JPH02203697A - Headphone device - Google Patents

Abstract

PURPOSE:To absorb the displacement after processing due to contraction of a housing by mounting and supporting the housing with a speaker unit mounted thereto to a housing support member fitted to both ends of a head band via a buffer. CONSTITUTION:The headphone device is a headphone device containing a speaker unit 17 in its housing 16 and the housing 16 is fitted to a housing support member 22 fitted to both ends of the head band 1 via a buffer 25. Since the housing 16 with the speaker unit 17 mounted thereto is mounted and supported to a housing support member 22 fitted to both ends of the head band 1 via the cushion 25, the deviation due to contraction of the housing 16 is absorbed. Moreover, the buffer 25 prevents the acoustic vibration of the housing 16 from being transmitted to the housing support member 22.

Description

DETAILED DESCRIPTION OF THE INVENTION A. Field of Industrial Application The present invention relates to a headphone device, and more particularly to a structure for attaching and supporting a housing in which a speaker unit is arranged to a headband.

80 Summary of the Invention In the headphone device according to the present invention, the housing to which the speaker unit is attached is attached to the housing support member attached to both ends of the headband! ! By supporting the installation through the city body, it absorbs changes over time after processing the housing and ensures secure attachment to the headband.
This prevents the acoustic vibrations of the speaker unit from being transmitted to the headband.

BACKGROUND ART Conventionally, it has been common practice to listen to reproduced sound using a headphone device. This headphone device supports a speaker unit at both ends of an elastic headband via a housing part, and by holding the head between the headbands, the sound emitting surface of the speaker unit is brought into contact with the ear. They are facing each other.

By the way, in order to improve the acoustic characteristics of this headphone device, it has recently been proposed that the housing portion for housing the speaker unit is formed of a single board of natural wood, as described in Japanese Patent Application No. 62-304056. has been done.

D1 Problems to be Solved by the Invention However, when the housing portion is formed of a veneer of natural wood as in the above specification, the natural wood housing portion tends to warp due to drying of the wood after processing. Moreover, the deviation due to this pulling varies greatly depending on the natural wood used.

For this reason, if you attempt to attach the housing made of natural wood directly to the housing support members attached to each end of the headband with adhesive or screws, the above-mentioned pull will cause the adhesive position and screw holes to shift. etc. may occur, making installation impossible. Further, if tension occurs after joining by adhesive, screwing, etc., cracks may occur in the natural wood housing part.

Furthermore, if the housing section is directly attached to the housing support member, acoustic vibrations generated in the housing section due to sound reproduced by the speaker unit will be transmitted to the headband via the housing support member. When the vibrations of the housing portion are transmitted to the headband in this manner, the acoustic vibrations of the speaker units attached to both sides of the headband interfere with each other. Therefore, crosstalk occurs between the speaker units on both sides, causing deterioration in the quality of reproduced sound.

Therefore, the present invention provides a headphone that absorbs the pulling of the housing part, enables reliable attachment of the housing part to both ends of the headband, and prevents the acoustic vibration of the housing part from being transmitted to the headband. The purpose is to provide equipment.

E,! Means for Solving the Problem I In order to achieve the above object, the present invention provides a headphone device in which a speaker unit is housed in a housing, in which the housing is attached to a shock absorber to a housing support member attached to both ends of a headband. The feature is that the attachment is supported through the.

F1 Effect In the present invention, the housing to which the speaker unit is attached is supported by the housing support members attached to both ends of the headband via the buffer, so that displacement due to the pulling of the housing can be absorbed. Further, at this time, the buffer body does not transmit the acoustic vibration of the housing to the housing support member.

G. Embodiments Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

As shown in FIGS. 1 and 2, the headphone device of the present invention has a headband l formed in an inverted U shape with
A headphone unit 4 is rotatably arranged via a support member 2 and a support arm 3.

The headband 1 is made of a plate having spring properties and formed into an inverted U-shape. The reason why the headband 1 is required to have spring properties is to press the headphone units 4 attached to both sides of the headband 1 against the ears with a constant lateral pressure when the headband 1 is worn on the head.

The headband 1 is made of carbon fiber reinforced plastic. This carbon fiber reinforced plastic is formed by laminating carbon fibers impregnated with a thermosetting resin. The reason why carbon fiber is used as the material for the headband 1 is to reduce the weight of the entire device and to attenuate the acoustic vibrations of the headband 1 so that the acoustic vibrations of one headphone unit 4 are transmitted to the other headphone unit. This is to prevent interference with 4.

The headband 1 made of the above-mentioned material is
As shown in FIG. 2, the headband 1 is formed into a substantially U-shaped cross section with a flattened shape facing inward, and the opening side is closed with a lid 6, and a cavity 7 is provided in the headband 1. It is being A spring member 9, which connects both ends of suspenders 8 formed in a band-like body, which will be described later, is housed in this gap 7.

Furthermore, support members 2.degree. 2 are attached to both ends of the headband 1. This support member 2 rotatably supports a support arm 3 with a support shaft 10, and supports a headphone unit 4 attached to the support arm 3. This support member 2 is made of a magnesium-based alloy in order to reduce its weight and to attenuate acoustic vibrations transmitted from the headphone unit 4 that it supports.

This support member 2 is made up of an exterior part 12 and an inner plate 13 so that a cavity 11 is provided inside, similar to the headband 1 described above. The inner plate 13 has an opening 14.
is provided.

For the headband l configured as described above, the first
As shown in the figure, the suspenders 8 are attached. That is, both ends of the suspenders 8 are drawn into the headband 1 through the openings 14.14 of the support members 2.2 attached to both sides of the headband l and connected to the spring members 9, so that the suspenders 8 The hook is passed so that the middle part serves as a head support part 15 and becomes a bowstring inwardly with respect to the headband 1.

The suspenders 8 are used to support the user's head by wrapping them around the user's head when the headphone device is attached to the user's head. That is, when the headband 1 is worn on the user's head, the headband 1 is pushed out and the head support part 15 of the suspender 8 is pushed inside the headband 1 against the tensile force of the spring member 9. The suspenders 8 are wrapped around the head along the shape of the head to press and support the head.

The suspenders 8 are flexible band-like bodies, and are preferably made of a material that does not stretch in the length direction but stretches to some extent in the width direction and fits the head.

The spring member 9 always tensions and biases the suspender 8 in the direction of storing it in the headband 1, and applies a certain tension to the suspender 8 that is pulled out when the headphone device is worn on the head. It is for the purpose of Since this spring member 9 applies a similar tensile force to both ends of the suspenders 8, it is preferable that the center portion thereof is fixedly supported within the apex of the headband l.

Next, as shown in FIG. 4, the headphone unit 4 consists of a housing part 16 made of natural wood and a speaker unit 17. It consists of a side housing 18 and a rear side housing 19. A sound absorbing material 20 is housed within the housing portion 16.

Further, a plurality of sound emitting holes 21 are bored in the front side housing 1B of the housing part 16.

The headphone unit 4 as described above is attached to both ends of the headband 1 in the following manner.

That is, the headphone unit 4 is attached to the support members 2 at both ends of the headband 1 via support arms 3.

A support arm 3 is rotatably attached to the support member 2 via a support shaft 10 . The support arm 3 has arcuate arms 3a and 3b extending from the support shaft 10 as a base end. Housing support members 22 are attached to both ends of this arm.

This housing support member 22 is formed in an arc shape. Three recesses 23 are provided on the inner circumferential side, and cutouts 24 are provided in each of the recesses 23 from the inner circumferential side. A buffer body 25 is attached to this notch 24 . Then, the housing portion 16 is fixed to the housing support member 2 by the fixing screw 26 via the buffer body 25.
2 is fixedly supported at three points.

The above-mentioned li street body 25 is made of an elastic material such as synthetic resin, and as shown in FIGS. 3 and 4, the outer periphery of the middle part is constricted all the way around and has a substantially groove-shaped support portion 25a. is formed, and both ends in the vertical direction are curved so as to bulge outward with this support portion 25a in between. In addition, a through hole 2 is provided in the axial center of the buffer body 25.
7 is drilled. This through hole 27 is for inserting the fixing screw 26. Then, the support part 25a is sandwiched between the cutout part 24 of the housing support member 22, the fixing screw 26 is inserted, and the headphone unit is screwed into the screw hole 28 provided on the front side of the housing part 16. 4 is supported on the housing support member 22. Therefore, the elastic displacement force of the buffer body 25 can accommodate the misalignment between the screw hole 28 and the notch 24 of the housing support member 22 due to the shrinkage of the housing portion 16. Therefore, even if the housing portion 16 made of natural wood undergoes changes over time such as pulling due to drying or the like, it can be reliably supported without causing cracks in the housing portion 16.

Moreover, since this buffer body 25 acts as a cushion for the housing part 16 on the housing support member 22, it can absorb the acoustic vibrations of the housing part 16, and the housing part 16 can absorb the acoustic vibrations of the housing part 16 when playing the Sutoichi Kannit 17. It is possible to prevent acoustic vibrations from being transmitted to the headband 1.

Note that a protective pad 29 is provided so as to cover the front side of the housing support member 22 that supports the headphone unit 4.
is attached to improve the wearing comfort of this headphone device.

Next, the usage state of the headphone device in which the headphone unit 4 is attached to the headband 1 as described above will be described.

In this headphone device, as shown in FIG. 5, the suspender B of the headband l constantly applies a certain tension in the direction of drawing the head support part 15 of the suspender 8 into the headband 1 from both ends by the spring member 9. It is held and tensioned.

When putting it on the user's head from this pre-wearing state, as shown in FIG.
The suspender 8 is pulled out from inside the headband 1 against the tensile force of , and the suspender 8 is wrapped around the head along the shape of the head to press and support the head and attached to the head.゛By supporting the head with the suspenders 8 whose length can be varied in this way, the suspenders 8 can be always pulled out from within the headband 1 without being affected by individual differences in the distance from the top of the user's head to the ears. Can be pressed and supported with constant tension. Also,
The suspenders 8 can contact the head with a uniform pressing force over the entire width of the head between both ears 1. Furthermore, since the length of the headband 1 itself is not variable at this time, The lateral pressure of the headphone unit 4 against the ear due to the headband 1 can also be kept constant at all times, and a good wearing feeling can be obtained.

The suspenders 8 are automatically pulled out when the headphone device is worn on the head to automatically adjust the height position of the headphone unit 4, so the suspenders 8 are automatically pulled out when the headphone device is attached to the head, and therefore the height position of the headphone unit 4 is automatically adjusted. There is no need to adjust the height position of the headphone unit each time, and operability can be improved.

H1 Effects of the Invention According to the present invention, the housing part to which the speaker unit is attached is supported by the housing support members attached to both ends of the headband via the buffer.
It is possible to absorb displacement after processing due to pulling of the housing part, etc.

Therefore, even if the housing portion changes over time, it can be reliably attached to the housing support member without damaging the housing portion.

In addition, this shock absorber transmits the acoustic vibration of the housing part to the housing support member, so that one headphone unit does not affect the other headphone unit due to acoustic vibration, thereby preventing the occurrence of crosstalk. This makes it possible to improve the quality of the reproduced sound.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of a headphone device according to the present invention,
FIG. 2 is a partially exploded perspective view thereof. FIG. 3 is an enlarged perspective view of essential parts showing the bonding relationship between the headphone unit and the housing support member, and FIG. 4 is a sectional view showing how the headphone unit is attached to the housing support member. 5 and 6 are front views showing the headband section of the headphone device according to the present invention cut away, with FIG. 5 showing the headphone device before it is worn on the head, and FIG. 6 showing the headphone device when it is being worn on the head. show. 1...Headband 2...Support member 4...Headphone unit 16...Housing portion 17...Speaker unit 18...Front side housing 19...Back side housing 22...Housing support Member 25...Buffer 26...Fixing screw 28...Screw hole

Claims (1)

[Claims] A headphone device in which a speaker unit is housed in a housing, characterized in that the housing is attached and supported via a buffer to housing support members attached to both ends of the headband. Headphone device.