JPH0217872U - - Google Patents
Info
- Publication number
- JPH0217872U JPH0217872U JP9685788U JP9685788U JPH0217872U JP H0217872 U JPH0217872 U JP H0217872U JP 9685788 U JP9685788 U JP 9685788U JP 9685788 U JP9685788 U JP 9685788U JP H0217872 U JPH0217872 U JP H0217872U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- flexible printed
- copper foil
- sides
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims 2
- 230000002950 deficient Effects 0.000 claims 2
- 230000007547 defect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9685788U JPH0217872U (he) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9685788U JPH0217872U (he) | 1988-07-20 | 1988-07-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0217872U true JPH0217872U (he) | 1990-02-06 |
Family
ID=31321985
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9685788U Pending JPH0217872U (he) | 1988-07-20 | 1988-07-20 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0217872U (he) |
-
1988
- 1988-07-20 JP JP9685788U patent/JPH0217872U/ja active Pending