JPH0218273U - - Google Patents
Info
- Publication number
- JPH0218273U JPH0218273U JP9743888U JP9743888U JPH0218273U JP H0218273 U JPH0218273 U JP H0218273U JP 9743888 U JP9743888 U JP 9743888U JP 9743888 U JP9743888 U JP 9743888U JP H0218273 U JPH0218273 U JP H0218273U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal
- protrusion
- receiving surface
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Non-Reversible Transmitting Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9743888U JPH0218273U (US08088816-20120103-C00036.png) | 1988-07-23 | 1988-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9743888U JPH0218273U (US08088816-20120103-C00036.png) | 1988-07-23 | 1988-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0218273U true JPH0218273U (US08088816-20120103-C00036.png) | 1990-02-06 |
Family
ID=31322908
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9743888U Pending JPH0218273U (US08088816-20120103-C00036.png) | 1988-07-23 | 1988-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0218273U (US08088816-20120103-C00036.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146609A (ja) * | 2011-01-14 | 2012-08-02 | Yazaki Corp | 基板接続用端子 |
| JP2021190677A (ja) * | 2020-05-27 | 2021-12-13 | 深▲セン▼桑椹電子商務有限公司Shenzhen Sangshen E−commerce Co., Ltd. | Ｌｅｄ基板の製造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814682B2 (ja) * | 1978-07-04 | 1983-03-22 | ニツポ−電気株式会社 | 温度調節装置 |
| JPS6237180B2 (US08088816-20120103-C00036.png) * | 1980-10-17 | 1987-08-11 | Caterpillar Mitsubishi Ltd | |
| JPS6249304B2 (US08088816-20120103-C00036.png) * | 1979-12-10 | 1987-10-19 | Toyo Boseki Kk |
-
1988
- 1988-07-23 JP JP9743888U patent/JPH0218273U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5814682B2 (ja) * | 1978-07-04 | 1983-03-22 | ニツポ−電気株式会社 | 温度調節装置 |
| JPS6249304B2 (US08088816-20120103-C00036.png) * | 1979-12-10 | 1987-10-19 | Toyo Boseki Kk | |
| JPS6237180B2 (US08088816-20120103-C00036.png) * | 1980-10-17 | 1987-08-11 | Caterpillar Mitsubishi Ltd |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012146609A (ja) * | 2011-01-14 | 2012-08-02 | Yazaki Corp | 基板接続用端子 |
| JP2021190677A (ja) * | 2020-05-27 | 2021-12-13 | 深▲セン▼桑椹電子商務有限公司Shenzhen Sangshen E−commerce Co., Ltd. | Ｌｅｄ基板の製造方法 |
