JPH02185736A - Optical recording disk - Google Patents
Optical recording diskInfo
- Publication number
- JPH02185736A JPH02185736A JP1004040A JP404089A JPH02185736A JP H02185736 A JPH02185736 A JP H02185736A JP 1004040 A JP1004040 A JP 1004040A JP 404089 A JP404089 A JP 404089A JP H02185736 A JPH02185736 A JP H02185736A
- Authority
- JP
- Japan
- Prior art keywords
- optical recording
- adhesive
- layer
- recording disk
- disk
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 13
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- 239000003505 polymerization initiator Substances 0.000 claims abstract description 5
- 239000004593 Epoxy Substances 0.000 claims description 12
- 239000007822 coupling agent Substances 0.000 claims description 5
- 150000001451 organic peroxides Chemical class 0.000 claims description 5
- 150000001412 amines Chemical class 0.000 claims description 4
- 239000002075 main ingredient Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 claims description 2
- 239000000654 additive Substances 0.000 claims description 2
- 229910000077 silane Inorganic materials 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims 1
- 150000001768 cations Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 abstract description 44
- 239000012790 adhesive layer Substances 0.000 abstract description 8
- 229920005989 resin Polymers 0.000 abstract description 6
- 239000011347 resin Substances 0.000 abstract description 6
- 238000010538 cationic polymerization reaction Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 4
- 239000011241 protective layer Substances 0.000 abstract description 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract description 3
- 125000004122 cyclic group Chemical group 0.000 abstract 2
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 10
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 8
- 238000001723 curing Methods 0.000 description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000004417 polycarbonate Substances 0.000 description 6
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 5
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910052786 argon Inorganic materials 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- -1 1-cyanoethyl-2-ethyl Chemical group 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- SJRJJKPEHAURKC-UHFFFAOYSA-N N-Methylmorpholine Chemical compound CN1CCOCC1 SJRJJKPEHAURKC-UHFFFAOYSA-N 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- SZFABAXZLWVKDV-UHFFFAOYSA-N 2-methyloctanoyl 2-methyloctaneperoxoate Chemical compound CCCCCCC(C)C(=O)OOC(=O)C(C)CCCCCC SZFABAXZLWVKDV-UHFFFAOYSA-N 0.000 description 2
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 2
- KOGSPLLRMRSADR-UHFFFAOYSA-N 4-(2-aminopropan-2-yl)-1-methylcyclohexan-1-amine Chemical compound CC(C)(N)C1CCC(C)(N)CC1 KOGSPLLRMRSADR-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- OWYWGLHRNBIFJP-UHFFFAOYSA-N Ipazine Chemical compound CCN(CC)C1=NC(Cl)=NC(NC(C)C)=N1 OWYWGLHRNBIFJP-UHFFFAOYSA-N 0.000 description 2
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 1
- KDGNCLDCOVTOCS-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy propan-2-yl carbonate Chemical compound CC(C)OC(=O)OOC(C)(C)C KDGNCLDCOVTOCS-UHFFFAOYSA-N 0.000 description 1
- QGKMIGUHVLGJBR-UHFFFAOYSA-M (4z)-1-(3-methylbutyl)-4-[[1-(3-methylbutyl)quinolin-1-ium-4-yl]methylidene]quinoline;iodide Chemical compound [I-].C12=CC=CC=C2N(CCC(C)C)C=CC1=CC1=CC=[N+](CCC(C)C)C2=CC=CC=C12 QGKMIGUHVLGJBR-UHFFFAOYSA-M 0.000 description 1
- FBHPRUXJQNWTEW-UHFFFAOYSA-N 1-benzyl-2-methylimidazole Chemical compound CC1=NC=CN1CC1=CC=CC=C1 FBHPRUXJQNWTEW-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- SVNWKKJQEFIURY-UHFFFAOYSA-N 2-methyl-1-(2-methylpropyl)imidazole Chemical compound CC(C)CN1C=CN=C1C SVNWKKJQEFIURY-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- KNTKCYKJRSMRMZ-UHFFFAOYSA-N 3-chloropropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCCl KNTKCYKJRSMRMZ-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- YIVJZNGAASQVEM-UHFFFAOYSA-N Lauroyl peroxide Chemical compound CCCCCCCCCCCC(=O)OOC(=O)CCCCCCCCCCC YIVJZNGAASQVEM-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 229920006317 cationic polymer Polymers 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- OSXYHAQZDCICNX-UHFFFAOYSA-N dichloro(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](Cl)(Cl)C1=CC=CC=C1 OSXYHAQZDCICNX-UHFFFAOYSA-N 0.000 description 1
- KTQYJQFGNYHXMB-UHFFFAOYSA-N dichloro(methyl)silicon Chemical compound C[Si](Cl)Cl KTQYJQFGNYHXMB-UHFFFAOYSA-N 0.000 description 1
- LXQJWJTWKSEINT-UHFFFAOYSA-N dimethoxy(dimethyl)silane;trimethoxy(phenyl)silane Chemical compound CO[Si](C)(C)OC.CO[Si](OC)(OC)C1=CC=CC=C1 LXQJWJTWKSEINT-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- 235000012489 doughnuts Nutrition 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NCXTWAVJIHJVRV-UHFFFAOYSA-N ethane-1,2-diol;16-methylheptadecanoic acid;titanium Chemical compound [Ti].OCCO.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O NCXTWAVJIHJVRV-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- ARYZCSRUUPFYMY-UHFFFAOYSA-N methoxysilane Chemical compound CO[SiH3] ARYZCSRUUPFYMY-UHFFFAOYSA-N 0.000 description 1
- 239000005055 methyl trichlorosilane Substances 0.000 description 1
- 239000005048 methyldichlorosilane Substances 0.000 description 1
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 description 1
- JLUFWMXJHAVVNN-UHFFFAOYSA-N methyltrichlorosilane Chemical compound C[Si](Cl)(Cl)Cl JLUFWMXJHAVVNN-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- MQWFLKHKWJMCEN-UHFFFAOYSA-N n'-[3-[dimethoxy(methyl)silyl]propyl]ethane-1,2-diamine Chemical compound CO[Si](C)(OC)CCCNCCN MQWFLKHKWJMCEN-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- GHAIYFTVRRTBNG-UHFFFAOYSA-N piperazin-1-ylmethanamine Chemical compound NCN1CCNCC1 GHAIYFTVRRTBNG-UHFFFAOYSA-N 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- BCNZYOJHNLTNEZ-UHFFFAOYSA-N tert-butyldimethylsilyl chloride Chemical compound CC(C)(C)[Si](C)(C)Cl BCNZYOJHNLTNEZ-UHFFFAOYSA-N 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- GQIUQDDJKHLHTB-UHFFFAOYSA-N trichloro(ethenyl)silane Chemical compound Cl[Si](Cl)(Cl)C=C GQIUQDDJKHLHTB-UHFFFAOYSA-N 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- 239000005051 trimethylchlorosilane Substances 0.000 description 1
- 239000005050 vinyl trichlorosilane Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、光を用いて情報の記録、再生または消去を行
なう光記録円板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical recording disk that records, reproduces, or erases information using light.
従来の光記録円板は熱可塑性樹脂を用いたロールコート
法によって貼り合わせられていた。また、片面型の光記
録円板では紫外線硬化樹脂が用いられている。Conventional optical recording disks have been bonded together using a roll coating method using thermoplastic resin. Moreover, ultraviolet curing resin is used in single-sided optical recording disks.
しかし従来技術のロールコート法ではロールコートにす
る樹脂が熱可塑性樹脂であるため、耐熱性がなく、高温
で使用したり保管したりすると記録層や保護層にクラッ
クを生じて使用できなくなるという問題点を有していた
。接着層が熱硬化性樹脂になる湿気硬化型のロールコー
トもあるか−、装置の取扱が難しく、貼り合わせられた
光記録円板の信頼性(耐熱性、耐候性)に問題があるた
め現実的でない。However, in the conventional roll coating method, since the resin used in the roll coating is a thermoplastic resin, it has no heat resistance, and when used or stored at high temperatures, cracks occur in the recording layer and protective layer, making it unusable. It had a point. Is there also a moisture-curing roll coat in which the adhesive layer is a thermosetting resin? This is not practical because the equipment is difficult to handle and there are problems with the reliability (heat resistance, weather resistance) of the bonded optical recording disk. Not on point.
そこで本発明はそのような課題を解決するものでその目
的とするところは、接着層が熱硬化性樹脂であるため、
耐熱性があり、光記録円板を高温で使用したり、高温に
保管しても記録層や保護層にクラックを生じることがな
く、光または熱を用いて貼り合わせ段階での仮止めがで
きるため、作業性に優れ、量産性があり、接着層が比較
的低温で硬化できるので容易に両面型の光記録円板を形
成できるところにある。Therefore, the present invention is intended to solve such problems, and its purpose is that since the adhesive layer is a thermosetting resin,
It is heat resistant and will not cause cracks in the recording layer or protective layer even if the optical recording disk is used or stored at high temperatures, and can be temporarily fixed at the bonding stage using light or heat. Therefore, it has excellent workability and is suitable for mass production, and since the adhesive layer can be cured at a relatively low temperature, a double-sided optical recording disk can be easily formed.
本発明は光により情報の記録、再生または消去を行う光
記録円板の貼り合わせ構造において少なくともエポキシ
の主剤と硬化剤を含み、該硬化剤が少なくとも環状脂肪
族アミン系と、光または熱カチオン重合開始剤である接
着剤を用いて貼り合わせたことを特徴とする。The present invention provides a bonded structure of an optical recording disk for recording, reproducing, or erasing information using light, which contains at least an epoxy main ingredient and a curing agent, and the curing agent is polymerized with at least a cycloaliphatic amine and a photo or thermal cationic polymer. It is characterized by being bonded together using an adhesive as an initiator.
本発明ではシランもしくは金属系のカップリング剤の添
加量は接着剤全重量の0.5%から8%としたが、0.
5%未満では高温高湿下での密着力が弱くなるため信頼
性が劣り、逆に8%より多く添加するとカップリング剤
の分解によって生じる、アルコール、水、その他の低分
子量成分の影響によって耐候性が悪くなる傾向にある。In the present invention, the amount of silane or metal coupling agent added was 0.5% to 8% of the total weight of the adhesive, but 0.5% to 8% of the total weight of the adhesive.
If it is less than 5%, the adhesion under high temperature and high humidity will be weak, resulting in poor reliability.On the other hand, if it is added more than 8%, weather resistance will be affected by the effects of alcohol, water, and other low molecular weight components caused by the decomposition of the coupling agent. It tends to get worse.
しかし、0.5%未満および8%より多く添加してはい
けないというのではなく、0.5%から8%の間が適当
というものである。より好ましくは、1%から5%程度
の添加量がよい。また、本発明では有機過酸化物を0.
1から5重量%添加するが、0゜1%未構では接着剤の
硬化に時間がかかり、5%より多いと接着剤の物性が悪
くなる傾向にある。However, this does not mean that it should not be added less than 0.5% or more than 8%, but that it is appropriate to add between 0.5% and 8%. More preferably, the amount added is about 1% to 5%. In addition, in the present invention, the organic peroxide is 0.
It is added in an amount of 1 to 5% by weight, but if it is not added at 0.1%, it takes time to cure the adhesive, and if it is more than 5%, the physical properties of the adhesive tend to deteriorate.
ここでも、0.1%未満及び5%より多く添加してはい
けないというのではなく、0.1%から5%程度が適当
というものである。より好ましくは0.5%から3%の
添加がよい。Again, this does not mean that it should not be added less than 0.1% or more than 5%, but that about 0.1% to 5% is appropriate. More preferably, it is added in an amount of 0.5% to 3%.
エポキシの主剤としては低粘度のものが作業性がよいの
で、ビスフェノールF型、フェノールノボラック型やビ
スフェノールA型のエポキシに一反応性希釈剤として少
量のグリシジルエーテル、ジグリシジルエーテル等を添
加したものを用いるとよい。この反応性希釈剤は硬化し
た後のエポキシの物性を悪くするので、添加量は控えた
方がよく、30重量%以下にした方がよい。As the main epoxy agent, one with low viscosity has good workability, so we use bisphenol F type, phenol novolak type, and bisphenol A type epoxy with a small amount of glycidyl ether, diglycidyl ether, etc. added as a monoreactive diluent. Good to use. Since this reactive diluent deteriorates the physical properties of the epoxy after hardening, it is better to limit the amount added, and it is better to keep it at 30% by weight or less.
エポキシの硬化剤として用いる環状脂肪族アミンとして
は、1−イソブチル−2−メチルイミダゾール、2−エ
チル−4(5)−メチルイミダゾール、1−ベンジル−
2−メチルイミダゾール、2−メチルイミダゾール、イ
ミダゾール、1−シアノエチル−2−エチル4(5)−
メチルイミダゾール、メンタンジアミン、N−アミノメ
チルピペラジン、N−メチルモルホリン、1.3−ジア
ミノサイクロヘキサン、イソホロンジアミン等をから選
んだ1種または2FIN以上の混合物を用いるとよい。Examples of cycloaliphatic amines used as epoxy curing agents include 1-isobutyl-2-methylimidazole, 2-ethyl-4(5)-methylimidazole, and 1-benzyl-2-methylimidazole.
2-methylimidazole, 2-methylimidazole, imidazole, 1-cyanoethyl-2-ethyl 4(5)-
It is preferable to use one type or a mixture of two or more FIN selected from methylimidazole, menthanediamine, N-aminomethylpiperazine, N-methylmorpholine, 1,3-diaminocyclohexane, isophoronediamine, and the like.
なかでもエポキシの主剤と混合したときのポットライフ
を比較的長くするために、メンタンジアミンやイミダゾ
ール系を用いるとよく、その添加量は2%から796程
度が適当である。2%以下ではエポキシの硬化が不十分
になり、7%以上ではポットライフが短くなる。より好
ましくは3%から5%が適当である。Among them, menthanediamine and imidazole are preferably used in order to have a relatively long pot life when mixed with the epoxy main ingredient, and the appropriate amount of addition is about 2% to 796%. If it is less than 2%, the curing of the epoxy will be insufficient, and if it is more than 7%, the pot life will be shortened. More preferably 3% to 5% is appropriate.
本発明で接着剤のなかに添加するカップリング剤の例と
してはγ−(2−アミノエチル)アミノプロピルトリメ
トキシシラン、γ−(アミノエチル)アミノプロピルメ
チルジメトキシシラン、γ−メタクリロキシブロピルト
リメトキシシラン、N−β−(N〜ルビニルベンジルア
ミノエチル−γ−アミノプロピルトリメトキシシラン、
γ−グリシドキシプロビルトリメトキシシラン、γ−メ
ルカプトプロピルトリメトキシシラン、メチルトリメト
キシシラン、メチルトリエトキシシラン、ビニルトリア
セトキシシラン、γ−アニリノプロピルトリメトキシシ
ラン、ビニルトリメトキシシラン、γ−クロロプロピル
メチルジメトキシシラン、γ−メルカプトプロピルメチ
ルジメトキシシラン、メチルトリクロロシラン、ジメチ
ルジクロロシラン、トリメチルクロロシラン、ビニルト
リクロルシラン、ビニルトリス(βメトキシエトキシ)
シラン、β−(3,4−エポキシシクロヘーキシル)エ
チルトリメトキシシラン、γ−グリシドキシプロピルメ
チルジェトキシシラン、N−β(アミノエチル)γ−ア
ミノプロピルトリメトキシシラン、N−フェニル−γ−
アミノプロピルトリメトキシシラン、メチルジクロロシ
ラン、フェニルトリクロロシラン、ジフェニルジクロロ
シラン、テトラメトキシシラン、ジメチルジメトキシシ
ランフェニルトリメトキシシラン、ジフェニルジメトキ
シシラン、デシルトリメトキシシラン、テトラエトキシ
シラン、メチルトリエトキシシラン、ジメチルジェトキ
シシラン、フェニルトリエトキシシラン、ジフェニルジ
ェトキシシラン、ビストリメチルアセトアミドトリメチ
ルシリルアセトアミド、ビストリメチルシリルウレア、
tert−ブチルジメチルクロロシラン、イソプロピル
トリイソステアロイルチタネート、イソプロピルトリド
デシルベンゼンスルホニルチタネート、イソプロピルト
リス(ジオクチルパイロフォスフェート)チタネート、
テトライソプロピルビス(ジオクチルホスファイト)チ
タネート、テトラオクチルビス(ジトリデシルフォスフ
ァイト)チタネト、テトラ(2,2−ジアリルオキシメ
チル−1−ブチル)ビス(ジトリデシル)フォスファイ
トチタネート、ビス(ジオクチルパイロフォスフェート
)エチレンチタネート、イソプロピルトリオクタノイル
チタネート、イソプロピルジメタクリルイソステアロイ
ルチタネート、イソプロピルイソステアロイルジアクリ
ルチタネート、イソプロピルトリ(ジオクチルフォスフ
ェート)チタネート、イソプロピルトリクミルフェニル
チタネート、イソプロピルトリ(N−アミドエチル・ア
ミドエチル)チタネート、ジクミルフェニルオキシアセ
テートチタネート、ジイソステアロイルエチレンチタネ
ート、アセトアルコキシアルミニウムジイソプロピエー
トなどが挙げられる。Examples of coupling agents added to the adhesive in the present invention include γ-(2-aminoethyl)aminopropyltrimethoxysilane, γ-(aminoethyl)aminopropylmethyldimethoxysilane, and γ-methacryloxypropyltrimethoxysilane. Methoxysilane, N-β-(N~ruvinylbenzylaminoethyl-γ-aminopropyltrimethoxysilane,
γ-glycidoxypropyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, vinyltriacetoxysilane, γ-anilinopropyltrimethoxysilane, vinyltrimethoxysilane, γ- Chloropropylmethyldimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, methyltrichlorosilane, dimethyldichlorosilane, trimethylchlorosilane, vinyltrichlorosilane, vinyltris(βmethoxyethoxy)
Silane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, γ-glycidoxypropylmethyljethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-phenyl-γ −
Aminopropyltrimethoxysilane, Methyldichlorosilane, Phenyltrichlorosilane, Diphenyldichlorosilane, Tetramethoxysilane, Dimethyldimethoxysilane Phenyltrimethoxysilane, Diphenyldimethoxysilane, Decyltrimethoxysilane, Tetraethoxysilane, Methyltriethoxysilane, Dimethyljetoxysilane Toxysilane, phenyltriethoxysilane, diphenyljethoxysilane, bistrimethylacetamidetrimethylsilylacetamide, bistrimethylsilylurea,
tert-butyldimethylchlorosilane, isopropyl triisostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl tris(dioctylpyrophosphate) titanate,
Tetraisopropyl bis(dioctyl phosphite) titanate, tetraoctyl bis(ditridecyl phosphite) titanate, tetra(2,2-diallyloxymethyl-1-butyl) bis(ditridecyl) phosphite titanate, bis(dioctyl pyrophosphate) Ethylene titanate, isopropyl trioctanoyl titanate, isopropyl dimethacrylic isostearoyl titanate, isopropyl isostearoyl diacryl titanate, isopropyl tri(dioctyl phosphate) titanate, isopropyl tricumylphenyl titanate, isopropyl tri(N-amidoethyl amidoethyl) titanate, dichloromethane Examples include milphenyloxyacetate titanate, diisostearoylethylene titanate, acetalkoxyaluminum diisopropiate, and the like.
これらのカップリング剤のなかでも、特にγグリシドキ
ブロピルトリメトキシシランやγ−メタクリロキシプロ
ピルトリメトキシシラン等のように沸点が150℃以上
あるものが取扱が容易である。Among these coupling agents, those having a boiling point of 150° C. or higher, such as γ-glycidquibropyltrimethoxysilane and γ-methacryloxypropyltrimethoxysilane, are particularly easy to handle.
また、本発明で接着剤のなかに添加する有機過酸化物の
例としては、ベンゾイルパーオキシド、イソノナノイル
パーオキシド、ラウロイルパーオキシド、t−ブチルパ
ー−2−エチルヘキサノエート、1.1−ビス(t−ブ
チルパーオキシ)3.3.5、−トリメチルシクロヘキ
サン、t−ブチルパーオキシイソプロピルカーボネート
、t−ブチルパーオキシベンゾエート、メチルエチルケ
トンパーオキシド、t−ブチルハイドロパーオキシド、
ジクミルパーオキシド、クメンヒドロパーオキシド、ジ
−t−ブチルパーオキシド等があげられる。これらの有
機過酸化物のなかでも半減期温度が60℃から100℃
にあるものがよく、その例としてはベンゾイルパーオキ
シド、イソノナノイルパーオキシド、t−ブチルパー2
−エチルヘキサノエート、クメンヒドロパーオキシド、
1.1−ビス(ターシャリ−ブチルパーオキシ)3.3
.5−)リメチルシクロヘキサン等である。Further, examples of organic peroxides added to the adhesive in the present invention include benzoyl peroxide, isononanoyl peroxide, lauroyl peroxide, t-butyl per-2-ethylhexanoate, 1.1- Bis(t-butylperoxy)3.3.5, -trimethylcyclohexane, t-butylperoxyisopropyl carbonate, t-butylperoxybenzoate, methyl ethyl ketone peroxide, t-butyl hydroperoxide,
Examples include dicumyl peroxide, cumene hydroperoxide, di-t-butyl peroxide, and the like. Among these organic peroxides, the half-life temperature is between 60℃ and 100℃.
Examples include benzoyl peroxide, isononanoyl peroxide, and t-butyl peroxide.
-ethylhexanoate, cumene hydroperoxide,
1.1-bis(tert-butylperoxy)3.3
.. 5-) Limethylcyclohexane, etc.
さらに、本発明ではこれらの添加剤の他に、濡れ性を改
善するための界面活性剤や、安定剤、酸化防止剤などを
添加しても問題ない。Furthermore, in the present invention, in addition to these additives, there is no problem in adding surfactants, stabilizers, antioxidants, etc. to improve wettability.
以下本発明について図面に基づいて詳細に説明する。 The present invention will be explained in detail below based on the drawings.
第1図は本発明になる光ディスクの基本構成図であり、
■は及び8はポリカーボネートの基板、2及び9は5i
AIN層、3、及び10はTbFeCoの記録層、4お
よび11は5iAIN層、5および12はAIの反射膜
、6は本発明になる接着層、7及び13はハードコート
層である。1及び8のポリカーボネートの基板は射出圧
縮成形によって1.6μピツチでスパイラル状のトラッ
キング用の溝及びフォーマット用のビット列を形成した
ものである。2及び9の5iAIN層は5iAlの焼結
ターゲットを用いて、窒素とアルゴンの混合ガスを導入
することによるRF反応マグネトロンスパッタ法により
成膜したものである。FIG. 1 is a basic configuration diagram of an optical disc according to the present invention,
■ and 8 are polycarbonate substrates, 2 and 9 are 5i
AIN layers 3 and 10 are TbFeCo recording layers, 4 and 11 are 5iAIN layers, 5 and 12 are AI reflective films, 6 is an adhesive layer according to the present invention, and 7 and 13 are hard coat layers. The polycarbonate substrates Nos. 1 and 8 were formed with spiral tracking grooves and formatting bit rows at a pitch of 1.6 μm by injection compression molding. The 5iAIN layers 2 and 9 were formed by RF reaction magnetron sputtering using a 5iAl sintered target and introducing a mixed gas of nitrogen and argon.
3及び10のTbFeCoの記録層はTbFeC0の合
金ターゲットを用いて、アルゴンガスを導入することに
よる、DCマグネトロンスパッダ法により成膜したもの
である。4及び11の5iAIN層は2及び9と同じく
、5iAlの焼結ターゲットを用いて窒素とアルゴンの
混合ガスを導入することによるRF反応マグネトロンス
パッタ法によって成膜したものである。5および12は
Alの金属ターゲットを用いてアルゴンガスを導入する
ことによるDCマグネトロンスパッタ法によって成膜し
たものである。貼り合わせた後、スピンコードによって
紫外線硬化樹脂をディスク面に塗布したあと紫外線を照
射して硬化させてハードコートとした。The TbFeCo recording layers of Nos. 3 and 10 were formed by a DC magnetron sputtering method using a TbFeC0 alloy target and introducing argon gas. Similar to 2 and 9, the 5iAIN layers Nos. 4 and 11 were formed by the RF reaction magnetron sputtering method using a 5iAl sintered target and introducing a mixed gas of nitrogen and argon. Films 5 and 12 were formed by DC magnetron sputtering using an Al metal target and introducing argon gas. After bonding, an ultraviolet curable resin was applied to the disk surface using a spin cord and cured by irradiating ultraviolet rays to form a hard coat.
6の本発明になる接着層について説明する。エポキシの
主剤として大日本インキ化学工業のエビクロンS−12
9を、エポキシの硬化剤として油化シェルエポキシのエ
ビキュアーBMI−12を、光または熱カチオン重合開
始剤としてチバガイギーのイルガキュアー261を、有
機過酸化物としてクメンヒドロパーオキシドを、シラン
カップリング剤としてγ−グリシドキシプロビルトリメ
トキシシランを用いた。貼り合わせ方法はBMI−12
を3にイルガキュアー261を1、クメンヒドロパーオ
キシドを1、γ−グリシドキシプロビルトリメトキシシ
ランを2溶解した硬化剤7重量%と、S−129を93
重量%とを混合して、片方のディスクの記録層が成膜さ
れている側の記録半径のほぼ中心にドーナツ状に塗布し
て、真空系内でもう片方のディスクと貼り合わせて、系
をリークしてディスクを日乾させながら紫外線を照射し
てディスクを仮止めした後、60℃で5時間加熱して硬
化させた。ディスクは紫外線によって仮止めできるよう
に、外周部と内周部に記録層が形成されぬい部分がある
。The adhesive layer according to No. 6 of the present invention will be explained. Dainippon Ink &Chemicals' Evicron S-12 is used as the main agent for epoxy.
9, oil-based shell epoxy Ebicure BMI-12 as an epoxy curing agent, Ciba Geigy's Irgacure 261 as a photo or thermal cationic polymerization initiator, cumene hydroperoxide as an organic peroxide, and a silane coupling agent. γ-glycidoxypropyltrimethoxysilane was used. The pasting method is BMI-12
3, 1 part of Irgacure 261, 1 part of cumene hydroperoxide, 2 parts of γ-glycidoxyprobyltrimethoxysilane, 7% by weight of a hardening agent, and 93 parts of S-129.
% by weight, apply it in a donut shape approximately at the center of the recording radius on the side where the recording layer is formed on one disk, and bond it to the other disk in a vacuum system to complete the system. After leaking and drying the disc in the sun, the disc was irradiated with ultraviolet rays to temporarily fix the disc, and then heated at 60°C for 5 hours to cure it. The disc has a recording layer formed on the outer and inner peripheries and has a seam so that it can be temporarily fixed using ultraviolet light.
次に、第1図において接着層を変えたときの70℃90
%RHで3000時間耐候性試験の結果を表1に示す。Next, in Figure 1, when changing the adhesive layer,
The results of the 3000 hour weathering test at %RH are shown in Table 1.
表1の結果から分かるように、本発明になる光記録円板
は耐候性試験後も性状やピットエラーレートの変化がな
く、長期信頼性があることが分かる。また、本実施例で
は紫外線によってディスクの外周部と内周部を仮止めで
きるので量産性があることが分かる。As can be seen from the results in Table 1, the optical recording disk of the present invention shows no change in properties or pit error rate even after the weather resistance test, indicating that it has long-term reliability. In addition, it can be seen that this embodiment is suitable for mass production because the outer and inner circumferential portions of the disk can be temporarily fixed using ultraviolet rays.
表 1
イルガキュア261;チバガイギー
アデカドール5o−120,旭電化
尚、本発明はこれらの実施例に限定されると考えられる
べきではなく、本発明の主旨を逸脱しない限り種々の変
更は可能である。例えば本発明ではPC基板上にセラミ
ックス層、記録層、セラミックス層、金属層の4層構造
としたが、セラミックス層、記録層、セラミックス層の
3層構造を−貼り合わせた構造でも全く問題はなく、セ
ラミックス層、記録層、セラミックス層を成膜したもの
をセラミックス層1層だけ成膜されたPC基板、あるい
は何も成膜されていないPC基板と貼り合わせた片面構
造でも構わない。Table 1 Irgacure 261; Ciba Geigy Adekador 5o-120, Asahi Denka It should be noted that the present invention should not be considered limited to these examples, and various changes are possible without departing from the gist of the present invention. For example, in the present invention, a four-layer structure of a ceramic layer, a recording layer, a ceramic layer, and a metal layer is used on a PC board, but there is no problem with a structure in which a three-layer structure of a ceramic layer, a recording layer, and a ceramic layer is bonded together. A single-sided structure may be used in which a ceramic layer, a recording layer, and a ceramic layer are bonded to a PC board on which only one ceramic layer is formed, or a PC board on which no film is formed.
また、セラミックス層の例としては、5iAIN層の他
に、SiN層、AIN層、5iAINO層などでもよく
記録層を挟むセラミックス層の材質が異なっていても問
題ない。記録層としてはTbFeCo層の他に、NdD
yFeCo層、GdTbFe層等の光磁気記録層の他に
、Te−TeOx層、Te5bAs等の相変化型、シア
ニン等の有機色素を用いたものでも適用できる。記録層
の種類によってはセラミックス層は必要ない場合もある
。Furthermore, as examples of the ceramic layer, in addition to the 5iAIN layer, a SiN layer, an AIN layer, a 5iAINO layer, etc. may be used, and there is no problem even if the ceramic layers sandwiching the recording layer are made of different materials. In addition to the TbFeCo layer, NdD is used as the recording layer.
In addition to magneto-optical recording layers such as a yFeCo layer and a GdTbFe layer, a Te-TeOx layer, a phase change type such as Te5bAs, and one using an organic dye such as cyanine can also be used. Depending on the type of recording layer, a ceramic layer may not be necessary.
さらに、本発明では紫外線を用いて仮+Jxめをした例
を示したか、熱により硬化できる開始剤を用いると熱に
よっても仮止めが可能となり、赤外線、マイクロ波、高
周波等を用いて硬化させることもてきる。Furthermore, in the present invention, an example was shown in which temporary +Jx bonding was performed using ultraviolet rays, and if an initiator that can be cured by heat is used, temporary fixing is also possible by heat, and curing can be performed using infrared rays, microwaves, high frequencies, etc. I can bring it.
以上のように接着剤にエポキシの主剤と光または熱カチ
オン重合開始剤と環状脂肪族アミンを添加することによ
り光メディア製造の作業性、生産性か著しく向上した。As described above, by adding an epoxy main ingredient, a photo or thermal cationic polymerization initiator, and a cycloaliphatic amine to the adhesive, the workability and productivity of optical media production were significantly improved.
第1図は、本発明の光記録媒体の基本構成図である。 1.8・ ・ 219 ・ ・ 3、 ] 0 ・ 4、11 ・ 5、12・ 6 ・ ・ ・ 鳴 7、13 ・ ポリカーボネートの基板 5iAIN層 TbFeCoの記録層 5iAIN層 AIの反射膜 接着層 ハードコート層 以上 出願人 セイコーエプソン株式会社 FIG. 1 is a basic configuration diagram of the optical recording medium of the present invention. 1.8・・ 219 ・ ・ 3、 ・ 4, 11・ 5, 12・ 6 ・ ・ ・ Sound 7, 13・ polycarbonate substrate 5iAIN layer TbFeCo recording layer 5iAIN layer AI reflective film adhesive layer hard coat layer that's all Applicant: Seiko Epson Corporation
Claims (3)
録円板の貼り合わせ構造において、少なくともエポキシ
の主剤と硬化剤を含み、該硬化剤が少なくとも環状脂肪
族アミン系と、光または熱カチオン重合開始剤である接
着剤を用いて貼り合わせたことを特徴とする光記録円板
。(1) A laminated structure of an optical recording disk that records, reproduces, or erases information using light, which contains at least an epoxy main ingredient and a curing agent, and the curing agent contains at least a cycloaliphatic amine and a light or thermal cation. An optical recording disk characterized in that it is bonded together using an adhesive that is a polymerization initiator.
グ剤を0.5から8重量%添加したことを特徴とする請
求項1記載の光記録円板。(2) The optical recording disk according to claim 1, wherein 0.5 to 8% by weight of silane or a metal-based coupling agent is added to the adhesive.
添加したことを特徴とする請求項1記載の光記録円板。(3) Add 0.1 to 5% by weight of organic peroxide to the adhesive.
2. The optical recording disk according to claim 1, further comprising: an additive.
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1004040A JPH02185736A (en) | 1989-01-11 | 1989-01-11 | Optical recording disk |
DE69030845T DE69030845T2 (en) | 1989-01-11 | 1990-01-11 | OPTICAL PLATE AND METHOD FOR PRODUCING THE SAME |
PCT/JP1990/000025 WO1990008382A1 (en) | 1989-01-11 | 1990-01-11 | Optical disk and method of manufacturing the same |
KR1019900702053A KR100264705B1 (en) | 1989-01-11 | 1990-01-11 | Optical disk and its manufacturing method |
EP90901677A EP0408763B1 (en) | 1989-01-11 | 1990-01-11 | Optical disk and method of manufacturing the same |
US07/576,490 US5197060A (en) | 1989-01-11 | 1990-09-11 | Dual substrate optical recording medium |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1004040A JPH02185736A (en) | 1989-01-11 | 1989-01-11 | Optical recording disk |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02185736A true JPH02185736A (en) | 1990-07-20 |
Family
ID=11573836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1004040A Pending JPH02185736A (en) | 1989-01-11 | 1989-01-11 | Optical recording disk |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02185736A (en) |
-
1989
- 1989-01-11 JP JP1004040A patent/JPH02185736A/en active Pending
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