JPH02181641A - Electrode plate for detecting water drop - Google Patents

Electrode plate for detecting water drop

Info

Publication number
JPH02181641A
JPH02181641A JP21289A JP21289A JPH02181641A JP H02181641 A JPH02181641 A JP H02181641A JP 21289 A JP21289 A JP 21289A JP 21289 A JP21289 A JP 21289A JP H02181641 A JPH02181641 A JP H02181641A
Authority
JP
Japan
Prior art keywords
insulating substrate
substrate
electrode rods
electrode
heater
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21289A
Other languages
Japanese (ja)
Other versions
JP2714835B2 (en
Inventor
Hiroshi Morioka
森岡 弘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Build Kogyo Co Ltd
Original Assignee
Nissei Build Kogyo Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Build Kogyo Co Ltd filed Critical Nissei Build Kogyo Co Ltd
Priority to JP64000212A priority Critical patent/JP2714835B2/en
Priority to CH177989A priority patent/CH679079A5/en
Publication of JPH02181641A publication Critical patent/JPH02181641A/en
Application granted granted Critical
Publication of JP2714835B2 publication Critical patent/JP2714835B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To decrease the failure rate with age by disconnection, etc., and to improve working reliability by connecting many electrode rods disposed regularly through an insulated substrate on the rear surface of the substrate in such a manner that the rods belong to alternately different polarities and attaching a heater thereto. CONSTITUTION:A water drop W drastically lowers the insulation resistance of the adjacent electrode rods 20 with each other on the surface 10a of the insulated substrate 10, by which the sure detection of the water drops of rains and snow via wiring patterns 11 is executed. The stop of the fall can be detected from the restoration of the insulation resistance value between the electrode rods 20 on evaporation of the water drop W. Since the necessary heat for evaporation is transferred efficiently to the surface of the substrate 10 via the electrode rods 20 by the heater 30, the electric power consumption is minimized. Only the end faces of the rods 20 exist here and there on the surface of the substrate 10 and the durability against the physical force from the outside and after long-use is excellent. The possibility of the disconnection accident of the wiring patterns 11, etc., is minimal.

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、降雨センサや降雪センサ等の基本構成部品
として使用するための、新規の、水滴検出用の電極板に
関する。
DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application This invention relates to a novel water droplet detection electrode plate for use as a basic component of rain sensors, snowfall sensors, and the like.

従来技術 降雨センサや降雪センサ等には、雨や雪による水滴の通
電性を利用して、これを検出するための電極板を備える
形式のものが多い。中でも、極性の異なる一対の電極間
を水滴が橋絡したときに電極間の絶縁抵抗値が急落する
ことを検出して、雨や雪が降り始めたことを検知するも
のは、構造が単純であり、動作原理も明確なので、その
実用性が極めて高い。
BACKGROUND OF THE INVENTION Many conventional rain sensors, snowfall sensors, and the like are equipped with an electrode plate for detecting water droplets caused by rain or snow by utilizing their electrical conductivity. Among these, a device that detects the sudden drop in insulation resistance between a pair of electrodes with different polarities when a water drop bridges the gap between a pair of electrodes, and detects the start of rain or snow, has a simple structure. Since the operating principle is clear, its practicality is extremely high.

この場合の電極板は、適度な大きさの絶縁基板の表面の
ほぼ全面に、所定間隔を保って、連続する電極パターン
による一対の電極を平面的に配設するとともに、裏面側
にヒータを付設してなり、水滴が電極の任意の一点を橋
絡することによって雨や雪を検出し、これらが降り止ん
だときは、ヒ=汐によ−って早急に電極面を乾かして、
作動前の状態に復帰することができるものである。
In this case, the electrode plate consists of a pair of electrodes arranged in a continuous electrode pattern on almost the entire surface of an appropriately sized insulating substrate at a predetermined interval, and a heater attached to the back side. Rain or snow is detected by the water droplets bridging any point on the electrode, and when the rain or snow stops falling, the electrode surface is quickly dried with water.
It is possible to return to the state before activation.

発明が解決しようとする課題 この従来技術によれば、一対の電極は、絶縁基板の表面
側において連続しているので、電極パターンの断線事故
が生じ易く、また、一箇所の断線事故によって電極パタ
ーンの大部分の機能が失われるという欠点があった。ま
た、電極とヒータとの間に絶縁基板が介在するので、ヒ
ータの熱効率が低く、電極板の乾燥に要する時間が過大
となるために、雨や雪の降止みの検出を適確に行ない得
ない場合が生じがちであった。
Problems to be Solved by the Invention According to this prior art, since the pair of electrodes are continuous on the surface side of the insulating substrate, it is easy for the electrode pattern to break. The disadvantage was that most of the functions were lost. Furthermore, since an insulating substrate is interposed between the electrode and the heater, the thermal efficiency of the heater is low and the time required to dry the electrode plate becomes excessive, making it difficult to accurately detect when rain or snow has stopped falling. There tended to be cases where there was no such thing.

そこで、この発明の目的は、電極パターンを、所定間隔
を隔てた点の集合体のように形成することによって、断
線事故等の経年故障率を低減するとともに、電極に対し
て、絶縁基板を介することなく直接にヒータ熱を伝える
ことによって、熱効率の向上を図り、その作動信頼性を
高めることができる水滴検出用の電極板を提供すること
にある。
Therefore, an object of the present invention is to reduce the failure rate over time such as disconnection accidents by forming an electrode pattern like a collection of points separated by a predetermined interval, and also to reduce the failure rate over time such as disconnection accidents. It is an object of the present invention to provide an electrode plate for detecting water droplets, which can improve thermal efficiency and increase operational reliability by directly transmitting heater heat without any interference.

課題を解決するための手段 かかる目的を達成するためのこの発明の構成は、絶縁基
板と、この絶縁基板に規則的に配設し、絶縁基板を貫通
する多数の電極棒と、この電極棒が交互に異なる極性に
属するように結線する配線パターンと、絶縁基板の裏面
に付設するヒータとからなり、配線パターンは、絶縁基
板の裏面に設けたことをその要旨とする。
Means for Solving the Problems The structure of the present invention to achieve the object includes an insulating substrate, a large number of electrode rods regularly arranged on the insulating substrate and penetrating the insulating substrate, and It consists of a wiring pattern that is connected to alternately belong to different polarities and a heater attached to the back surface of an insulating substrate, and the gist is that the wiring pattern is provided on the back surface of the insulating substrate.

なお、絶縁基板を上層基板と下層基板とからなるものと
し、配線パターンは、両基板の間に設けてもよいもので
ある。
Note that the insulating substrate is made up of an upper layer substrate and a lower layer substrate, and the wiring pattern may be provided between both substrates.

作用 この構成によれば、電極棒は絶縁基板を貫通しているの
で、絶縁基板の表面には、各電極棒の端面部が規則的に
表出する電極パターンが形成される。また、電極棒は、
配線パターンによって交互に異なる極性を有する。した
がって、水滴が、隣接する2以上の電極棒の端面部を橋
絡するように付着するとき、この水滴を介して、2以上
の電極棒間に通電可能な電気回路が構成され、電極棒間
の絶縁抵抗値は急落するように変化する。そこで、この
変化を捉えることによって、水滴の存在を検出すること
ができる。また、電極棒は、絶縁基板を貫通して裏面の
ヒータに接しているので、ヒータは、効率よく電極棒を
加熱することができる。
According to this configuration, since the electrode rods pass through the insulating substrate, an electrode pattern is formed on the surface of the insulating substrate in which the end face portions of each electrode rod are regularly exposed. In addition, the electrode rod is
It has alternately different polarity depending on the wiring pattern. Therefore, when a water droplet adheres to bridge the end surfaces of two or more adjacent electrode rods, an electric circuit that can conduct electricity between the two or more electrode rods is constructed via the water droplet, and The insulation resistance value of changes rapidly. Therefore, by capturing this change, the presence of water droplets can be detected. Moreover, since the electrode rod penetrates the insulating substrate and is in contact with the heater on the back surface, the heater can efficiently heat the electrode rod.

以上のように作用するものである。It works as described above.

実施例 以下、図面を以って実施例を説明する。Example Examples will be described below with reference to the drawings.

水滴検出用の電極板(以下、単に、電極板という)は、
絶縁基板10と、多数の電極棒20.20・・・と、ヒ
ータ30とからなる(第1図)。
The electrode plate for detecting water droplets (hereinafter simply referred to as the electrode plate) is
It consists of an insulating substrate 10, a large number of electrode rods 20, 20, and a heater 30 (FIG. 1).

絶縁基板10は、絶縁材料を適宜の厚さの板状に形成し
たものである。絶縁材料としては、ベークライトやエポ
キシ樹脂等の硬質合成樹脂材料が適当であるが、セラミ
ックスやシリコーンゴム等を使用することもできる。ま
た、絶縁基板10の表面積Sは、10≦S≦100(c
n)程度が実用的である。
The insulating substrate 10 is made of an insulating material formed into a plate shape with an appropriate thickness. As the insulating material, hard synthetic resin materials such as Bakelite and epoxy resin are suitable, but ceramics, silicone rubber, etc. can also be used. Further, the surface area S of the insulating substrate 10 is 10≦S≦100(c
n) degree is practical.

絶縁基板10には、その表面10aのほぼ全面に、その
板厚を貫通するようにして、多数の電極棒20.20・
・・が配設されている。電極棒20.20・・・は、縦
横方向に、所定の間隔dを保って規則的に配列して埋設
してあり、間隔dは、降雨等の水滴の1滴ないし数滴に
よって濡れる範囲内に入り得るものであればよく、約3
mmないし7mm程度が適切である。ただし、降雨等の
検出時間に遅れを生じても支障ない場合、または、遅れ
を生じさせたい場合には、間隔dをさらに大きなものと
してもよい。
The insulating substrate 10 has a large number of electrode rods 20, 20, 20, 20, 20, 20, 20, 20, 20, 20, etc. on almost the entire surface 10a of the insulating substrate 10, penetrating the board thickness.
... is installed. The electrode rods 20, 20... are regularly arranged and buried in the vertical and horizontal directions at predetermined intervals d, and the interval d is within the range where they can be wetted by one or several drops of water such as rain. As long as it can fit into the range, about 3
Approximately 7 mm to 7 mm is appropriate. However, if there is no problem even if there is a delay in the detection time of rain or the like, or if it is desired to cause a delay, the interval d may be made larger.

各電極棒20の長さは、絶縁基板10の板厚相当として
あり、したがって、絶縁基板10の表面10aと裏面1
0bとには、多数の電極棒20.20・・・の各端面部
が表出している(第1図、第2図)。
The length of each electrode rod 20 is set to correspond to the thickness of the insulating substrate 10, and therefore the front surface 10a and the back surface 1
0b, each end face portion of a large number of electrode rods 20, 20... is exposed (FIGS. 1 and 2).

電極棒20.20・・・の埋設は、あらかじめ、絶縁基
板10に穿設した小孔に水密に嵌合する径の電極棒20
.20・・・を圧入して行なうことができる。ただし、
電極棒20,20・・・は、ハンダ等の低融点の金属を
小孔内に流し込んで形成することもでき、また、流動性
の材料を型枠内で凝固させて絶縁基板10を形成する場
合には、型込めの際に、電極棒20.20・・・を埋め
込むようにしてもよいものである。さらには、電極棒2
0.20・・・は、いわゆるスルーホールメツキ技術に
よっても形成することができ、この場合は、スルーホー
ルメツキの後、小孔内に、適切な径の金属棒を打ち込む
か、溶融金属を流し込むことにより、小孔内を中実に形
成するのがよい。
When embedding the electrode rods 20, 20, etc., the electrode rods 20 have a diameter that fits watertightly into a small hole drilled in the insulating substrate 10 in advance.
.. 20... can be press-fitted. however,
The electrode rods 20, 20... can also be formed by pouring a low melting point metal such as solder into the small hole, or the insulating substrate 10 can be formed by solidifying a fluid material in a mold. In some cases, the electrode rods 20, 20, etc. may be embedded during molding. Furthermore, the electrode rod 2
0.20... can also be formed by the so-called through-hole plating technique. In this case, after through-hole plating, a metal rod of an appropriate diameter is driven into the small hole, or molten metal is poured into the small hole. Therefore, it is preferable to form the inside of the small hole solid.

電極棒20.20・・・は、絶縁基板10の裏面10b
に設けた配線パターン11によって、交互に異なる極性
に属するように結線されている(第2図)。
Electrode rods 20, 20... are attached to the back surface 10b of the insulating substrate 10.
The wiring patterns 11 provided in the wiring patterns 11 are used to connect the wires so as to belong to alternately different polarities (FIG. 2).

配線パターン11は、プリント基板を作るときと同等の
方法によって、絶縁基板10の裏面10b側に、互いに
異なる極性に属する一対の銅箔パターンlla、lla
を形成したものである。−対の銅箔パターンlla、l
laは、絶縁基板10の対角線方向に平行な列をなして
並ぶように形成し、各列の一端を、−列おきに、絶縁基
板10の対向する辺上で連結しである。このような銅箔
パターンlla、llaを介して結線された電極棒20
.20・・・は、対角線方向には共通の極性であるが、
縦横方向には、いずれも、交互に異なる極性に属するも
のとなる。なお、電極棒20゜20・・・の結線は、銅
箔パターンlla、llaに代えて、普通の線材を用い
てもよいものとする。
The wiring pattern 11 is formed by forming a pair of copper foil patterns lla and lla belonging to mutually different polarities on the back surface 10b side of the insulating substrate 10 using a method similar to that used when making a printed circuit board.
was formed. - Pair of copper foil patterns lla, l
la are formed in parallel rows in the diagonal direction of the insulating substrate 10, and one end of each row is connected on opposite sides of the insulating substrate 10 every other row. Electrode rods 20 connected through such copper foil patterns lla, lla
.. 20... has a common polarity in the diagonal direction, but
In the vertical and horizontal directions, the polarities alternately belong to different polarities. Note that for the connection of the electrode rods 20, 20, etc., ordinary wires may be used instead of the copper foil patterns lla, lla.

ヒータ30は、絶縁基板10の裏面10bに付設しであ
る(第3図)。ヒータ30は、面状ヒータが好適である
が、他の形式のヒータであってもよい。ヒータ30は、
絶縁基板10の配線パターン11を覆うようにして、絶
縁基板10の裏面10bに密着した状態となっているが
、配線パターン11、電極棒20.20・・・に対して
は、電気的に絶縁されているものとする。なお、ヒータ
30の付設は、耐熱性があり、しかも電気絶縁性に優れ
た接着剤を用いて行なうのがよいが、これは、ねじ止め
等の手段によってもよい。また、ヒータ30は、適当な
温度制御器を組み合わせて常時通電し、電極棒20.2
0・・・を所定の温度に加熱して用いるものである。
The heater 30 is attached to the back surface 10b of the insulating substrate 10 (FIG. 3). The heater 30 is preferably a planar heater, but may be another type of heater. The heater 30 is
Although it is in close contact with the back surface 10b of the insulating substrate 10 so as to cover the wiring pattern 11 of the insulating substrate 10, the wiring pattern 11 and the electrode rods 20, 20, . . . are electrically insulated. It is assumed that Note that the heater 30 is preferably attached using an adhesive that is heat resistant and has excellent electrical insulation properties, but this may also be done by means such as screwing. Further, the heater 30 is constantly energized by combining an appropriate temperature controller, and the electrode rod 20.2
0... is used by heating it to a predetermined temperature.

このような電極板は、降雨センサや降雪センサの水滴検
出用の電極板として用いることができる。
Such an electrode plate can be used as an electrode plate for detecting water droplets in a rainfall sensor or a snowfall sensor.

すなわち、水滴Wが、絶縁基板10の表面10a上に落
下して、隣り合う2本以上の電極棒20.20・・・に
跨る範囲に拡がれば、これらの電極棒20.20・・・
は、水滴Wを介して、通電可能な電気回路を構成し、電
極棒20.20・・・間の絶縁抵抗値が急減する。した
がって、配線パターン11を介して、これを検出するこ
とによって、雨や雪による水滴Wの存在を確実に検出す
ることができるものである。
That is, if a water droplet W falls onto the surface 10a of the insulating substrate 10 and spreads over two or more adjacent electrode rods 20, 20,..., these electrode rods 20, 20,...・
constitutes an electrical circuit that can conduct electricity via the water droplet W, and the insulation resistance value between the electrode rods 20, 20... decreases rapidly. Therefore, by detecting this via the wiring pattern 11, the presence of water droplets W due to rain or snow can be reliably detected.

雨や雪の降止みは、水滴Wが蒸発し、電極棒20.20
・・・間の絶縁抵抗値が元の値に復帰することによって
知ることができる。この際、ヒータ30は、水滴Wが蒸
発するのに必要な気化熱を供給するが、ヒータ30から
の熱は、絶縁基板10を貫通している電極棒20.20
・・・を介して、絶縁基板10の表面10aにまで効率
よく伝達されるので、絶縁基板10が大きな板厚を有す
るものであるときにも、ヒータ30の電力消費量を最少
限に抑えることができる。
When the rain or snow stops falling, the water droplets W evaporate and the electrode rod 20.20
This can be determined by the insulation resistance value between returning to its original value. At this time, the heater 30 supplies the vaporization heat necessary for the water droplet W to evaporate, but the heat from the heater 30 is transferred to the electrode rods 20 and 20 passing through the insulating substrate 10.
Since the power is efficiently transmitted to the surface 10a of the insulating substrate 10 through the insulating substrate 10, the power consumption of the heater 30 can be minimized even when the insulating substrate 10 has a large thickness. Can be done.

また、各電極棒20は、絶縁基板10の表面10a側に
おいては連続しておらず、その端面部が点在するのみで
あるから、この電極板は、その構造上、外部からの物理
的な力や、経年使用に対する耐久性に優れ、配線パター
ン11の断線事故等のおそれも極めて少ない。
In addition, each electrode rod 20 is not continuous on the surface 10a side of the insulating substrate 10, and its end face portions are only scattered. It has excellent strength and durability over time, and there is extremely little risk of disconnection of the wiring pattern 11.

他の実施例 絶縁基板10は、上層基板10Cと、下層基板10dと
からなる二層構造とすることができる(第4図)。電極
棒20.20・・・は、上層基板10C1下層基板10
dを貫通するとともに、配線パターン11は、上層基板
10cと下層基板10dとの間に挾み込むようにして設
けである。
Another embodiment The insulating substrate 10 may have a two-layer structure consisting of an upper layer substrate 10C and a lower layer substrate 10d (FIG. 4). Electrode rods 20, 20... are upper layer substrate 10C1 lower layer substrate 10
d, and the wiring pattern 11 is provided so as to be sandwiched between the upper layer substrate 10c and the lower layer substrate 10d.

配線パターン11を、上下方向から保護することができ
るので、断線事故等に対する信頼性を一層向上すること
ができるとともに、ヒータ30の取付けも、より簡単に
行なうことができる。
Since the wiring pattern 11 can be protected from above and below, reliability against disconnection accidents and the like can be further improved, and the heater 30 can be attached more easily.

発明の詳細 な説明したように、この発明によれば、絶縁基板に、そ
の板厚を貫通する多数の電極棒を規則的に配設し、この
電極棒に対する配線は、絶縁基板の配線パターンによっ
て、隣り合う電極棒が交互に異なる極性に属するように
結線するとともに、絶縁基板の裏面にヒータを付設する
ことによって、電極パターンは、絶縁基板の表面に、電
極棒の端面部が規則的に散在する状態となるので、断線
事故等を有効に排除し、経年故障率を大幅に低減するこ
とができるという優れた効果がある。
As described in detail, according to the present invention, a large number of electrode rods are regularly arranged on an insulating substrate, penetrating through the thickness of the insulating substrate, and the wiring for the electrode rods is arranged according to the wiring pattern of the insulating substrate. By connecting the adjacent electrode rods so that they belong to different polarities alternately and attaching a heater to the back surface of the insulating substrate, the electrode pattern is created such that the end surfaces of the electrode rods are regularly scattered on the surface of the insulating substrate. This has the excellent effect of effectively eliminating disconnection accidents and greatly reducing the failure rate over time.

また、絶縁基板を貫通している電極棒を介して、ヒータ
の熱を絶縁基板の表面側へ伝達することができるので、
ヒータの熱効率を高め、全体としての作動信頼性を著し
く向上することができるという優れた効果もある。
In addition, heat from the heater can be transferred to the surface of the insulating substrate via the electrode rod penetrating the insulating substrate.
Another advantageous effect is that the thermal efficiency of the heater can be increased and the overall operational reliability can be significantly improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は実施例を示し、第1図は一部破断
全体斜視図、第2図は配線パターンの平面説明図、第3
図は要部拡大断面説明図である。 第4図は他の実施例を示す第3図相当図である。 10・・・絶縁基板 10b・・・裏面 10C・・・上層基板 10d・・・下層基板 11・・・配線パターン 20・・・電極棒 30・・・ヒータ
Figures 1 to 3 show examples, with Figure 1 being a partially cutaway overall perspective view, Figure 2 being an explanatory plan view of the wiring pattern, and Figure 3 being an explanatory plan view of the wiring pattern.
The figure is an enlarged sectional explanatory view of the main part. FIG. 4 is a diagram corresponding to FIG. 3 showing another embodiment. 10...Insulating substrate 10b...Back surface 10C...Upper layer substrate 10d...Lower layer substrate 11...Wiring pattern 20...Electrode rod 30...Heater

Claims (1)

【特許請求の範囲】 1)絶縁基板と、該絶縁基板に規則的に配設し、該絶縁
基板を貫通する多数の電極棒と、該電極棒が交互に異な
る極性に属するように結線する配線パターンと、前記絶
縁基板の裏面に付設するヒータとからなり、前記配線パ
ターンは、前記絶縁基板の裏面に設けることを特徴とす
る水滴検出用の電極板。 2)前記絶縁基板は、上層基板と下層基板とからなり、
前記配線パターンは、前記上層基板と下層基板との間に
設けることを特徴とする特許請求の範囲第1項記載の水
滴検出用の電極板。
[Scope of Claims] 1) An insulating substrate, a large number of electrode rods regularly arranged on the insulating substrate and penetrating the insulating substrate, and wiring connected so that the electrode rods have alternately different polarities. An electrode plate for detecting water droplets, comprising a pattern and a heater attached to the back surface of the insulating substrate, the wiring pattern being provided on the back surface of the insulating substrate. 2) The insulating substrate consists of an upper layer substrate and a lower layer substrate,
2. The electrode plate for detecting water droplets according to claim 1, wherein the wiring pattern is provided between the upper layer substrate and the lower layer substrate.
JP64000212A 1988-10-11 1989-01-04 Electrode plate for detecting water droplets Expired - Fee Related JP2714835B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP64000212A JP2714835B2 (en) 1989-01-04 1989-01-04 Electrode plate for detecting water droplets
CH177989A CH679079A5 (en) 1988-10-11 1989-05-11 Snow fall detector with funnel shaped collector - has temp. detector connected to detection circuit and heated electrode plate mounted below collector detects moisture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP64000212A JP2714835B2 (en) 1989-01-04 1989-01-04 Electrode plate for detecting water droplets

Publications (2)

Publication Number Publication Date
JPH02181641A true JPH02181641A (en) 1990-07-16
JP2714835B2 JP2714835B2 (en) 1998-02-16

Family

ID=11467656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP64000212A Expired - Fee Related JP2714835B2 (en) 1988-10-11 1989-01-04 Electrode plate for detecting water droplets

Country Status (1)

Country Link
JP (1) JP2714835B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017200028A1 (en) * 2016-05-20 2017-11-23 京セラ株式会社 Sensor board and sensor device
EP3382379A4 (en) * 2015-11-25 2019-08-14 Kyocera Corporation Sensor substrate and sensor device

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216976U (en) * 1975-07-24 1977-02-05
JPS5415874A (en) * 1977-06-29 1979-02-06 Ebara Infilco Treating method to make compost
JPS5477095U (en) * 1977-11-11 1979-06-01
JPS60168054U (en) * 1984-04-16 1985-11-07 アスモ株式会社 Raindrop sensing device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5216976U (en) * 1975-07-24 1977-02-05
JPS5415874A (en) * 1977-06-29 1979-02-06 Ebara Infilco Treating method to make compost
JPS5477095U (en) * 1977-11-11 1979-06-01
JPS60168054U (en) * 1984-04-16 1985-11-07 アスモ株式会社 Raindrop sensing device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3382379A4 (en) * 2015-11-25 2019-08-14 Kyocera Corporation Sensor substrate and sensor device
US10768131B2 (en) 2015-11-25 2020-09-08 Kyocera Corporation Sensor substrate arrangement for a particulate sensor device
WO2017200028A1 (en) * 2016-05-20 2017-11-23 京セラ株式会社 Sensor board and sensor device
EP3444596A4 (en) * 2016-05-20 2019-04-10 Kyocera Corporation Sensor board and sensor device

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