JPH0218677B2 - - Google Patents
Info
- Publication number
- JPH0218677B2 JPH0218677B2 JP59142823A JP14282384A JPH0218677B2 JP H0218677 B2 JPH0218677 B2 JP H0218677B2 JP 59142823 A JP59142823 A JP 59142823A JP 14282384 A JP14282384 A JP 14282384A JP H0218677 B2 JPH0218677 B2 JP H0218677B2
- Authority
- JP
- Japan
- Prior art keywords
- strip
- base paper
- shaped base
- aperture
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 8
- 238000005553 drilling Methods 0.000 description 8
- 238000004080 punching Methods 0.000 description 6
- 241000208125 Nicotiana Species 0.000 description 1
- 235000002637 Nicotiana tabacum Nutrition 0.000 description 1
- 235000019504 cigarettes Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〔発明の技術分野〕
この発明は、例えばタバコフイルタ巻紙用の帯
状原紙に、パルスレーザビームにより間欠的に形
成した開孔の品質チエツクを行うレーザ開孔装置
に関するものである。[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a laser perforation device for checking the quality of perforations formed intermittently with a pulsed laser beam in, for example, a strip of base paper for cigarette filter wrapping paper. be.
従来この種のレーザ開孔装置としては、第１図
に示すものがあつた。第１図は従来のレーザ開孔
装置を示す概略構成図である。図において、１は
パルスレーザ発振器、２はパルスレーザ発振器１
から発生されたパルスレーザビーム、３はパルス
レーザビーム２を集光照射る加工ヘツド、４は、
例えばタバコフイルタ巻紙用の帯状原紙、５は帯
状原紙４を、第１図の矢印方向に送給するロー
ラ、６は帯状原紙４上へのパルスレーザビーム２
の集光照射により形成された開孔である。
A conventional laser hole drilling device of this type is shown in FIG. FIG. 1 is a schematic diagram showing a conventional laser hole drilling device. In the figure, 1 is a pulse laser oscillator, 2 is a pulse laser oscillator 1
3 is a processing head that condenses and irradiates the pulsed laser beam 2; 4 is a processing head that emits the pulsed laser beam 2;
For example, a strip-shaped base paper for tobacco filter wrapping paper, 5 is a roller that feeds the strip-shaped base paper 4 in the direction of the arrow in FIG. 1, and 6 is a pulse laser beam 2 directed onto the strip-shaped base paper 4.
This is an opening formed by focused irradiation.
上記第１図に示す様な構成を有する従来のレー
ザ開孔装置では、パルスレーザ発振器１から発生
されたパルスレーザビーム２は、加工ヘツド３を
介して帯状原紙４上に集光照射される。帯状原紙
４はローラ５の駆動により、約150m／minの高
速度にて、第１図の矢印方向に移動されているか
ら、加工ヘツド３から帯状原紙４上に集光照射さ
れるパルスレーザビーム２により、帯状原紙４に
は、所定の間隔Ｐを置いた多数の開孔６が形成さ
れる。 In the conventional laser hole punching apparatus having the configuration as shown in FIG. Since the strip-shaped base paper 4 is being moved in the direction of the arrow in FIG. 1 at a high speed of about 150 m/min by the drive of the roller 5, a pulsed laser beam is focused and irradiated onto the strip-shaped base paper 4 from the processing head 3. 2, a large number of openings 6 are formed in the strip-shaped base paper 4 at predetermined intervals P.
従来のレーザ開孔装置は以上の様に構成されて
おり、パルスレーザビーム２により高速度で移動
する帯状原紙４に開孔６を形成する場合、間欠的
に形成された開孔６が所定の大きさの開孔面積を
もつて正確に形成されているかどうか、すなわち
開孔６の品質が適切であるかどうかを調べる必要
がある。ところが、帯状原紙４は非常に高速で移
動しているため、レーザ開孔装置の運転中に目視
により開孔６の品質チエツクをすることができ
ず、このため、適宜にレーザ開孔装置の運転を停
止して開孔６の品質チエツクを行わなければなら
ない。この結果、帯状原紙４上に形成された開孔
６の品質チエツクにははん繁な操作が必要とな
り、また、常時、開孔６の品質を監視することが
できないなどの欠点があつた。 The conventional laser perforation device is configured as described above, and when the pulsed laser beam 2 forms the perforations 6 in the strip-shaped base paper 4 moving at high speed, the perforations 6 formed intermittently form a predetermined position. It is necessary to check whether the apertures 6 are formed accurately with the appropriate aperture area, that is, whether the quality of the apertures 6 is appropriate. However, since the strip-shaped base paper 4 is moving at a very high speed, it is not possible to visually check the quality of the holes 6 while the laser hole punching device is in operation. must be stopped to check the quality of the aperture 6. As a result, checking the quality of the apertures 6 formed on the strip-shaped base paper 4 requires numerous operations, and the quality of the apertures 6 cannot be constantly monitored.
この発明は、上記の様な従来のものの欠点を改
善する目的でなされたもので、パルスレーザ発振
器からのパルスレーザビームを、移動する帯状原
紙に集光照射して開孔を形成する装置において、
前記帯状原紙に形成した開孔の部分に光を照射す
る光源と、この開孔の部分を通過する前記光源か
らの光量を検出する受光器とを備えるか、あるい
は、前記帯状原紙に形成した開孔の部分にガスを
噴射する圧力源と、この開孔の部分を通過する前
記圧力源からのガス量又はガス圧力を検出する受
圧器とを備えて成る構成を有し、簡単な構成によ
り、帯状原紙を高速度で移動させているレーザ開
孔装置の運転中においても、常時帯状原紙に形成
した開孔の品質チエツクを正確に行うことができ
るレーザ開孔装置を提供するものである。
This invention was made with the aim of improving the above-mentioned drawbacks of the conventional ones, and is an apparatus for forming holes by condensing a pulsed laser beam from a pulsed laser oscillator onto a moving strip-shaped base paper.
A light source that irradiates light onto the apertures formed in the base paper strip, and a light receiver that detects the amount of light from the light source that passes through the apertures; It has a configuration comprising a pressure source that injects gas into the hole portion, and a pressure receiver that detects the amount of gas or gas pressure from the pressure source passing through the hole portion, and has a simple configuration, To provide a laser hole punching device that can always accurately check the quality of holes formed in a strip of base paper even when the laser hole punching device is moving the strip of base paper at high speed.
以下、この発明の実施例を図について説明す
る。第２図はこの発明の一実施例であるレーザ開
孔装置を示す概略構成図で、第１図と同一部分は
同一符号を用いて表示してあり、その詳細な説明
は省略する。図において、７は帯状原紙４に形成
した開孔６の部分に光を照射するため、加工ヘツ
ド３の下流側に別個に設けた光源、８は帯状原紙
４に形成した開孔６の部分を通過する光源７から
の光量を検出する受光器、９は受光器８の受ける
受光量において、この平均受光量が、所定の上限
制御レベル又は下限制御レベルをそれぞれ越える
時に警告音を発生する警報器である。パルスレー
ザ発振器１は、受光器８の受ける受光量に比例し
て制御される様に構成される。その他の構成は、
上記第１図に示されるものと同様に構成されてい
る。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 2 is a schematic diagram showing a laser hole drilling apparatus according to an embodiment of the present invention, and the same parts as those in FIG. 1 are designated by the same reference numerals, and detailed explanation thereof will be omitted. In the figure, 7 is a light source separately provided on the downstream side of the processing head 3 in order to irradiate light onto the apertures 6 formed in the strip-shaped base paper 4, and 8 is a light source that illuminates the apertures 6 formed in the strip-shaped base paper 4. A light receiver that detects the amount of light from the light source 7 passing through the light source 7, and an alarm device 9 that generates a warning sound when the average amount of light received by the light receiver 8 exceeds a predetermined upper limit control level or lower limit control level, respectively. It is. The pulse laser oscillator 1 is configured to be controlled in proportion to the amount of light received by the light receiver 8. Other configurations are
The structure is similar to that shown in FIG. 1 above.
上記第２図に示す様な構成を有するこの発明の
一実施例であるレーザ開孔装置では、上記第１図
に示す従来のレーザ開孔装置と同様に、パルスレ
ーザ発振器１から発生されたパルスレーザビーム
２は、加工ヘツド３を介して帯状原紙４上に集光
照射される。帯状原紙４はローラ５の駆動によ
り、約150m／minの高速度にて、第２図の矢印
方向に移動されているから、加工ヘツド３から帯
状原紙４上に集光照射されるパルスレーザビーム
２により、帯状原紙４には、所定の間隔Ｐを置い
た多数の開孔６が形成される。 In the laser hole drilling apparatus which is an embodiment of the present invention having the configuration shown in FIG. 2 above, the pulses generated from the pulsed laser oscillator 1 are The laser beam 2 is condensed and irradiated onto the strip-shaped base paper 4 via the processing head 3. Since the strip-shaped base paper 4 is being moved at a high speed of about 150 m/min in the direction of the arrow in FIG. 2, a large number of openings 6 are formed in the strip-shaped base paper 4 at predetermined intervals P.
上述した様な構成を有するレーザ開孔装置にお
いて、パルスレーザビーム２により高速度で移動
する帯状原紙４に開孔６を形成する場合、帯状原
紙４に間欠的に形成された開孔６が、所定の大き
さの開孔面積をもつて正確に形成されているかど
うかという、開孔６の品質のチエツクをすること
が必要となる。ところが、この発明によるレーザ
開孔装置では、帯状原紙４を高速度で移動させて
いるレーザ開孔装置の運転中においても、帯状原
紙４に形成した開孔６の部分に光源７から光を照
射し、上記開孔６の部分を通過する光源７からの
光量を受光器８によつて検出する様にしている。
すなわち、第３図に示す様に、光源７の光源光量
L1に対し、間欠的に形成された開孔６の開孔面
積に比例して、それぞれの開孔６を通過する通過
光量L2を受光器８によつて検出する。そして、
各開孔６を通過する通過光量L2の平均受光量L3
を求め、この平均受光量L3が、所定の上限制御
レベル（CUL）又は下限制御レベル（LCL）を
それぞれ越えた時に、警報器９から警告音を発生
させる様にする。これにより、帯状原紙４に間欠
的に形成された開孔６が、所定の大きさの開孔面
積をもつて正確に形成されているかどうかとい
う、開孔６の品質のチエツクを容易に行うことが
可能となる。 In the laser aperture device having the above-described configuration, when forming apertures 6 in the strip-shaped base paper 4 moving at high speed using the pulsed laser beam 2, the apertures 6 intermittently formed in the strip-shaped base paper 4 are It is necessary to check the quality of the apertures 6 to see if they are accurately formed with a predetermined aperture area. However, in the laser perforation device according to the present invention, even when the laser perforation device is moving the strip-shaped base paper 4 at high speed, the light source 7 does not irradiate the portion of the opening 6 formed in the strip-shaped base paper 4 with light. The amount of light from the light source 7 passing through the aperture 6 is detected by a light receiver 8.
That is, as shown in FIG. 3, the amount of light from the light source 7
The amount of light L 2 passing through each of the apertures 6 is detected by the light receiver 8 in proportion to the aperture area of the apertures 6 that are intermittently formed with respect to L 1 . and,
The average amount of light received L 3 of the amount of light passing through each aperture 6 L 2
is determined, and when this average amount of received light L3 exceeds a predetermined upper limit control level (CUL) or lower limit control level (LCL), the alarm device 9 is made to emit a warning sound. This makes it easy to check the quality of the apertures 6, that is, whether or not the apertures 6 intermittently formed in the strip-shaped base paper 4 are accurately formed with a predetermined aperture area. becomes possible.
第４図はこの発明の変形例であるレーザ開孔装
置を示す概略構成図である。第４図に示すレーザ
開孔装置では、上記第２図に示すレーザ開孔装置
において、光源７の代りに、空気等のガスを噴射
る圧力源１０を、また、受光器８の代りに、開孔
６の部分を通過する圧力源１０からのガス量又は
ガス圧力を検出する受圧器１１を、それぞれ置き
換えて使用した構成を有しており、その他の構成
は、第２図に示されるものと同様に構成されてい
る。 FIG. 4 is a schematic configuration diagram showing a laser hole drilling device which is a modified example of the present invention. In the laser hole punching device shown in FIG. 4, in the laser hole punching device shown in FIG. It has a configuration in which the pressure receiver 11 that detects the gas amount or gas pressure from the pressure source 10 passing through the opening 6 is used in place of each other, and the other configuration is as shown in FIG. It is configured in the same way.
上述した様に、第２図に示すレーザ開孔装置
が、開孔６の部分を通過する光源７からの光量を
受光器８により検出する様にしたものに対し、第
４図に示す様に構成されたレーザ開孔装置では、
開孔６の部分を通過する圧力源１０からのガス量
又はガス圧力を受圧器１１により検出する様にし
たものであり、この場合にも、上記第２図に示す
レーザ開孔装置と同様に、帯状原紙４に間欠的に
形成された開孔６の品質のチエツクを行うことが
できる。 As mentioned above, in contrast to the laser aperture device shown in FIG. 2 in which the amount of light from the light source 7 passing through the aperture 6 is detected by the receiver 8, the laser aperture device shown in FIG. In the configured laser aperture device,
The gas amount or gas pressure from the pressure source 10 passing through the aperture 6 is detected by the pressure receiver 11, and in this case as well, the laser aperture device shown in FIG. , the quality of the openings 6 formed intermittently in the strip-shaped base paper 4 can be checked.
この発明は以上説明した様に、レーザ開孔装置
において、加工ヘツドの下流側に別個に設けた光
源と受光器とを用い、帯状原紙に形成した開孔の
部分を通過する光量により開孔面積を検出、判定
する様に構成するか、又は、加工ヘツドの下流側
に別個に設けた圧力源と受圧器とを用い、帯状原
紙に形成した開孔の部分を通過するガス量又はガ
ス圧力により開孔面積を検出、判定する様に構成
したので、従来のこの種のレーザ開孔装置に比べ
て、帯状原紙を高速度で移動させているレーザ開
孔装置の運転中においても、常時、帯状原紙に形
成した開孔の品質チエツクを正確に、かつ容易に
行うことができるという優れた効果を奏るもので
ある。
As explained above, the present invention uses a light source and a light receiver separately provided downstream of a processing head in a laser perforation device, and determines the perforation area by determining the amount of light passing through the perforation portion formed in the strip-shaped base paper. or by using a pressure source and a pressure receiver separately installed downstream of the processing head, based on the amount of gas passing through the openings formed in the strip of paper or the gas pressure. Since the structure is configured to detect and judge the perforation area, compared to conventional laser perforation devices of this type, even when the laser perforation device is in operation, which moves the strip of base paper at high speed, the strip This provides an excellent effect in that the quality of the holes formed in the base paper can be accurately and easily checked.
第１図は従来のレーザ開孔装置を示す概略構成
図、第２図はこの発明の一実施例であるレーザ開
孔装置を示す概略構成図、第３図は、第２図のレ
ーザ開孔装置における光源光量、通過光量及び平
均受光量の関係を示す特性図、第４図はこの発明
の変形例であるレーザ開孔装置を示す概略構成図
である。
図において、１…パルスレーザ発振器、２…パ
ルスレーザビーム、３…加工ヘツド、４…帯状原
紙、５…ローラ、６…開孔、７…光源、８…受光
器、９…警報器、１０…圧力源、１１…受圧器で
ある。なお、各図中、同一符号は同一又は相当部
分を示す。
FIG. 1 is a schematic configuration diagram showing a conventional laser hole drilling device, FIG. 2 is a schematic configuration diagram showing a laser hole drilling device which is an embodiment of the present invention, and FIG. 3 is a schematic diagram showing the laser hole drilling device of FIG. 2. FIG. 4 is a characteristic diagram showing the relationship between the amount of light from the light source, the amount of passing light, and the average amount of received light in the device. FIG. 4 is a schematic configuration diagram showing a laser aperture device as a modification of the present invention. In the figure, 1...pulse laser oscillator, 2...pulse laser beam, 3...processing head, 4...belt-shaped base paper, 5...roller, 6...opening, 7...light source, 8...light receiver, 9...alarm, 10... Pressure source, 11...pressure receiver. In each figure, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ムを、加工ヘツドから移動する帯状原紙に集光照
射して開孔を形成する装置において、前記帯状原
紙に形成した開孔の部分に光を照射するため、前
記加工ヘツドの下流側に別個に設けた光源と、こ
の開孔の部分を通過する前記光源からの光量を検
出する受光器とを備えて成ることを特徴とするレ
ーザ開孔装置。 ２ パルスレーザ発振器からのパルスレーザビー
ムを、加工ヘツドから移動する帯状原紙に集光照
射して開孔を形成する装置において、前記帯状原
紙に形成した開孔の部分にガスを噴射するため、
前記加工ヘツドの下流側に別個に設けた圧力源
と、この開孔の部分を通過する前記圧力源からの
ガス量又はガス圧力を検出する受圧器とを備えて
成ることを特徴とするレーザ開孔装置。[Scope of Claims] 1. In an apparatus that forms apertures by condensing and irradiating a pulsed laser beam from a pulsed laser oscillator onto a strip-shaped base paper moving from a processing head, the laser beam is applied to a portion of the aperture formed in the strip-shaped base paper. A laser aperture comprising: a light source separately provided downstream of the processing head to irradiate the aperture; and a light receiver that detects the amount of light from the light source that passes through the aperture. Device. 2. In a device that forms apertures by condensing and irradiating a pulsed laser beam from a pulsed laser oscillator onto a strip-shaped base paper moving from a processing head, in order to inject gas into the apertures formed in the strip-shaped base paper,
A laser aperture machine characterized by comprising: a pressure source provided separately on the downstream side of the processing head; and a pressure receiver that detects the amount of gas or gas pressure from the pressure source passing through the aperture. hole device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142823A JPS6120682A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59142823A JPS6120682A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6120682A JPS6120682A (en) | 1986-01-29 |
| JPH0218677B2 true JPH0218677B2 (en) | 1990-04-26 |
Family
ID=15324453
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59142823A Granted JPS6120682A (en) | 1984-07-10 | 1984-07-10 | Laser drilling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6120682A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51148896A (en) * | 1975-06-16 | 1976-12-21 | Toshiba Corp | Method of machining workp iece by way of laser beam |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS52134197U (en) * | 1976-04-07 | 1977-10-12 |
-
1984
- 1984-07-10 JP JP59142823A patent/JPS6120682A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51148896A (en) * | 1975-06-16 | 1976-12-21 | Toshiba Corp | Method of machining workp iece by way of laser beam |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6120682A (en) | 1986-01-29 |
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