JPH0221551U - - Google Patents
Info
- Publication number
- JPH0221551U JPH0221551U JP10005688U JP10005688U JPH0221551U JP H0221551 U JPH0221551 U JP H0221551U JP 10005688 U JP10005688 U JP 10005688U JP 10005688 U JP10005688 U JP 10005688U JP H0221551 U JPH0221551 U JP H0221551U
- Authority
- JP
- Japan
- Prior art keywords
- humidity sensor
- heating element
- prevention device
- condensation prevention
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005494 condensation Effects 0.000 claims description 3
- 238000009833 condensation Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
Description
第1図は本考案の一実施例に係る湿度センサの
結露防止装置を示す斜視図、第2図は従来の参考
例に係る湿度センサの結露防止装置を示す斜視図
、第3図は対向距離と消費電力の関係を示す曲線
図、第4図は時間と温度上昇の関係を示す曲線図
である。
1……基板、2……感湿部、3……セラミツク
湿度センサ、4……熱放射性半導体素子。
Fig. 1 is a perspective view showing a condensation prevention device for a humidity sensor according to an embodiment of the present invention, Fig. 2 is a perspective view showing a condensation prevention device for a humidity sensor according to a conventional reference example, and Fig. 3 is a perspective view showing the opposing distance. FIG. 4 is a curve diagram showing the relationship between time and power consumption, and FIG. 4 is a curve diagram showing the relationship between time and temperature rise. DESCRIPTION OF SYMBOLS 1...Substrate, 2...Moisture sensing section, 3...Ceramic humidity sensor, 4...Heat emitting semiconductor element.
Claims (1)
配設してなる湿度センサの結露防止装置において
、前記発熱体が熱放射性半導体素子からなること
を特徴とする湿度センサの結露防止装置。 1. A dew condensation prevention device for a humidity sensor comprising a ceramic humidity sensor and a heating element disposed facing each other on a substrate, wherein the heating element comprises a heat emitting semiconductor element.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10005688U JPH0619086Y2 (en) | 1988-07-27 | 1988-07-27 | Humidity sensor condensation prevention device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10005688U JPH0619086Y2 (en) | 1988-07-27 | 1988-07-27 | Humidity sensor condensation prevention device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0221551U true JPH0221551U (en) | 1990-02-13 |
JPH0619086Y2 JPH0619086Y2 (en) | 1994-05-18 |
Family
ID=31327786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10005688U Expired - Lifetime JPH0619086Y2 (en) | 1988-07-27 | 1988-07-27 | Humidity sensor condensation prevention device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0619086Y2 (en) |
-
1988
- 1988-07-27 JP JP10005688U patent/JPH0619086Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0619086Y2 (en) | 1994-05-18 |