JPH02208005A - Manufacture of light particle board - Google Patents
Manufacture of light particle boardInfo
- Publication number
- JPH02208005A JPH02208005A JP2841589A JP2841589A JPH02208005A JP H02208005 A JPH02208005 A JP H02208005A JP 2841589 A JP2841589 A JP 2841589A JP 2841589 A JP2841589 A JP 2841589A JP H02208005 A JPH02208005 A JP H02208005A
- Authority
- JP
- Japan
- Prior art keywords
- particle board
- adhesive
- density
- light particle
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002245 particle Substances 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title claims description 15
- 239000000853 adhesive Substances 0.000 claims abstract description 25
- 230000001070 adhesive effect Effects 0.000 claims abstract description 25
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 238000004132 cross linking Methods 0.000 claims abstract description 10
- 239000012948 isocyanate Substances 0.000 claims abstract description 7
- 150000002513 isocyanates Chemical class 0.000 claims abstract description 6
- -1 polymethylene Polymers 0.000 claims description 16
- 239000002023 wood Substances 0.000 claims description 15
- 229920005862 polyol Polymers 0.000 claims description 14
- 150000003077 polyols Chemical class 0.000 claims description 14
- 229920001451 polypropylene glycol Polymers 0.000 claims description 11
- 239000005056 polyisocyanate Substances 0.000 claims description 5
- 229920001228 polyisocyanate Polymers 0.000 claims description 5
- 229920006389 polyphenyl polymer Polymers 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 21
- 229920000642 polymer Polymers 0.000 abstract 1
- 230000000704 physical effect Effects 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 7
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- 238000005452 bending Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 2
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 2
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- 239000004566 building material Substances 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 239000011120 plywood Substances 0.000 description 2
- 239000000600 sorbitol Substances 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 235000018185 Betula X alpestris Nutrition 0.000 description 1
- 235000018212 Betula X uliginosa Nutrition 0.000 description 1
- 241000218645 Cedrus Species 0.000 description 1
- 244000301850 Cupressus sempervirens Species 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 240000002871 Tectona grandis Species 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010902 straw Substances 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
- 235000013311 vegetables Nutrition 0.000 description 1
Landscapes
- Dry Formation Of Fiberboard And The Like (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、建築材料φ家具材料等に応用可能な軽量パー
ティクルボードの製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing lightweight particle board that can be applied to building materials, furniture materials, and the like.
（背景）
従来パーティクルボードは、安価であり、方向性がない
こと、木材資源の有効活用等の利点があり、建築材料や
家具材料として広く利用されている。(Background) Particleboard has been widely used as a building material and furniture material because it is inexpensive, has no directionality, and can effectively utilize wood resources.
しかしながら、通常のパーティクルボードは、合板と比
較した場合、必ずしも物性が良好とならず、また同一物
性を得るためには、重量が重くなる傾向にある。However, when compared with plywood, ordinary particle board does not necessarily have better physical properties, and in order to obtain the same physical properties, it tends to be heavier.
これに対し、発泡性樹脂接着剤を用いて軽量パーティク
ルボードを製造する方法として、特開昭５７−１８２４
２１号、特公昭６１−３６７８号、特開昭５７−１８５
１２０号、特開昭５７−１８５１３６号及び特開昭８２
−５９００４号等公報記載の方法が提案されている。On the other hand, as a method for manufacturing lightweight particle board using foamable resin adhesive, Japanese Patent Laid-Open No. 57-1824
No. 21, JP 61-3678, JP 57-185
No. 120, JP-A-57-185136 and JP-A-82
Methods described in publications such as No.-59004 have been proposed.
（従来技術の問題点）
特開昭５７−１８２４２１号及び特公昭６１−３６７８
号等の方法は、発泡性樹脂接着剤を用いて熱圧初期に高
圧圧締し、樹脂の硬化前に解圧させる方法である。(Problems with the prior art) JP-A-57-182421 and JP-A-61-3678
The method described in No. 1 is a method in which a foamable resin adhesive is used to perform high-pressure compression at the initial stage of hot pressing, and the pressure is released before the resin hardens.
この方法では、樹脂の硬化速度が、水分含有率の大小、
温度差、木質チップ基、木質チップに混在する不純物等
に左右され、得られたパーティクルボードの密度差のば
らつきが大きくなる。In this method, the curing speed of the resin depends on the moisture content.
The difference in density of the obtained particle board increases depending on the temperature difference, the wood chip base, impurities mixed in the wood chips, etc.
また特開昭５７−１８５１２０号等の方法は、フェノー
ル、ユリア、ウレタン系等の発泡性樹脂を使用する方法
である。The method disclosed in Japanese Patent Application Laid-Open No. 57-185120 uses a foamable resin such as phenol, urea, or urethane.
この方法では、曲げ性能、はく離強度、水中厚さｍａ率
等の一般物性が必ずしも良好でない。With this method, general physical properties such as bending performance, peel strength, underwater thickness ma ratio, etc. are not necessarily good.
また特開昭５７−１８５１３６号等の方法は。Furthermore, the method disclosed in Japanese Patent Application Laid-Open No. 57-185136 is as follows.
ウレタン系樹脂を接着剤にし、多量の水を予じめ含有さ
せる方法である。This method uses urethane resin as an adhesive and pre-contains a large amount of water.
この方法では、多量の水を含有すると、層がはく離し易
い、これは、末端ＮＧＯ基と水との反応で発生する炭酸
ガス及び多量の水が、熱圧締時に蒸気になり層間にたま
るか、又はボイド、エアポケット等がボード中に発生す
るか、更に末端ＮＧＯ基と水が反応してウレタン樹脂化
してしまう等、木材チップの接着に寄与しないためであ
る。In this method, if a large amount of water is contained, the layers tend to separate. This is because carbon dioxide gas generated by the reaction between the terminal NGO group and water and a large amount of water become steam during thermal compaction and accumulate between the layers. Otherwise, voids, air pockets, etc. are generated in the board, or the terminal NGO group and water react to form a urethane resin, which does not contribute to the adhesion of wood chips.
また、特開昭８２−５９００４号等の方法は、芯材とし
て親水性に富むポリオールとイソシアネート化合物を反
応して得られる末端ＮＣＯ基含有プレポリマーを使用す
る方法である。Furthermore, the method disclosed in JP-A No. 82-59004 uses a prepolymer containing a terminal NCO group obtained by reacting a highly hydrophilic polyol with an isocyanate compound as a core material.
この方法では、親水性ポリオールに基因するところの水
中浸漬１１潤率が大きく、耐水性が悪い等の欠点がある
。This method has drawbacks such as a high water immersion rate due to the hydrophilic polyol and poor water resistance.
以上のような公知方法では、軽量ボードが得られるもの
の、安定した製造、安定した物性が得られず、合板と比
較して物性が顕著に悪いものであった。Although the above-mentioned known methods can produce lightweight boards, stable manufacturing and stable physical properties cannot be obtained, and the physical properties are significantly worse than that of plywood.
そこで本発明は、通常のパーティクルボードの製造設備
を用いて、通常の方法で軽量パーティクルボードを製造
由来、しかも得られたパーティクルボードの物性が軽量
にもかかわらず向上した、軽量パーティクルボードの製
造法を提供することを課題とするものである。Therefore, the present invention provides a method for manufacturing lightweight particle board that uses ordinary particle board manufacturing equipment to manufacture lightweight particle board in a conventional manner, and that improves the physical properties of the resulting particle board despite its light weight. The goal is to provide the following.
本発明の軽量パーティクルボードの製造方法は、木質チ
ップを接着剤で接着して軽量パーティクルボードを製造
するにおいて、
該接着剤として
■架橋密度が０．０５〜３．００であるポリメチレンポ
リフェニルポリイソシアネート、又は
■数平均分子量が５０〜ｔｏ、０００のポリオキシプロ
ピレンポリオールと過剰のポリメチレンポリフェニルポ
リイソシアネットを反応させてなる架橋密度が０．０５
〜３．００であるウレタンプレポリマー
を、全体のイソシアネート含量が０．５〜５．０％にな
るよう配合すること。The method for manufacturing a lightweight particle board of the present invention is to manufacture a lightweight particle board by bonding wood chips with an adhesive, and as the adhesive: Isocyanate, or ■ a polyoxypropylene polyol with a number average molecular weight of 50 to 000, and an excess of polymethylene polyphenyl polyisocyanate having a crosslinking density of 0.05.
~3.00% is blended with a total isocyanate content of 0.5% to 5.0%.
並びに
該軽量パーティクルボードとして、その密度が０．１〜
０．６ｇ／ｃで３であることｔ−要旨とするものである
。In addition, as the lightweight particle board, its density is 0.1~
It is t-gist that it is 3 at 0.6 g/c.
本発明の木質チップは、通常パーティクルボードの製造
に使用される杉、松、檜、樺、ラワン。The wood chips of the present invention are cedar, pine, cypress, birch, and lauan, which are commonly used in the production of particle board.
チーク等の木材屑、細片をはじめ、樹皮、ワラ。Wood chips such as teak, small pieces, bark, and straw.
トウモロコシの茎、モミガラ、パルプ等の植物質小片等
である。These include small pieces of vegetable matter such as corn stalks, rice hulls, and pulp.
また、これらは使用直前の含水率が１〜２０％であるこ
とが好ましい。Moreover, it is preferable that the moisture content of these immediately before use is 1 to 20%.
次に本発明の接着剤は、ポリメチレンポリフェニルポリ
イソシアネート（以下、ポリメリックＭＤＩという）単
独、又はポリオキシプロピレンポリオールと過剰のポリ
メチレンポリフェニルポリイソシアネートを反応させて
得たウレタンプレポリマー等である。Next, the adhesive of the present invention is polymethylene polyphenyl polyisocyanate (hereinafter referred to as polymeric MDI) alone, or a urethane prepolymer obtained by reacting polyoxypropylene polyol with an excess of polymethylene polyphenyl polyisocyanate. .
ポリメリックＭＤＩとしては、７ニリンとホルマリンの
縮合物をホスゲン化して得られる粗製のジフェニルメタ
ンジイソシアネート（Ｃ−ＭＤ■）等が挙げられる。Examples of polymeric MDI include crude diphenylmethane diisocyanate (C-MD) obtained by phosgenating a condensate of 7-niline and formalin.
ウレタンプレポリマーに使用するポリオキシプロピレン
ポリオールとしては、グリセリン、トリメチロールプロ
パン、ペンタエリスリトール、ソルビトール、シュガー
等にプロピレンオキシドを付加反応させて得られる数平
均分子量が５０〜１ｏ 、ｏｏｏの多官能ポリオール等
が挙げられる。Polyoxypropylene polyols used in the urethane prepolymer include polyfunctional polyols with a number average molecular weight of 50 to 1o, ooo obtained by addition-reacting propylene oxide to glycerin, trimethylolpropane, pentaerythritol, sorbitol, sugar, etc. can be mentioned.
前記ポリオキシプロピレンポリオールと反応させるポリ
メリックＭＤＩとしては、前記ポリメリックＭＤＩが挙
げられ、その反応比は、ポリオキシプロピレンポリオー
ルより過剰量反応させるものである。Examples of the polymeric MDI to be reacted with the polyoxypropylene polyol include the aforementioned polymeric MDI, and the reaction ratio is such that the reaction is performed in an excess amount compared to the polyoxypropylene polyol.
尚、ウレタンプレポリマーは、前記の如く、ポリオキシ
プロピレンポリオールとポリメリックＭＤＩを予め反応
させて末端ＮＣＯ含有プレポリマーとして木質チップに
ブレンドするか。The urethane prepolymer may be prepared by reacting polyoxypropylene polyol and polymeric MDI in advance and blending it into the wood chips as a terminal NCO-containing prepolymer, as described above.
又は未反応の両者を使用直前にプレミックスし、さらに
木質チップとブレンドするか、いずれの方法でも良い。Alternatively, the unreacted two may be premixed immediately before use and further blended with wood chips.
プレミックスする方法は、混合物の粘度が低いた非常に
有用である。The premixing method is very useful because the viscosity of the mixture is low.
本発明の接着剤である。ポリメリックＭＤＩ、又はポリ
オキシプロピレンポリオールと過剰量のポリメリックＭ
ＤＩを反応させて得たウレタンプレポリマーは、いずれ
も架橋密度が０．０５〜３．００であることが必要であ
る。It is an adhesive of the present invention. Polymeric MDI or polyoxypropylene polyol and an excess amount of Polymeric M
All urethane prepolymers obtained by reacting DI must have a crosslink density of 0.05 to 3.00.
この架橋密度とは１分子量Ｎ Ｗ ＊ 、官能基数Ｆ鼠
のポリメリックＭ Ｄ Ｉ Ｗ ｉ Ｋと１分子量ＮＷ
虚、官能基数Ｆ２のポリオキシプロピレンポリオールＷ
ｔＫとを反応又は併用して得られるポリウレタン樹脂１
０００原子量あたりの架橋密度（ＣＤ）であり、次式よ
り計算されるものである。This crosslink density is 1 molecular weight N W *, polymeric M DI W i K with functional group number F, and 1 molecular weight N W
Imaginary, polyoxypropylene polyol W with functional group number F2
Polyurethane resin 1 obtained by reaction or combination with tK
It is the crosslink density (CD) per 000 atomic weight, and is calculated from the following formula.
尚、ポリオキシプロピレンポリオールを使用しない場合
は、それに係る個所をｒＯＪ として計算する。In addition, when polyoxypropylene polyol is not used, the portion related to it is calculated as rOJ.
架橋密度が０．０５以下の接着剤では曲げ性能、はく離
強度、湿潤強度が悪い、また架橋密度が３．００以上で
はボードがモロクなる。Adhesives with a crosslinking density of 0.05 or less have poor bending performance, peel strength, and wet strength, and adhesives with a crosslinking density of 3.00 or more cause the board to become dull.
木質チップに配合する接着剤の配合割合＼は、系全体の
イソシアネート含量が０．５〜５．０％。The blending ratio of the adhesive added to the wood chips is such that the isocyanate content of the entire system is 0.5 to 5.0%.
好ましくは０．７〜３．０％となるよう配合するもので
ある。The content is preferably 0.7 to 3.0%.
系全体のイソシアネート含量が０．５％以下では、はく
離強度、湿潤強度等が弱い。When the isocyanate content of the entire system is 0.5% or less, peel strength, wet strength, etc. are weak.
また５、０％以上では、ボードの単価が高くなるのみな
らず、木質感が失なわれる。Moreover, if it exceeds 5.0%, not only will the unit price of the board become high, but the woody feel will be lost.
次に本発明軽量パーティクルボードを製造するには、最
初に、木質チップと必要に応じ溶剤で希釈した又はエマ
ルジョン形態とした接着剤を、タンブラ−またはブレン
ダー装置を用いて混合またはスプレーする。Next, in order to manufacture the lightweight particle board of the present invention, wood chips and an adhesive optionally diluted with a solvent or in the form of an emulsion are first mixed or sprayed using a tumbler or blender device.
次に、この混合物をマット状に成形し、熱盤を用いて温
度８０〜１８０℃、好ましくは１２０〜１６０℃で、圧
力５〜３０ Ｋ ｇ ／ ＣＩｎ ”好ましくは１０〜
２０Ｋｇ／ｃｍ”で圧締し、次に解圧し、軽量パーティ
クルボードを得るものである。Next, this mixture is formed into a mat shape, and heated using a hot platen at a temperature of 80 to 180°C, preferably 120 to 160°C, and a pressure of 5 to 30 Kg/CIn'', preferably 10 to 160°C.
The material is compressed at 20 kg/cm" and then decompressed to obtain a lightweight particle board.
得られる軽量パーティクルボードは、密度が０゜１〜０
．６ｇ／ｃｍ”である、密度の調整は、木質チップの密
度及び仕込量で、適宜調整されるものである。The resulting lightweight particle board has a density of 0°1 to 0.
．． The density, which is 6 g/cm'', is adjusted as appropriate by adjusting the density of the wood chips and the amount of the wood chips.
本発明め軽量パーティクルボードの製造方法は、原料に
使用する木質チップの含水率が２０％以下であれば自由
に選択でき、調湿する作業が非常に楽である。また接着
剤が硬化する前に解圧するというたような複雑な操作を
必要としない。In the method for manufacturing lightweight particleboard of the present invention, the moisture content of wood chips used as raw materials can be freely selected as long as it is 20% or less, and the work of controlling humidity is very easy. Further, there is no need for complicated operations such as releasing the pressure before the adhesive hardens.
さらに得られる軽量ボードは、従来のパーティクルボー
ドと比較し、低密度で、しかもはく酸強度１曲げ強度、
耐本性等め物性が優れている。Furthermore, the resulting lightweight board has a lower density than conventional particle boards, and has a bending strength of 1
It has excellent physical properties such as book resistance.
以下、実施例により１本発明の態様及び効果を説明する
。Hereinafter, aspects and effects of the present invention will be explained with reference to Examples.
尚、実施例中、１部１及び１％」は重量を基準とするも
のである。In the Examples, "1 part 1" and "1%" are based on weight.
実施例１゜
気乾状態に調湿されたラワンパーティクル１００部（比
重０．４．厚さ０．５ｍｍ）をロータリードラムブレン
グー中に入れ回転しながら接着剤として架橋密度０．９
７のＣ−ＭＤＩ （フリーＮＣ０３１％）８部を噴霧し
た。Example 1 100 parts of air-dried lauan particles (specific gravity 0.4, thickness 0.5 mm) were placed in a rotary drum blender and rotated to form an adhesive with a crosslinking density of 0.9.
8 parts of C-MDI 7 (free NC031%) was sprayed.
処理したチップをマット形成した後１６０℃、１３ Ｋ
ｇ ／ ｃ ｒｎ’で５分間熱圧締した。After forming the treated chip into a mat, it was heated at 160°C and 13K.
g/crn' for 5 minutes.
得られたボードは４００Ｘ３５０Ｘ１２ｍｍの寸法であ
り、密度は０．４ｇ／ａｍ″であった。このボードをＪ
ＩＳ Ａ３９０８に準じて物性試験をした。The resulting board had dimensions of 400 x 350 x 12 mm and a density of 0.4 g/am''.
Physical property tests were conducted according to IS A3908.
実施例２゜
接着剤として架橋密度２．７８のＣ−ＭＤＩ（フリーＮ
ＧＯ３１％）を用いて、実施例１と同様にボードを得た
。Example 2 C-MDI (free N) with a crosslink density of 2.78 was used as an adhesive.
A board was obtained in the same manner as in Example 1 using GO31%).
実施例３゜
接着剤としてソルビトールのプロピレンオキシド付加物
（分子量１５００）とＣ−ＭＤＩ （フリーＮＣ０３１
％）を直前に混合して、実施例１と同様にボードを得た
。Example 3゜ Sorbitol propylene oxide adduct (molecular weight 1500) and C-MDI (free NC031) were used as adhesives.
%) was mixed immediately beforehand to obtain a board in the same manner as in Example 1.
実施例４゜
接着剤としてペンタエリスリトールのプロピレンオキシ
ド付加物（分子量４７００）３１．７部とＣ−ＭＤＩ
６８．３部から得られたウレタンプレポリマー（フリ
ーＮＣ０２０％）を用いて実施例１と同様にボードを得
た。Example 4 31.7 parts of propylene oxide adduct of pentaerythritol (molecular weight 4700) and C-MDI as adhesive
A board was obtained in the same manner as in Example 1 using the urethane prepolymer (20% free NC) obtained from 68.3 parts.
実施例５゜
接着剤としてグリセリンのプロピレンオキシド付加物（
分子量３０００）６９部とＣ−ＭＤＩ３１部から得られ
たウレタンプレポリマー（フリーＮＣ０１０％）を用い
て、実施例１と同様にボードを得た。Example 5 Propylene oxide adduct of glycerin (
A board was obtained in the same manner as in Example 1 using a urethane prepolymer (10% free NC) obtained from 69 parts (molecular weight 3000) and 31 parts C-MDI.
実施例６゜
接着剤として架橋密度０．４０のＣ−ＭＤＩ（フリーＮ
Ｃ０３１％）を用いて、実施例１と同様にボードを得た
。Example 6 C-MDI (free N) with a crosslink density of 0.40 was used as an adhesive.
A board was obtained in the same manner as in Example 1 using C031%).
比較例１゜
接着剤としてポリオキシプロピレングリコール（分子量
２０００）１７部とＣ−ＭＤＩ ６３部から得られた
ウレタンプレポリマー（架橋密度０．０４４、フリーＮ
ＣＯ２５％）を用いて。Comparative Example 1 As an adhesive, a urethane prepolymer (crosslinking density 0.044, free N
CO25%).
実施例１と同様にボードを得た。A board was obtained in the same manner as in Example 1.
比較例２゜
接着剤としてポリオキシプロピレングリコール（分子量
２０００）５３．８部とトリレンジイソシアネート（Ｔ
ＤＩ−８０）４６．２部から得られたウレタンプレポリ
マー（架橋密度０．フリーＮＣＯ２０％）を用いて、実
施例１と同様にボードを得た。Comparative Example 2 53.8 parts of polyoxypropylene glycol (molecular weight 2000) and tolylene diisocyanate (T
A board was obtained in the same manner as in Example 1 using a urethane prepolymer (crosslinking density: 0, free NCO: 20%) obtained from 46.2 parts of DI-80).
比較例３゜
接着剤としてジプロピレングリコールのエチレンオキシ
ド・プロピレンオキシド付加物（親水性ポリオール、エ
チレンオキシド５０％含有）１７部とＣ−ＭＤＩ ６
３部から得られたウレタンプレポリマー（架橋密度０．
１５４、フリーＮＣＯ２５！６）を用いて、実施例１と
同様にボードを得た。Comparative Example 3: 17 parts of ethylene oxide/propylene oxide adduct of dipropylene glycol (hydrophilic polyol, containing 50% ethylene oxide) and C-MDI 6 as an adhesive
Urethane prepolymer obtained from 3 parts (crosslink density 0.
154, Free NCO25!6), a board was obtained in the same manner as in Example 1.
比較例４゜
接着剤としてジプロピレングリコール（分子量２．００
０）７３．８部とＣ−ＭＤＩ ２６．４部から得られ
たウレタンプレポリマー（架橋密度０．４０．７１）−
ＮＣ０５％）を用１＋％て、実施例１と同様にしたが、
１６０℃、１３ Ｋ ｇ ／ ｃ ｒｎ’で２分後接着
剤が硬化する前に解圧した。Comparative Example 4゜ Dipropylene glycol (molecular weight 2.00
0) Urethane prepolymer obtained from 73.8 parts and 26.4 parts of C-MDI (crosslink density 0.40.71) -
The same procedure as in Example 1 was carried out using 1+% of NC05%), but
After 2 minutes at 160°C and 13 Kg/crn', the pressure was released before the adhesive had hardened.
これらの結果を表−１に示す。These results are shown in Table-1.
本発明の装造方法によれば、通常のパーティクルボード
の製造膜−を用いて、かつ通常の方法で軽量パーティク
ルボードが製造出来、しかも得られる軽量パーティクル
ボードは、従来のパーティクルボードと比較し、低密度
で、かつはく離強度１曲げ強度、耐水性等の物性に優れ
ている。According to the mounting method of the present invention, a lightweight particle board can be manufactured using a conventional particle board manufacturing film and by a conventional method, and the resulting lightweight particle board is, in comparison with a conventional particle board, It has low density and excellent physical properties such as peel strength, bending strength, and water resistance.
Claims (1)
を製造するにおいて、 該接着剤として （ａ）架橋密度が０．０５〜３．００であるポリメチレ
ンポリフェニルポリイソシアネ ート、又は （ｂ）数平均分子量が５０〜１０，０００のポリオキシ
プロピレンポリオールと過剰のポリ メチレンポリフェニルポリイソシアネート を反応させてなる架橋密度が０．０５〜 ３．００であるウレタンプレポリマー を、全体のイソシアネート含量が０．５〜 ５．０％になるよう配合すること、 並びに 該軽量パーティクルボードとして、その密度が０．１〜
０．６ｇ／ｃｍ＾３であること を特徴とする軽量パーティクルボードの製造方法。[Claims] In manufacturing a lightweight particle board by bonding wood chips with an adhesive, the adhesive includes (a) polymethylene polyphenyl polyisocyanate having a crosslinking density of 0.05 to 3.00, or (b) A urethane prepolymer having a crosslinking density of 0.05 to 3.00 obtained by reacting a polyoxypropylene polyol with a number average molecular weight of 50 to 10,000 and an excess of polymethylene polyphenyl polyisocyanate, The isocyanate content should be 0.5 to 5.0%, and the lightweight particle board should have a density of 0.1 to 5.0%.
A method for producing lightweight particle board characterized by having a particle thickness of 0.6 g/cm^3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2841589A JPH02208005A (en) | 1989-02-07 | 1989-02-07 | Manufacture of light particle board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2841589A JPH02208005A (en) | 1989-02-07 | 1989-02-07 | Manufacture of light particle board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02208005A true JPH02208005A (en) | 1990-08-17 |
Family
ID=12248022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2841589A Pending JPH02208005A (en) | 1989-02-07 | 1989-02-07 | Manufacture of light particle board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02208005A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071248B2 (en) | 2003-01-21 | 2006-07-04 | Ashland Licensing And Intellectual Property, Llc | Adhesive additives and adhesive compositions containing an adhesive additive |
| JP2012067242A (en) * | 2010-09-27 | 2012-04-05 | Eidai Co Ltd | Two-part adhesive for woody board, method for producing woody board, and lightweight particle board |
-
1989
- 1989-02-07 JP JP2841589A patent/JPH02208005A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7071248B2 (en) | 2003-01-21 | 2006-07-04 | Ashland Licensing And Intellectual Property, Llc | Adhesive additives and adhesive compositions containing an adhesive additive |
| JP2012067242A (en) * | 2010-09-27 | 2012-04-05 | Eidai Co Ltd | Two-part adhesive for woody board, method for producing woody board, and lightweight particle board |
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