing a halogen group.

ハロゲンとしては塩素、臭素が好ましい。一般に臭素の
方が難燃化の作用が大であり、同一効果を示す重量の比
であられすと塩素対臭素は約1対2である。即ち臭素は
塩素の1/2(重量)でほぼ同等の効果が得られるので
、この関係を利用して本発明ではハロゲン含有量はすべ
て臭素の重量に換算して規定することにした。
As the halogen, chlorine and bromine are preferred. In general, bromine has a greater flame retardant effect, and the weight ratio of chlorine to bromine, which provides the same effect, is approximately 1:2. In other words, since bromine can provide approximately the same effect as chlorine at 1/2 (weight), by utilizing this relationship, in the present invention, all halogen contents are defined in terms of the weight of bromine.

また不飽和ポリエステル樹脂の他の成分である重合性単
量対としては、スチレンなどの2官能性のものが通常よ
く用いられるが、2官能性またはそれ以上の多官能性ポ
リオールのポリアクリレート(またはポリアクリレート
)のような多官能性単量体を少量変性用として含んでい
ると樹脂の特性(特に耐熱性、耐薬品性)が著しく向上
するので好ましい。
In addition, as the polymerizable monomer pair that is another component of the unsaturated polyester resin, difunctional monomers such as styrene are usually used, but polyacrylates (or It is preferable to contain a small amount of a polyfunctional monomer such as polyacrylate for modification, since the properties of the resin (especially heat resistance and chemical resistance) are significantly improved.

ナ8 ハロゲン、燐、窒素の少なくとも1種を含んでい
る重合性単量体を適宜用いてもよい。含ハロゲン不飽和
ポリエステルオリゴマーと重合性単量体(含ハロゲン、
ハロゲン不含の何れでも可)との混合物である以外に、
ハロゲン不含の不飽和ポリエステルオリゴマーと単量体
とよりなる通常の一般用不飽和ポリエステル系樹脂に対
して、有機含ハロゲンの添加剤を適宜添加配合したもの
を用いてもよい。
(8) A polymerizable monomer containing at least one of halogen, phosphorus, and nitrogen may be used as appropriate. Halogen-containing unsaturated polyester oligomer and polymerizable monomer (halogen-containing,
In addition to being a mixture with any halogen-free
A general unsaturated polyester resin composed of a halogen-free unsaturated polyester oligomer and a monomer may be blended with an organic halogen-containing additive as appropriate.

更にまた上記の一般用不飽和ポリエステル樹脂の代りに
エポキシアクリレートタイプの樹脂、またはその含ハロ
ゲンタイプのものを用いてもよい。
Furthermore, an epoxy acrylate type resin or a halogen-containing type thereof may be used instead of the above-mentioned general unsaturated polyester resin.

以上のような各種の含ハロゲン不飽和ポリエステル樹脂
は、ハロゲン含有量(Br換算として)5%以上である
ことが好ましく、紙基材積層板の樹脂含有量などに応し
てその量を予め適宜調整することが必要である。
The various halogen-containing unsaturated polyester resins described above preferably have a halogen content (in terms of Br) of 5% or more, and the amount can be adjusted in advance as appropriate depending on the resin content of the paper base laminate. Adjustment is necessary.

なお本発明に於いては高ハロゲン含を量の樹脂を用いる
はど難燃性はすくれているが、硬化時、加工時及び機器
に実装使用時の何れに於いても高温にさらされると熱分
解を伴う性能の劣化並びに発生ガスによる機器の損傷が
おこり易い欠点があるので、その使用量は必要最小限に
とどめるべきであり、本発明に於いてはハロゲン基のみ
でなく共存する含燐基、含窒素基との関連に於いてその
使用量をできるだけ少にせんとしているのである。
In the present invention, the flame retardance is low due to the use of a resin with a high halogen content, but if it is exposed to high temperatures during curing, processing, and mounting on equipment. Since it has the drawback of easily deteriorating performance due to thermal decomposition and damaging equipment due to generated gas, its usage should be kept to the minimum necessary.In the present invention, not only halogen groups but also coexisting phosphorus The aim is to minimize the amount used in relation to nitrogen-containing groups and nitrogen-containing groups.

次に本発明に於いて、不飽和ポリエステル系樹脂に含ま
れる燐は次のような添加型のタイプのを機化合物であり
、不飽和ポリエステル樹脂と反応性のある基や、含ハロ
ゲン、含窒素の基を有していてもよい。
Next, in the present invention, the phosphorus contained in the unsaturated polyester resin is an organic compound of the following additive type, and contains groups reactive with the unsaturated polyester resin, halogen-containing, nitrogen-containing It may have a group of

(RO) 3PO型(ホスフェート型、その含ハロゲン
系のものを含む)、 !! (RO)JPO型(ホスホネート型、その含ハロ
ゲン及び/又は含窒素系のものを含 む)、 iii  R,RO型(ホスフィンオキサイド型)、+
v  R3P型(ホスフィン型)、 V(RO)3P型(ホスファイト型)、viその他(縮
合型タイプ、第4級ホスホニウム塩など) 式中 R=  CH2CH2Cj2 n=1〜3 R4P″C1−: テトラキス(ヒドロキシメチル)ホ
スホニウムクロライド(R: CH,OH)など 以上のような有機系燐化合物を含む含燐不飽和ポリエス
テル樹脂は、燐含有量0.5%以上が好ましく、最終製
品形態としての紙基材積層板の樹脂含有量に応してその
量を予め適宜調整することが必要である。
(RO) 3PO type (phosphate type, including halogen-containing types), ! ! (RO) JPO type (phosphonate type, including halogen-containing and/or nitrogen-containing types), iii R, RO type (phosphine oxide type), +
v R3P type (phosphine type), V(RO)3P type (phosphite type), vi others (condensed type, quaternary phosphonium salt, etc.) where R= CH2CH2Cj2 n=1-3 R4P''C1-: Tetrakis (Hydroxymethyl)phosphonium chloride (R: CH, OH) The phosphorus-containing unsaturated polyester resin containing the above-mentioned organic phosphorus compounds preferably has a phosphorus content of 0.5% or more, and is suitable for use as a paper base in the form of a final product. It is necessary to appropriately adjust the amount in advance depending on the resin content of the material laminate.

燐の含有量としては多いほど難燃性のためにはよいが、
他の性能劣化をおこし易いのでできるだけ少ない方がよ
い。また、燐化合物に於いても含ハロゲン及び/又は含
窒素タイプのものの方が効果が大きいので好ましい。
The higher the phosphorus content, the better for flame retardancy;
Since it is easy to cause other performance deterioration, it is better to minimize the amount as much as possible. Furthermore, among the phosphorus compounds, halogen-containing and/or nitrogen-containing types are preferred because they are more effective.

また燐化合物にはハロゲン基の熱安定性を向上させる働
きがあるので好ましい。
Further, phosphorus compounds are preferable because they have the function of improving the thermal stability of halogen groups.

本発明に用いる含燐含ハロゲン不飽和ポリエステル樹脂
は、要すれば更に、含窒素有機化合物を配合することが
より少ないハロゲン量で効率的に難燃性を付与すること
が出来るので好ましい。
The phosphorus-containing halogen-unsaturated polyester resin used in the present invention is preferably further blended with a nitrogen-containing organic compound, if necessary, since flame retardance can be efficiently imparted with a smaller amount of halogen.

含窒素化合物としては、不飽和ポリエステル樹脂に対し
て相溶性の良好なアミン系樹脂、熱硬化アクリル系樹脂
、ポリアミド系樹脂などを適宜配合してもよいし、また
含ハロゲン化合物及び/又は含燐化合物の中の含窒素タ
イプのものを適宜用いてもよい。窒素含存置は紙基材の
下塗り樹脂により導入される量との関連に於いて、紙基
材積層板全体として調整されるべきものである。紙基材
に対する下塗り樹脂として用いる含窒素水溶性熱硬化性
樹脂の量が少ない程、積層板としての窒素含を量が減少
するので、含浸用樹脂中の窒素量はより多く必要となる
As the nitrogen-containing compound, amine resins, thermosetting acrylic resins, polyamide resins, etc. that have good compatibility with unsaturated polyester resins may be blended as appropriate, and halogen-containing compounds and/or phosphorus-containing compounds may be used. Among the compounds, nitrogen-containing types may be used as appropriate. The nitrogen content should be adjusted for the paper base laminate as a whole in relation to the amount introduced by the base coat resin of the paper base. The smaller the amount of the nitrogen-containing water-soluble thermosetting resin used as the undercoat resin for the paper base material, the less the amount of nitrogen contained in the laminate, and therefore the larger the amount of nitrogen in the impregnating resin is required.

本発明に用いる不飽和ポリエステル樹脂は、上記のよう
に含ハロゲン、含燐、(要すれば含窒素)であることが
必要であるが、更に連続積層工程に適合するように粘度
が20%ポイズ/20℃以下、揺変度力月、2乃至2.
5であることが必要である。
The unsaturated polyester resin used in the present invention needs to contain halogen, phosphorus, and (if necessary, nitrogen) as described above, but also has a viscosity of 20% po to be suitable for the continuous lamination process. /20℃ or less, thixotropy, 2 to 2.
Must be 5.

一般に樹脂粘度が低い程ロールラミ皐クーによる基材へ
の液状樹脂の含浸及び脱泡を迅速、かつ完全に行うこと
が出来るので有利であるが、反面次いでカバー用フィル
ム(または銅箔)で積層含浸基材を被覆し、ロール(ま
たはダブルベルトコンベアー)を用いて接触圧下、加熱
炉を通して加熱硬化させる工程において、耳端部のシー
ルが不十分となり樹脂液が流出し、積層基材内へ気泡が
再侵入し易くなり、ボイドレスの良好な積層板(硬化物
)が得難くなる欠点がある。
In general, the lower the resin viscosity is, the more quickly and completely the liquid resin can be impregnated into the base material and defoamed using roll lamination, which is advantageous. During the process of coating the base material and heating and curing it under contact pressure using rolls (or double belt conveyor) and passing through a heating furnace, the sealing at the edge end was insufficient, resulting in resin liquid flowing out and air bubbles entering the laminated base material. This has the drawback that it becomes easy to re-enter, making it difficult to obtain a void-free laminate (cured product).

逆に樹脂粘度が高いと耳端部のシールは比較的容易とな
り、樹脂液の流出や積層基材中への気泡の再侵入はさけ
られるが、反面基材への樹脂の含浸速度は遅くなり、し
かも含浸は不十分となり、この場合にもボイドレスの良
好な積層板(硬化物)は得難い欠点がある。
On the other hand, if the resin viscosity is high, it will be relatively easy to seal the edge end, preventing the resin liquid from flowing out and bubbles from re-entering the laminated base material, but on the other hand, the rate of resin impregnation into the base material will be slow. Moreover, the impregnation becomes insufficient, and in this case as well, it is difficult to obtain a void-free laminate (cured product).

何れにしても単に粘度の調節のみでこの点を改善しよう
とするのは極めて困難であるが、樹脂に適度の探度性を
付与すると樹脂が低粘度であっても上記耳端部のシール
が容易となり、気泡の再浸入を避けることが出来るよう
になる。このような含浸性とシール性とが両立するには
、粘度が20ポイズ/20’C以下であり、揺変度の範
囲は1.2〜2.5である。
In any case, it is extremely difficult to try to improve this point simply by adjusting the viscosity, but if the resin is given appropriate probing properties, even if the resin has a low viscosity, the seal at the end of the ear can be improved. This makes it possible to avoid re-infiltration of air bubbles. In order to achieve both impregnating properties and sealing properties, the viscosity should be 20 poise/20'C or less, and the thixotropy range should be from 1.2 to 2.5.

なお揺変度の測定力(プルタフイールド粘度計による)
は次のようである。
In addition, the measurement force of thixotropy (using a Pluta field viscometer)
is as follows.

揺変度−(6r、P、mでの見掛は粘度)/(60r、
Pomでの見掛は粘度) また粘度は60r、P、mでの見掛は粘度をとるものと
する。
Thixotropy - (apparent viscosity at 6r, P, m)/(60r,
(Appearance at Pom is viscosity) The viscosity is 60r, and the appearance at P and m is viscosity.

チキソトロピー性を樹脂に付与する添加剤としては、微
粒子シリカ類、短繊維アスヘスト類、ヘントナイト類、
水素化ひまし油などであり、何れも同様に用いることが
出来る。
Additives that impart thixotropic properties to resins include fine particle silicas, short fiber ashests, hentonites,
Hydrogenated castor oil and the like can be used in the same manner.

しかし、熱時でもチキソトロピー性が低下し難いことよ
り微粒子シリカ類が特に好ましい。またチキソトロピー
性は粘度が低いほど付与し易いので、この面よりも粘度
は出来るだけ低くすることが望ましい。
However, particulate silicas are particularly preferred because their thixotropic properties do not easily deteriorate even when heated. Furthermore, since it is easier to impart thixotropy as the viscosity is lower, it is desirable to keep the viscosity as low as possible.

しかし難燃性樹脂、特にハロゲン含有樹脂は一般に高粘
度であるが、その低粘度化をはかる方法は次のようであ
る。
However, flame-retardant resins, especially halogen-containing resins, generally have a high viscosity, and the following methods are used to reduce the viscosity.

■ 含塩素不飽和ポリエステルオリゴマーに於いて、可
撓性の長鎖状脂肪族系の2塩基酸やジオールの残基の導
入、 ■ 架橋性単量体の量の増加、 ■ 反応性可塑剤の添加、 ■ 低粘土の一般用不飽和ポリエステル樹脂の配合。
■ Introducing flexible long-chain aliphatic dibasic acid or diol residues into chlorine-containing unsaturated polyester oligomers, ■ Increasing the amount of crosslinking monomers, ■ Increasing the amount of reactive plasticizers. Addition, ■ Formulated with low clay general purpose unsaturated polyester resin.

また含浸を促進するために樹脂に界面活性剤。Also a surfactant in the resin to promote impregnation.

湿潤剤、脱泡剤などを適宜配合してもよい。A wetting agent, a defoaming agent, etc. may be added as appropriate.

本発明に用いる液状不飽和ポリエステル樹脂は、基材へ
の含浸に先立って脱泡脱気を行うことが好ましい。
The liquid unsaturated polyester resin used in the present invention is preferably defoamed and deaerated prior to being impregnated into a base material.

一般にチキソトロピー性をイリ与した樹脂より脱泡脱気
することはやや困難であるので、本発明に於いては真空
による脱泡脱気を行うよりも超音波(10〜50キロヘ
ルツ)の作用でこれを行う方がスチレンなどの重合性単
量体のロスを少くして短時間(要すれば管の中を流しな
がら連続的に)で達成出来るので好ましい。またそのた
めに通常のシリコン系、弗素系などの脱泡剤を樹脂に適
宜配合してもよい。尚、ケルコ−1−用樹脂としては粘
度1〜20ポイズ(20°c)、揺変度1.5〜4.0
であるものが望ましい。
In general, it is somewhat difficult to degas and degas the resin with thixotropic properties, so in the present invention, this is achieved by the action of ultrasonic waves (10 to 50 kHz) rather than by vacuum. It is preferable to carry out this method because it can reduce the loss of polymerizable monomers such as styrene and can be achieved in a short time (if necessary, continuously while flowing through the tube). Further, for this purpose, a conventional defoaming agent such as silicone-based or fluorine-based defoamers may be appropriately blended with the resin. In addition, the resin for Kelco-1 has a viscosity of 1 to 20 poise (20°c) and a thixotropy of 1.5 to 4.0.
It is desirable that

本発明の含ハロゲン・含燐不飽和ポリエステル樹脂は、
更に要すれば有機錫系化合物及び/又はエポキシ系化合
物を安定剤として適宜添加配合されていることが好まし
い。含ハロゲン不飽和ポリエステル樹脂の200℃乃至
300℃の温度範囲内の銅張積層板の半田処理などの加
工工程に於けるハロゲンの脱離を伴う熱分解は、熱分解
生成物の発生によって更に加速される傾向がある。従っ
て300℃までの準高温領域に於ける初期のハロゲン基
の分解の抑制が極めて重要であり、有機錫化合物やエポ
キシ系化合物はこのような面で樹脂の熱安定性の向上に
大きく寄与するものである。
The halogen-containing and phosphorus-containing unsaturated polyester resin of the present invention is
Furthermore, if necessary, it is preferable that an organic tin compound and/or an epoxy compound be appropriately added as a stabilizer. Thermal decomposition of halogen-containing unsaturated polyester resin during processing steps such as soldering of copper-clad laminates within the temperature range of 200°C to 300°C, accompanied by the elimination of halogens, is further accelerated by the generation of thermal decomposition products. There is a tendency to Therefore, it is extremely important to suppress the initial decomposition of halogen groups in the semi-high temperature range up to 300°C, and organotin compounds and epoxy compounds greatly contribute to improving the thermal stability of resins in this respect. It is.

有機錫化合物としては、可溶性の有機酸の錫塩、ジアル
キル錫の脂肪酸塩、ジアルキル錫硫黄化合物塩などであ
る。
Examples of the organic tin compound include tin salts of soluble organic acids, dialkyltin fatty acid salts, and dialkyltin sulfur compound salts.

エポキシ化合物としては、脂環族エポキシ樹脂、グリシ
シールメタクリレートなどの相溶性のよい低分子化合物
である。
The epoxy compound is a low-molecular compound with good compatibility such as an alicyclic epoxy resin or glycysyl methacrylate.

これら有機錫化合物及び/又はエポキシ化合物よりなる
安定剤の量は、樹脂のハロゲン含有量(Br換算)に対
して5〜80%であることか好ましい。これより少ない
と効果が著しく減少し、これより多過ぎると樹脂の特性
を劣化させる恐れがあるので何れも好ましくない。
The amount of the stabilizer made of these organic tin compounds and/or epoxy compounds is preferably 5 to 80% based on the halogen content (in terms of Br) of the resin. If the amount is less than this, the effect will be significantly reduced, and if it is more than this, the properties of the resin may be deteriorated, so neither is preferable.

本発明に用いる紙基材は、コツトンリンター紙、サルフ
ァイド紙、クラフト紙など何れも同様に用いることが出
来るが、難燃性をより向上させるために、無機系難燃助
剤を予め抄き込んだ所謂難燃紙であることが好ましい。
The paper base material used in the present invention may be cotton linter paper, sulfide paper, kraft paper, etc., but in order to further improve flame retardancy, an inorganic flame retardant aid is added to the paper in advance. It is preferable to use a so-called flame-retardant paper.

こうすることにより、より少ない積層板中のハロゲン含
有量によっても所望の難燃性が得られるようになるので
有利である。
This is advantageous because the desired flame retardancy can be achieved even with a lower halogen content in the laminate.

本発明に用いる無機系難燃助剤とは、アンチモン系化合
物、亜鉛系化合物、はう素糸化合物、アルミニウム系化
合物、ジルコニウム系化合物などがある。
Examples of the inorganic flame retardant aid used in the present invention include antimony compounds, zinc compounds, thread compounds, aluminum compounds, and zirconium compounds.

これらの中でアンチモン系の化合物、中でも:酸化アン
チモン、五酸化アンチモン(特にメツキ浴を汚染しない
ので有利)が比較的少量でも有効であるので好ましい。
Among these, antimony-based compounds, especially antimony oxide and antimony pentoxide (especially advantageous because they do not contaminate the plating bath), are preferred because they are effective even in relatively small amounts.

アンチモン系化合物では0.5乃至10%(内削、ドラ
イベース)の含有量が好ましい。これ以下では難燃化の
効果が殆どみとめられなくなるし、これより多くしても
その効果は大差がなくなる上、紙の性質(とくに樹脂の
含浸性)を劣化させ、コストを大幅に増大させるので好
ましくない。またアンチモン系化合物は毒性があるので
取扱いには注意を要するものである。
For antimony compounds, the content is preferably 0.5 to 10% (internal cutting, dry base). If the amount is less than this, the flame retardant effect will hardly be noticeable, and if the amount is more than this, the effect will not be much different, and the properties of the paper (especially resin impregnation) will deteriorate and the cost will increase significantly. Undesirable. Furthermore, antimony compounds are toxic and must be handled with care.

またほう素糸、アルミニウム系の化合物のように結晶水
、水和した水が加熱時大量に放出されることによる吸熱
と発生した水蒸気の作用により難燃化をはかろうとして
いるものでは、紙に対する添加量がかなり大きくないと
その効果が十分に発揮されない。例えば水和アルミナで
は50乃至90%(抄きこの紙に対して)の含有量が必
要である。
In addition, for materials such as boron threads and aluminum compounds that are intended to be flame retardant through the action of heat absorption and generated water vapor due to the release of a large amount of crystallized water and hydrated water during heating, paper The effect will not be fully exhibited unless the amount added is quite large. For example, hydrated alumina requires a content of 50 to 90% (based on papermaking).

ジルコニウム系化合物は単独ではその効果がアンチモン
系に比し若干低く、アンチモン系化合物との併用が好ま
しい。
A zirconium compound alone has a slightly lower effect than an antimony compound, so it is preferable to use it in combination with an antimony compound.

このような方法に対し、これらの無機系難燃助剤を含ハ
ロゲン含燐不飽和ポリエステル系樹脂に予め添加し分散
させておき、これらの無機系難燃助剤を抄きこんでない
通常の紙基材を用いて、同等の難燃化の効果を上げるこ
とも可能である。
In contrast to this method, these inorganic flame retardant aids are added and dispersed in halogen-containing phosphorus-containing unsaturated polyester resin in advance, and ordinary paper without these inorganic flame retardant aids is added. It is also possible to achieve the same flame retardant effect using a base material.

しかし後者の方法では、一般に樹脂中に分散させた無機
系助剤が比重の差により沈降し易く均一状態を保ちにく
いこと、またそのために紙へ塗布含浸させた時にムラを
生し易く、性能は勿論のこと、外観さえ不良となり易い
However, in the latter method, in general, the inorganic auxiliary agent dispersed in the resin tends to settle due to the difference in specific gravity and is difficult to maintain in a uniform state.As a result, when it is coated and impregnated on paper, it tends to become uneven, resulting in poor performance. Of course, even the appearance is likely to be defective.

抄こみ紙を用いると、全くこのような問題はなく、積層
板中の無機系助剤の分布の均一化と性能のバラツキの減
少をはかることが出来るので好ましい。
The use of paper is preferable because it does not have such problems at all, and it is possible to make the distribution of the inorganic auxiliary agent in the laminate uniform and to reduce variations in performance.

本発明に於いて下塗り処理に用いる熱硬化性樹脂として
は、水溶性乃至水分散性であり、窒素を含有しかつラジ
カル重合の抑制作用を有する成分を含有しないものであ
れば何れも同様に用いることが出来る。
In the present invention, any thermosetting resin used in the undercoating process may be used as long as it is water-soluble or water-dispersible, contains nitrogen, and does not contain a component that inhibits radical polymerization. I can do it.

本発明に用いる下塗り用樹脂としては、アミノ系樹脂以
外にポリエチレンイミン系、ポリアクリルアミド系、ポ
リアミド・ポリアミン・エピクロルヒドリン系などのプ
レポリマーのホルムアルデヒド縮金物であって、水溶性
かつ熱硬化性のものを用いてもよい。
In addition to amino resins, the undercoating resin used in the present invention may be formaldehyde condensation products of prepolymers such as polyethyleneimine, polyacrylamide, polyamide/polyamine/epichlorohydrin, etc., which are water-soluble and thermosetting. May be used.

またこれら含窒素水溶性熱硬化性樹脂は、更にエポキシ
系、不飽和ポリエステル系(アルキッド系を含む)、ケ
トン系樹脂などによって適宜変性されていてもよい。
Further, these nitrogen-containing water-soluble thermosetting resins may be further appropriately modified with epoxy resins, unsaturated polyester resins (including alkyd resins), ketone resins, and the like.

更に本発明の下塗り用樹脂は、窒素を含有する難燃タイ
プの樹脂であることが必要であるが、ハロゲン、燐をも
適宜含有することにより一層難燃化されていることが好
ましい。
Furthermore, the undercoat resin of the present invention needs to be a flame-retardant type resin containing nitrogen, but it is preferable that it is further made flame-retardant by also appropriately containing halogen and phosphorus.

本発明に用いる銅箔の接着剤は、エラストマと熱硬化性
樹脂との組合せが銅箔のビール強度と耐熱半田性とを両
立さゼる上で望ましい。
The adhesive for copper foil used in the present invention preferably has a combination of an elastomer and a thermosetting resin in order to achieve both beer strength and heat-resistant solderability of the copper foil.

本発明の目的のためには、ニトリルゴム−エポキシ樹脂
−フエノール樹脂、ニトリルゴム−フェノール樹脂、ニ
トリルゴム−エポキシ樹脂、ニトリルゴム−ポリウレタ
ンゴム−エポキシ樹脂、非品性ポリアミドレジン−エポ
キシ樹脂などの組合せが好ましい。
For purposes of the present invention, combinations such as nitrile rubber-epoxy resin-phenolic resin, nitrile rubber-phenolic resin, nitrile rubber-epoxy resin, nitrile rubber-polyurethane rubber-epoxy resin, non-grade polyamide resin-epoxy resin, etc. is preferred.

本発明の目的のためには、上記接着剤に上記のハロゲン
系、燐系、窒素系、アンチモン系などの添加型の難燃剤
、難燃助剤を適宜配合するとか、上記接着剤用樹脂に於
いて含ハロゲン系のものを用いるとかして適宜その難燃
化をはかることが好ましい。
For the purpose of the present invention, the adhesive may be appropriately blended with additive flame retardants and flame retardant aids such as the halogen-based, phosphorus-based, nitrogen-based, and antimony-based flame retardants, or the adhesive resin may It is preferable to use a halogen-containing material to make it flame retardant.

以下実施例につき説明する。Examples will be explained below.

〔実施例〕〔Example〕

実施例1 用いた各種原料は次のようである。 Example 1 The various raw materials used are as follows.

■ 不飽和ポリエステル樹脂(第1表に示す)第1表 
不飽和ポリエステル樹脂及び硬化触媒(Mi成) マレ
イン酸0.5モル、クロレンド酸0.5モル、プロピレ
ングリコール0゜5モルブチレングリコール05モル (分子量) Mn :I、600 (酸価35に相当)
峠 ジエチルN、Nビス(2ビロキシエチル〕アミノメ
チルフオスフエート 峙−スチレン/トリアリルシアヌレート/トリメチルロ
ールプロパントリアクリレート−7/2/1 ■ 紙基材:クラフト紙、厚さ0.30mm、中1.0
5帥湿潤強度0.25kg/15+nm、吸水性100
mm/10分 ■ 下塗り用樹脂水性ワニス: レジン溶液ニトリメチロールメラミンはメタノール/水
の2/1の混合溶剤 で30%?容液 燐化合物ニドリス(3,4ジブロムプロピル)ホスフェ
ート 酸化アンチモン このワニスの硬化物中のN%=273%2%:1.3%
、Br%: 20.6%、Sb203%:5.0% ■ 銅箔:連続型、電解銅、巾1.05 m、厚35ミ
クロン、表面粗化 ■ 銅箔接着剤:実施例1と同し ■ カバー用フィルム:ポリエチレンテレフタレートシ
ート、中1.2m、厚さ60ミクロン以上の原材料を用
いて、第1図の工程の流れに従って銅張積層板を連続的
に製造した。
■ Unsaturated polyester resin (shown in Table 1) Table 1
Unsaturated polyester resin and curing catalyst (Mi composition) Maleic acid 0.5 mol, chlorendic acid 0.5 mol, propylene glycol 0.5 mol butylene glycol 05 mol (molecular weight) Mn: I, 600 (equivalent to acid value 35)
Pass Diethyl N, N-bis(2-biloxyethyl)aminomethylphosphate - styrene/triallyl cyanurate/trimethylolpropane triacrylate -7/2/1 ■ Paper base material: Kraft paper, thickness 0.30 mm, medium 1.0
5-layer wet strength 0.25kg/15+nm, water absorption 100
mm/10 minutes■ Resin water-based varnish for undercoat: Resin solution nitrimethylolmelamine is 30% in a 2/1 mixed solvent of methanol/water? Liquid phosphorus compound Nidris (3,4 dibromopropyl) phosphate Antimony oxide N% in cured product of this varnish = 273% 2%: 1.3%
, Br%: 20.6%, Sb203%: 5.0% ■ Copper foil: continuous type, electrolytic copper, width 1.05 m, thickness 35 microns, surface roughening ■ Copper foil adhesive: Same as Example 1 (2) Covering film: A copper-clad laminate was continuously produced using a raw material of a polyethylene terephthalate sheet, 1.2 m in diameter and 60 microns or more thick, according to the process flow shown in Figure 1.

紙基材を下塗り処理し、樹脂を含浸し、積層脱泡する中
間工程に於ける中間材料の試験項目と性能を示すと第2
表の通りである。
The second section shows the test items and performance of intermediate materials in the intermediate process of undercoating the paper base material, impregnating it with resin, and laminating and degassing it.
As shown in the table.

次に樹脂含浸基材の積層物(未硬化)より銅張積層板(
製品)に至る中間工程に於ける操作条件は第3表の通り
である。
Next, the copper-clad laminate (
The operating conditions in the intermediate steps leading to the final product are shown in Table 3.

第2表 中間工程と中間材料 100〜140℃1)0分、熱風乾燥炉1  ロールコ
ータH吏用、含浸前に樹脂(1)″傘  ロールラミネ
ーター使用 1)申  140℃30分(沿り凌蜂H牛)は超音波(
28KC)により脱気処理 第3表 銅張接着及び硬化工程の条件 (備考)槌1行U層の厚さ 40ミクロン 得られた銅張積層板(1)の性能は第4表の通りである
Table 2 Intermediate process and intermediate materials 100-140℃ 1) 0 minutes, hot air drying oven 1 Roll coater H, use of roll laminator before impregnation 1) 140℃ 30 minutes (long drying) Bee H Cow) is ultrasonic (
Table 3 Conditions for copper clad adhesion and curing process (Note) The performance of the copper clad laminate (1) obtained by hammering 1 row U layer thickness 40 microns is as shown in Table 4. .

実施例2 実施例1に於いて用いた不飽和ポリエステル樹脂にジブ
チル錫ジラウレート1%(樹脂に対し)を配合した以外
は全く同様に行い銅張積層板(II)を得た。得られた
銅張積層板(II)の性質は積層板(1)とほぼ同しで
あったが、150℃1)000時間の長期耐久テストに
於ける変色は著しく抑制され、ハロゲン基の分解が著し
く抑制されていることがわかる。
Example 2 A copper-clad laminate (II) was obtained in exactly the same manner as in Example 1, except that 1% dibutyltin dilaurate (based on the resin) was added to the unsaturated polyester resin used in Example 1. The properties of the obtained copper-clad laminate (II) were almost the same as those of laminate (1), but discoloration in a long-term durability test of 1) 000 hours at 150°C was significantly suppressed, and the decomposition of halogen groups was significantly suppressed. It can be seen that this is significantly suppressed.

比較例1 用いた各種原材料は次のようである。Comparative example 1 The various raw materials used are as follows.

■ 不飽和ポリエステル樹脂: (第5表に示す)第4
表銅張積層板の性能 ■ 紙基材;実施例1と同じ ■ 下塗り用樹脂水性ワニス なお上記樹脂硬化物中の窒素含有量は39.0%である
■ Unsaturated polyester resin: (shown in Table 5)
Performance of surface copper-clad laminate (1) Paper base material; same as Example 1 (2) Resin water-based varnish for undercoat Note that the nitrogen content in the cured resin product is 39.0%.

■ 銅箔、銅箔接着剤、カバー用フィルムは何れも実施
例1に同じ。
■ The copper foil, copper foil adhesive, and cover film were all the same as in Example 1.

以上の原材料を用いて、実施例1とほぼ同じ工程の流れ
に従って銅張積層板を連続的に製造した。中間材料の試
験項目と性能は第6表の通りである。
A copper-clad laminate was continuously produced using the above raw materials and following substantially the same process flow as in Example 1. The test items and performance of the intermediate material are shown in Table 6.

第5表 不1iiIDd; IJエステル樹脂及び硬化触媒第6
表 中間工程と中間材料 次に銅張積層板(製品)に至る中間工程の条件は実施例
1と同しである。得られた銅張積層板の性能は第4表の
通りである。
Table 5 F1iiiIDd; IJ ester resin and curing catalyst No. 6
The conditions for the surface intermediate process and the intermediate process leading to the production of intermediate materials and copper-clad laminates (products) are the same as in Example 1. The performance of the obtained copper clad laminate is shown in Table 4.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は一段法による不飽和ポリエステル樹脂紙−銅張
積層板の連続製造方法を示す工程図である。
FIG. 1 is a process diagram showing a continuous production method of an unsaturated polyester resin paper-copper clad laminate using a one-step process.

Claims (4)

【特許請求の範囲】[Claims] (1)ハロゲン及び燐を含有し粘度が20ポイズ/20
℃以下であり揺変度1.2〜2.5であり有機系窒素及
び/又は無機系難燃助剤を含有する液状の不飽和ポリエ
ステル樹脂を、含窒素系であり燐及び/又はハロゲンを
含有する有機化合物、無機難燃剤よりなる群より選ばれ
た少なくとも1種のものを含有する熱硬化性樹脂の水性
ワニスで処理した紙基材に含浸させ積層し、該積層した
ものと接着剤層を介し銅箔及び/又はカバーフィルムと
を積層しロールラミネーターを用いて連続的に接触圧下
で加熱乾燥炉を通しながら硬化一体化することを特徴と
する不飽和ポリエステル−紙−銅張積層板の製造方法に
おいて紙基材積層板(銅箔を除外した重量に換算)に対
してハロゲン含有量(Br換算)が5.0〜20.0%
(重量、以下同じ)、燐含有量として0.4〜2.0%
、窒素含有量として0.8〜8.0%になるように上記
各成分の配合量を調整してなることを特徴とする難燃性
不飽和ポリエステル樹脂−紙−銅張積層板の連続製造方
法。
(1) Contains halogen and phosphorus and has a viscosity of 20 poise/20
℃ or less, a thixotropy of 1.2 to 2.5, and a liquid unsaturated polyester resin containing organic nitrogen and/or an inorganic flame retardant. A paper base material treated with a water-based varnish of a thermosetting resin containing at least one selected from the group consisting of an organic compound and an inorganic flame retardant is impregnated and laminated, and the laminated material and an adhesive layer are laminated. An unsaturated polyester-paper-copper-clad laminate characterized by laminating copper foil and/or a cover film through a roll laminator and curing and integrating the sheets through a heating drying oven under continuous contact pressure using a roll laminator. In the manufacturing method, the halogen content (in terms of Br) is 5.0 to 20.0% based on the paper base laminate (in terms of weight excluding copper foil).
(weight, same below), phosphorus content 0.4-2.0%
Continuous production of a flame-retardant unsaturated polyester resin-paper-copper clad laminate, characterized in that the blending amount of each of the above components is adjusted so that the nitrogen content is 0.8 to 8.0%. Method.
(2)紙基材は、予め無機系難燃助剤を0.5〜10.
0%(ドライベース)抄きこんだものである特許請求の
範囲第(1)項記載の難燃性不飽和ポリエステル樹脂−
紙−銅張積層板の連続製造方法。
(2) The paper base material is preliminarily coated with an inorganic flame retardant additive of 0.5 to 10%.
The flame-retardant unsaturated polyester resin according to claim (1), which is a 0% (dry base) infused resin.
Continuous manufacturing method for paper-copper clad laminates.
(3)無機系難燃助剤が、アンチモン系のものである特
許請求の範囲第(2)項記載の難燃性不飽和ポリエステ
ル樹脂−紙−銅張積層板の連続製造方法。
(3) The method for continuously producing a flame-retardant unsaturated polyester resin-paper-copper-clad laminate according to claim (2), wherein the inorganic flame retardant aid is antimony-based.
(4)ハロゲン及び燐を含有する不飽和ポリエステル樹
脂は、さらにハロゲン基の安定剤として有機錫化合物及
び/又はエポキシ系化合物をハロゲン基の含有量(Br
換算)に対し5〜80%含有するものである特許請求の
範囲第(1)項記載の難燃性不飽和ポリエステル樹脂−
紙−銅張積層板の連続製造方法。
(4) The unsaturated polyester resin containing halogen and phosphorus is further treated with an organotin compound and/or an epoxy compound as a halogen group stabilizer.
The flame retardant unsaturated polyester resin according to claim (1), which contains 5 to 80% of the flame retardant unsaturated polyester resin
Continuous manufacturing method for paper-copper clad laminates.
JP1131582A 1989-05-26 1989-05-26 Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet Pending JPH0222049A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1131582A JPH0222049A (en) 1989-05-26 1989-05-26 Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1131582A JPH0222049A (en) 1989-05-26 1989-05-26 Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP16661882A Division JPS5955739A (en) 1982-09-27 1982-09-27 Continuous manufacture of flame-retarded unsaturated polyester resin-paper-copper lined laminated board

Publications (1)

Publication Number Publication Date
JPH0222049A true JPH0222049A (en) 1990-01-24

Family

ID=15061425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1131582A Pending JPH0222049A (en) 1989-05-26 1989-05-26 Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet

Country Status (1)

Country Link
JP (1) JPH0222049A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496359A (en) * 1972-03-23 1974-01-21
JPS577185A (en) * 1980-06-16 1982-01-14 Kanegafuchi Chemical Ind Flame resistant electric laminated board

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS496359A (en) * 1972-03-23 1974-01-21
JPS577185A (en) * 1980-06-16 1982-01-14 Kanegafuchi Chemical Ind Flame resistant electric laminated board

Similar Documents

Publication Publication Date Title
EP0779905B1 (en) Epoxy resin mixtures for prepregs and composites
CN103347938B (en) Pre-preg, laminate board, printed wiring board, and semiconductor device
JP3412585B2 (en) Epoxy resin composition for prepreg used for production of printed wiring board and multilayer printed wiring board, prepreg, multilayer printed wiring board
EP1948735B1 (en) Flame retardant prepregs and laminates for printed circuit boards
CN105482442A (en) Halogen-free resin composition and cover film prepared from the same
EP0779906B1 (en) Epoxy resin mixtures for prepregs and composites
WO2011132408A1 (en) Epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
EP0779904B1 (en) Epoxy resin mixtures for prepregs and composites
CN113292852B (en) Resin composition containing phosphorus-benzene bisphenol polymer, preparation method and application thereof
CN108047647B (en) Halogen-free thermosetting resin composition, and prepreg, laminated board, metal foil-clad laminated board and printed circuit board using same
JPH0222049A (en) Continuous preparation of fire-retardant unsaturated polyester resin/paper/copper-clad laminated sheet
JPS5955739A (en) Continuous manufacture of flame-retarded unsaturated polyester resin-paper-copper lined laminated board
JPS62153373A (en) Flame-retardant adhesive composition for flexible printed circuit board
KR100867906B1 (en) Laminate composition for producing reduced curl flat thin core laminate
EP0119617B1 (en) Flame retarded epoxy resin composition for use in the manufacture of electrical laminates
JP2644233B2 (en) Flame retardant adhesive composition for flexible printed circuit boards
JPH0812858A (en) Epoxy resin composition, prepreg using the epoxy resin composition, and laminate board using the prepreg
JPS5957744A (en) Flame-retarded unsaturated polyester resin-copper lined lam-inated board and its manufacture
TWI710596B (en) Resin composition, prepreg containing the same, laminated board and printed circuit board
EP3943549B1 (en) Resin composition, prepreg containing same, laminate, and printed circuit board
WO2012070202A1 (en) High-heat-resistant epoxy resin composition, prepreg, metal-clad laminate, and printed wiring board
JP4660953B2 (en) Dicyandiamide-added phosphorus-modified epoxy resin-containing resin composition and method for producing the same
JP2000290474A (en) Flame resistant hardenable resin composition
JP2002060590A (en) Epoxy resin composition for imprregnating glass fiber substrate and prepreg, laminated sheet and printed wiring board using the same
JP2000273298A (en) Flame-retardant, hardening resin composition