JPH0221763U - - Google Patents
Info
- Publication number
- JPH0221763U JPH0221763U JP1988100074U JP10007488U JPH0221763U JP H0221763 U JPH0221763 U JP H0221763U JP 1988100074 U JP1988100074 U JP 1988100074U JP 10007488 U JP10007488 U JP 10007488U JP H0221763 U JPH0221763 U JP H0221763U
- Authority
- JP
- Japan
- Prior art keywords
- lead frames
- led lamp
- bonded
- lead
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/547—Dispositions of multiple bond wires
- H10W72/5473—Dispositions of multiple bond wires multiple bond wires connected to a common bond pad
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100074U JPH0221763U (enFirst) | 1988-07-28 | 1988-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988100074U JPH0221763U (enFirst) | 1988-07-28 | 1988-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0221763U true JPH0221763U (enFirst) | 1990-02-14 |
Family
ID=31327821
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988100074U Pending JPH0221763U (enFirst) | 1988-07-28 | 1988-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0221763U (enFirst) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585362B2 (ja) * | 1976-07-28 | 1983-01-31 | 電測工業株式会社 | 絶縁性被覆の偏肉検出方法 |
| JPS6247154B2 (enFirst) * | 1983-05-11 | 1987-10-06 | Atsuji Tetsuko Kk |
-
1988
- 1988-07-28 JP JP1988100074U patent/JPH0221763U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS585362B2 (ja) * | 1976-07-28 | 1983-01-31 | 電測工業株式会社 | 絶縁性被覆の偏肉検出方法 |
| JPS6247154B2 (enFirst) * | 1983-05-11 | 1987-10-06 | Atsuji Tetsuko Kk |