JPH0218947Y2 - - Google Patents

Description

[Detailed Description of the Invention] Industrial Field of Use The present invention relates to an IC socket that is attached to a printed wiring board and used for IC measurement, etc.

Conventional Structure and Problems Conventionally, this type of IC socket has an IC retainer cover pivotably attached to one end of an IC socket base on which a large number of contacts are planted, so that the IC retainer can be opened and closed, and the IC retainer is attached to the other end of the IC socket base. A lock lever is pivotally mounted to engage the end of the cover to hold the IC holding cover in a closed state. Therefore, if these IC sockets are installed in parallel close to the printed wiring board, each
Because the IC holding cover and lock lever of the IC socket interfere with each other, it is not possible to open the IC socket base of each IC socket at once, and the IC package cage must be stored and removed for each IC socket. Work efficiency is extremely poor.

Also, if each IC socket is mounted on the printed wiring board at a distance so that the IC holding cover and lock lever do not interfere with each other, a large dead space will be created between each IC socket when the IC is mounted.
Not only is it uneconomical, but it cannot be used unless there is sufficient space.

Purpose of the invention The purpose of the invention is to enable high-density mounting in the limited space of a printed wiring board, and to
An object of the present invention is to provide an IC socket that allows easy and quick storage and removal of the IC socket.

Structure of the invention As a means to achieve the above object, the present invention has two IC socket boards formed by arranging a plurality of IC socket board units in parallel in the front and back, and attaches them in pairs to a wiring board in parallel from side to side. A pair of IC retainer covers shared by each socket base unit group are pivotally supported on the outer edge of each IC socket base plate, and are opened and closed in a double-fold pattern onto both IC socket bases, and each IC retainer cover has a plurality of protrusions at its free end. In addition to protruding at intervals in the front and rear, the above-mentioned two sockets are provided between the inner edges of both socket bases.
A common locking device is disposed on the IC holding cover, and a plurality of locking members provided in the locking device are rotated or slid between the inner edges of the socket bases to lock each protrusion of each IC holding cover in the closed state. The structure is such that it can be connected to and disconnected from the

DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

First, the first embodiment will be explained. As shown in FIGS. 1 to 5, the IC socket of the present invention includes a pair of IC socket boards 1 and each IC socket board 1.
IC holding cover 2 has a double-opening shape and is connected so as to be openable and closable using the outer edge of the IC socket base 1 as a pivot point, and a locking device 3 engages with the free ends of both IC holding covers 2 between the inner edges of the IC socket base 1. ing.

Each IC socket board 1 in the illustrated example is composed of a plurality of, for example, four, IC socket board units 4 arranged in parallel at the front and back.

Each IC socket base unit 4 is provided with IC accommodating portions 5 at four locations in total: front, rear, left, and right.

Two sides (or four sides) corresponding to each IC housing section 5
A plurality of slits 6 are formed in parallel, a contact 7 is planted in each slit 6, and the contact portion 7
a projects above the slit 6.

Thus, one IC socket board 1 is constructed by combining the IC socket board units 4, and the two IC socket boards 1 are attached in pairs to the printed wiring board 27 in parallel on the left and right, and each row Connecting portions 8 are integrally provided at the front and back of the outside of each IC socket base unit 4 constituting the IC socket base 1, and a connecting hole 9 is provided in each connecting portion 8 on the same axis.
is penetrated.

On the other hand, the IC holding cover 2 is formed to have approximately the same width and length as the IC socket board 1 made up of the four IC socket board units 4, and has a pad on its inner surface that holds down the IC 10 placed on the contact portion 7a of the contact 7. 11 is provided protrudingly.

A connecting part 12 is integrally provided on the inner edge of each IC holding cover 2 to be inserted between the connecting parts 8 of each IC socket base unit 4, and a connecting hole 13 is formed in each connecting part 12 on the same axis. It has been penetrated.

Thus, the IC socket base units 4 are arranged in parallel in the front and back, and the connecting portion 12 of the IC holding cover 2 is inserted between the connecting portions 8 of each IC socket base unit 4.
A connecting shaft 14 is inserted into the connecting holes 9, 13 of both the connecting parts 8, 12 and is prevented from coming out. That is, each
The IC socket base unit 4 and the IC retainer cover 2 are connected by a hinge mechanism 15 consisting of connecting portions 8, 12 and a connecting shaft 14, and the four IC socket base units 4 are connected to each other by the connection by this hinge mechanism 15. One IC socket board 1
It consists of This hinge mechanism 15 allows IC
The presser cover 2 can be opened and closed in a double-door pattern with respect to the upper surface of the IC socket board 1.

Both IC socket boards 1, 1 are attached to the outer edge of each IC socket board 1, which is installed in parallel on the left and right sides of the wiring board 27 as described above.
A pair of socket base units 4, which are shared by each socket base unit 4, which opens and closes on the IC socket bases 1, 1 in a double-door pattern.
In addition to pivotally supporting the IC holding covers 2, 2, a common locking device 3 is disposed between the inner edges of both the socket bases 1, 1, and the locking device 3 is provided with a common locking device 3 on each of the protrusions 25. A plurality of lock members 21 which can be engaged and disengaged are provided, and the lock members 21 are arranged at intervals in the front and back between the inner edges of both the socket bases 1, 1.

A pair of protrusions 16 are protruded from the center of the inner edge side of each IC socket base unit 4 constituting each IC socket base 1, and a vertical groove 17 is formed between them. Through hole 1
8 is formed.

Connecting shafts 19 are inserted into these through holes 18, and retaining members 20 are engaged with both ends of the connecting shafts 19, and these retaining members 20 are attached to the outer wall surfaces of the IC socket base unit 4 on both the front and rear sides. It is designed to be engaged and held in a non-removal state.

The base of the hook-shaped locking member 21 is inserted between the opposing surfaces of the protrusions 16 of each IC socket base unit 4 in each IC socket base 1, and as is particularly clear from FIGS. A round rod-shaped shaft portion 22 protruding horizontally from the groove 1
The connecting shaft 19 inserted into the groove 7 crosses the groove to prevent the connecting shaft 19 from coming out and to be rotatably supported. An engaging surface 24 is formed on the inner surface of the distal end hook portion of each hook-shaped locking member 21, and this engaging surface 24 is concavely shaped into an arcuate surface.

On the other hand, at the free end of the IC holding cover 2, a plurality of protrusions 25 which are engaged with hook-shaped locking members 21 are integrally provided at intervals in the front and back.
An engagement surface 26 on the outer surface thereof is projected in an arcuate shape to correspond to the engagement surface 24 described above. Further, the front end of the engagement surface 24 of the hook-like locking member 21 is formed into an inclined surface 21a whose tip side gradually faces upward, making it easy to engage with the engagement surface 26 of the protrusion 25.

As described above, the pair of IC socket boards 1, which are connected to the IC holding cover 2 so as to be openable and closable by the hinge mechanism 15, are placed in parallel and attached to the printed wiring board 27 (Figs. 2, 3, 7, and 8). (See) As described above, the shaft portion 22 of each hook-shaped locking member 21 is sandwiched from all sides by the wall of the groove 17, the connecting shaft 19, and the printed wiring board 27, and is rotatably supported. In this state, both IC holding covers 2 are connected to both IC socket bases 1 by a hinge mechanism 15 in a double-folding manner.

7A and 8 with both IC retainer covers 2 open as shown in FIGS. 1 to 4.
As shown in FIG. A, the hook-like lock member 21 is rotated to the open state, and the IC 10 is placed on the contact portion 7a of the contact 7 in each IC accommodating portion 5.
Next, both IC holding covers 2 are rotated via the hinge mechanism 15 as shown in FIG. The inner edges of the two are almost butted.

Thereafter, as shown in FIGS. 5, 6, 7B, and 8B, the hook-shaped locking member 21 is rotated, and its engaging surface 24 is aligned with the protrusion 25 of both IC holding covers 2. By engaging with the engaging surface 26 of the IC presser cover 2, the IC presser cover 2 can be locked in a state in which the IC is pressed against the contact portion 7a of the contact plate 7.

On the contrary, the hook-shaped locking member 21 is
Rotate the protrusion 2 as shown in Figure A and Figure 8A.
By opening 5, both IC presser covers 2 are removed.
By rotating the IC socket base 1 to the outside, the IC socket base 1 can be opened. Therefore, the IC inside the IC socket board 1 can be taken out.

9 to 12 show a second embodiment of the locking device 3 of the present invention.

In this embodiment, a horizontal guide 28 is integrally provided in a straight line at the upper part of the inner edge of each IC socket board unit 4 constituting each IC socket board 1, and a groove 29 is formed below the guide. Sliders 3 are provided between the groove 29 and the printed wiring board 27 on both sides of the base connecting portion 30 of the hook-shaped locking member 21.
1 is slidably supported, and by sliding these hook-like locking members 21, the protrusions 25 of both IC holding covers 2 are brought into a butt state and engaged as shown in FIG. 12B, or as shown in FIG. It is opened as shown in A. This embodiment has the advantage that the hook-like locking member 21 can be operated in one step compared to the rotary type of the above-mentioned embodiment.

Figures 13 to 16 show the locking device 3 of the present invention.
This shows a third embodiment of the invention. In this embodiment, each IC socket board unit 4 constituting each IC socket board 1 is constructed in the same manner as in the second embodiment described above.
A horizontal guide 28 is installed in a straight line on the upper part of the inner edge of the
are integrally provided, a groove 29 is formed on the lower side, and between the groove 29 and the printed wiring board 27, there are twice as many base connecting portions 30 of the hook-like lock members 21 as in each of the above embodiments. Sliders 31 provided on both sides are slidably fitted together.

On the other hand, the protrusions 25a and 25 of both IC holding covers 2
b are different from each of the above embodiments, and are arranged at positions shifted from each other.

Then, as shown in FIG. 16B, the engaging surfaces 24 of the hook-like locking members 21 are engaged with the engaging surfaces 26 of the protrusions 25a, 25b of both IC holding covers 2 by sliding the hook-like locking members 21, respectively. or the first
It can be opened as shown in Figure 6A. Although not particularly shown in this embodiment, when both IC presser covers 2 are closed, the protrusions 2 on both IC presser covers 2
5a and 25b are arranged in a line, thereby further narrowing the width of the hook-like lock member 21, that is, the distance between both IC socket bases 1.

The present invention can be modified in various other ways without departing from the basic technical idea.

Effects of the Idea In IC measurement work, a large number of IC sockets are densely mounted on a wiring board, and they are placed all at once into a high-temperature furnace and measured. In order to perform this IC measurement work efficiently, the IC groups must be mounted more densely on the wiring board, the IC holding cover group of each socket can be easily opened and closed, and the IC group can be extracted and removed easily.
Reloading can be done quickly, and when the IC holding cover and locking member are opened, the
It is desirable to have a structure that does not interfere with the IC socket group. The present invention satisfies each of the above conditions and responds to the demand for efficiently performing IC measurements. That is, in the present invention, a plurality of IC socket base units are closely arranged in parallel to form one socket base, and the IC
A pair of IC socket boards consisting of a group of socket board units are mounted in parallel on a wiring board, and an IC holding cover shared by the group of IC socket board units is pivotally attached to the outer edge of each IC socket board. On the other hand, a common locking device is arranged between the inner edges of both the above IC socket bases, and
Since the locking device is configured to include a plurality of locking members that rotate or slide between the same inner edges and engage and disengage from a plurality of protrusions protruding from the free end of the IC holding cover, the IC socket base In addition to being able to mount units more densely and with high density, the common locking member placed between the inner edges of the left and right IC socket boards can be rotated or slid between the inner edges to open and close the common IC holding cover all at once. Therefore, IC loading and extraction operations can be performed easily and quickly, and in addition to the above-mentioned high-density packaging being possible, measurement operations can be performed efficiently. In addition, when a pair of IC retainer covers are attached to one IC socket base unit, or when an IC retainer cover and a lock lever are attached, when each cover and lever of each socket base unit are released, the This creates a lot of dead space on the back for opening and closing, but also increases the chance of interference with the adjacent socket base unit for opening and closing, but according to the present invention, these problems can be eliminated as much as possible. It is.

[Brief explanation of the drawing]

1 to 8 show a first embodiment of the IC socket of the present invention, in which FIG. 1 is a plan view with the IC retaining cover opened, and FIGS. Figure 1 is a partially cutaway front view, side view, and partially cutaway perspective view, Figure 5 is a perspective view with the IC holding cover closed, Figure 6 is an enlarged perspective view of the locking device, and Figures 7A and B. and Figures 8A and B are - of Figure 1, respectively.
The operation explanatory diagrams corresponding to the arrow view and -arrow view, FIGS. 9 to 12 show the second embodiment of the present invention,
Figure 9 is a plan view of the IC socket with the IC retaining cover opened, Figures 10 and 11 are a partially cutaway front view and side view of Figure 9, respectively, and Figures 12 A and B.
is an explanatory diagram of the operation corresponding to the XII-XII arrow view in FIG. 9, FIGS. 13 to 16 show the third embodiment of the present invention, and FIG.
The IC socket plan view, Figures 14 and 15 are the partially cutaway front view and side view of Figure 13, respectively.
6A and 6B are operation explanatory diagrams corresponding to the - arrow view in FIG. 13. 1...IC socket base, 2...IC presser cover,
3... Lock device, 4... IC socket base unit, 5... IC housing section, 7... Contact, 1
5... Hinge mechanism, 21... Lock member, 24...
...Engagement surface, 25, 25a, 25b...Protrusion, 26
...Engagement surface, 27...Printed wiring board, 28...
...Guide, 29...Groove.

Claims (1)

[Claims for Utility Model Registration] (1) One IC socket board 1 is formed by arranging a plurality of IC socket board units 4 . Install them in parallel on the left and right, and
Each socket base unit 4 which opens and closes in a double door shape onto both IC socket bases 1, 1 on the outer edge of the IC socket bases 1, 1...A pair of common IC retainer covers 2, 2 are pivotally supported, and each IC retainer cover 2,
A plurality of protrusions 25 are protruded from the free end of 2 at intervals in the front and back, and a locking device 3 shared by both the IC holding covers 2, 2 is disposed between the inner edges of both the socket bases 1, 1. The locking device 3 is provided with a plurality of locking members 21 disposed at intervals in the front and back between the inner edges of the socket bases 1, 1, and each lock member is attached to the socket bases 1, 1.
1. An IC socket characterized in that the IC socket is actuated between the inner edges of the IC socket 1 and engaged with and disengaged from each protrusion 25 of each IC holding cover 2, 2 in the closed state. (2) The above locking device 3 is connected to both IC socket boards 1,
1. The IC socket according to claim 1, which comprises a plurality of lock members 21 rotatably supported between inner edges of the IC socket. (3) The above locking device 3 is connected to both IC socket boards 1,
1. The IC socket according to claim 1, which is comprised of a plurality of lock members 21 slidably supported between inner edges.