JPH02200099A - Ultrasonic wave transmission/reception probe and its manufacture - Google Patents
Ultrasonic wave transmission/reception probe and its manufactureInfo
- Publication number
- JPH02200099A JPH02200099A JP1017573A JP1757389A JPH02200099A JP H02200099 A JPH02200099 A JP H02200099A JP 1017573 A JP1017573 A JP 1017573A JP 1757389 A JP1757389 A JP 1757389A JP H02200099 A JPH02200099 A JP H02200099A
- Authority
- JP
- Japan
- Prior art keywords
- matching layer
- piezoelectric
- acoustic matching
- piezoelectric vibrating
- ultrasonic wave
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000523 sample Substances 0.000 title claims description 19
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 230000005540 biological transmission Effects 0.000 title 1
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- 239000010408 film Substances 0.000 claims description 10
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 239000011358 absorbing material Substances 0.000 claims description 3
- 238000000151 deposition Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 abstract description 9
- 229920000647 polyepoxide Polymers 0.000 abstract description 9
- 239000006096 absorbing agent Substances 0.000 abstract description 5
- 239000000945 filler Substances 0.000 abstract description 4
- 230000007774 longterm Effects 0.000 abstract description 3
- 230000002708 enhancing effect Effects 0.000 abstract 2
- 239000004575 stone Substances 0.000 abstract 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract 1
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000002787 reinforcement Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000003384 imaging method Methods 0.000 description 3
- 238000003745 diagnosis Methods 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔発明の目的〕
(産業上の利用分野)
本発明は、生体の診断等に用いられる超音波送受波プロ
ーブ及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to an ultrasonic wave transmitting/receiving probe used for diagnosis of a living body and a method for manufacturing the same.
(従来の技術)
生体の各種診断等に用いられる従来の一般的な電子走査
用の超音波送受波プローブは、第11図に示すような構
造をしている。すなわち、囚は、圧電振動素子にして、
(B)はこの素子の上下面にとりつけられた電極、(C
)は電極に配設されたリード、(至)は振動素子(5)
と超音波被放射体との音響インピーダンスをマツチング
させるための音響整合層にして、一般にエポキシ樹脂な
どの熱硬化性樹脂が用いられ、普通、これに適量の充填
材が混合されている。さらに、(均は超音波吸収材から
なる振動素子の保持体にして、(F″)は各振動素子内
の絶縁層であって、これによって振動素子を分離し、か
つ振動素子の補強と音響整合層0を能率よく形成するた
めに整合層形成用の樹脂を充填するか、又は、各振動素
子(イ)間の機械的結合をできるだけ少なくする丸めに
剛性率の小さなシリコーン等が充填されている。さらに
、この上に音波を収束させるための音響レンズ回が形成
されている。(Prior Art) A conventional general electronic scanning ultrasonic transceiver probe used for various types of diagnosis of living organisms has a structure as shown in FIG. In other words, the prisoner is a piezoelectric vibrating element,
(B) is the electrode attached to the upper and lower surfaces of this element, (C
) is the lead attached to the electrode, (to) is the vibrating element (5)
A thermosetting resin such as epoxy resin is generally used as an acoustic matching layer for matching the acoustic impedance of the object and the object to be radiated with ultrasonic waves, and an appropriate amount of filler is usually mixed with this. Furthermore, (Junior is a holder for the vibrating elements made of an ultrasonic absorbing material, and (F'') is an insulating layer inside each vibrating element, which separates the vibrating elements and reinforces the vibrating elements. In order to efficiently form the matching layer 0, it is filled with a resin for forming the matching layer, or a silicone or the like with a low rigidity is filled in the round shape to minimize the mechanical coupling between each vibrating element (a). Furthermore, an acoustic lens circuit is formed on top of this to converge sound waves.
しかるに、このような超音波送受波プローブにおいては
、すべての振動素子(5)がその上面において、一連の
音響整合層(D)によって連結されており、かつ、各摂
動素子開開に音響整合層(至)と同質の材量あるいは剛
性率の小さいシリコーン等が充填されている。したがっ
て、振動素子内の電極(B)に電圧が印加されて動作さ
せるとき、振動素子(5)が電極(B)方向と同時に横
方向にも振動し互に分離して配設されている各振動素子
(8)間に電気的及び超音波による機械的の結合が生ず
るということになって、その結果、各振動素子(5)は
所定通りの動作ができにくくなり、送受波の波形が極端
に悪くなって分解能を低下させてしまい、超音波送受波
プローブとしての役目を的確に果せなくなるという不具
合があった。However, in such an ultrasonic transceiver probe, all the vibrating elements (5) are connected on their upper surfaces by a series of acoustic matching layers (D), and each perturbation element is provided with an acoustic matching layer (D). Filled with silicone, etc., of the same quality as (to) or with a lower rigidity. Therefore, when a voltage is applied to the electrode (B) in the vibrating element and the vibrating element (5) is operated, the vibrating element (5) vibrates in the transverse direction at the same time as in the electrode (B) direction. Electrical and ultrasonic mechanical coupling occurs between the vibrating elements (8), and as a result, each vibrating element (5) becomes difficult to operate as specified, and the waveforms of the transmitted and received waves become extreme. There was a problem in that the resolution deteriorated and the ultrasonic wave transmitting/receiving probe could no longer function properly.
そこで、従来においては、特許第1202295号に開
示されているように、音qfi整合/l(至)が取付け
られた圧電振動素子間に空間を形成することにより、従
来のような電気的並びに機械的の結合を各振動素子(5
)・・・が起すことなく、それぞれの撮動素子(8)が
独立した機能を果すようにして、プローブとしての性能
向上をはかっている。Therefore, in the past, as disclosed in Japanese Patent No. 1202295, by forming a space between the piezoelectric vibrating elements to which the sound qfi matching/l is attached, the conventional electrical and mechanical The coupling of targets is determined by each vibrating element (5
)... is caused, and each imaging element (8) performs an independent function, thereby improving the performance of the probe.
しかしながら、空間が形成されたプローブの撮動素子内
は、この空間く踏出しているため、長期間にわたって使
用している際中に、しばしば撮動素子内の内壁面から崩
壊する。その結果、プローブとして動作させたとき、送
受波の波形が悪化し、所定通り的確な動作をすることが
できないようになり、分解能低下の一因となっている。However, since the space inside the imaging element of the probe is stepped out of this space, the probe often collapses from the inner wall surface within the imaging element during long-term use. As a result, when operated as a probe, the waveforms of the transmitted and received waves deteriorate, making it impossible to operate accurately as specified, which is one of the causes of reduced resolution.
(発明が解決しようとする課題)
本発明は、上記事情を参酌してなされ九もので、長期間
にわたって所定の分解能を維持することのできる高信頼
性の超音波送受波プローブ及びその製造方法を提供する
ことを目的とする。(Problems to be Solved by the Invention) The present invention has been made in consideration of the above circumstances, and provides a highly reliable ultrasonic transceiver probe that can maintain a predetermined resolution over a long period of time, and a method for manufacturing the same. The purpose is to provide.
(11題を解決するための手段と作用)超音波吸収体上
に離間して併設された複数個の圧電振動素子間の空間内
面に振動素子強化膜を被着し、圧電振動素子の壁面の崩
壊に基因する超音波分解能の低下を防止するようにした
ものである。(Means and effects for solving Problem 11) A vibrating element reinforcing film is coated on the inner surface of the space between a plurality of piezoelectric vibrating elements spaced apart on an ultrasonic absorber, and the wall surface of the piezoelectric vibrating elements is This is to prevent a decrease in ultrasonic resolution due to collapse.
(実施例) 以下、本発明の一実施例を図面を参照して詳述する。(Example) Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.
第1図及び第2図に示すように、超音波吸収体(1)に
電極(2)とリード#!! (3)の取付けられた圧電
振動板(4)を貼着し、さらにこの上に充填材、例えば
アルミナ粉末が70%混入されし74波長の厚さを有す
るエポキシ樹脂からなる音響整合層(5)を配設する。As shown in Figures 1 and 2, the ultrasonic absorber (1) has an electrode (2) and a lead #! ! The piezoelectric diaphragm (4) with the attached piezoelectric diaphragm (3) is pasted on top of this, and an acoustic matching layer (5) made of an epoxy resin having a thickness of 74 wavelengths and containing 70% of a filler such as alumina powder is applied. ).
ついで、第3図に示すように、音響整合層(5)がその
上面に形成された圧電振動板(4)を砥石で切れ目を入
れ分割しく図に点線で示す。)、それぞれ互に独立した
複数個の圧電振動素子(6)・・・を形成する。Next, as shown in FIG. 3, the piezoelectric diaphragm (4) on which the acoustic matching layer (5) is formed is scored with a grindstone and divided into parts, which are shown by dotted lines in the figure. ), forming a plurality of mutually independent piezoelectric vibrating elements (6).
さらに、第4図に示すように、圧電振動素子(6)・・
・の空間(力・・・を形成する内面に、エポキシ樹脂(
例えば「アラルダイ) 103 J (商品名二日本チ
バガイギー社#))などからなる振動素子強化膜(8)
・・・をコーティングする。このとき、コーティング部
位を70℃程度に予熱して、エポキシ樹脂の粘度を低下
させ、余分なエポキシ樹脂を排出し、空間(7)・・・
が埋まらないようにする。つぎに、第5図に示すように
、剛性を有するエポキシ樹脂(9)を用い、互に分離し
て設けられた複数個の圧電振動素子(6)・・・の一方
の側の端部同士および他方の側の端部同士それぞれ全面
にわたって連結固着する。ついで、第6図及び第7図に
示すよう(、テフロンやポリエチレンなどの離型性のよ
いシー)Ql上に、例えば10〜20μmの厚さに例え
ば「スコッチウェルド1838 J(商品名:住友スリ
ーエム社製)などの接着剤をコーティングし、この上に
圧電振動素子(6)・・・をその表面に設けられた音響
整合層(5)をシート(IIに向けて載置する。ついで
、接着剤が硬化してのち、シートa1をはがすと、樹脂
薄膜αυが音響整合層(5)上に転写して形成される。Furthermore, as shown in FIG. 4, a piezoelectric vibrating element (6)...
・Epoxy resin (
For example, a vibrating element reinforcement film (8) made of "Araldai" 103 J (product name Nippon Ciba Geigy Co., Ltd. #))
...to be coated. At this time, the coating area is preheated to about 70°C to lower the viscosity of the epoxy resin, excess epoxy resin is discharged, and the space (7)...
Make sure that the area is not filled up. Next, as shown in FIG. 5, using a rigid epoxy resin (9), the ends of one side of a plurality of piezoelectric vibrating elements (6) separated from each other are connected to each other. and the ends of the other side are connected and fixed over the entire surface. Next, as shown in FIGS. 6 and 7, for example, ``Scotchweld 1838 J'' (trade name: Sumitomo 3M Co., Ltd. Coated with an adhesive such as (manufactured by Co., Ltd.), and placed on top of this an acoustic matching layer (5) with piezoelectric vibrating elements (6)... facing the sheet (II). After the agent is cured, when the sheet a1 is peeled off, a thin resin film αυ is transferred and formed on the acoustic matching layer (5).
つぎに、樹脂薄膜aυの上にシリコーン接着剤を介して
音響レンズa渇を接着し、第8図のように、超音波送受
波プローブを形成する。Next, an acoustic lens (a) is bonded onto the resin thin film (a) using a silicone adhesive to form an ultrasonic transmitting/receiving probe as shown in FIG.
このように形成され九超音波送受波プローブでは、圧電
振動素子(6)・・・の空間(7)を形成する内面に振
動素子強化膜(8)を形成したので、砥石により形成さ
れた圧電振動素子(6)・・・の内面が機械的に強化さ
れ、長期間にわたって使用しても崩壊することがなくな
り、空間(7)内に圧電振動素子(6)の崩落片が残留
することがない。したがって、各圧電振動素子(6)・
・・は、その上に形成された音響整合層(5)とともに
、それぞれ隣接のものとは、一定の空間を保ち、それぞ
れの圧電振動素子(6)・・・が、電気的並びに機械的
に結合することなく、それぞれの圧電振動素子(6)・
・・は独立した機能を果し、プローブとして動作させた
ときに送受波の波形が悪化することなく、長期間にわた
って良好な分解能を維持することができる。ちなみに、
第9図は、振動素子強化膜(8)がない場合の5000
時間使用後の受信波形、第10図はこの発明によるもの
で同じ(5000時間使用後の同一条件で得た受信波形
であるが、最大受信電圧はほとんど変わらないが、振動
の減衰性において、この発明によるものがきわめて良好
な結果を示しており、圧電振動素子(6)・・・の内壁
面の振動素子強化膜(8)による強化の効果がよく現わ
れている。In the nine ultrasonic transceiver probes formed in this way, the vibrating element reinforcing film (8) was formed on the inner surface of the piezoelectric vibrating elements (6) that forms the space (7). The inner surface of the vibrating element (6) is mechanically strengthened so that it will not collapse even after long-term use, and pieces of the piezoelectric vibrating element (6) will not remain in the space (7). do not have. Therefore, each piezoelectric vibrating element (6)
. . . together with the acoustic matching layer (5) formed thereon, each maintains a certain space from the adjacent one, and each piezoelectric vibrating element ( 6 ) . . . is electrically and mechanically Each piezoelectric vibrating element (6) without coupling.
... performs an independent function, and when operated as a probe, it is possible to maintain good resolution over a long period of time without deteriorating the waveforms of transmitted and received waves. By the way,
Figure 9 shows the 5000mm vibration element without the reinforcement membrane (8).
The received waveform after use for 5000 hours, Figure 10, is the same as that of the present invention. The one according to the invention shows very good results, and the effect of reinforcement by the vibrating element reinforcing film (8) on the inner wall surface of the piezoelectric vibrating element (6) is clearly visible.
なお、上記実施例における音響整合層は1層であるが、
例えば下層が樹脂に充填材を混合したもの及び上層が樹
脂だけからなる多層構造であってもよい。さらに、振動
素子強化膜(8)の材質は、エポキシ樹脂に限ることな
く、例えばポリエステル樹脂等でもよい。。Note that although the number of acoustic matching layers in the above embodiment is one layer,
For example, it may be a multilayer structure in which the lower layer is made of resin mixed with a filler and the upper layer is made of only resin. Furthermore, the material of the vibration element reinforcing film (8) is not limited to epoxy resin, and may be, for example, polyester resin. .
本発明は、圧電振動素子間の空間を形成する内壁面に振
動素子強化膜をコーティングするようにしたので、長期
間にわたって使用しても、内壁面の一部が崩壊して、崩
落片が空間内に残留することがない。したがって、各圧
電振動素子が、機械的且つ電気的に結合することなく、
独立した機能を果すことができる結果、寿命及び分解能
の良好な高信頼性の超音波送受波プローブを得ることが
できる。In the present invention, the inner wall surface forming the space between the piezoelectric vibrating elements is coated with a vibrating element reinforcing film, so even if used for a long period of time, part of the inner wall surface will collapse and fallen pieces will leave the space. It will not remain inside. Therefore, each piezoelectric vibrating element is not mechanically and electrically coupled.
As a result of being able to perform independent functions, a highly reliable ultrasonic transceiver probe with good longevity and resolution can be obtained.
第1図乃至第7図は本発明の一実施例の超音波送受波プ
ローブの製造方法の説明図、第8図は本発明の一実施例
の超音波送受波プローブの構成図、第9図及び第10図
はそれぞれ従来及び第8図に示す超音波送受波プローブ
による波形図、第11図は従°来技術の説明図である。
(1):超音波吸収体、 (5):音響整合層。
(6):圧電振動素子、 (7):空 間。
(8):振動素子強化膜、 0υ:樹脂薄膜。
0′J:音響レンズ。
′JIT3 図
第 + 図
第
δ
図
竿
田
第
γ
図
そ
10図1 to 7 are explanatory diagrams of a method for manufacturing an ultrasonic transceiver probe according to an embodiment of the present invention, FIG. 8 is a configuration diagram of an ultrasonic transceiver probe according to an embodiment of the present invention, and FIG. 9 10 are waveform diagrams obtained by the conventional ultrasonic wave transmitting/receiving probe shown in FIG. 8, respectively, and FIG. 11 is an explanatory diagram of the conventional technique. (1): Ultrasonic absorber, (5): Acoustic matching layer. (6): Piezoelectric vibration element, (7): Space. (8): Vibration element reinforcement film, 0υ: Resin thin film. 0′J: Acoustic lens. 'JIT3 Figure + Figure δ Figure Kanada No. γ Figure 10
Claims (2)
空間を介して互に離間独立して並設された複数個の圧電
振動素子と、これら圧電振動素子ごとにその上にそれぞ
れ設けられた音響整合層と、これら音響整合層上全面に
わたって一体形成された樹脂薄膜と、この樹脂薄膜上に
形成された音響レンズと、上記複数個の圧電振動素子の
一方の側の端部同士および他方の側の端部同士をそれぞ
れ連結固着した樹脂部材と、上記音響整合層の取付けら
れたそれぞれの圧電振動素子間に形成された上記空間内
面に被着された振動素子強化膜とを具備することを特徴
とする超音波送受波プローブ。(1) A holder made of an ultrasonic absorbing material, a plurality of piezoelectric vibrating elements arranged in parallel and separated from each other on this holder with a space between them, and each of these piezoelectric vibrating elements an acoustic matching layer provided, a resin thin film integrally formed over the entire surface of the acoustic matching layer, an acoustic lens formed on the resin thin film, and end portions on one side of the plurality of piezoelectric vibrating elements. and a resin member whose ends on the other side are connected and fixed to each other, and a vibrating element reinforcing film adhered to the inner surface of the space formed between each of the piezoelectric vibrating elements to which the acoustic matching layer is attached. An ultrasonic transceiver probe characterized by:
子を超音波吸収材からなる保持体上に互に分離して設け
る工程と、上記音響整合層の取付けられたそれぞれの圧
電振動素子間に形成された空間内面に合成樹脂を被着さ
せ振動素子強化膜を形成する工程と、上記複数個の圧電
振動素子の一方の側の端部同士および他方の側の端部同
士をそれぞれ樹脂部材により連結固着する工程と、上記
音響整合層上全面にわたって樹脂薄膜を一体成形する工
程と、上記樹脂薄膜上に音響レンズを形成する工程とを
具備することを特徴とする超音波送受波プローブの製造
方法。(2) A step of separately providing a plurality of piezoelectric vibrating elements each having an acoustic matching layer on a holder made of an ultrasonic absorbing material, and intervening between each piezoelectric vibrating element to which the acoustic matching layer is attached. A process of depositing a synthetic resin on the inner surface of the space formed to form a vibrating element reinforcing film, and bonding the ends of one side of the plurality of piezoelectric vibrating elements to each other and the ends of the other side with a resin member, respectively. manufacturing an ultrasonic wave transmitting/receiving probe, comprising the steps of: connecting and fixing the acoustic matching layer; integrally molding a resin thin film over the entire surface of the acoustic matching layer; and forming an acoustic lens on the resin thin film. Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1017573A JPH02200099A (en) | 1989-01-30 | 1989-01-30 | Ultrasonic wave transmission/reception probe and its manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1017573A JPH02200099A (en) | 1989-01-30 | 1989-01-30 | Ultrasonic wave transmission/reception probe and its manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02200099A true JPH02200099A (en) | 1990-08-08 |
Family
ID=11947654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1017573A Pending JPH02200099A (en) | 1989-01-30 | 1989-01-30 | Ultrasonic wave transmission/reception probe and its manufacture |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02200099A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6396198B1 (en) * | 1999-06-16 | 2002-05-28 | Ngk Spark Plug Co. Ltd. | Wave transmission-reception element for use in ultrasound probe, method for manufacturing the wave transmission-reception element and ultrasound probe incorporating the transmission-reception element |
JP2018093380A (en) * | 2016-12-05 | 2018-06-14 | セイコーエプソン株式会社 | Method for manufacturing ultrasonic device, method for manufacturing ultrasonic probe, method for manufacturing electronic equipment, and method for manufacturing ultrasonic imaging device |
-
1989
- 1989-01-30 JP JP1017573A patent/JPH02200099A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6396198B1 (en) * | 1999-06-16 | 2002-05-28 | Ngk Spark Plug Co. Ltd. | Wave transmission-reception element for use in ultrasound probe, method for manufacturing the wave transmission-reception element and ultrasound probe incorporating the transmission-reception element |
JP2018093380A (en) * | 2016-12-05 | 2018-06-14 | セイコーエプソン株式会社 | Method for manufacturing ultrasonic device, method for manufacturing ultrasonic probe, method for manufacturing electronic equipment, and method for manufacturing ultrasonic imaging device |
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