JPH02205006A - Metallized film capacitor - Google Patents
Metallized film capacitorInfo
- Publication number
- JPH02205006A JPH02205006A JP2550489A JP2550489A JPH02205006A JP H02205006 A JPH02205006 A JP H02205006A JP 2550489 A JP2550489 A JP 2550489A JP 2550489 A JP2550489 A JP 2550489A JP H02205006 A JPH02205006 A JP H02205006A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- film
- pei
- capacitor
- pet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 46
- 239000011104 metalized film Substances 0.000 title claims abstract description 21
- 239000010408 film Substances 0.000 claims abstract description 56
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 229920001577 copolymer Polymers 0.000 claims abstract description 8
- 229920002799 BoPET Polymers 0.000 claims abstract description 6
- LZFNKJKBRGFWDU-UHFFFAOYSA-N 3,6-dioxabicyclo[6.3.1]dodeca-1(12),8,10-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=CC1=C2 LZFNKJKBRGFWDU-UHFFFAOYSA-N 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 13
- LLLVZDVNHNWSDS-UHFFFAOYSA-N 4-methylidene-3,5-dioxabicyclo[5.2.2]undeca-1(9),7,10-triene-2,6-dione Chemical compound C1(C2=CC=C(C(=O)OC(=C)O1)C=C2)=O LLLVZDVNHNWSDS-UHFFFAOYSA-N 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 abstract description 16
- 230000002950 deficient Effects 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 7
- 230000015556 catabolic process Effects 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 26
- 239000005020 polyethylene terephthalate Substances 0.000 description 13
- 238000002844 melting Methods 0.000 description 8
- 230000008018 melting Effects 0.000 description 8
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000008188 pellet Substances 0.000 description 4
- 230000003746 surface roughness Effects 0.000 description 4
- 239000004698 Polyethylene Substances 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- PAALZGOZEUHCET-UHFFFAOYSA-N 1,4-dioxecane-5,10-dione Chemical compound O=C1CCCCC(=O)OCCO1 PAALZGOZEUHCET-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- 241000220317 Rosa Species 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000011140 metalized polyester Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 235000008113 selfheal Nutrition 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/145—Organic dielectrics vapour deposited
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は、電子機器、情報機器等に使用する金属化フィ
ルムコンデンサに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metallized film capacitor used in electronic equipment, information equipment, and the like.
[従来の技術]
従来、ポリエチレンテレフタレートの二軸配向フィルム
を誘電体とし、その表面に形成されたアルミニウムを主
成分とする蒸着薄膜を主電極とするコンデンサが、金属
化ポリエステルフィルムコンデンサとして広く用いられ
ている。しかしこのタイプのコンデンサには、高温高湿
下で長時間使用した場合、雰囲気中の酸素および水分に
よって金属薄膜からなる電極が酸化され導電性を失いそ
のためにコンデンサとしての機能を損なう(耐湿性に劣
る)という欠点があった。[Prior Art] Conventionally, capacitors in which a biaxially oriented polyethylene terephthalate film is used as a dielectric and a vapor-deposited thin film mainly composed of aluminum formed on the surface of the dielectric are used as metallized polyester film capacitors. ing. However, when this type of capacitor is used for a long time under high temperature and high humidity, the electrodes made of thin metal films are oxidized by oxygen and moisture in the atmosphere and lose their conductivity, which impairs their function as a capacitor (humidity resistance It had the disadvantage of being inferior.
かかる欠点を改良するために、従来、コンデンサ素子へ
の水分の侵入を防ぐ目的で外装を強化することが特開昭
62−190827号公報などにおいて提案されている
。In order to improve this drawback, Japanese Patent Laid-Open No. 62-190827 and other publications have proposed strengthening the exterior for the purpose of preventing moisture from entering the capacitor element.
[発明が解決しようとする課題]
しかしながら、一方でコンデンサの小型化への要求も強
く、上記の従来技術はこれに逆行し、小型化の要求に伴
う簡易な外装と耐湿性の確保とは、従来相客れないもの
であった。[Problem to be solved by the invention] However, on the other hand, there is also a strong demand for miniaturization of capacitors, and the above-mentioned conventional technology goes against this demand. This was something that was not traditionally available to customers.
本発明は、かかる問題点を解決し、従来よりも簡易な外
装でも耐湿性に優れた金属化フィルムコンデンサを提供
することを目的とする。An object of the present invention is to solve these problems and provide a metallized film capacitor that has superior moisture resistance even with a simpler exterior than conventional capacitors.
[課題を解決するための手段]
本発明は、上記目的を解決するために、ポリエチレンテ
レフタレートの二軸配向フィルムの少なくとも片面に、
エチレンイソフタレート単位を10〜25モル%の範囲
で共重合したエチレンテレフタレート・エチレンイソフ
タレート共重合体からなる層(PEI層)を設けた積層
フィルムを主たる誘電体とし、該PE1層上に表面抵抗
値が0゜5〜5Ω/□の金属膜層を電極として設けてな
ることを特徴とする金属化フィルムコンデンサをその骨
子とするものである。[Means for Solving the Problems] In order to solve the above objects, the present invention provides at least one side of a biaxially oriented film of polyethylene terephthalate,
The main dielectric is a laminated film with a layer (PEI layer) made of ethylene terephthalate/ethylene isophthalate copolymer copolymerized with ethylene isophthalate units in a range of 10 to 25 mol%, and a surface resistance layer is formed on the PE layer. The main feature of the capacitor is a metallized film capacitor characterized by having a metal film layer having a value of 0°5 to 5Ω/□ as an electrode.
本発明におけるポリエチレンテレフタレート(以″FP
ETと略称する)とは、エチレンテレフタレート単位が
90モル%以上を占めているものである。言いかえれば
、10モル%を超えない範囲で他の分子単位、例えばエ
チレンアジペート、アルキレングリコールなどが共重合
されていてもよい。このPET中には、公知の添加剤、
例えば無機微粒子、着色防止剤などが添加されていても
よい。□本発明のPETの二軸配向フィルムとは、上記
PETを製膜し二軸方向に延伸して配向せしめたもので
ある。Polyethylene terephthalate (hereinafter referred to as "FP") in the present invention
(abbreviated as ET) is one in which ethylene terephthalate units account for 90 mol% or more. In other words, other molecular units such as ethylene adipate, alkylene glycol, etc. may be copolymerized within a range not exceeding 10 mol%. This PET contains known additives,
For example, inorganic fine particles, anti-coloring agents, etc. may be added. □The biaxially oriented PET film of the present invention is obtained by forming the above-mentioned PET into a film and stretching it in biaxial directions to orient it.
本発明のエチレンテレフタレート・エチレンイソフタレ
ート共重合体とは、エチレンイソフタレート単位を10
モル%以上、好ましくは12モル%以上からなる共重合
体であり、この値より小さいとコンデンサにした時の耐
湿性能に関する効果が小さい。また、エチレンイソフタ
レート単位が25モル%以下であることが必要で、二の
値より大きくなるとコンデンサにした時の絶縁破壊の不
良率が増加する。このエチレンテレフタレート・エチレ
ンイソフタレート共重合体(以下PEIと略称する)中
には、公知の燃加剤、例えば無機微粒子、着色防止剤な
どが添加されていてもよい。The ethylene terephthalate/ethylene isophthalate copolymer of the present invention has 10 ethylene isophthalate units.
It is a copolymer consisting of mol % or more, preferably 12 mol % or more, and if it is smaller than this value, the effect on moisture resistance when used in a capacitor is small. Further, it is necessary that the ethylene isophthalate unit content is 25 mol % or less, and if it exceeds the second value, the defective rate due to dielectric breakdown will increase when used as a capacitor. This ethylene terephthalate/ethylene isophthalate copolymer (hereinafter abbreviated as PEI) may contain a known refueling agent such as inorganic fine particles, color inhibitor, etc.
また、二軸方向に配向せしめてもよい。Alternatively, it may be oriented in biaxial directions.
該PEIの融点は、好ましくは190℃以上、より好ま
しくは200℃以上である。なお、本発明のPEI層の
平均表面粗さは、好ましくは0゜01〜0.10μm1
より好ましくは0.02〜0.07μmである。また、
PEI中の前記無機微粒子は、平均粒径0.1〜0.6
μmの大きさの粒子が0.05〜0. 5%含有されて
いるのが好ましい。The melting point of the PEI is preferably 190°C or higher, more preferably 200°C or higher. The average surface roughness of the PEI layer of the present invention is preferably 0°01 to 0.10 μm1.
More preferably, it is 0.02 to 0.07 μm. Also,
The inorganic fine particles in PEI have an average particle size of 0.1 to 0.6.
Particles with a size of μm range from 0.05 to 0. The content is preferably 5%.
本発明は、上記PETフィルムの少なくとも片面にPE
Iフィルムを積層した積層フィルムであり、PET層と
片側のPEI層の厚みの比は、0.01≦PEI層/P
ET層≦0.4であることが好ましい。この範囲より小
さいと耐湿効果が小さく、この範囲より大きいと絶縁破
壊電圧が低下する。The present invention provides PE on at least one side of the PET film.
It is a laminated film made by laminating I films, and the ratio of the thickness of the PET layer to the PEI layer on one side is 0.01≦PEI layer/P
It is preferable that the ET layer≦0.4. If it is smaller than this range, the moisture resistance effect will be small, and if it is larger than this range, the dielectric breakdown voltage will decrease.
本発明は積層フィルムのPEIからなる層上に金属膜層
が設けられていることが必要である。該金属膜層は、耐
湿性、付着力の点でアルミニウムを主成分とするものが
好ましく、アルミニウムの性質を損なわない範囲内で少
量の亜鉛、銅などの金属が付着していてもよい。ここで
、アルミニウムを主成分とするとはアルミニウムの層が
100A以上であることをいう。The present invention requires that a metal film layer be provided on the PEI layer of the laminated film. The metal film layer preferably contains aluminum as a main component in terms of moisture resistance and adhesive strength, and a small amount of metal such as zinc or copper may be attached within a range that does not impair the properties of aluminum. Here, the term "aluminum is the main component" means that the aluminum layer has a thickness of 100A or more.
本発明の金属膜層の表面抵抗値は、0.′5〜5Ω/□
であり、好ましくは1〜4Ω/ロセあ・る。The surface resistance value of the metal film layer of the present invention is 0. '5~5Ω/□
and preferably 1 to 4Ω/Rose.
この範囲より大きいと、金属膜の′膜厚が小さく耐湿効
果が出にくく、逆に、この範囲より小さいと金属膜の膜
厚が厚すぎてセルフヒールが効きにくく好ましくない。If it is larger than this range, the thickness of the metal film will be too small and it will be difficult to produce a moisture-resistant effect.On the other hand, if it is smaller than this range, the thickness of the metal film will be too thick and self-heal will not be effective easily, which is undesirable.
本発明の金属化フィルムコンデンサとは、上記金属膜層
を電極とし、積層フィルムを主たる・誘電体とし、′巻
回または積層して、熱プレス、メタリコン、切断、電圧
処理したものである。金゛員膜′層上に別の誘電体、例
えばPETフィルムなどを重ね合わせて金属化フィルム
コンデンサをつくってもよいことは勿論である。又、ア
ルミニウム箔をはさみこんで該箔をもう一方の電極とす
る巻回型コンデンサをつくってもよい。The metallized film capacitor of the present invention is one in which the metal film layer is used as an electrode, the laminated film is used as the main dielectric material, the capacitor is wound or laminated, and then subjected to heat pressing, metallization, cutting, and voltage treatment. Of course, a metallized film capacitor may be formed by overlaying another dielectric material, such as a PET film, on the gold film layer. Alternatively, a wound capacitor may be made by sandwiching an aluminum foil and using the foil as the other electrode.
次に本発明の金属化フィルムコンデンサの製造方法につ
いて説明する。Next, a method for manufacturing the metallized film capacitor of the present invention will be explained.
積層フィルムの製法は、共押・出し、押出、しラミネー
ト、コーティングなどいずれでもよいが、共押出しが好
ましい。PETおよびPEIのペレットを各々別の押出
機に供給して270〜300℃で溶融押出しし、各々の
溶融体をT型口金の中で合流せしめてPET/PEIの
2層からなるシートをつくる。このシートを80〜10
0’Cで長手方向に3〜4倍延伸し、−旦冷却した後、
80〜110℃で軸方向に3〜4倍延伸する。延伸後、
フィルムを熱固定することが好ましいが、これは通常1
60℃ないし240℃、好ましくは180℃ないし23
0℃の温度下で通常1ないし20秒間行なわれる。積層
フィルムの厚みは0,5〜25μmが好ましい。熱固定
した積層フィルムを室温まで冷却しPEI層表面に10
−2〜1O−6T。The laminated film may be manufactured by any method such as coextrusion/extrusion, extrusion, lamination, coating, etc., but coextrusion is preferred. The PET and PEI pellets are each fed into separate extruders and melt extruded at 270-300°C, and the respective melts are combined in a T-shaped nozzle to form a two-layer PET/PEI sheet. This sheet is 80-10
After stretching 3 to 4 times in the longitudinal direction at 0'C and cooling once,
Stretch 3 to 4 times in the axial direction at 80 to 110°C. After stretching,
It is preferred to heat set the film, which is usually 1
60°C to 240°C, preferably 180°C to 23°C
It is usually carried out for 1 to 20 seconds at a temperature of 0°C. The thickness of the laminated film is preferably 0.5 to 25 μm. The heat-set laminated film is cooled to room temperature and 10% is applied to the surface of the PEI layer.
-2 to 1O-6T.
rrの圧力で電極となるべき金属をフィルム全面に、あ
るいはテープなどでマージンをとりながら0.5〜5Ω
/□の厚みで真空蒸着する。こうしてできた蒸着フィル
ムは、全面蒸着されたものはレーザ光線などでマージン
部をつくり、マイクロスリットされる。マイクロスリッ
トされたフィルムは、巻回あるいは積層され、コンデン
サ素子にし、公知の方法で熱プレス、メタリコン、電圧
処理され、金属化フィルムコンデンサになる。この金属
化フィルムコンデンサは場合に応じてリード線材され、
熱硬化性樹脂による外装を施されて製品になる。At a pressure of rr, apply the metal that will become the electrode to the entire surface of the film, or with a margin of 0.5 to 5 Ω using tape.
Vacuum evaporate to a thickness of /□. In the thus-formed vapor-deposited film, if the entire surface is vapor-deposited, a margin portion is created using a laser beam or the like, and microslits are performed. The microslit films are rolled or laminated into capacitor elements and heat pressed, metallized, and voltage treated by known methods to form metallized film capacitors. This metallized film capacitor is optionally lead wired,
The product is finished with a thermosetting resin exterior.
[発明の効果]
本発明は、PET/PEIめ積層フィルムのPEI層上
に特定の表面抵抗値となるように金属蒸着を行ないコン
デンサを作成したため、蒸着膜の付着、蒸着膜の配向、
蒸着膜の成長状態が単にPET層に蒸着する場合とは異
なり、緻密になったものと推定される。このため、蒸着
膜の付着力が向上し、静電容量変化率が減少したものと
思われる。また、コンデンサにした時に問題になる絶縁
破壊の不良率も小さいという利点がある。[Effects of the Invention] The present invention creates a capacitor by vapor depositing a metal on the PEI layer of a PET/PEI laminated film to have a specific surface resistance value.
It is presumed that the growth state of the deposited film is different from that in the case of simply depositing on a PET layer, and is denser. This seems to be the reason why the adhesion of the deposited film improved and the rate of change in capacitance decreased. It also has the advantage of having a low defective rate due to dielectric breakdown, which is a problem when used in capacitors.
[特性の測定方法および効果の評価方法](1)蒸着膜
の付着力
巻回または積層する前の蒸着フィルムを65°Cの恒温
槽に15分間浸漬し、蒸着膜の消失度合を観察した。評
価基準は次の通りである。[Method for measuring properties and evaluating effects] (1) Adhesion of vapor deposited film The vapor deposited film before being rolled or laminated was immersed in a constant temperature bath at 65° C. for 15 minutes, and the degree of disappearance of the vapor deposited film was observed. The evaluation criteria are as follows.
○:蒸着膜の変化がないもの
△:蒸着膜が少し変化したもの
×:蒸着膜がほとんど消失してしまったもの(2)静電
容量変化率
金属化フィルムコンデンサ(静電容量C=1゜5μF)
をつくり50℃、95%RHで、35Vの直流を印加す
る。2000時間経過したときの静電容量の変化量をΔ
Cとし、静電容量変化率(ΔC/C)(%)を測定した
。○: There is no change in the deposited film △: The deposited film has slightly changed ×: The deposited film has almost disappeared (2) Capacitance change rate Metalized film capacitor (capacitance C = 1° 5μF)
A DC voltage of 35 V was applied at 50°C and 95% RH. The amount of change in capacitance after 2000 hours is Δ
C, and the capacitance change rate (ΔC/C) (%) was measured.
(3)コンデンサの不良率
できあがった金属化フィルムコンデンサ100個につい
て、用いたフィルム厚み1μm当りDC120vを瞬時
昇圧法で印加し、絶縁破壊を起こしたコンデンサの個数
をそのまま不良率(%)とした。つまり、100個のコ
ンデンサのうち、10個が絶縁破壊を生じた場合の不良
率は10%である。なお、この不良率の値は、一般に3
%以下、好ましくは2%以下でないと実用化がむずかし
いと考えられる。(3) Defective rate of capacitors For 100 metallized film capacitors, DC 120 V was applied per 1 μm of film thickness using an instantaneous step-up method, and the number of capacitors that suffered dielectric breakdown was directly defined as the defective rate (%). In other words, if 10 out of 100 capacitors have dielectric breakdown, the defective rate is 10%. Note that the value of this defective rate is generally 3
% or less, preferably 2% or less, it would be difficult to put it into practical use.
(4)融点
試料10mgをDSCにセットし、20℃/分の昇温速
度で昇温しでいき、融解にともなう吸熱ピークの頂上部
に相当する温度を融点とした。(4) Melting point 10 mg of the sample was set in a DSC, and the temperature was raised at a rate of 20° C./min, and the temperature corresponding to the top of the endothermic peak accompanying melting was defined as the melting point.
(5)平均表面粗さ
J I 5−B−0601に規定された方法にしたがっ
て、触針式表面粗さ計を用いて測定した。なお、カット
オフ0.25mm、測定長4mmとする。(5) Average surface roughness Measured using a stylus surface roughness meter according to the method specified in J I 5-B-0601. Note that the cutoff is 0.25 mm and the measurement length is 4 mm.
(6)表面抵抗値
東洋メタライジング■製OHM−METERを用いて測
定した。(6) Surface resistance value Measured using OHM-METER manufactured by Toyo Metallizing ■.
[実施例]
以下、実施例に基づいて本発明をより具体的に説明する
。もっとも、本発明は下記実施例に限定されるものでは
ない。[Examples] Hereinafter, the present invention will be described in more detail based on Examples. However, the present invention is not limited to the following examples.
実施例I
PETのペレット(融点260℃、平均粒径0゜3μm
の乾式シリカ0.1重量%を含有)、及び酸成分として
テレフタル酸85モル%、イソフタル酸15モル%、ジ
オール成分としてエチレングリコール100%で共重合
したPEI (融点215℃で平均粒径0.2μmの乾
式シリカ0.10%を含有)のペレットを各々別の押出
機に供給して、290℃で溶融押出しし、各々の溶融体
をT型口金の中で合流させて、PET/PEIの2層か
らなるシートをつくった。このシートを85℃で長手方
向に3.2倍、95℃で幅方向に3.3倍延伸して20
0℃で5秒間熱処理し、PET層l、5μm、PEI層
0.4μmの積層フィルムを得た。PEI層の平均表面
粗さは0.05μmであった。この積層フィルムのPE
I層表面にアルミニウムを表面抵抗値で2Ω/□の厚さ
に蒸着した。こ、の蒸着フィルムを1ペア巻回し、熱プ
レス、メタクリン、リード線材、電圧処理、外装して金
属化フィルムコンデンサにした。この金属化フィルムコ
ンデンサの評価結果を第1表に示すが、蒸着膜の付着力
、静電容量変化率、コンデンサの不良率は良好な結果を
示した。Example I PET pellets (melting point 260°C, average particle size 0°3 μm)
PEI copolymerized with 85 mol% terephthalic acid and 15 mol% isophthalic acid as the acid component and 100% ethylene glycol as the diol component (contains 0.1% by weight of dry silica) (with a melting point of 215°C and an average particle size of 0.1%). The pellets (containing 0.10% of 2 μm dry silica) were each fed into a separate extruder and melt extruded at 290°C, and the respective melts were combined in a T-shaped nozzle to form PET/PEI. A sheet consisting of two layers was made. This sheet was stretched 3.2 times in the longitudinal direction at 85°C and 3.3 times in the width direction at 95°C.
Heat treatment was performed at 0° C. for 5 seconds to obtain a laminated film having a PET layer 1, 5 μm thick, and a PEI layer 0.4 μm thick. The average surface roughness of the PEI layer was 0.05 μm. PE of this laminated film
Aluminum was deposited on the surface of the I layer to a thickness of 2Ω/□ in terms of surface resistance. One pair of this vapor-deposited film was wound, heat-pressed, treated with methacrylate, lead wire material, voltage treated, and packaged to form a metallized film capacitor. The evaluation results of this metallized film capacitor are shown in Table 1, and the results showed that the adhesion of the deposited film, the capacitance change rate, and the defective rate of the capacitor showed good results.
比較例1
アルミニウムの表面抵抗値を5.5Ω/□にすることを
除き、実施例1と同様の製造条件で金属化フィルムコン
デンサを製造した。Comparative Example 1 A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1, except that the surface resistance value of aluminum was set to 5.5Ω/□.
蒸着膜の付着力、静電容量変化率、コンデンサの不良率
を第1表に示した。第1表から明らかなように、蒸着膜
付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion strength of the deposited film, the capacitance change rate, and the failure rate of the capacitor. As is clear from Table 1, the adhesion of the deposited film and the rate of change in capacitance were poor.
比較例2
イソフタル酸6モル%で共重合したPEI(融点247
℃)を用いることを除き、実施例1と同様の製造条件に
より金属化フィルムコンデンサを製造した。Comparative Example 2 PEI copolymerized with 6 mol% isophthalic acid (melting point 247
A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1, except that the temperature (°C) was used.
蒸着膜の付着力、静電容量変化率、コンデンサの不良率
を第1表に示した。第1表から明らかなように、蒸着膜
付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion strength of the deposited film, the capacitance change rate, and the failure rate of the capacitor. As is clear from Table 1, the adhesion of the deposited film and the rate of change in capacitance were poor.
比較例3
イソフタル酸30モル%で共重合したPEI(融点18
5℃)を用いることを除き、実施例1と同様の製造条件
により金属化フィルムコンデンサを製造した。Comparative Example 3 PEI copolymerized with 30 mol% isophthalic acid (melting point 18
A metallized film capacitor was manufactured under the same manufacturing conditions as in Example 1, except that a temperature of 5° C.) was used.
蒸着膜の付着力、静電容量変化率、コンデンサの不良率
を第1表に示した。第1表から明らかなように、蒸着膜
付着力、静電容量変化率は優れているが、コンデンサ不
良率が異常に高くなり使用に耐えない。Table 1 shows the adhesion strength of the deposited film, the capacitance change rate, and the failure rate of the capacitor. As is clear from Table 1, although the adhesion of the deposited film and the capacitance change rate are excellent, the capacitor failure rate is abnormally high, making it unusable.
比較例4
実施例1のPETペレットのみを280℃で溶融押出し
し、単層シートをつくった。このシートを実施例1と同
様に処理して3μmのフィルムを得て、金属化フィルム
コンデンサを製造した。Comparative Example 4 Only the PET pellets of Example 1 were melt-extruded at 280°C to produce a single layer sheet. This sheet was treated in the same manner as in Example 1 to obtain a 3 μm film to produce a metallized film capacitor.
蒸着膜の付着力、静電容量変化率、コンデンサの不良率
を第1表に示した。第1表から明らかなように、蒸着膜
付着力、静電容量変化率は悪い結果になっている。Table 1 shows the adhesion strength of the deposited film, the capacitance change rate, and the failure rate of the capacitor. As is clear from Table 1, the adhesion of the deposited film and the rate of change in capacitance were poor.
Claims (2)
の少なくとも片面に、エチレンイソフタレート単位を1
0〜25モル%の範囲で共重合したエチレンテレフタレ
ート・エチレンイソフタレート共重合体からなる層(P
EI層)を設けた積層フィルムを主たる誘電体とし、該
PEI層上に表面抵抗値が0.5〜5Ω/□の金属膜層
を電極として設けてなることを特徴とする金属化フィル
ムコンデンサ。(1) One ethylene isophthalate unit is added to at least one side of a biaxially oriented polyethylene terephthalate film.
A layer consisting of ethylene terephthalate/ethylene isophthalate copolymer copolymerized in the range of 0 to 25 mol% (P
1. A metallized film capacitor characterized in that a laminated film provided with an EI layer is used as a main dielectric, and a metal film layer having a surface resistance value of 0.5 to 5 Ω/□ is provided on the PEI layer as an electrode.
特徴とする請求項(1)に記載の金属化フィルムコンデ
ンサ。(2) The metallized film capacitor according to claim 1, wherein the metal film layer contains aluminum as a main component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2550489A JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2550489A JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH02205006A true JPH02205006A (en) | 1990-08-14 |
JP2653153B2 JP2653153B2 (en) | 1997-09-10 |
Family
ID=12167898
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2550489A Expired - Lifetime JP2653153B2 (en) | 1989-02-02 | 1989-02-02 | Metallized film capacitors |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2653153B2 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152159A (en) * | 1991-11-29 | 1993-06-18 | Diafoil Co Ltd | Metallized polyester film capacitor |
JP2003502856A (en) * | 1999-06-22 | 2003-01-21 | リチウム パワー テクノロジーズ インコーポレイテッド | High energy density metallized film capacitor and method of manufacturing the same |
-
1989
- 1989-02-02 JP JP2550489A patent/JP2653153B2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05152159A (en) * | 1991-11-29 | 1993-06-18 | Diafoil Co Ltd | Metallized polyester film capacitor |
JP2003502856A (en) * | 1999-06-22 | 2003-01-21 | リチウム パワー テクノロジーズ インコーポレイテッド | High energy density metallized film capacitor and method of manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
JP2653153B2 (en) | 1997-09-10 |
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