JPH02186354A - Photosensitive planographic printing plate treated with anionic surfactant - Google Patents
Photosensitive planographic printing plate treated with anionic surfactantInfo
- Publication number
- JPH02186354A JPH02186354A JP467589A JP467589A JPH02186354A JP H02186354 A JPH02186354 A JP H02186354A JP 467589 A JP467589 A JP 467589A JP 467589 A JP467589 A JP 467589A JP H02186354 A JPH02186354 A JP H02186354A
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive
- printing plate
- support
- lithographic printing
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003945 anionic surfactant Substances 0.000 title claims abstract description 15
- 239000007864 aqueous solution Substances 0.000 claims description 24
- 238000011282 treatment Methods 0.000 abstract description 25
- 239000000126 substance Substances 0.000 abstract description 17
- 238000011161 development Methods 0.000 abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 13
- 239000000203 mixture Substances 0.000 description 32
- -1 polyoxyethylene Polymers 0.000 description 28
- 229920005989 resin Polymers 0.000 description 28
- 239000011347 resin Substances 0.000 description 28
- 238000000576 coating method Methods 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 17
- 238000000034 method Methods 0.000 description 16
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 15
- 229910052782 aluminium Inorganic materials 0.000 description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 15
- 150000001875 compounds Chemical class 0.000 description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 11
- 239000000178 monomer Substances 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 9
- 239000000243 solution Substances 0.000 description 9
- 206010016807 Fluid retention Diseases 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 8
- 238000011156 evaluation Methods 0.000 description 7
- 239000007788 liquid Substances 0.000 description 7
- 229920003986 novolac Polymers 0.000 description 7
- 238000007788 roughening Methods 0.000 description 7
- 229920002554 vinyl polymer Polymers 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 6
- 150000002989 phenols Chemical class 0.000 description 6
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- NBIIXXVUZAFLBC-UHFFFAOYSA-N phosphoric acid Substances OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 5
- 239000004094 surface-active agent Substances 0.000 description 5
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 4
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 4
- 229910017604 nitric acid Inorganic materials 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000011342 resin composition Substances 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 125000001424 substituent group Chemical group 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000001299 aldehydes Chemical class 0.000 description 3
- 239000003513 alkali Substances 0.000 description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 150000003254 radicals Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- ROVRRJSRRSGUOL-UHFFFAOYSA-N victoria blue bo Chemical compound [Cl-].C12=CC=CC=C2C(NCC)=CC=C1C(C=1C=CC(=CC=1)N(CC)CC)=C1C=CC(=[N+](CC)CC)C=C1 ROVRRJSRRSGUOL-UHFFFAOYSA-N 0.000 description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-UHFFFAOYSA-N Acetaldehyde Chemical compound CC=O IKHGUXGNUITLKF-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 2
- YRKCREAYFQTBPV-UHFFFAOYSA-N acetylacetone Chemical compound CC(=O)CC(C)=O YRKCREAYFQTBPV-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- HRBFQSUTUDRTSV-UHFFFAOYSA-N benzene-1,2,3-triol;propan-2-one Chemical compound CC(C)=O.OC1=CC=CC(O)=C1O HRBFQSUTUDRTSV-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 229920006026 co-polymeric resin Polymers 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 150000008049 diazo compounds Chemical class 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- BJZIJOLEWHWTJO-UHFFFAOYSA-H dipotassium;hexafluorozirconium(2-) Chemical compound [F-].[F-].[F-].[F-].[F-].[F-].[K+].[K+].[Zr+4] BJZIJOLEWHWTJO-UHFFFAOYSA-H 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 238000005868 electrolysis reaction Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- FJKIXWOMBXYWOQ-UHFFFAOYSA-N ethenoxyethane Chemical compound CCOC=C FJKIXWOMBXYWOQ-UHFFFAOYSA-N 0.000 description 2
- SUPCQIBBMFXVTL-UHFFFAOYSA-N ethyl 2-methylprop-2-enoate Chemical compound CCOC(=O)C(C)=C SUPCQIBBMFXVTL-UHFFFAOYSA-N 0.000 description 2
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical compound CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 2
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Chemical compound CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 150000002367 halogens Chemical class 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 229910001507 metal halide Inorganic materials 0.000 description 2
- 150000005309 metal halides Chemical class 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 150000002825 nitriles Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 2
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 2
- 229920001568 phenolic resin Polymers 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 238000006068 polycondensation reaction Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 229920005749 polyurethane resin Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 238000010186 staining Methods 0.000 description 2
- 229940124530 sulfonamide Drugs 0.000 description 2
- MGSRCZKZVOBKFT-UHFFFAOYSA-N thymol Chemical compound CC(C)C1=CC=C(C)C=C1O MGSRCZKZVOBKFT-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 239000002023 wood Substances 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- HZBSQYSUONRRMW-UHFFFAOYSA-N (2-hydroxyphenyl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1=CC=CC=C1O HZBSQYSUONRRMW-UHFFFAOYSA-N 0.000 description 1
- QPVRKFOKCKORDP-UHFFFAOYSA-N 1,3-dimethylcyclohexa-2,4-dien-1-ol Chemical compound CC1=CC(C)(O)CC=C1 QPVRKFOKCKORDP-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- DNJRKFKAFWSXSE-UHFFFAOYSA-N 1-chloro-2-ethenoxyethane Chemical compound ClCCOC=C DNJRKFKAFWSXSE-UHFFFAOYSA-N 0.000 description 1
- KTZVZZJJVJQZHV-UHFFFAOYSA-N 1-chloro-4-ethenylbenzene Chemical compound ClC1=CC=C(C=C)C=C1 KTZVZZJJVJQZHV-UHFFFAOYSA-N 0.000 description 1
- OZCMOJQQLBXBKI-UHFFFAOYSA-N 1-ethenoxy-2-methylpropane Chemical compound CC(C)COC=C OZCMOJQQLBXBKI-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- JXFITNNCZLPZNX-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxypropoxy)propane Chemical compound CCOCC(C)OCC(C)OC JXFITNNCZLPZNX-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- VZQBDGHUOBRFAA-UHFFFAOYSA-N 2-(2,6-dihydroxyphenyl)benzaldehyde Chemical compound C1(O)=C(C(O)=CC=C1)C1=CC=CC=C1C=O VZQBDGHUOBRFAA-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- HRWADRITRNUCIY-UHFFFAOYSA-N 2-(2-propan-2-yloxyethoxy)ethanol Chemical compound CC(C)OCCOCCO HRWADRITRNUCIY-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- OEPOKWHJYJXUGD-UHFFFAOYSA-N 2-(3-phenylmethoxyphenyl)-1,3-thiazole-4-carbaldehyde Chemical compound O=CC1=CSC(C=2C=C(OCC=3C=CC=CC=3)C=CC=2)=N1 OEPOKWHJYJXUGD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- JIKJXWFVPDDJNU-UHFFFAOYSA-N 2-[2-(4-methoxyphenyl)ethenyl]-5-(trichloromethyl)-1,3,4-oxadiazole Chemical compound C1=CC(OC)=CC=C1C=CC1=NN=C(C(Cl)(Cl)Cl)O1 JIKJXWFVPDDJNU-UHFFFAOYSA-N 0.000 description 1
- HLMLWEGDMMDCDW-UHFFFAOYSA-N 2-butylphenol;formaldehyde Chemical compound O=C.CCCCC1=CC=CC=C1O HLMLWEGDMMDCDW-UHFFFAOYSA-N 0.000 description 1
- LSSICPJTIPBTDD-UHFFFAOYSA-N 2-ethenyl-1h-indole Chemical compound C1=CC=C2NC(C=C)=CC2=C1 LSSICPJTIPBTDD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical group OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical compound C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- FCYVWWWTHPPJII-UHFFFAOYSA-N 2-methylidenepropanedinitrile Chemical compound N#CC(=C)C#N FCYVWWWTHPPJII-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- CFVWNXQPGQOHRJ-UHFFFAOYSA-N 2-methylpropyl prop-2-enoate Chemical compound CC(C)COC(=O)C=C CFVWNXQPGQOHRJ-UHFFFAOYSA-N 0.000 description 1
- GXEXLSDIVMVEFZ-UHFFFAOYSA-N 2-nitroprop-1-ene Chemical group CC(=C)[N+]([O-])=O GXEXLSDIVMVEFZ-UHFFFAOYSA-N 0.000 description 1
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- JLBJTVDPSNHSKJ-UHFFFAOYSA-N 4-Methylstyrene Chemical compound CC1=CC=C(C=C)C=C1 JLBJTVDPSNHSKJ-UHFFFAOYSA-N 0.000 description 1
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 1
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 1
- VGVHNLRUAMRIEW-UHFFFAOYSA-N 4-methylcyclohexan-1-one Chemical compound CC1CCC(=O)CC1 VGVHNLRUAMRIEW-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
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- WBYWAXJHAXSJNI-VOTSOKGWSA-M trans-cinnamate Chemical compound [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 229940001496 tribasic sodium phosphate Drugs 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- KOZCZZVUFDCZGG-UHFFFAOYSA-N vinyl benzoate Chemical compound C=COC(=O)C1=CC=CC=C1 KOZCZZVUFDCZGG-UHFFFAOYSA-N 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Landscapes
- Printing Plates And Materials Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野コ
本発明は、支持体の表面が処理されている感光性平版印
刷版に関し、更に詳しくは残膜がなく、耐処理薬品性並
びに耐剛性に優れている感光性平版印刷版に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a photosensitive lithographic printing plate whose support surface has been treated. Concerning an excellent photosensitive lithographic printing plate.
[従来の技術J
従来、感光性平版印刷版、例えばポジ型感光性平版印刷
版は、親木性を備えた支持体上にインキ受容性の感光層
を設けたもので、このような感光性平版印刷版の感光層
に画像露光を施し、ついで現像液を用いて露光ずみの感
光層を現像すると、露光部の感光層は除去されて、親水
性の支持体の表面が露出する一方、非露光部の感光層は
支持体の表面に残留してインキ受容性の画像部が形成さ
れ、それによって平版印刷版が得られる。[Prior Art J Conventionally, a photosensitive lithographic printing plate, such as a positive-working photosensitive lithographic printing plate, has an ink-receptive photosensitive layer provided on a wood-philic support. When the photosensitive layer of a lithographic printing plate is subjected to image exposure and then the exposed photosensitive layer is developed using a developer, the photosensitive layer in the exposed areas is removed and the surface of the hydrophilic support is exposed, while the non-photosensitive layer is exposed. The photosensitive layer in the exposed areas remains on the surface of the support to form ink-receptive image areas, thereby obtaining a lithographic printing plate.
このような平版印刷版は水と油とが互いに反発し合う性
質を利用して印刷するものである。具体的にはその版面
の非画像部を水で湿した後、版面にインキを与えると、
非画像部では湿し水によりインキが反発するため、画像
部にのみインキが選択的に付着する。Such a lithographic printing plate utilizes the property that water and oil repel each other for printing. Specifically, after moistening the non-image area of the printing plate with water, applying ink to the printing plate,
Since the ink is repelled by the dampening water in the non-image area, the ink selectively adheres only to the image area.
そして上記画像部のインキを被転写物に転写すると、上
記画像部に対応した画像を有する印刷物が得られる。When the ink in the image area is transferred to a transfer object, a printed matter having an image corresponding to the image area is obtained.
したがって、このような平版印刷版を得るための支持体
としては、水に湿した時、親木性かつ保水性に優れてい
ると共に印圧を受ける画像部となる感光層との接着性が
良好なものでなければならない。また感光層としては、
インキ受容性、露光に対して高感度を有すること等が必
要であると共に、最も大切な条件としては高耐91力を
備えてぃなければならない。Therefore, as a support for obtaining such a lithographic printing plate, it is necessary to use a support that is wood-philic and has excellent water retention properties when wetted with water, and has good adhesion to the photosensitive layer that forms the image area that receives printing pressure. It has to be something. In addition, as a photosensitive layer,
It is necessary to have ink receptivity, high sensitivity to exposure, etc., and the most important condition is that it must have high resistance to 91 strength.
これらの条件を満足する支持体としては、アルミニウム
板が最も優れており、このアルミニウム板と感光層との
十分な接着性を得るために、支持体表面を機械的に粗面
化する表面処理が施される。この表面処理法としては、
例えばボールグレインニング、ワイヤーグレインニング
、ブラシグレインニング等の各方法が特公昭50−40
047号公報、特公昭51−48003号公報等に記載
されている。An aluminum plate is the best support that satisfies these conditions, and in order to obtain sufficient adhesion between the aluminum plate and the photosensitive layer, surface treatment to mechanically roughen the surface of the support is required. administered. This surface treatment method includes:
For example, various methods such as ball graining, wire graining, and brush graining were
It is described in Japanese Patent Publication No. 047, Japanese Patent Publication No. 51-48003, etc.
また特公昭48−28123号公報、米国特許第4,0
87,341号明細書、特開昭53−67507号公報
等には、塩酸浴、硝酸浴等を用いて直流あるいは交流の
電流で、アルミニウム板表面に均一で緻密な砂目形状を
形成させる電解粗面化法が記載されている。更に特開昭
56−150595号公報には、支持体表面に熱水によ
る封孔処理、珪酸塩による封孔処理等を施すことによっ
て支持体と感光層との接着性をコントロールする方法が
記載されている。Also, Japanese Patent Publication No. 48-28123, U.S. Patent No. 4,0
No. 87,341, Japanese Patent Application Laid-Open No. 53-67507, etc., describe an electrolysis method in which a uniform and dense grain shape is formed on the surface of an aluminum plate by direct current or alternating current using a hydrochloric acid bath, a nitric acid bath, etc. A surface roughening method is described. Furthermore, JP-A-56-150595 describes a method of controlling the adhesion between the support and the photosensitive layer by subjecting the surface of the support to a sealing treatment using hot water, a sealing treatment using a silicate, or the like. ing.
このように支持体と感光層との間に十分?J接着性をも
たせると共に、アルミニウム板のような支持体に、親木
性並びに保水性を向上させるために、更に表面処理が施
され、例えば、特公昭36−22063号公報、米国特
許第2,246.683号明細書、同第3,160,5
06号明細書には、金属表面を弗化ジルコン酸カリウム
で化学処理して被膜を形成することによりその金属表面
の親水性並びに保水性を向上できることが記載されてい
る。また特開昭53−131102号公報には、弗化ジ
ルコン酸カリウム水溶液で処理した後、珪酸ナトリウム
水溶液で処理することにより親水性並びに保水性を向上
させた支持体が記載されている。Is there enough space between the support and the photosensitive layer like this? In order to provide J adhesion and improve wood affinity and water retention, the support such as an aluminum plate is further surface treated. For example, Japanese Patent Publication No. 36-22063, US Pat. No. 246.683, No. 3,160,5
The specification of No. 06 describes that the hydrophilicity and water retention of the metal surface can be improved by chemically treating the metal surface with potassium fluorozirconate to form a film. Further, JP-A-53-131102 describes a support whose hydrophilicity and water retention are improved by treating it with an aqueous potassium fluorozirconate solution and then with an aqueous sodium silicate solution.
しかしながら、これらの方法では、現像処理して得られ
た平版印刷版の非画像部が汚染されるのを防止するとい
う効果は認められても、平版印刷版の耐刷力および耐処
理薬品性が十分でなく、方これらの耐刷力および耐処理
薬品性が十分であっても、これらの感光性平版印刷版を
像露光した後、現像すると、得られた平版印刷版の非画
像部には感光液中に含まれていた物質が版表面に強く吸
着してしまい、現像処理に際し、現像液により容易に除
去されずに残留し、そのため修正跡が明瞭に残り、その
結果不均一な版面となる。したがって、このような現象
は、一般に耐刷力を向上させる手段として良く行われて
いるバーニング処理を行った場合、−層顕著に現れ、前
記方法によって処理された支持体から得られた平版印刷
版は実際の印刷の使用にはもはや耐えられなくなってき
ている。However, although these methods are effective in preventing contamination of the non-image areas of the lithographic printing plate obtained by development, the printing durability and treatment chemical resistance of the lithographic printing plate are reduced. Even if these printing durability and processing chemical resistance are sufficient, if these photosensitive lithographic printing plates are imagewise exposed and then developed, the non-image areas of the resulting lithographic printing plates will be Substances contained in the photosensitive solution are strongly adsorbed to the plate surface, and during the development process, they are not easily removed by the developer and remain, leaving clear traces of correction, resulting in an uneven plate surface. Become. Therefore, when a burning treatment, which is commonly carried out as a means of improving printing durability, such a phenomenon appears conspicuously in the lithographic printing plate obtained from the support treated by the above method. is no longer suitable for practical printing use.
そこで、本発明者等は、上述の問題点に鑑みて鋭意研究
を重ねた結果、アルミニウムのような支持体の表面を特
定の処理液を用いて処理することにより耐処理薬品性並
びに高耐刷性を保つと同時に非画像部で十分な保水性を
維持し、かつ非画像部の汚れを生じない感光性平版印刷
版が得られることを見出し1本発明を完成するに至った
。Therefore, as a result of extensive research in view of the above-mentioned problems, the inventors of the present invention have found that by treating the surface of a support such as aluminum with a specific treatment liquid, it is possible to improve treatment chemical resistance and high printing durability. The present inventors have discovered that it is possible to obtain a photosensitive lithographic printing plate that maintains its properties, maintains sufficient water retention in non-image areas, and does not cause staining in non-image areas, and has completed the present invention.
[発明の目的]
従って、本発明の第1の目的は、露光、現像後、非画像
部に感光層の成分が残留しない、所謂現像により膜が残
らないとともに非画像部で十分な保水性を保持する感光
性平版印刷版を提供することにある。[Objective of the Invention] Accordingly, the first object of the present invention is to prevent the components of the photosensitive layer from remaining in the non-image area after exposure and development, that is, to prevent a film from remaining after development, and to provide sufficient water retention in the non-image area. An object of the present invention is to provide a photosensitive lithographic printing plate that retains its properties.
また、本発明の第2の目的は、耐刷性並びに耐処理薬品
性が高く、かつ非画像部に汚れを生じない感光性平版印
刷版を提供することにある。A second object of the present invention is to provide a photosensitive lithographic printing plate that has high printing durability and processing chemical resistance and does not cause stains in non-image areas.
[発明の構成]
本発明の前記の目的は、前処理された支持体の表面を、
アニオン性界面活性剤を含む水溶液で処理した後、該表
面に感光層を設けたことを特徴とする感光性平版印刷版
によって達成された。[Configuration of the Invention] The above-mentioned object of the present invention is to treat the surface of the pretreated support by
This was achieved using a photosensitive lithographic printing plate characterized in that a photosensitive layer was provided on the surface after treatment with an aqueous solution containing an anionic surfactant.
[作用]
本発明は、支持体の表面を前処理した後、この表面を更
にアニオン性界面活性剤を含む水溶液で処理したことに
より、感光性平版印刷版を現像して得られた印刷版は、
非画像部において、感光層の成分が残留しないので、汚
れを生じない。[Function] In the present invention, after pre-treating the surface of the support, this surface is further treated with an aqueous solution containing an anionic surfactant, so that the printing plate obtained by developing the photosensitive lithographic printing plate is ,
In the non-image area, no components of the photosensitive layer remain, so stains do not occur.
[発明の詳細な説明] 以下、本発明を更に具体的に説明する。[Detailed description of the invention] The present invention will be explained in more detail below.
本発明は、前処理された支持体の表面に感光層を設ける
前に、その表面をアニオン性界面活性剤を含む水溶液で
処理する点に特徴があり、これにより非画像部の汚れが
防止される。The present invention is characterized in that, before forming a photosensitive layer on the surface of a pretreated support, the surface is treated with an aqueous solution containing an anionic surfactant, thereby preventing staining of non-image areas. Ru.
本発明において用いられるアニオン性界面活性剤には、
アルキル硫酸塩、ポリオキシエチレンアルキルエーテル
硫酸塩、N−アシルアミノ酸とその塩、N−アシルメチ
ルタウリン塩、ポリオキシエチレンアルキルエーテル酢
酸塩、アルキルスルホカルボン酸塩、α−オレフィンス
ルホン酸塩、アルキル燐酸塩、ポリオキシエチレンアル
キルエーテルリン酸塩等があり、エマールNC,レベノ
ールWZ(花王アトラス社製)、NIKKOL−5BL
−3N−27、N I KKOL−3NP−4N(日光
ケミカルズ社製)等のポリオキシエチレンアルキルエー
テル硫酸塩、ネオペレックスF−60、ネオペレックス
F−25(花王アトラス社製)、NIKKOL−LSA
、NIKKOL−O3−14(日光ケミカルズ社製)等
のアルキルスルホン酸塩及びエレクトロストリッパーN
、エレクトロストリッパーK(花王アトラス社製)、N
I KKOL−3LP−N%N I KKOL−DD
p−to(日光ケミカルズ社製)等の燐酸エステル塩系
のアニオン界面活性剤等が挙げられる。The anionic surfactant used in the present invention includes:
Alkyl sulfate, polyoxyethylene alkyl ether sulfate, N-acyl amino acid and its salt, N-acylmethyl taurate, polyoxyethylene alkyl ether acetate, alkyl sulfocarboxylate, α-olefin sulfonate, alkyl phosphoric acid There are salts, polyoxyethylene alkyl ether phosphates, etc., such as Emar NC, Lebenol WZ (manufactured by Kao Atlas Co., Ltd.), and NIKKOL-5BL.
-3N-27, polyoxyethylene alkyl ether sulfate such as NIKKOL-3NP-4N (manufactured by Nikko Chemicals), Neoperex F-60, Neoperex F-25 (manufactured by Kao Atlas Company), NIKKOL-LSA
, alkyl sulfonates such as NIKKOL-O3-14 (manufactured by Nikko Chemicals) and electrostripper N
, Electro Stripper K (manufactured by Kao Atlas Co., Ltd.), N
I KKOL-3LP-N%N I KKOL-DD
Examples include phosphoric acid ester salt-based anionic surfactants such as p-to (manufactured by Nikko Chemicals).
この界面活性剤は、勿論2種以上を併用することができ
る。Of course, two or more types of these surfactants can be used in combination.
本発明に用られるアニオン性界面活性剤を含む水溶液は
、一般にアニオン性界面活性剤を0.5重量%〜1重量
%含有する水溶液である。The aqueous solution containing the anionic surfactant used in the present invention is generally an aqueous solution containing 0.5% to 1% by weight of the anionic surfactant.
上記処理液で支持体表面を処理する場合の処理条件とし
ては、室温から約80℃の温度範囲で、前処理された支
持体を30秒〜3分の間浸漬するか、またはその処理液
を支持体に塗布するのが好ましい。When treating the surface of the support with the above treatment liquid, the treatment conditions include immersing the pretreated support for 30 seconds to 3 minutes at a temperature range from room temperature to about 80°C, or soaking the pretreated support in the treatment liquid for 30 seconds to 3 minutes. Preferably, it is applied to a support.
アニオン性界面活性剤を含む水溶液によって処理された
支持体は、その後好ましくは乾燥される。The support treated with the aqueous solution containing the anionic surfactant is then preferably dried.
前記のアニオン性界面活性剤を含む水溶液には、必要に
応じて添加剤、例えば水溶性高分子などを加えることが
できる。Additives such as water-soluble polymers can be added to the aqueous solution containing the anionic surfactant, if necessary.
本発明において用いられる支持体としては、通常の平版
印刷機にセットできるたわみ性と印刷時に加わる荷重に
耐えるものが好ましく、例えばアルミニウム、マグネシ
ウム、亜鉛、クロム鉄、銅、ニッケル等の金属板、及び
これらの金属の合金板等が挙げられ、更にはクロム、亜
鉛、銅、ニッケル、アルミニウム及び鉄等がメツキまた
は蒸着によって被覆されている金属板でもよい、これら
のうち好ましい支持体は、アルミニウムまたはその合金
である。The support used in the present invention is preferably one that is flexible enough to be set in a normal lithographic printing machine and that can withstand the load applied during printing, such as metal plates such as aluminum, magnesium, zinc, chromium iron, copper, and nickel; Examples include alloy plates of these metals, and metal plates coated with chromium, zinc, copper, nickel, aluminum, iron, etc. by plating or vapor deposition. Among these, preferable supports are aluminum or aluminum. It is an alloy.
本発明に用いられる支持体は、アニオン性界面活性剤を
含む水溶液によって処理される前に、前処理を施すが、
この前処理としては、この技術分野において通常採用さ
れている脱脂処理および粗面化処理がある。The support used in the present invention is pretreated before being treated with an aqueous solution containing an anionic surfactant.
This pretreatment includes degreasing treatment and surface roughening treatment that are commonly employed in this technical field.
粗面化処理のうちの砂目型処理は、機械的に表面を粗面
化するもので、いわゆる機械的粗面化法といわれ、例え
ばボール研摩、ブラシ研摩、ブラスト研摩、パフ研摩等
の方法がある。また電気的に表面を粗面化する、いわゆ
る電気的粗面化法を粗面化処理に利用することもでき、
例えば塩酸または硝酸等を含む電解液中で交流あるいは
直流によって支持体を電解処理することもできる。Among the surface roughening treatments, the grain type treatment is a method of mechanically roughening the surface, and is called a so-called mechanical surface roughening method, such as ball polishing, brush polishing, blast polishing, puff polishing, etc. There is. In addition, the so-called electrical roughening method, which electrically roughens the surface, can also be used for surface roughening treatment.
For example, the support can also be electrolytically treated by alternating current or direct current in an electrolytic solution containing hydrochloric acid or nitric acid.
前述のような砂目型処理して得られた支持体の表面には
、スコツトが生成しているので、このスコツトを除去す
るために適宜水洗あるいはアルカリエツチング等の処理
を行なうことが一般に好ましい、このような処理として
は、例えば特公昭48−28123号公報に記載されて
いるアルカリエツチング法や特開昭53−12739号
公報に記載されている硫酸デスコツト法等の処理方法が
挙げられる。Scots are formed on the surface of the support obtained by the above-mentioned grain type treatment, so it is generally preferable to carry out appropriate treatments such as water washing or alkali etching to remove these scotts. Examples of such treatments include the alkali etching method described in Japanese Patent Publication No. 48-28123 and the sulfuric acid descott method described in Japanese Patent Application Laid-open No. 53-12739.
本発明に用いられる支持体には、前述のような前処理を
施した後、通常、耐摩耗性、耐薬品性、保水性を向上さ
せるために、陽極酸化によって支持体に酸化被膜を形成
させる。この陽極酸化では一般的に、硫酸および/また
は燐酸等を10〜50%の濃度で含む水溶液を電解液と
して電流密度l〜lO^/dm’で電解する方法が好ま
しく用いられるが、他に米国特許第1,412,768
号明細書に記載されている硫酸中で高電流密度で電解す
る方法や米国特許第3,511,861号明細書に記載
されている燐酸を用いて電解する方法がある。After the support used in the present invention is pretreated as described above, an oxide film is usually formed on the support by anodic oxidation in order to improve wear resistance, chemical resistance, and water retention. . Generally, in this anodization, a method is preferably used in which an aqueous solution containing sulfuric acid and/or phosphoric acid at a concentration of 10 to 50% is used as an electrolyte, and electrolysis is performed at a current density of l to lO^/dm'. Patent No. 1,412,768
There are a method of electrolyzing in sulfuric acid at a high current density as described in the specification of US Pat. No. 3,511,861, and a method of electrolyzing using phosphoric acid as described in the specification of US Pat.
本発明に用いられる最も好ましい支持体は、陽極酸化被
膜を有するアルミニウム支持体である。The most preferred support for use in the present invention is an aluminum support with an anodized coating.
前記の支持体の感光層に対する接着性を向上させるため
の支持体自体に施される処理は特に限定されるものでな
く、必要に応じてブライマー層等を設けることができる
。The treatment applied to the support itself in order to improve the adhesion of the support to the photosensitive layer is not particularly limited, and a brimer layer or the like may be provided as necessary.
該ブライマー層には例えばポリエステル樹脂、塩化ビニ
ル−酢酸ビニル共重合体、アクリル樹脂、塩化ビニル樹
脂、ポリアミド樹脂、ポリビニルブチラール樹脂、エポ
キシ樹脂、アクリレート系共重合体、酢酸ビニル系共重
合体、フェノキシ樹脂、ポリウレタン樹脂、ポリカーボ
ネート樹脂、ポリアクリロニトリルブタジェン、ポリ酢
酸ビニル等が挙げられる。The brimer layer includes, for example, polyester resin, vinyl chloride-vinyl acetate copolymer, acrylic resin, vinyl chloride resin, polyamide resin, polyvinyl butyral resin, epoxy resin, acrylate copolymer, vinyl acetate copolymer, phenoxy resin. , polyurethane resin, polycarbonate resin, polyacrylonitrile butadiene, polyvinyl acetate, and the like.
また上記ブライマー層を構成するアンカー剤としては、
例えばシランカップリング剤、シリコーンブライマー等
を用いることができ、また有機チタネート等も有効であ
る。In addition, as the anchor agent constituting the above-mentioned brimer layer,
For example, silane coupling agents, silicone primers, etc. can be used, and organic titanates and the like are also effective.
本発明の感光性平版印刷版は、以上のようにして得られ
た親水性を備えた支持体に感光層を設けるものであるが
、この感光層中に用いられる感光性物質は、特に限定さ
れるものでなく、通常、感光性平版印刷版に用いられて
いる、例えば下記のような各種のものが使用される。In the photosensitive lithographic printing plate of the present invention, a photosensitive layer is provided on the hydrophilic support obtained as described above, but the photosensitive material used in this photosensitive layer is not particularly limited. It is not a standard material, but various materials commonly used in photosensitive lithographic printing plates, such as those listed below, can be used.
1)光架橋系感光性樹脂組成物
光架橋系感光性樹脂組成物中の感光成分は、分子中に不
飽和二重結合を有する感光性樹脂からなるもので、例え
ば米国特許第3..030,208号明細書、同第3,
435.237号明細書および同第3.622,320
号明細書等に記載されている如ぎ、重合体主鎖中に感光
基として一〇〇−CH−C−を含む感光性樹脂、および
重合体の側鎖に感光基を有するポリビニルシンナメート
等があげられる。1) Photocrosslinkable photosensitive resin composition The photosensitive component in the photocrosslinkable photosensitive resin composition is composed of a photosensitive resin having an unsaturated double bond in the molecule, for example as described in US Pat. .. Specification No. 030,208, No. 3,
No. 435.237 and No. 3.622,320
A photosensitive resin containing 100-CH-C- as a photosensitive group in the main chain of the polymer, and polyvinyl cinnamate having a photosensitive group in the side chain of the polymer, etc., as described in the specification etc. can be given.
2)光重合系感光性樹脂組成物
付加重合性不飽和化合物を含む光重合性組成物であって
、二重結合を有する単量体、または二重結合を有する単
量体と高分子バインダーとからなり、このような組成物
の代表的なものは、例えば米国特許第2,780,88
3号明細書および同第2,791゜504号明細書等に
記載されている。2) Photopolymerizable photosensitive resin composition A photopolymerizable composition containing an addition polymerizable unsaturated compound, comprising a monomer having a double bond, or a monomer having a double bond and a polymer binder. Typical such compositions are disclosed, for example, in U.S. Pat. No. 2,780,88.
It is described in Specification No. 3 and Specification No. 2,791°504 of the same.
−例を挙げるとメタクリル酸メチルを含む組成物、メタ
クリル酸メチル、ポリメチルメタクリレートを含む組成
物、メタクリル酸メチル、ポリメチルメタクリレートお
よびポリエチレングリコールジメタクリレートモノマー
を含む組成物、メタクリル酸メチル、アルキッド樹脂と
ポリエチレングリコールジメタクリレートモノマーを含
む組成物等の光重合性組成物が用いられる。- For example, compositions containing methyl methacrylate, compositions containing methyl methacrylate, polymethyl methacrylate, compositions containing methyl methacrylate, polymethyl methacrylate and polyethylene glycol dimethacrylate monomers, methyl methacrylate, alkyd resins and Photopolymerizable compositions such as compositions containing polyethylene glycol dimethacrylate monomers are used.
この光重合系感光性樹脂組成物には、この技術分野で通
常知られている光重合開始剤(例えばベンゾインメチル
エーテル等のベンゾイン誘導体、ベンゾフェノン等のベ
ンゾフェノン誘導体、チオキサントン誘導体、アントラ
キノン誘導体、アクリドン誘導体等)が添加される。This photopolymerizable photosensitive resin composition contains photopolymerization initiators commonly known in this technical field (for example, benzoin derivatives such as benzoin methyl ether, benzophenone derivatives such as benzophenone, thioxanthone derivatives, anthraquinone derivatives, acridone derivatives, etc.). ) is added.
3)ジアゾ化合物を含む感光性組成物
この感光性組成物中のジアゾ化合物は、例えば、好まし
くは芳香族ジアゾニウム塩とホルムアルデヒドまたはア
セトアルデヒドとの縮合物で代表されるジアゾ樹脂であ
る。特に好ましくは、p−ジアゾジフェニルアミンとホ
ルムアルデヒドまたはアセトアルデヒドとの縮合物の塩
、例えばヘキサフルオロホウ燐酸塩、テトラフルオロホ
ウ酸塩、過塩素酸塩または過ヨウ素酸塩と前記縮合物と
の反応生成物であるジアゾ樹脂無機塩や、米国特許第3
,300,309号明細書中に記載されているような、
前記縮合物とスルホン酸類との反応生成物であるジアゾ
樹脂有機塩等が挙げられる。ざらにジアゾ樹脂は、好ま
しくは結合剤と共に使用される。かかる結合剤としては
種々の高分子化合物を使用することができるが、好まし
くは特開昭54−98613号公報に記載されているよ
うな芳香族性水酸基を有する単量体、例えばN−(4−
ヒドロキシフェニル) アクリルアミド、ト(4−ヒド
ロキシフェニル)メタクリルアミド、0−1■−1また
はp−ヒドロキシスチレン、 0−1■−1またはp−
ヒドロキシフェニルメタクリレート等と他の単量体との
共重合体、米国特許第4,123,276号明細書中に
記載されているようなヒドロキシエチルアクリレート単
位またはヒドロキシエチルメタクリレート単位を主な繰
り返し単位として含むポリマー シェラツク、ロジン等
の天然樹脂、ポリビニルアルコール、米国特許第3,7
51.257号明細書中に記載されているようなポリア
ミド樹脂、米国特許第3,860,097号明細書中に
記載されているような線状ポリウレタン樹脂、ポリビニ
ルアルコールのフタレート化樹脂、ビスフェノールAと
エピクロルヒドリンから縮合されたエポキシ樹脂、酢酸
セルロース、セルロースアセテートフタレート等のセル
ロース誘導体が包含される。3) Photosensitive composition containing a diazo compound The diazo compound in this photosensitive composition is, for example, a diazo resin preferably represented by a condensate of an aromatic diazonium salt and formaldehyde or acetaldehyde. Particularly preferred are salts of condensates of p-diazodiphenylamine and formaldehyde or acetaldehyde, such as reaction products of hexafluoroborophosphates, tetrafluoroborates, perchlorates or periodates with said condensates. diazo resin inorganic salt, and U.S. Patent No. 3
, 300, 309,
Examples include diazo resin organic salts which are reaction products of the above condensates and sulfonic acids. The diazo resin is preferably used together with a binder. Various polymer compounds can be used as such a binder, but monomers having an aromatic hydroxyl group such as those described in JP-A No. 54-98613, such as N-(4 −
hydroxyphenyl) acrylamide, tho(4-hydroxyphenyl)methacrylamide, 0-1■-1 or p-hydroxystyrene, 0-1■-1 or p-
Copolymers of hydroxyphenyl methacrylate, etc. and other monomers, with hydroxyethyl acrylate units or hydroxyethyl methacrylate units as the main repeating unit as described in U.S. Pat. No. 4,123,276 Containing polymers Shellac, natural resins such as rosin, polyvinyl alcohol, U.S. Patent Nos. 3 and 7
51.257, linear polyurethane resins as described in U.S. Pat. No. 3,860,097, phthalated polyvinyl alcohol resins, bisphenol A Included are epoxy resins condensed from and epichlorohydrin, cellulose derivatives such as cellulose acetate, and cellulose acetate phthalate.
4)0−キノンジアジド化合物を含む感光性組成物本発
明において使用される0−キノンジアジド化合物を含む
感光性組成物においては、O−キノンジアジド化合物と
アルカリ可溶性樹脂を併用することが好ましい。4) Photosensitive composition containing O-quinonediazide compound In the photosensitive composition containing O-quinonediazide compound used in the present invention, it is preferable to use the O-quinonediazide compound and an alkali-soluble resin together.
O−キノンジアジド化合物としては、例えば0−ナフト
キノンジアジドスルホン酸と、フェノール類及びアルデ
ヒド又はケトンの重縮合樹脂とのエステル化合物が挙げ
られる。Examples of O-quinonediazide compounds include ester compounds of O-naphthoquinonediazide sulfonic acid and polycondensation resins of phenols and aldehydes or ketones.
前記フェノール類としては、例えば、フェノ−Jし、0
−タレゾール、諺−クレゾール、p−クレゾール、3.
5−キシレノール、カルバクロール、チモール等の一価
フエノール、カテコール、レゾルシン、ヒドロキノン等
の二価フェノール、ピロガロール、フロログルシン等の
三価フェノール等が挙げられる。前記アルデヒドとして
はホルムアルデヒド、ベンズアルデヒド、アセトアルデ
ヒド、クロトンアルデヒド、フルフラール等が挙げられ
る。これらのうち好ましいものはホルムアルデヒド及び
ベンズアルデヒドである。前記ケトンとしてはアセトン
、メチルエチルケトン等が挙げられる。Examples of the phenols include phenol-J, 0
-Taresol, proverb -cresol, p-cresol, 3.
Examples include monohydric phenols such as 5-xylenol, carvacrol, and thymol, dihydric phenols such as catechol, resorcinol, and hydroquinone, and trihydric phenols such as pyrogallol and phloroglucin. Examples of the aldehyde include formaldehyde, benzaldehyde, acetaldehyde, crotonaldehyde, and furfural. Preferred among these are formaldehyde and benzaldehyde. Examples of the ketone include acetone and methyl ethyl ketone.
前記重縮合樹脂の具体的な例としては、フェノール・ホ
ルムアルデヒド樹脂、腸−クレゾール・ホルムアルデヒ
ド樹脂、m−+I’−混合クレゾール・ホルムアルデヒ
ド樹脂、レゾルシン・ベンズアルデヒド樹脂、ピロガロ
ール・アセトン樹脂等が挙げられる。Specific examples of the polycondensation resin include phenol-formaldehyde resin, intestinal-cresol-formaldehyde resin, m-+I'-mixed cresol-formaldehyde resin, resorcinol-benzaldehyde resin, pyrogallol-acetone resin, and the like.
前記0−ナフトキノンジアジド化合物のフェノール類の
OH基に対する0−ナフトキノンジアジドスルホン酸の
縮合率(OH基1個に対する反応率)は、15%〜80
%が好ましく、より好ましくは20〜45%である。The condensation rate of 0-naphthoquinonediazide sulfonic acid with respect to the OH group of the phenol of the 0-naphthoquinonediazide compound (reaction rate with respect to one OH group) is 15% to 80%.
%, more preferably 20 to 45%.
更に本発明に用いられる0−キノンジアジド化合物とし
ては特開昭58−43451号公報に記載のある以下の
化合物も使用できる。即ち、例えば1.2−ベンゾキノ
ンジアジドスルホン酸エステル、1.2−ナフトキノン
ジアジドスルホン酸エステル、l、2−ベンゾキノンジ
アジドスルホン酸アミド、1.2−ナフトキノンジアジ
ドスルホン酸アミドなどの公知の1.2−キノンジアジ
ド化合物、更に具体的にはジェイ・コサール(J、にo
sar)著「ライト−センシティブ・システムズJ (
Light−5ensitive Systems )
第339〜352頁(1965年) ジョン・ウィリ
ー・アンドサンズ(John Wlley & 5on
s)社にューヨーク)やダブリュ・ニス・デイ・フォレ
スト(W、 S、Da Forest)著「フォトレジ
ストJ (Photoresi−st)第50jI!、
(1975年)、マツクローヒル (McGra胃H
ill)社にューヨーク)に記載されている1、2−ベ
ンゾキノンジアジド−4−スルホン酸フェニルエステル
、 1,2.1’、2’−ジー (ベンゾキノンジアジ
ド−4−スルホニル)−ジヒドロキシビフェニル、1.
2−ベンゾキノンジアジド−4(N−エチル−M−β−
ナフチル)−スルホンアミド、1.2−ナフトキノンジ
アジド−5−スルホン酸シクロヘキシルエステル、 1
−(1,2−ナフトキノジアジド−5−スルホニル)−
3,S−ジメチルとラゾール、1.2−ナフトキノジア
ジド−5−スルホン酸−4′−ヒドロキシジフェニル−
4′−アゾ−β−ナフトール−エステル、N、N−ジー
(l、2−ナフトキノンジアジド−5−スルホニル)−
アニリン、 2’−(1,2−ナフドキノンジアジド−
5−スルホニルオキシ)−1−ヒドロキシ−アントラキ
ノン、1.2−ナフトキノジアジド−5−スルホン−2
,4−ジヒドロキシベンゾフェノンエステル、1,2−
ナフトキノジアジド−5−スルホン酸−2,3,4−ト
リヒドロキシベンゾフェノンエステル、1.2−ナフト
キノンジアジド−5−スルホン酸クロリド2モルと4.
4′−ジアミノベンゾフェノン1モルとの縮合物、1.
2−ナフトキノンジアジド−5−スルホン酸クロリド2
モルと4.4′−ジヒドロキシ−1,1′−ジフェニル
スルホン1モルとの縮合物、1,2−ナフトキノンジア
ジド−5−スルホン酸クロリド1モルとプルブロガリン
1モルとの縮合物、1.2−ナフトキノンジアジド−5
−(N−ジヒドロアビエチル)−スルホンアミドなどの
1゜2−キノンジアジド化合物を例示することができる
。又、特公昭37−1953号、同37−3627号、
同37−13109号、同40−26126号、同40
−3801号、同45−5604号、同45−2734
5号、同51−13013号、特開昭48−98575
号、同48−63802号、同48−63802号各公
報に記載された1、2−キノンジアジド化合物も挙げる
ことができる。Further, as the O-quinonediazide compound used in the present invention, the following compounds described in JP-A-58-43451 can also be used. That is, for example, known 1,2-benzoquinonediazide sulfonic acid ester, 1,2-naphthoquinonediazide sulfonic acid ester, l,2-benzoquinonediazide sulfonic acid amide, 1,2-naphthoquinonediazide sulfonic acid amide, etc. Quinonediazide compounds, more specifically J.
``Light-Sensitive Systems J (
Light-5ensistive Systems)
Pages 339-352 (1965) John Wllley & Sons
(New York) and W. S. Da Forest, Photoresist J (Photoresi-st) No. 50jI!
(1975), Pineclaw Hill (McGra Stomach H
1,2-benzoquinonediazide-4-sulfonic acid phenyl ester, 1,2.1',2'-di(benzoquinonediazide-4-sulfonyl)-dihydroxybiphenyl, 1.
2-benzoquinonediazide-4(N-ethyl-M-β-
naphthyl)-sulfonamide, 1,2-naphthoquinonediazide-5-sulfonic acid cyclohexyl ester, 1
-(1,2-naphthoquinodiazide-5-sulfonyl)-
3,S-dimethyl and lazole, 1,2-naphthoquinodiazide-5-sulfonic acid-4'-hydroxydiphenyl-
4'-Azo-β-naphthol-ester, N,N-di(l,2-naphthoquinonediazide-5-sulfonyl)-
Aniline, 2'-(1,2-nafdoquinonediazide-
5-sulfonyloxy)-1-hydroxy-anthraquinone, 1,2-naphthoquinodiazide-5-sulfone-2
, 4-dihydroxybenzophenone ester, 1,2-
Naphthoquinodiazide-5-sulfonic acid-2,3,4-trihydroxybenzophenone ester, 2 moles of 1.2-naphthoquinonediazide-5-sulfonic acid chloride and 4.
Condensate with 1 mol of 4'-diaminobenzophenone, 1.
2-naphthoquinonediazide-5-sulfonic acid chloride 2
condensate of 1 mole of 4.4'-dihydroxy-1,1'-diphenylsulfone, 1 mole of 1,2-naphthoquinonediazide-5-sulfonic acid chloride and 1 mole of purbrogalin, 1.2- Naphthoquinone diazide-5
Examples include 1°2-quinonediazide compounds such as -(N-dihydroabiethyl)-sulfonamide. Also, Special Publication No. 37-1953, No. 37-3627,
No. 37-13109, No. 40-26126, No. 40
-3801, 45-5604, 45-2734
No. 5, No. 51-13013, JP-A-48-98575
1,2-quinonediazide compounds described in Japanese Patent Application No. 48-63802 and Japanese Patent No. 48-63802 can also be mentioned.
上記0−キノンジアジド化合物のうち、1.2−ベンゾ
キノンジアジドスルホニルクロリド又は1,2−ナフト
キノンジアジドスルホニルクロリドをピロガロール・ア
セトン縮合樹脂又は2,3.4−トリヒドロキシベンゾ
フェノンと反応させて得られる〇−キノンジアジドエス
テル化合物が特に好ましい。Among the above 0-quinonediazide compounds, 0-quinonediazide is obtained by reacting 1,2-benzoquinonediazide sulfonyl chloride or 1,2-naphthoquinonediazide sulfonyl chloride with pyrogallol acetone condensation resin or 2,3,4-trihydroxybenzophenone. Ester compounds are particularly preferred.
本発明に用いられる0−キノンジアジド化合物としては
上記化合物を各々単独で用いてもよいし、2種以上組合
せて用いてもよい。As the O-quinonediazide compound used in the present invention, each of the above compounds may be used alone, or two or more thereof may be used in combination.
本発明に用いられる0−キノンジアジド化合物の感光性
組成物中に占める割合は、5〜60重量%が好ましく、
特に好ましくは、10〜501i量%である。The proportion of the 0-quinonediazide compound used in the present invention in the photosensitive composition is preferably 5 to 60% by weight,
Particularly preferably, the amount is 10 to 501i%.
本発明の感光性組成物中に用いられるアルカリ可溶性樹
脂としては、ノボラック樹脂、フェノール性水酸基を有
するビニル系重合体、特開昭55−57841号公報に
記載されている多価フェノールとアルデヒド又はケトン
との縮合樹脂等が挙げられる。Examples of alkali-soluble resins used in the photosensitive composition of the present invention include novolac resins, vinyl polymers having phenolic hydroxyl groups, and polyhydric phenols and aldehydes or ketones described in JP-A-55-57841. Examples include condensation resins with.
本発明に使用されるノボラック樹脂としては、例えばフ
ェノール・ホルムアルデヒド樹脂、クレゾール・ホルム
アルデヒド樹脂、特開昭55−57841号公報に記載
されているようなフェノール・クレゾール・ホルムアル
デヒド共重合体樹脂、特開昭55−127553号公報
に記載されているようなp−置換フェノールとフェノー
ルもしくは、クレゾールとホルムアルデヒドとの共重合
体樹脂等が挙げられる。Examples of the novolac resin used in the present invention include phenol-formaldehyde resin, cresol-formaldehyde resin, phenol-cresol-formaldehyde copolymer resin as described in JP-A-55-57841, Examples include copolymer resins of p-substituted phenol and phenol or cresol and formaldehyde as described in Japanese Patent No. 55-127553.
前記ノボラック樹脂の分子量(ポリスチレン標準)は、
好ましくは数平均分子量Mnが3.00x 10”〜7
.SOx 10’ 、重量平均分子量Mwが1.00X
10’ 〜3、OOx 1.0’ より好ましく
はMnが5.00x 10’ 〜4、OOx 10’
Mwが3.00X 103〜2.00X 10’であ
る。The molecular weight (polystyrene standard) of the novolak resin is:
Preferably, the number average molecular weight Mn is 3.00x 10” to 7
.. SOx 10', weight average molecular weight Mw is 1.00X
10' to 3, OOx 1.0' More preferably Mn is 5.00x 10' to 4, OOx 10'
Mw is 3.00X 103 to 2.00X 10'.
上記ノボラック樹脂は単独で用いてもよいし、2種以上
組合せて用いてもよい。The above novolak resins may be used alone or in combination of two or more.
上記ノボラック樹脂の本発明の感光性組成物中に占める
割合は5〜95重量%である。The proportion of the novolak resin in the photosensitive composition of the present invention is 5 to 95% by weight.
又、本発明に用いられるフェノール性水酸基を有するビ
ニル系重合体としては、該フェノール性水酸基を有する
単位を分子構造中に有する重合体であり、下記−数式[
11〜[V]の少なくとも1つの構造単位を含む重合体
が好ましい。Furthermore, the vinyl polymer having a phenolic hydroxyl group used in the present invention is a polymer having a unit having a phenolic hydroxyl group in its molecular structure, and has the following formula [
A polymer containing at least one structural unit of 11 to [V] is preferred.
−数式[1]
一般式[i!]
一般式[II+ ]
一般式[IV ]
一般式[V]
H
[式中R3およびR2はそれぞれ水素原子、アルキル基
又はカルボキシル基、好ましくは水素原子を表わす、R
5は水素原子、ハロゲン原子又はアルキル基を表わし、
好ましくは水素原子又はメチル基、エチル基等のアルキ
ル基を表わす、R4は水素原子、アルキル基、アリール
基又はアラルキル基を表わし、好ましくは水素原子を表
わす、Aは窒素原子又は酸素原子と芳香族炭素原子とを
連結する、置換基を有していてもよいアルキレン基を表
わし、曙は0〜lOの整数を表わし、Bは置換基を有し
ていてもよいフェニレン基又は置換基を有してもよいナ
フチレン基を表わす、]木発明の感光性組成物に用いら
れる重合体としては共重合体型の構造を有するものが好
ましく、前記−数式[I]〜−数式[V]でそれぞれ示
される構造単位と組合せて用いることができる単量体単
位としては、例えばエチレン、プロピレン、イソブチレ
ン、ブタジェン、イソプレン等のエチレン系不飽和オレ
フィン類、例えばスチレン、α−メチルスチレン、p−
メチルスチレン、p−クロロスチレン等のスチレン類、
例えばアクリル酸、メタクリル酸等のアクリル酸類、
例えばイタコン酸、マレイン酸、無水マレイン酸等の不
飽和脂肪族ジカルボン酸類、例えばアクリル酸メチル、
アクリル酸エチル、アクリル酸−〇−ブチル、アクリル
酸イソブチル、アクリル酸ドデシル、アクリル酸−2−
クロロエチル、アクリル酸フェニル、α−クロロアクリ
ル酸メチル、メタクリル酸メチル、メタクリル酸エチル
5メタクリル酸エチル等のα−メチレン脂肪族モノカル
ボン酸のエステル類、例えばアクリロニトリル、メタア
クリロニトリル等のニトリル類、例えばアクリルアミド
等のアミド類、例えばアクリルアニリド、p−クロロア
クリルアニリド、■−ニトロアクリルアニリド、■−メ
トキシアクリルアニリド等のアニリド類、例えば酢酸ビ
ニル、プロピオン酸ビニル、ベンジェ酸ビニル、酪酸ビ
ニル等のビニルエステル類、例えばメチルビニルエーテ
ル、エチルビニルエーテル、イソブチルビニルエーテル
、β−クロロエチルビニルエーテル等のビニルエーテル
類、塩化ビニル、ビニリデンクロライド、ビニリデンシ
アナイド、例えばl−メチル−1−メトキシエチレン、
1.1−ジメトキシエチレン、l、2−ジメトキシエチ
レン、1.1−ジメトキシカルボニルエチレン、 1−
メチル−1−二トロエチレン等のエチレン誘導体類、例
えばN−ビニルビロール、N−ビニルカルバゾール、N
−ビニルインドール、N−ビニルビロールン、N−ビニ
ルピロリドン等のN−ビニル系単量体がある。これらの
ビニル系単量体は、不飽和二重結合が開裂した構造で高
分子化合物中に存在する。- Formula [1] General formula [i! ] General formula [II+] General formula [IV] General formula [V] H [wherein R3 and R2 each represent a hydrogen atom, an alkyl group or a carboxyl group, preferably a hydrogen atom, R
5 represents a hydrogen atom, a halogen atom or an alkyl group,
Preferably represents a hydrogen atom or an alkyl group such as a methyl group or an ethyl group. R4 represents a hydrogen atom, an alkyl group, an aryl group or an aralkyl group, preferably a hydrogen atom. A represents a nitrogen atom or an oxygen atom and an aromatic group. represents an alkylene group that may have a substituent and connects to a carbon atom, Akebono represents an integer from 0 to 1O, and B represents a phenylene group that may have a substituent or a phenylene group that may have a substituent. The polymer used in the photosensitive composition of the wood invention preferably has a copolymer-type structure, and is represented by the above-mentioned formula [I] to formula [V], respectively. Examples of monomer units that can be used in combination with the structural unit include ethylenically unsaturated olefins such as ethylene, propylene, isobutylene, butadiene, and isoprene, such as styrene, α-methylstyrene, p-
Styrenes such as methylstyrene and p-chlorostyrene,
For example, acrylic acids such as acrylic acid and methacrylic acid,
For example, unsaturated aliphatic dicarboxylic acids such as itaconic acid, maleic acid, maleic anhydride, etc., such as methyl acrylate,
Ethyl acrylate, 〇-butyl acrylate, isobutyl acrylate, dodecyl acrylate, 2-acrylate
Esters of α-methylene aliphatic monocarboxylic acids such as chloroethyl, phenyl acrylate, methyl α-chloroacrylate, methyl methacrylate, ethyl methacrylate, 5 ethyl methacrylate, nitriles such as acrylonitrile, methacrylonitrile, etc., e.g. acrylamide Amides such as acrylanilide, p-chloroacrylanilide, ■-nitroacrylanilide, ■-methoxyacrylanilide, etc., vinyl esters such as vinyl acetate, vinyl propionate, vinyl benzoate, vinyl butyrate, etc. , vinyl ethers such as methyl vinyl ether, ethyl vinyl ether, isobutyl vinyl ether, β-chloroethyl vinyl ether, vinyl chloride, vinylidene chloride, vinylidene cyanide, such as l-methyl-1-methoxyethylene,
1.1-dimethoxyethylene, l,2-dimethoxyethylene, 1.1-dimethoxycarbonylethylene, 1-
Ethylene derivatives such as methyl-1-nitroethylene, such as N-vinylvirol, N-vinylcarbazole, N
- There are N-vinyl monomers such as vinyl indole, N-vinylvirolone, and N-vinylpyrrolidone. These vinyl monomers exist in polymer compounds with a structure in which unsaturated double bonds are cleaved.
上記の単量体のうち脂肪族モノカルボン酸のエステル類
、ニトリル類が本発明の目的に対して優れた性能を示し
、好ましい。Among the above monomers, aliphatic monocarboxylic acid esters and nitriles exhibit excellent performance for the purpose of the present invention and are therefore preferred.
これらの単量体は、本発明に用いられる重合体中にブロ
ック又はランダムのいずれかの状態で結合していてもよ
い。These monomers may be bound in either a block or random manner in the polymer used in the present invention.
本発明に用いられるビニル系重合体の感光性組成物中に
占める割合は0.5〜70重量%である。The proportion of the vinyl polymer used in the present invention in the photosensitive composition is 0.5 to 70% by weight.
本発明に用いられるビニル系重合体は、上記重合体を単
独で用いてもよいし、又2種以上組合せ′〔用いてもよ
い。又、他の高分子化合物等と組合せて用いることもで
きる。As the vinyl polymer used in the present invention, the above-mentioned polymers may be used alone, or a combination of two or more thereof may be used. Moreover, it can also be used in combination with other polymer compounds.
感光性組成物には、露光より可視画像を形成させるプリ
ントアウト材料を添加することができる。プリントアウ
ト材料は露光により酸もしくは遊離基を生成する化合物
と相互作用することによってその色調を変える有機染料
より成るもので、露光により酸もしくは遊離基を生成す
る化合物としては、例えば特開昭50−36209号公
報に記載の0−ナフトキノンジアジド−4−スルホン酸
ハロゲニド、特開昭53−36223号公報に記載のト
リハロメチルー2−ピロンやトリハロメチル−トリアジ
ン、特開昭55−6244号公報に記載されている0−
ナフトキノンジアジド−4−スルホン酸クロライドと電
子吸引性置換基を有するフェノール類、またはアニリン
酸とのエステル化合物またはアミド化合物、特開昭55
−77742号公報、特開昭57−148784号公報
等に記載のハロメチルビニルオキサジアゾール化合物及
びジアゾニウム塩等が挙げられる。A printout material can be added to the photosensitive composition that upon exposure to light forms a visible image. The printout material is made of an organic dye that changes its color tone by interacting with a compound that generates an acid or a free radical when exposed to light. 0-naphthoquinonediazide-4-sulfonic acid halide described in JP-A No. 36209, trihalomethyl-2-pyrone and trihalomethyl-triazine described in JP-A No. 53-36223, and trihalomethyl-triazine described in JP-A-55-6244. There is 0-
Ester or amide compound of naphthoquinonediazide-4-sulfonic acid chloride and phenols having electron-withdrawing substituents or anilic acid, JP-A-55
Examples include halomethylvinyloxadiazole compounds and diazonium salts described in JP-A-77742 and JP-A-57-148784.
また前記の有機染料としては、ビクトリアピュアーブル
ーBOH(作土ケ谷化学(株)製)、バテントビエアー
ブルー(住人王国化学(株)製)、オイルブルー#60
3 (オリエント化学工業(株)製)、スーダンブル
ーII (BASF製)、クリスタルバイオレット、マ
ラカイトグリーン、ツクシン、メチルバイオレット、エ
チルバイオレット、メチルオレンジ、ブリリアントグリ
ーン、コンゴーレッド、エオシン、ローダミン6G等を
挙げることができる。また感光性組成物には、上記の素
材の他、必要に応じて可塑剤、界面活性剤、有機酸、酸
無水物などを添加することができる。In addition, examples of the organic dyes include Victoria Pure Blue BOH (manufactured by Sakudogaya Chemical Co., Ltd.), Batent Via Blue (manufactured by Jujuokoku Chemical Co., Ltd.), and Oil Blue #60.
3 (manufactured by Orient Chemical Industry Co., Ltd.), Sudan Blue II (manufactured by BASF), crystal violet, malachite green, Tsukushin, methyl violet, ethyl violet, methyl orange, brilliant green, Congo red, eosin, rhodamine 6G, etc. Can be done. In addition to the above-mentioned materials, a plasticizer, a surfactant, an organic acid, an acid anhydride, and the like can be added to the photosensitive composition as needed.
更に本発明に用いられる感光性組成物には、該感光性組
成物の感脂性を向上するために例えば、p−tert−
ブチルフェノールホルムアルデヒド樹脂やp−n−オク
チルフェノールホルムアルデヒド樹脂や、あるいはこれ
らの樹脂が0−キノンジアジド化合物で部分的にエステ
ル化されている樹脂などを添加することもできる。Furthermore, the photosensitive composition used in the present invention may contain, for example, p-tert- to improve the oil sensitivity of the photosensitive composition.
It is also possible to add butylphenol formaldehyde resin, p-n-octylphenol formaldehyde resin, or a resin in which these resins are partially esterified with an 0-quinonediazide compound.
これらの各成分を下記の溶媒に溶解させ、本発明に用い
られる支持体表面に塗布乾燥させることにより、感光性
層を設けて、本発明の感光性平版印刷版を製造すること
ができる。The photosensitive lithographic printing plate of the present invention can be produced by dissolving each of these components in the following solvents and coating and drying the solution on the surface of the support used in the present invention to provide a photosensitive layer.
本発明に用いられる感光性組成物を溶解する際に使用し
得る溶媒としては、メチルセロソルブ、メチルセロソル
ブアセテート、エチルセロソルブ、エチルセロソルブア
セテート、ジエチレングリコール千ツメチルエーテル、
ジエチレングリコールモノエチルエーテル、ジエチレン
グリコールジメチルエーテル、ジエチレングリコールメ
チルエチルエーテル、ジエチレングリコールジエチルエ
ーテル、ジエチレングリコールモノイソプロピルエーテ
ル、プロピレングリコール、プロピレングリコールモノ
エチルエーテルアセテート、プロピレングリコールモノ
ブチルエーテル、ジプロピレングリコールモノメチルエ
ーテル、ジプロピレングリコールジメチルエーテル、ジ
プロピレングリコールメチルエチルエーテル、ギ酸エチ
ル、ギ酸プロピル、ギ酸ブチル、ギ酸アミル、酢酸メチ
ル、酢酸エチル、酢酸プロピル、酢酸ブチル、プロピオ
ン酸メチル、プロピオン酸エチル、酪酸メチル、酪酸エ
チル、ジメチルホルムアミド、ジメチルスルホキシド、
ジオキサン、アセトン、メチルエチルケトン、シクロヘ
キサノン、メチルシクロヘキサノン、ジアセトンアルコ
ール、アセチルアセトン、r−ブチロラクトン等が挙げ
られる。これら溶媒は、単独あるいは2種以上混合して
使用することができる。Examples of solvents that can be used to dissolve the photosensitive composition used in the present invention include methyl cellosolve, methyl cellosolve acetate, ethyl cellosolve, ethyl cellosolve acetate, diethylene glycol methyl ether,
Diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, diethylene glycol monoisopropyl ether, propylene glycol, propylene glycol monoethyl ether acetate, propylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol dimethyl ether, dipropylene Glycol methyl ethyl ether, ethyl formate, propyl formate, butyl formate, amyl formate, methyl acetate, ethyl acetate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate, methyl butyrate, ethyl butyrate, dimethyl formamide, dimethyl sulfoxide,
Dioxane, acetone, methyl ethyl ketone, cyclohexanone, methyl cyclohexanone, diacetone alcohol, acetylacetone, r-butyrolactone and the like can be mentioned. These solvents can be used alone or in combination of two or more.
本発明に用いられる感光性組成物を支持体表面に塗布す
る際に用いる塗布方法としては、従来公知の方法、例え
ば、回転塗布、ワイヤーバー塗布、デイツプ塗布、エア
ーナイフ塗布、ロール塗布、ブレード塗布及びカーテン
塗布等が用いられる。この際塗布量は用途により異るが
、例えば固形分として0.05〜5.0g/+e”の塗
布量が好ましい。The coating method used in coating the surface of the support with the photosensitive composition used in the present invention includes conventionally known methods, such as spin coating, wire bar coating, dip coating, air knife coating, roll coating, and blade coating. and curtain coating, etc. are used. At this time, the coating amount varies depending on the application, but a coating amount of, for example, 0.05 to 5.0 g/+e'' in terms of solid content is preferable.
こうして得られた感光性平版印刷版の使用に際しては、
従来から常用されている方法を適用することができ、例
えば線画像、網点画像などを有する透明原画を感光面に
密着して露光し、次いでこれを適当な現像液を用いて非
画像部の感光性層を除去することによりレリーフ像が得
られる。露光に好適な光源としては、水銀灯、メタルハ
ライドランプ、キセノンランプ、ケミカルランプ、カー
ボンアーク灯などが使用され、また現像に使用される現
像液としては、アルカリ水溶液が好ましく、例えば、珪
酸ナトリウム、珪酸カリウム、水酸化ナトリウム、水酸
化カリウム、第三リン酸ナトリウム、第ニリン酸ナトリ
ウム、炭酸ナトリウム、炭酸カリウムなどの水溶液のよ
うなアルカリ水溶液がある。このときのアルカリ水溶液
の濃度は、感光性組成物及びアルカリの種類により異る
が、概して0.1〜10重量%の範囲が適当であり、又
酸アルカリ水溶液には必要に応じ界面活性剤やアルコー
ルなどのような有機溶媒を加えることもできる。When using the photosensitive lithographic printing plate thus obtained,
Conventional methods can be applied, such as exposing a transparent original image with a line image, halftone image, etc. in close contact with the photosensitive surface, and then using an appropriate developer to develop the non-image areas. A relief image is obtained by removing the photosensitive layer. As a light source suitable for exposure, a mercury lamp, a metal halide lamp, a xenon lamp, a chemical lamp, a carbon arc lamp, etc. are used, and as a developer used for development, an alkaline aqueous solution is preferable, such as sodium silicate, potassium silicate, etc. There are alkaline aqueous solutions such as aqueous solutions of sodium hydroxide, potassium hydroxide, tribasic sodium phosphate, dibasic sodium phosphate, sodium carbonate, potassium carbonate, etc. The concentration of the alkaline aqueous solution at this time varies depending on the photosensitive composition and the type of alkali, but is generally in the range of 0.1 to 10% by weight, and the acid-alkaline aqueous solution may contain a surfactant or Organic solvents such as alcohols can also be added.
以下余白
[実施例]
以下に本発明を実施例により具体的に説明するが、本発
明は、その要旨を超えない限りこれらの実施例に限定さ
れるものではない。In the following margin [Examples] The present invention will be specifically explained below using Examples, but the present invention is not limited to these Examples unless the gist thereof is exceeded.
実施例1〜4
[支持体lの作製]
厚さ0.3mmアルミニウム板(材質1050.調質H
16)を5%苛性ソーダ水溶液中に浸漬し65℃の温度
で1分間脱脂処理を行なった後、水洗した。Examples 1 to 4 [Preparation of support l] 0.3 mm thick aluminum plate (material 1050. Tempered H
16) was immersed in a 5% caustic soda aqueous solution, degreased at a temperature of 65° C. for 1 minute, and then washed with water.
この脱脂処理したアルミニウム板をlθ%硝酸水溶液中
、25℃で1分間浸漬して中和した後、水洗した。つい
でこのアルミニウム板を0.3mol/fの硝酸水溶液
中において30℃で電流密度50^/dm2の交流で3
0秒間電電解面化を行なった後、5%苛性ソーダ水溶液
中で60℃、10秒間のデスマット処理を行った。その
後、20%硫酸溶液中で温度20℃、電流密度3A/d
a’ 、処理時間1分の条件で、前記のアルミニウム板
の表面を陽極酸化処理を行ない、さらに80℃の熱水で
20秒間然本封孔処理を施した。This degreased aluminum plate was neutralized by immersing it in a lθ% nitric acid aqueous solution at 25° C. for 1 minute, and then washed with water. Next, this aluminum plate was heated in a 0.3 mol/f nitric acid aqueous solution at 30°C with an alternating current density of 50^/dm2 for 30 minutes.
After performing electrolytic surface treatment for 0 seconds, desmutting treatment was performed at 60° C. for 10 seconds in a 5% caustic soda aqueous solution. Then, in a 20% sulfuric acid solution at a temperature of 20°C and a current density of 3A/d.
a' The surface of the aluminum plate was anodized under conditions of a treatment time of 1 minute, and further subjected to a sealing treatment for 20 seconds with hot water at 80°C.
以上の前処理を施したアルミニウム板を1%エマールN
C(アニオン界面活性剤、花王アトラス株式会社製)水
溶液中において60℃で1分間浸漬し、この処理を行っ
た支持体を支持体1とした。1% Emar N
The support was immersed in an aqueous solution of C (anionic surfactant, manufactured by Kao Atlas Co., Ltd.) at 60° C. for 1 minute, and the treated support was designated as Support 1.
[支持体2〜6の作製]
前記の支持体1の作製において、1%エマールNCの水
溶液にかえて、第1表に記載された水溶液でアルミニウ
ム板を浸漬処理した以外は、すべて支持体1と同様にし
て支持体2〜6を作製した。[Preparation of Supports 2 to 6] In the preparation of Support 1 described above, all of Support 1 was prepared except that the aluminum plate was immersed in the aqueous solution listed in Table 1 instead of the 1% Emar NC aqueous solution. Supports 2 to 6 were produced in the same manner as described above.
以下余白 第1表 *比較例では周囲温度で15秒間漫潰した。Margin below Table 1 *Comparative examples were crushed for 15 seconds at ambient temperature.
[感光性平版印刷版の試料1.−1の作製]前記のよう
にして作製した支持体1に、次の組成の感光性組成物の
塗布液(1)をワイヤーバーを用いて塗布し、80℃で
2分間乾燥した。乾燥塗布膜の厚さが2.2g/i’で
ある感光性平版印刷版が得られた。[Sample 1 of photosensitive lithographic printing plate. -1 Preparation] A coating solution (1) of a photosensitive composition having the following composition was applied to the support 1 prepared as described above using a wire bar, and dried at 80° C. for 2 minutes. A photosensitive lithographic printing plate having a dry coating thickness of 2.2 g/i' was obtained.
[感光性組成物の塗布液(1)]
ノボラック樹脂中^ 6.7go−キ
ノンジアジド化合物◆8 1.5g界面活性剤
弓 0.28ビクトリアピユアブ
ルーBOH
(保土ケ谷化学(株)製) 0.08gハロ
ゲン遊離基を生成する化合物1 0゜15gメチルセロ
ソルブ 100mILついで、光源と
して、2にWメタルハライドランプを使用し、得られた
感光性平版印刷版を8 mW/Cl112で60秒間照
射することにより露光した。[Coating liquid of photosensitive composition (1)] In novolac resin 6.7 go-quinonediazide compound ◆8 1.5 g Surfactant base 0.28 Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.) 0.08 g Compound 1 that generates halogen free radicals 0.15 g Methyl cellosolve 100 mIL Next, using a W metal halide lamp in 2 as a light source, the obtained photosensitive lithographic printing plate was exposed by irradiating it with 8 mW/Cl112 for 60 seconds. .
この露光済の感光性平版印刷版は、市販されている現像
液(SDR−1、コニカ社製、5倍に稀釈、現像時間3
0秒、現像温度25℃)で現像し、平版印刷版の試料I
′−1を得た。This exposed photosensitive lithographic printing plate was prepared using a commercially available developer (SDR-1, manufactured by Konica Co., Ltd., diluted 5 times, developing time 3
Sample I of the lithographic printing plate
'-1 was obtained.
[感光性平版印刷版の試料1−2〜1.−Itの作製]
試料1−1の作製と同様にして第1表に示される水溶液
で処理した支持体2〜6に、感光性組成物の塗布液(1
)を塗布して感光性平版印刷版の試料I−2〜I−6を
得た。[Samples 1-2 to 1 of photosensitive lithographic printing plates. -Preparation of It]
A coating solution of the photosensitive composition (1
) to obtain samples I-2 to I-6 of photosensitive lithographic printing plates.
ついで、露光および現像を前記と同様に行フて平版印刷
版の試料1 ’−1〜■′−6を得た。Then, exposure and development were carried out in the same manner as described above to obtain lithographic printing plate samples 1'-1 to ■'-6.
なお、前記の*A〜*Dの化合物としては、以下のもの
を用いた。The following compounds were used as the compounds *A to *D.
*A;ノボラック樹脂[フェノールと■−クレゾールと
p−クレゾールとホルムアルデヒドとの共重縮合樹脂(
フェノール、■−クレゾールおよびp−クレゾールの各
々のモル比が2.0=4.8:3.2 、 Mw−
6,500、M+y/Mn−5,4) ]]*B;0
−キノンジアジド化合
物C;界面活性剤
エマルゲン120
(ポリオキシエチレンラウリルエーテル、花王社製)
*D;ハロゲン遊離基を生成する化合物2−トリクロロ
メチル−5−(p−メトキシスチリル)−1,3,4−
オキサジアゾール(特開昭54−74728号公報の実
施例1に記載された化合物)
得られた平版印刷版の試料1 ’−1−I ’−6につ
いて、以下に記載された評価方法を用いて評価を行った
。*A; Novolac resin [copolycondensation resin of phenol, ■-cresol, p-cresol, and formaldehyde (
The molar ratio of phenol, ■-cresol and p-cresol is 2.0=4.8:3.2, Mw-
6,500, M+y/Mn-5,4) ]]*B;0
-Quinonediazide compound C: Surfactant Emulgen 120 (polyoxyethylene lauryl ether, manufactured by Kao Corporation) *D: Compound that generates halogen free radicals 2-trichloromethyl-5-(p-methoxystyryl)-1,3,4 −
Oxadiazole (compound described in Example 1 of JP-A No. 54-74728) The obtained lithographic printing plate sample 1'-1-I'-6 was evaluated using the evaluation method described below. We conducted an evaluation.
得られた結果を第2表に示した。The results obtained are shown in Table 2.
[評価方法]
(残膜による汚れテスト)
前記の露光・現像条件により得られた平版印刷版に5本
(5wmX 15c+e)の画像部を形成させた後、消
去液(SIR−15、コニカ社製)により画像部を消去
した。[Evaluation method] (Stain test due to residual film) After forming 5 image areas (5wm x 15c+e) on the planographic printing plate obtained under the above exposure and development conditions, an erasing liquid (SIR-15, manufactured by Konica Corporation) was applied. ) to erase the image area.
消去時間を5水準(第2表に示す)に分け、そのときの
消去によるフリンジ汚れを現像インクcsop−i、コ
ニカ社製)盛りをして確認した。The erasing time was divided into 5 levels (shown in Table 2), and fringe stains due to erasing at that time were checked using developing ink CSOP-I (manufactured by Konica).
評価:
○・・良好
△・・消去跡が現れる(インキは着肉しないが目視で明
らかに確認できる。)
×・・汚れる(インキが着肉する。)
(耐処理薬品性)
前記の露光・現像条件により製版した後、現像インク盛
り用のインク(sap−t、コニカ社製、PI富士写真
フィルム社製)および印刷時に使用するプレートクリー
ナー(ウルトラプレートクリーナー(UPC)、ABC
ケミカル社製)に一定時間浸漬させ、その時の版上の感
光層の状態を評価した。Evaluation: ○...Good △...Erased marks appear (ink does not stick, but can be clearly seen by visual inspection) ×...Stains (ink sticks) (processing chemical resistance) The above-mentioned exposure and After plate making according to development conditions, ink for development ink (SAP-T, manufactured by Konica, manufactured by PI Fuji Photo Film) and plate cleaners used during printing (Ultra Plate Cleaner (UPC), ABC) are added.
(manufactured by Chemical Co., Ltd.) for a certain period of time, and the state of the photosensitive layer on the plate at that time was evaluated.
評価: O・・変化なし。evaluation: O: No change.
Δ・・ベタ部表面が薬品で侵食される。Δ: The solid surface is eroded by chemicals.
×・・ベタ部が侵食され消失する。×: The solid portion is eroded and disappears.
(網点再現性)
前記の露光・現像条件により得られた平版印刷版を印刷
機(ハイデルGTO)において、コート紙印刷インキ(
東洋インキ製造社製、ニューブライト紅)および湿し水
(SEU−3,2,5%、コニカ社製)を使用し、印刷
を行りた。(Half dot reproducibility) The planographic printing plate obtained under the above exposure and development conditions was coated with coated paper printing ink (
Printing was performed using Toyo Ink Mfg. Co., Ltd., New Bright Red) and dampening water (SEU-3, 2.5%, Konica Co., Ltd.).
このようにして得られた印刷物を25倍のルーペで網点
画像の暗部(wi点面積率97%)の網点再現の状態を
評価した。The state of halftone dot reproduction of the dark part of the halftone dot image (wi point area ratio 97%) of the thus obtained printed matter was evaluated using a 25x magnifying glass.
評価:
○・・再現(カラミ無し)
×・・再現しない(カラミ有り)
(耐刷性)
網点再現性において使用した条件と同様の条件で印刷し
た印刷物の画像部のベタ部に着肉不良が現れるかまたは
非画像部にインキが着肉するまで印刷を続け、それらが
現れた時点での印刷枚数を数えた。Evaluation: ○...Reproduced (no smearing) ×: Not reproduced (stains smeared) (Printing durability) Poor inkling in the solid area of the image area of a printed matter printed under the same conditions as those used for halftone reproducibility Printing was continued until these appeared or the ink was deposited on the non-image areas, and the number of printed sheets was counted at the time these appeared.
実施例5〜8
[感光性平版印刷版の試料n −1の作製]実施例1に
おいて作製した支持体1上に、次の組成の感光性組成物
の塗布液(2)をホワラーを用いて塗布し、90℃で1
分間乾燥した。乾燥塗布膜の厚さが1.7g/la’で
ある感光性平版印刷版の試料H−1が得られた。Examples 5 to 8 [Preparation of sample n-1 of photosensitive lithographic printing plate] On the support 1 prepared in Example 1, a coating solution (2) of the photosensitive composition having the following composition was applied using a whirler. Apply and heat at 90℃ for 1
Dry for a minute. Sample H-1 of a photosensitive lithographic printing plate having a dry coating film thickness of 1.7 g/la' was obtained.
[感光性組成物の塗布液(2)]
共重合体◆E5゜Og
ジアゾ樹脂*FO,5g
ジュリマー^C−10L (日本純薬社製) 0.0
5gビクトリアピュアブルーBO)I
(保止ケ谷化学(株)製) 0.1gメチル
セロソルブ loomllついで、光
源として、2KWメタルハライドランプを使用し、得ら
れた感光性平版印刷版を8 mW/C11”で60秒間
照射することにより露光した。[Coating liquid of photosensitive composition (2)] Copolymer◆E5゜Og Diazo resin *FO, 5g Jurimer^C-10L (manufactured by Nippon Pure Chemical Industries, Ltd.) 0.0
5g Victoria Pure Blue BO) I (manufactured by Hodokugaya Chemical Co., Ltd.) 0.1g Methyl Cellosolve Exposure was performed by irradiating for 60 seconds.
この露光済の感光性平版印刷版は、市販されている現像
液(SDN−21、コニカ社製、4倍に稀釈、現像時間
20秒、現像温度27℃)で現像し、平版印刷版の試1
AIV−1を得た。This exposed photosensitive lithographic printing plate was developed with a commercially available developer (SDN-21, manufactured by Konica, diluted 4 times, development time 20 seconds, development temperature 27°C), and a sample of the lithographic printing plate was developed. 1
AIV-1 was obtained.
[感光性平版印刷版の試料ロー2〜I(−6の作製コ実
施例2〜4および比較例5〜6において作製した各水溶
液で処理した支持体2〜6に実施例1の試料I−1の作
製と同様にして感光性組成物の塗布液(2)を塗布し、
感光性平版印刷版の試料+12〜ll−6を得た。[Preparation of sample rows 2-I (-6 of photosensitive lithographic printing plate) Samples I--6 of Example 1 were applied to supports 2-6 treated with the respective aqueous solutions prepared in Examples 2-4 and Comparative Examples 5-6. Coating liquid (2) of the photosensitive composition is applied in the same manner as in the preparation of step 1,
Samples of photosensitive lithographic printing plates +12 to 11-6 were obtained.
ついで、露光および現像を同様に行フて平版印刷版の試
料+1’−1〜I+’−6を得た。Then, exposure and development were carried out in the same manner to obtain lithographic printing plate samples +1'-1 to I+'-6.
得られた平版印刷版の試料+1’−1〜II’−6につ
いて、実施例1〜4に記載された評価方法を用いて評価
を行った。The obtained lithographic printing plate samples +1'-1 to II'-6 were evaluated using the evaluation methods described in Examples 1 to 4.
得られた結果を第3表に示した。The results obtained are shown in Table 3.
また感光性組成物の塗布液(2)に用いた共重合体IE
およびジアゾ樹脂中Fは、以下のものを使用した。In addition, copolymer IE used in the coating solution (2) of the photosensitive composition
The following F in the diazo resin was used.
*E;共瓜合体
p−ヒドロキシフェニルメタクリルアミド/アクリロニ
トリル/エチルアクリレート/メタクリル酸−10/3
0/[10/6の組成の共瓜イ体(Mw=60゜
*Fニジアゾ樹脂
第
表
[発明の効果]
本発明は、前処理された支持体を、更にアニオ界面活性
剤を含む水溶液で処理することにより、得られた平版印
刷版は、現像により膜が残らないとともに保水性に優れ
ている。更に耐処理薬品性並びに耐刷性にも優れている
。*E; Eutectic p-hydroxyphenylmethacrylamide/acrylonitrile/ethyl acrylate/methacrylic acid-10/3
0/[10/6 eutectic body (Mw=60°*F Nidiazo Resin Table Table [Effects of the Invention] The present invention further provides a pretreated support with an aqueous solution containing an aniosurfactant. Through the treatment, the resulting lithographic printing plate does not leave any film after development and has excellent water retention properties.Furthermore, it has excellent treatment chemical resistance and printing durability.
Claims (1)
含む水溶液で処理した後、該表面に感光層を設けたこと
を特徴とする感光性平版印刷版。1. A photosensitive lithographic printing plate, characterized in that the surface of a pretreated support is treated with an aqueous solution containing an anionic surfactant, and then a photosensitive layer is provided on the surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP467589A JPH02186354A (en) | 1989-01-13 | 1989-01-13 | Photosensitive planographic printing plate treated with anionic surfactant |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP467589A JPH02186354A (en) | 1989-01-13 | 1989-01-13 | Photosensitive planographic printing plate treated with anionic surfactant |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02186354A true JPH02186354A (en) | 1990-07-20 |
Family
ID=11590472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP467589A Pending JPH02186354A (en) | 1989-01-13 | 1989-01-13 | Photosensitive planographic printing plate treated with anionic surfactant |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02186354A (en) |
-
1989
- 1989-01-13 JP JP467589A patent/JPH02186354A/en active Pending
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