JPH02200767A - Method and apparatus for plasma thermal spraying - Google Patents
Method and apparatus for plasma thermal sprayingInfo
- Publication number
- JPH02200767A JPH02200767A JP1017735A JP1773589A JPH02200767A JP H02200767 A JPH02200767 A JP H02200767A JP 1017735 A JP1017735 A JP 1017735A JP 1773589 A JP1773589 A JP 1773589A JP H02200767 A JPH02200767 A JP H02200767A
- Authority
- JP
- Japan
- Prior art keywords
- base material
- electrode
- plasma
- thermal spraying
- spray gun
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007751 thermal spraying Methods 0.000 title claims abstract description 18
- 238000000034 method Methods 0.000 title claims description 9
- 239000000463 material Substances 0.000 claims abstract description 95
- 239000011248 coating agent Substances 0.000 claims abstract description 19
- 238000000576 coating method Methods 0.000 claims abstract description 19
- 150000002500 ions Chemical class 0.000 claims abstract description 9
- 239000001301 oxygen Substances 0.000 claims abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 7
- 239000007921 spray Substances 0.000 claims description 36
- 238000007750 plasma spraying Methods 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 239000000919 ceramic Substances 0.000 claims description 7
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 3
- 239000011195 cermet Substances 0.000 claims description 2
- 239000000843 powder Substances 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052802 copper Inorganic materials 0.000 abstract description 7
- 239000010949 copper Substances 0.000 abstract description 7
- 230000006866 deterioration Effects 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 239000007789 gas Substances 0.000 description 20
- 238000004140 cleaning Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000010953 base metal Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 1
- -1 cermets Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
Landscapes
- Coating By Spraying Or Casting (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は酸素濃度を低下させた雰囲気下で、母材表面上
に金属、合金、サーメット、セラミックス等の被覆材を
プラズマ溶射により被覆するプラズマ溶射方法およびそ
の装置に関する。[Detailed Description of the Invention] <Industrial Application Field> The present invention is a plasma spraying method in which a coating material such as metal, alloy, cermet, or ceramic is coated on the surface of a base material by plasma spraying in an atmosphere with a reduced oxygen concentration. This invention relates to a thermal spraying method and apparatus.
〈従来の技術〉
従来の技術としては第２図に示すプラズマ溶射方法（特
公昭６Ｏ−３５９Ｈ号）がある。以下図面に基づいて説
明する。第２図において１は内部を大気から隔離し、酸
素濃度を低下させたチャンバ、２は溶射ガンであり、タ
ングステン電極４と水冷銅電極３を備え、絶縁体１５に
より互いに電気的に絶縁され、タングステン電極４は直
流電源７の負極に、水冷銅電極３は正極にそれぞれ接続
されている。６はガスボンベ１３から供給されるプラズ
マガス（アルゴン、ヘリウム等）を溶射ガン２内に送り
込むガス供給口、ｉ４は溶射粉末をためておくホッパで
あり、ガスボンベ１３からのガスにより溶射粉末が溶射
ガン２に送られるようになっている。５は溶射ガン２の
溶射粉末供給１］である。２１は金属母材、８は溶射ガ
ン２に対して金属母材２１に負の電圧を与える電源、９
はしゃ断製である。次に作用を説明する。<Prior Art> As a conventional technique, there is a plasma spraying method (Japanese Patent Publication No. 6O-359H) shown in FIG. This will be explained below based on the drawings. In FIG. 2, 1 is a chamber whose interior is isolated from the atmosphere and the oxygen concentration is reduced, 2 is a thermal spray gun, and is equipped with a tungsten electrode 4 and a water-cooled copper electrode 3, which are electrically insulated from each other by an insulator 15. The tungsten electrode 4 is connected to the negative electrode of the DC power source 7, and the water-cooled copper electrode 3 is connected to the positive electrode. 6 is a gas supply port that sends plasma gas (argon, helium, etc.) supplied from the gas cylinder 13 into the thermal spray gun 2; i4 is a hopper that stores thermal spray powder; the gas from the gas cylinder 13 causes the thermal spray powder to flow into the thermal spray gun It is now sent to 2. 5 is the thermal spray powder supply 1 of the thermal spray gun 2. 21 is a metal base material; 8 is a power source that applies a negative voltage to the metal base material 21 for the spray gun 2; 9
It is cut in pieces. Next, the effect will be explained.
先ず、ガスボンベ１３からガス供給口６を通してプラズ
マガスを溶射ガン２に供給し、タングステン電極４と水
冷銅電極３の間に直流電源７によりプラズマアークを発
生させる。発生したプラズマアークはその圧力によりプ
ラズマジェットとなって溶射ガン２より噴出する。金属
母材２１は該プラズマジェットの先端に接する位置に設
置１２、しゃ断製９を閉として金属母材２１と水冷銅電
極３との間に電流を流す。これにより金属母材２１はア
ークのクリーニング作用を受けて酸化被覆が除去され、
清浄な表面が現出される。その後しゃ断製９を開とし、
金属母材２１を通常のプラズマ溶射の位置までずらし、
ホッパ１４内の溶射粉末をガスボンベ１３からのガスに
より、溶射ガン２の溶射粉末供給口５を通じて、上記プ
ラズマジェット中に供給し、金属母材２１に溶射する。First, plasma gas is supplied from the gas cylinder 13 to the thermal spray gun 2 through the gas supply port 6, and a plasma arc is generated between the tungsten electrode 4 and the water-cooled copper electrode 3 by the DC power supply 7. The generated plasma arc becomes a plasma jet due to its pressure and is ejected from the thermal spray gun 2. The metal base material 21 is placed 12 at a position in contact with the tip of the plasma jet, the breaker 9 is closed, and a current is passed between the metal base material 21 and the water-cooled copper electrode 3. As a result, the metal base material 21 is subjected to the cleaning action of the arc, and the oxide coating is removed.
A clean surface is revealed. After that, open the shutoff 9,
Shift the metal base material 21 to the normal plasma spraying position,
The thermal spray powder in the hopper 14 is supplied to the plasma jet through the thermal spray powder supply port 5 of the thermal spray gun 2 using gas from the gas cylinder 13, and is sprayed onto the metal base material 21.
〈発明が解決しようとする問題点〉
以上説明した従来技術においては、プラズマアークのク
リーニング作用を利用し、金属母材２１の酸化被膜を除
去してから被覆材を溶射するので、被覆材の接着強度は
、酸化被膜を除去しないで被覆材を溶射する従来の場合
に比べて格段に向上するが、
（１） クリーニング時には母材自体が陰極となり、
母材に電流が流れなければならないので母材は導電性の
ある金属に限定されること。<Problems to be Solved by the Invention> In the prior art described above, the cleaning effect of plasma arc is used to remove the oxide film on the metal base material 21 before spraying the coating material, so that the adhesion of the coating material is reduced. The strength is significantly improved compared to the conventional method of spraying coating material without removing the oxide film, but (1) the base material itself becomes a cathode during cleaning;
Since current must flow through the base material, the base material must be a conductive metal.
（２）母材の電気抵抗によりジュール熱が発生し、クリ
ーニング時に母材の温度が５００℃以上に上昇する場合
があり、高温のため母材の材質の劣化が起るので使用可
能な母材の材質が限定されること。（尚、通常の溶射で
は母材の温度は２００℃以下に押さえることができる。(2) Joule heat is generated due to the electrical resistance of the base material, and the temperature of the base material may rise to over 500℃ during cleaning.The high temperature may cause deterioration of the base material, so the base material cannot be used. The materials used are limited. (In addition, in normal thermal spraying, the temperature of the base material can be kept below 200°C.
）などの問題がある。) and other problems.
〈発明の目的〉
本発明は上記問題点に鑑み案出されたもので、母材とは
別にクリーニング用に電極を設けることにより母材の材
質の制限のないプラズマ溶射方法およびその装置を提供
することを目的とする。<Object of the Invention> The present invention has been devised in view of the above-mentioned problems, and provides a plasma spraying method and apparatus thereof that are free from limitations on the material of the base material by providing an electrode for cleaning separately from the base material. The purpose is to
く問題点を解決するための手段〉
上記目的を達成するため本願の第１発明のプラズマ溶射
方法は大気から隔離されて、酸素濃度を低下させた雰囲
気中で、プラズマ溶射により母材表面上に金属、合金、
サーメット、セラミックス等の被覆材を被覆するプラズ
マ溶射方法において、母材に近接しており、かつ母材と
は電気的に絶縁されている電極を設け、この電極に溶射
ガンに対して負の電圧を与え、被覆材を含まない状態で
プラズマジェットの正イオンを母材の表面に衝突させて
母材表面上の酸化被膜を除去してから、前記電極への電
圧を切り、その後被覆材をプラズマ溶射により母材表面
に被覆することを特徴とするものであり、本願の第２発
明のプラズマ溶射装置は酸素濃度を低下させた密閉チャ
ンバ内で、母材表面上に金属、合金、サーメット、セラ
ミックス等の被覆材を被覆するプラズマ溶射装置におい
て、プラズマ溶射ガンに対峙するように母材を支持する
Ｎ Ｕ支持台と、母材に近接しており、母材とは電気的
に絶縁されており、かつ溶射ガンからのプラズマジェッ
トの正イオンが母材に当るように配置された電極と、こ
の電極に溶射ガンに対して負の電位を与える電源と、該
電源と電極との間をしゃ断するしゃ断製とを備えたこと
を特徴とするものである。Means for Solving the Problems In order to achieve the above object, the plasma spraying method of the first invention of the present application applies plasma spraying onto the surface of a base material in an atmosphere isolated from the atmosphere and with a reduced oxygen concentration. metals, alloys,
In the plasma spraying method for coating coating materials such as cermets and ceramics, an electrode is provided that is close to the base material and electrically insulated from the base material, and a negative voltage is applied to this electrode with respect to the spray gun. The positive ions of the plasma jet are applied to the surface of the base material without the coating material to remove the oxide film on the surface of the base material, the voltage to the electrode is cut off, and then the coating material is exposed to the plasma. The plasma spraying apparatus of the second invention of the present application coats the surface of the base material by thermal spraying, and the plasma spraying apparatus of the second invention coats the surface of the base material with metals, alloys, cermets, and ceramics in a closed chamber with a reduced oxygen concentration. In plasma spray equipment for coating coating materials such as , and an electrode arranged so that the positive ions of the plasma jet from the thermal spray gun hit the base material, a power source that applies a negative potential to this electrode with respect to the thermal spray gun, and a disconnection between the power source and the electrode. It is characterized by having a cut-off structure.
く作 用〉
プラズマジェットの正イオンを母材の表面に衝突させて
母材表面上の酸化被膜を除去するに際して、母材とは絶
縁された負の電極を設け、そこに電流が流れるようにし
たので、母材に本流が流れることがない。Effect> When the positive ions of the plasma jet collide with the surface of the base material to remove the oxide film on the surface of the base material, a negative electrode insulated from the base material is provided so that a current flows there. Therefore, the main stream does not flow into the base metal.
〈実 施 例〉
以Ｆ図面に基づいて本発明の一実施例について説明する
。<Embodiment> An embodiment of the present invention will be described below based on drawing F.
第１図は本発明のプラズマ溶射装置の側断面図である。FIG. 1 is a side sectional view of the plasma spraying apparatus of the present invention.
第１図において１はチャンバ、２は溶射ガン、３は水冷
銅電極（陽極）、４はタングステン電極（陰極）、５は
溶射粉末供給口、６はガス供給口、７は溶射ガン２用の
直流電源、８は直流電源、９はしゃ断製、１０はアース
、１１は母材であり、本実施例ではセラミック製で棒状
の形をしている。１２は母材に近接して設けられる水冷
電極で内部の空胴内に冷却水が循環ｊ７ている。１３は
ガスボンベ、１４は溶射粉末のホ・ンバ、１５は絶縁体
、１６は母材１１の支持台で回転可能となっている。１
７は電ＩＪＩｉ１．２の支持台で昇降可能となっている
。１８は支持台１６」７に取付けられ母材１１を支持す
る台座である。In Figure 1, 1 is a chamber, 2 is a thermal spray gun, 3 is a water-cooled copper electrode (anode), 4 is a tungsten electrode (cathode), 5 is a thermal spray powder supply port, 6 is a gas supply port, and 7 is a thermal spray gun 2. 8 is a DC power source, 9 is a cut-off material, 10 is a ground, and 11 is a base material, which in this embodiment is made of ceramic and has a rod-like shape. Reference numeral 12 denotes a water-cooled electrode provided close to the base material, and cooling water is circulated in the internal cavity j7. 13 is a gas cylinder, 14 is a hot spring for thermal spray powder, 15 is an insulator, and 16 is a support base for the base material 11, which is rotatable. 1
7 can be raised and lowered using the support stand of Den IJIi 1.2. Reference numeral 18 denotes a base that is attached to the support base 16''7 and supports the base material 11.
尚、第１図において、第２図と共通ずる部材につ・いて
は共通の付号を付してあり、重複する説明は省略する。In FIG. 1, sliding members common to those in FIG. 2 are given the same reference numerals, and redundant explanations will be omitted.
第１図に示すように大気から隔離されたチャンバｌ内に
溶射ガン２と、溶射ガン２と対峙してセラミック製で棒
状の母材ＩＬが回転支持台１６上に配置されている。母
材１１に近接して水冷銅製の電極＋２が設けられている
。電極１２は略半円形で母材１．１の溶射ガン２側と反
対側を取り囲むように、電極支持台１７上に配置されて
いる。電極支持台１７は溶射ガン２と同調して昇降する
ようになっている。As shown in FIG. 1, a thermal spray gun 2 is placed in a chamber l isolated from the atmosphere, and a rod-shaped base material IL made of ceramic is placed on a rotating support 16 facing the thermal spray gun 2. A water-cooled copper electrode +2 is provided adjacent to the base material 11. The electrode 12 has a substantially semicircular shape and is arranged on an electrode support base 17 so as to surround the base material 1.1 on the side opposite to the thermal spray gun 2 side. The electrode support stand 17 is adapted to move up and down in synchronization with the thermal spray gun 2.
直流電源８の負極は電極１２と、正極はしゃ断製９を介
して溶射ガン２の電極３とそれぞれ接続されている。尚
、電極３とチャンバｌはアース１０と接続されている。The negative electrode of the DC power source 8 is connected to an electrode 12, and the positive electrode is connected to the electrode 3 of the thermal spray gun 2 via a breaker 9. Note that the electrode 3 and the chamber 1 are connected to the ground 10.
ｆり祠１１は絶縁体の台座１８を介して支持台Ｉ６に取
付けられているので、電気的には他の部品から絶縁され
た浮いた状態となっている。チャンバｌは図示しない排
気装置に接続されており、溶射ガン２は図示しない昇降
装置により昇降１′１１能となっている。Since the shrine 11 is attached to the support base I6 via the insulating base 18, it is electrically insulated from other parts and is in a floating state. The chamber 1 is connected to an exhaust device (not shown), and the thermal spray gun 2 can be raised and lowered 1'11 by means of a lifting device (not shown).
次に作用を説明する。Next, the action will be explained.
チャンバｌ内を１０” Ｔｏｒｒ近くの圧力になるまで
排気した後、ガスボンベ１３よりＡ「ガスをチャンバｌ
内の圧力が数Ｔｏｒｒから大気圧までの任意の設定圧力
になるまで導入して１内を低酸素濃度のＡｒ雰囲気に調
整する。溶射ガンの陽極３と陰極４間に電圧をかけると
共にガス供給口６より＾「ガスを供給するとＡｒガスは
陽極３と陰極４間に発生１．たアークによりｆ［１され
、正イオンと重ｆとに分離したプラズマガスッ１゛とな
り溶１、Ｊガン２より噴出する。母材ｌｌと電極１２は
プラズマジェットの先端部に配置されていルノテ、しゃ
断製９を閉じるとプラズマジェットの正イオンは電極１
２の負電圧に引かれて高速で母材目の表面に衝突して母
材１１の表面についていた酸化被膜を除去する。母材目
は回転しているので、溶射ガン２と電極Ｉ２を昇降させ
れば母材１１の溶射の必要な全表面の酸化膜を除去する
ことができる。次にしゃ断製９を開いて陽極３と電極１
２間の接続を切った後、溶射ガン２を通常の溶射の位置
まで後退させ、ホッパ目より溶射粉末を溶射ガン２に供
給して通常の溶射を行う。プラズマガスとしては必要に
応じてＨｅ、 ＮＺ、Ｈ２などを混入し、で使用しても
よい。また、母材１１が平面状で広い場合には電極１２
を網状として酸化被膜除去時には母材１１の前方（溶射
ガン２寄り）に配置してプラズマジェットの正イオンを
電極１２を通過させて母材１１に衝突させ、溶射時には
電極１２を母材Ｈの後方に移動させればよい。After evacuating the inside of chamber 1 to a pressure close to 10" Torr, the gas from gas cylinder 13 is pumped into chamber 1.
The interior of the chamber 1 is adjusted to an Ar atmosphere with a low oxygen concentration by introducing the gas until the pressure within the chamber reaches an arbitrary set pressure from several Torr to atmospheric pressure. When a voltage is applied between the anode 3 and cathode 4 of the thermal spray gun and gas is supplied from the gas supply port 6, the Ar gas is f[1] by the arc generated between the anode 3 and cathode 4, and becomes positive ions and heavy The plasma gas is separated into f and 1, which are ejected from the melt 1 and the J gun 2.The base material 1 and the electrode 12 are placed at the tip of the plasma jet, and when the shutoff 9 is closed, the positive ions of the plasma jet are Electrode 1
It is attracted by the negative voltage of No. 2 and collides with the grain surface of the base material 11 at high speed to remove the oxide film attached to the surface of the base material 11. Since the base material is rotating, the oxide film on the entire surface of the base material 11 that requires thermal spraying can be removed by moving the thermal spray gun 2 and electrode I2 up and down. Next, open the breaker 9 and connect the anode 3 and electrode 1.
After cutting the connection between the two, the thermal spraying gun 2 is moved back to the normal thermal spraying position, and the thermal spraying powder is supplied to the thermal spraying gun 2 from the hopper to perform normal thermal spraying. As the plasma gas, He, NZ, H2, etc. may be mixed as necessary and used. In addition, if the base material 11 is planar and wide, the electrode 12
is placed in front of the base material 11 (near the thermal spray gun 2) when removing the oxide film, and the positive ions of the plasma jet are made to pass through the electrode 12 and collide with the base material 11. Just move it backwards.
母材１１は水冷電極により輻射冷却され、過熱が防止さ
れるため、プラズマジェットの先端部より内側に母材１
１を配置してもよく、また、チャンバー１内の圧力を小
さくすれば、母材１１をプラズマジェットの先端部より
外側に配置することもできる。The base material 11 is radiation-cooled by the water-cooled electrode to prevent overheating, so the base material 11 is placed inside the tip of the plasma jet.
Alternatively, if the pressure inside the chamber 1 is reduced, the base material 11 can be placed outside the tip of the plasma jet.
尚、本実施例では溶射ガン２と電極１２を４降可能とし
たが、これらを固定し、母材１１を昇降可能としてもよ
い等、特許請求の範囲内で種々の変更が可能である。In this embodiment, the thermal spray gun 2 and the electrode 12 can be lowered four times, but various changes can be made within the scope of the claims, such as fixing them and allowing the base material 11 to move up and down.
〈発明の効果〉 以上述べたように本発明には以下の効果がある。<Effect of the invention> As described above, the present invention has the following effects.
（１）母材とは別体の電極を設けたので、母材の材質が
導電性のないものであっても、溶射に先立って母材の表
面の酸化被膜を除去することができ、母材との密着力の
強い被覆を得ることができる。(1) Since an electrode is provided separately from the base material, even if the base material is non-conductive, the oxide film on the surface of the base material can be removed prior to thermal spraying. A coating with strong adhesion to the material can be obtained.
（２）母材とは別体の電極を設け、酸化被膜を除去する
とき母材には電流が流れないようにしたので、母材にジ
ュール熱が発生せず、４月の温度上昇による材質の劣化
を防止できるので、母材の材質による制限がなくなる。(2) An electrode separate from the base material is provided to prevent current from flowing through the base material when removing the oxide film, so Joule heat is not generated in the base material, and the material is not affected by the temperature rise in April. Since deterioration of the material can be prevented, there are no restrictions imposed by the material of the base material.
第１図は本発明のプラズマ溶射装置の側断面図、第２図
は従来のプラズマ溶射装置の側断面図である。
ｌ ・・・・・・・・ チャンバ
２・・・・・・・・・ 溶射ガン
８・・・・・・・・・電源
９・・・・・・・・・ しゃ断製
ｌｌ ・・・・・・・・・ 母 材１２・
・・・・・・・・電極
１６ ・・・・・・・・・ 母材支持台用 願 人
石川島播磨重工業株式会社代 理 人
弁理士 島 村 芳 明第１図
第
図FIG. 1 is a side sectional view of a plasma spraying apparatus of the present invention, and FIG. 2 is a side sectional view of a conventional plasma spraying apparatus. l...... Chamber 2... Thermal spray gun 8... Power supply 9... Shut-off ll... ...Base material 12.
・・・・・・・・・Electrode 16 ・・・・・・・・・ For base metal support base Request person
Representative of Ishikawajima-Harima Heavy Industries Co., Ltd.
Patent Attorney Yoshiaki Shimamura Figure 1
Claims (3)
気中で、プラズマ溶射により母材表面上に金属、合金、
サーメット、セラミックス等の被覆材を被覆するプラズ
マ溶射方法において、母材に近接しており、かつ母材と
は電気的に絶縁されている電極を設け、この電極に溶射
ガンに対して負の電圧を与え、被覆材を含まない状態で
プラズマジェットの正イオンを母材の表面に衝突させて
母材表面上の酸化被膜を除去してから、前記電極への電
圧を切り、その後被覆材をプラズマ溶射により母材表面
に被覆することを特徴とするプラズマ溶射方法。(1) Metals, alloys,
In the plasma spraying method for coating coating materials such as cermets and ceramics, an electrode is provided that is close to the base material and electrically insulated from the base material, and a negative voltage is applied to this electrode with respect to the spray gun. The positive ions of the plasma jet are applied to the surface of the base material without the coating material to remove the oxide film on the surface of the base material, the voltage to the electrode is cut off, and then the coating material is exposed to the plasma. A plasma spraying method characterized by coating the surface of a base material by thermal spraying.
面上に金属、合金、サーメット、セラミックス等の被覆
材を被覆するプラズマ溶射装置において、プラズマ溶射
ガンに対峙するように母材を支持する母材支持台と、母
材に近接しており、母材とは電気的に絶縁されており、
かつ溶射ガンからのプラズマジェットの正イオンが母材
に当るように配置された電極と、この電極に溶射ガンに
対して負の電位を与える電源と、該電源と電極との間を
しゃ断するしゃ断製とを備えたことを特徴とするプラズ
マ溶射装置。(2) In a plasma spraying device that coats a coating material such as metal, alloy, cermet, or ceramics on the surface of a base material in a closed chamber with a reduced oxygen concentration, the base material is supported so as to face the plasma spray gun. A base material support stand is located close to the base material and is electrically insulated from the base material.
and an electrode arranged so that the positive ions of the plasma jet from the thermal spray gun hit the base material, a power source that applies a negative potential to the electrode with respect to the thermal spray gun, and a breaker that disconnects between the power source and the electrode. A plasma spraying device characterized by comprising:
囲第２項記載のプラズマ溶射装置。(3) The plasma spraying apparatus according to claim 2, wherein the base material support is rotatable.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1017735A JPH02200767A (en) | 1989-01-30 | 1989-01-30 | Method and apparatus for plasma thermal spraying |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1017735A JPH02200767A (en) | 1989-01-30 | 1989-01-30 | Method and apparatus for plasma thermal spraying |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02200767A true JPH02200767A (en) | 1990-08-09 |
Family
ID=11952004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1017735A Pending JPH02200767A (en) | 1989-01-30 | 1989-01-30 | Method and apparatus for plasma thermal spraying |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02200767A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770273A (en) * | 1995-02-14 | 1998-06-23 | General Electric Company | Plasma coating process for improved bonding of coatings on substrates |
| JP2005350748A (en) * | 2004-06-11 | 2005-12-22 | Tama Tlo Kk | Thermal spraying method of forming thermally sprayed film having excellent adhesion |
| CN108707859A (en) * | 2018-07-12 | 2018-10-26 | 刘威 | A kind of driving device for powder ion plasma plating automatic doubler surface glouer |
-
1989
- 1989-01-30 JP JP1017735A patent/JPH02200767A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5770273A (en) * | 1995-02-14 | 1998-06-23 | General Electric Company | Plasma coating process for improved bonding of coatings on substrates |
| JP2005350748A (en) * | 2004-06-11 | 2005-12-22 | Tama Tlo Kk | Thermal spraying method of forming thermally sprayed film having excellent adhesion |
| JP4649126B2 (en) * | 2004-06-11 | 2011-03-09 | 学校法人 中央大学 | Thermal spraying method for forming thermal spray coating with excellent adhesion |
| CN108707859A (en) * | 2018-07-12 | 2018-10-26 | 刘威 | A kind of driving device for powder ion plasma plating automatic doubler surface glouer |
| CN108707859B (en) * | 2018-07-12 | 2020-09-29 | 广州初曲科技有限公司 | Driving device for powder ion plasma coating equipment |
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