JPH02214102A - Resin-molded coil - Google Patents
Resin-molded coilInfo
- Publication number
- JPH02214102A JPH02214102A JP3472589A JP3472589A JPH02214102A JP H02214102 A JPH02214102 A JP H02214102A JP 3472589 A JP3472589 A JP 3472589A JP 3472589 A JP3472589 A JP 3472589A JP H02214102 A JPH02214102 A JP H02214102A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molded
- inner periphery
- exposed
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 29
- 239000003822 epoxy resin Substances 0.000 claims abstract description 16
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 16
- 238000004804 winding Methods 0.000 claims description 11
- 239000003365 glass fiber Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 23
- 238000000465 moulding Methods 0.000 abstract description 5
- 230000008646 thermal stress Effects 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract 4
- 238000004299 exfoliation Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 14
- 239000004020 conductor Substances 0.000 description 8
- 239000011229 interlayer Substances 0.000 description 5
- 239000004745 nonwoven fabric Substances 0.000 description 5
- 239000011810 insulating material Substances 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920006267 polyester film Polymers 0.000 description 4
- 239000011888 foil Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229920000784 Nomex Polymers 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000002655 kraft paper Substances 0.000 description 2
- 239000004763 nomex Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- 229920006289 polycarbonate film Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はモールド変圧器の樹脂モールドコイルに関する
ものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a resin molded coil for a molded transformer.
従来の技術
従来の樹脂モールドコイルはガラス繊維強化エポキシ樹
脂をコイル内周部に数層配設し、その内周面は殆ど露出
し、その他のコイル全体を樹脂モールドする。このよう
にして得られた従来のモールドコイルの構成を第2図に
従って説明する。8はコイル内周に設けたガラス繊維強
化エポキシ樹脂層で、−船釣にはアミン硬化タイプのプ
リプレグ状のものが用いられ、その硬化はモールド樹脂
と同時に完結するようにしている。さらに前記ガラス繊
維強化エポキシ樹脂の樹脂含有率は40〜50重量%で
ある。9は層間絶縁材料で、ポリエステルフィルム、ポ
リ力フィルム、ポリフェニレンサルファイドフィルム、
クラフト紙、ポリエステル不織布等が用いられる。10
は導体で、第2図では箔状導体でアルミ箔(条)や銅箔
(条)が用いられる。11は外周絶縁材料で、層間絶縁
材料を数層巻回するか又はガラスクロスやポリエステル
不織布、ノーメックス、ガラス繊維強化エポキシ樹脂等
が用いられている。12は樹脂モールド層、+3は端子
である。BACKGROUND OF THE INVENTION Conventional resin molded coils have several layers of glass fiber reinforced epoxy resin arranged around the inner circumference of the coil, with most of the inner circumference exposed, and the rest of the coil entirely molded with resin. The structure of the conventional molded coil thus obtained will be explained with reference to FIG. Reference numeral 8 denotes a glass fiber reinforced epoxy resin layer provided on the inner periphery of the coil. - For boat fishing, an amine-curing prepreg type material is used, and its curing is completed at the same time as the mold resin. Further, the resin content of the glass fiber reinforced epoxy resin is 40 to 50% by weight. 9 is an interlayer insulation material, which includes polyester film, polycarbonate film, polyphenylene sulfide film,
Kraft paper, polyester nonwoven fabric, etc. are used. 10
is a conductor, and in Fig. 2, it is a foil conductor, and aluminum foil (strip) or copper foil (strip) is used. Reference numeral 11 denotes a peripheral insulating material, which is made by winding several layers of interlayer insulating material, or is made of glass cloth, polyester nonwoven fabric, Nomex, glass fiber reinforced epoxy resin, or the like. 12 is a resin mold layer, and +3 is a terminal.
発明が解決しようとする課題
上記のような従来のモールドコイルは実用時、特に過負
荷時の温度上昇により、ガラス繊維強化エポキシ樹脂層
8と樹脂モールド層12の周面に剥離部が発生し電気絶
縁不良を起こして変圧器の破損に至ることがある。特に
その傾向はコーナー部以外に著しく発生する。Problems to be Solved by the Invention In the conventional molded coil as described above, during practical use, especially due to temperature rise during overload, peeling occurs on the circumferential surfaces of the glass fiber reinforced epoxy resin layer 8 and the resin molded layer 12, resulting in electrical failure. This may cause insulation failure and damage to the transformer. This tendency is especially noticeable in areas other than corner areas.
課題を解決するための手段
本発明は上記目的を達成するために、ガラス繊維強化エ
ポキシ樹脂よりなる矩形巻枠に巻線を施してコイル素体
を形成し、一体にモールドし、前記巻枠の内側コーナー
部に露出部を設け、露出部以外の全体を被覆するモール
ド樹脂層によって一体化して樹脂モールドコイルを構成
したものである。Means for Solving the Problems In order to achieve the above object, the present invention involves winding a rectangular winding frame made of glass fiber reinforced epoxy resin to form a coil body, integrally molding the winding frame, and An exposed portion is provided at the inner corner portion, and a resin molded coil is constructed by integrating the coil with a molded resin layer that covers the entire area other than the exposed portion.
作用
上記のようにモールドコイルの矩形内周材はコーナー部
のみが露出しているだけで、他の部分はモールドされで
いるので、トランス運転時の過信荷時における内周材と
樹脂モールド層の熱膨張係数の差異による熱応力に耐え
ることができ前記内周材と樹脂モールド層との界面でも
剥離が発生することがない。Function As mentioned above, only the corners of the rectangular inner peripheral material of the molded coil are exposed, and the other parts are molded, so the inner peripheral material and the resin molded layer will be damaged during overload during transformer operation. It can withstand thermal stress caused by a difference in coefficient of thermal expansion, and no peeling occurs at the interface between the inner peripheral material and the resin mold layer.
実施例
以下本発明の一実施例について第1図に従って説明する
。EXAMPLE An example of the present invention will be described below with reference to FIG.
1はガラス繊維強化エポキシ樹脂の内周材で、矩形巻枠
を形成し、プリプレグ状のエポキシ樹脂を40〜50重
量%含有したものを用いている。Reference numeral 1 denotes an inner peripheral material of glass fiber reinforced epoxy resin, which forms a rectangular winding frame and contains 40 to 50% by weight of prepreg-like epoxy resin.
2は層間絶縁材で、コイルが必要とする耐熱性能、絶縁
性能に応じてポリエステルフィルム、ポリ力フィルム、
ポリフェニレンサルファイドフィルム、クラフト紙、ポ
リエステル不織布、芳香族ボリアミド不織布等の中から
選択して使用される。3は箔状導体で、具体的な導体材
料としてはアルミニウムや銅が用いられる。又、導体は
箔状導体に限られず、導体として絶縁皮膜を形成したマ
グネットワイヤーを用いることもできるが、この場合は
層間絶縁材2が不要となる。4は外周絶縁層で層間絶縁
材2を数層巻回するか又はガラスクロスやポリエステル
不織布、ノーメックス、ガラス繊維強化エポキシ樹脂等
が用いられる。5はモールド樹脂層で、矩形巻枠に巻線
してなるコイル素体全体を被覆する。このモールド樹脂
層は、エポキシ樹脂主剤に硬化剤として、メチルテトラ
ヒドロ無水フタル酸(MeTIIPA) 、メヂルヘキ
サヒドロ無水フタル酸(MetlllPA) 、ヘキサ
ヒドロ無水フタル酸(uopA)等の酸無水物を用い、
さらにDMP−30等の3級アミンを反応促進剤として
、0.2〜0.5PNP混入し、さらに充填剤としてシ
リカ粉末等を50〜60PHR混入したものを用いる。2 is an interlayer insulation material, which can be polyester film, polyester film, or polyester film depending on the heat resistance and insulation performance required by the coil.
The material is selected from among polyphenylene sulfide film, kraft paper, polyester nonwoven fabric, aromatic polyamide nonwoven fabric, and the like. 3 is a foil-like conductor, and the specific conductor material used is aluminum or copper. Further, the conductor is not limited to a foil-like conductor, and a magnet wire coated with an insulating film may be used as the conductor, but in this case, the interlayer insulating material 2 is not required. Reference numeral 4 is an outer peripheral insulating layer, which is formed by winding several layers of interlayer insulating material 2, or is made of glass cloth, polyester nonwoven fabric, Nomex, glass fiber reinforced epoxy resin, or the like. Reference numeral 5 denotes a molded resin layer, which covers the entire coil body formed by winding a wire around a rectangular winding frame. This mold resin layer uses an epoxy resin as a main ingredient and an acid anhydride such as methyltetrahydrophthalic anhydride (MeTIIPA), methylhexahydrophthalic anhydride (MetllPA), or hexahydrophthalic anhydride (uopA) as a curing agent.
Further, tertiary amine such as DMP-30 is used as a reaction accelerator, 0.2 to 0.5 PNP is mixed therein, and silica powder or the like is mixed in 50 to 60 PHR as a filler.
樹脂モールド層はコイルが高圧下で使用される場合には
専ら真空注型がなされ、又、低い電圧−ドで使用される
場合は常圧注入等でモールドされる。6は内周材露出部
で、ガラス繊維強化エポキシ樹脂内周材lのコーナー部
がモールド樹脂5で覆わわずに露出している。この内周
材露出部6は樹脂モールドするときに内周部のコーナー
部に相当する位置を突出させた内型を用い、コーナー部
と内型とを接触し、又、乎坦部は前記内周材との間隙を
2〜3 m/m程度に保持し、その後外型と結合し樹脂
を注入硬化する。7は端子である。The resin mold layer is exclusively vacuum cast when the coil is used under high pressure, and is molded by normal pressure injection when used under low voltage. Reference numeral 6 denotes an exposed portion of the inner peripheral material, in which a corner portion of the glass fiber reinforced epoxy resin inner peripheral material 1 is exposed without being covered with the mold resin 5. When this inner peripheral material exposed portion 6 is molded with resin, an inner mold with protruding positions corresponding to the corner portions of the inner peripheral portion is used, and the corner portions and the inner mold are in contact with each other, and the rounded portions are formed in the inner mold. The gap with the surrounding material is maintained at about 2 to 3 m/m, and then it is combined with the outer mold and resin is injected and hardened. 7 is a terminal.
上記実施例ではガラス繊維強化エポキシ樹脂内周材とし
て作業性の良好なプリプレグ状エポキシ樹脂を用いてい
るが、これに限られない。又、前記樹脂含有量も40〜
50重量%としたが、これに限られず電気絶縁性能及び
力学特性への影響を考慮して適宜含有量も決めることが
できる。In the above embodiment, a prepreg-like epoxy resin with good workability is used as the glass fiber-reinforced epoxy resin inner peripheral material, but the material is not limited thereto. Moreover, the resin content is also 40~
Although the content is set at 50% by weight, the content is not limited to this and can be determined as appropriate in consideration of the influence on electrical insulation performance and mechanical properties.
発明の効果
上記のように本発明によるモールドコイルは内周材のi
V坦部に補強用の樹脂層を形成したので、このようなモ
ールドコイルを装着した変圧器は例え過負荷運転により
コイルの温度が上y7シても熱膨張係数の差異による熱
応力に耐えることができ、内周材とモールド樹脂との界
面から剥離が発生することがないので、絶縁信頼性が高
くなる。Effects of the Invention As described above, the molded coil according to the present invention has an i
Since a reinforcing resin layer is formed on the V flat part, a transformer equipped with such a molded coil can withstand thermal stress caused by differences in thermal expansion coefficients, even if the coil temperature rises due to overload operation. Since peeling does not occur at the interface between the inner peripheral material and the mold resin, insulation reliability is increased.
さらに内周材のコーナー部に露出部が形成されているの
でモールド樹脂の使用量が低減することができる等の効
果を有する。Furthermore, since the exposed portions are formed at the corner portions of the inner peripheral material, the amount of molding resin used can be reduced.
第1図は本発明に係る樹脂モールドコイルの一部切欠し
た概略斜視図、第2図は他実施例を示す一部切欠した概
略斜視図である。
l・・・エポキシ樹脂内周月 3・・・箔状導体5・
・・モールド樹脂
6・・・内周材露出部FIG. 1 is a partially cutaway schematic perspective view of a resin molded coil according to the present invention, and FIG. 2 is a partially cutaway schematic perspective view showing another embodiment. l...Epoxy resin inner circumference 3...Foil conductor 5.
...Mold resin 6...Inner peripheral material exposed part
Claims (1)
巻線を施してコイル素体を形成し、一体にモールドし、
前記巻枠の内側コーナー部に露出部を設け、露出部以外
の全体を被覆するモールド樹脂層によって一体化したこ
とを特徴とする樹脂モールドコイル。(1) A coil body is formed by winding a rectangular winding frame made of glass fiber reinforced epoxy resin, and the coil body is integrally molded.
A resin molded coil characterized in that an exposed portion is provided at an inner corner portion of the winding frame and is integrated with a molded resin layer that covers the entire area other than the exposed portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3472589A JPH02214102A (en) | 1989-02-14 | 1989-02-14 | Resin-molded coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3472589A JPH02214102A (en) | 1989-02-14 | 1989-02-14 | Resin-molded coil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02214102A true JPH02214102A (en) | 1990-08-27 |
Family
ID=12422296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3472589A Pending JPH02214102A (en) | 1989-02-14 | 1989-02-14 | Resin-molded coil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02214102A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100734420B1 (en) * | 2006-09-14 | 2007-07-03 | 삼성전자주식회사 | Refrigerator |
-
1989
- 1989-02-14 JP JP3472589A patent/JPH02214102A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100734420B1 (en) * | 2006-09-14 | 2007-07-03 | 삼성전자주식회사 | Refrigerator |
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