JPH0217849U - - Google Patents
Info
- Publication number
- JPH0217849U JPH0217849U JP1988096282U JP9628288U JPH0217849U JP H0217849 U JPH0217849 U JP H0217849U JP 1988096282 U JP1988096282 U JP 1988096282U JP 9628288 U JP9628288 U JP 9628288U JP H0217849 U JPH0217849 U JP H0217849U
- Authority
- JP
- Japan
- Prior art keywords
- resin sealing
- semiconductor device
- sealing part
- semiconductor chip
- recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W74/10—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096282U JPH0217849U (enExample) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988096282U JPH0217849U (enExample) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217849U true JPH0217849U (enExample) | 1990-02-06 |
Family
ID=31321150
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988096282U Pending JPH0217849U (enExample) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217849U (enExample) |
-
1988
- 1988-07-19 JP JP1988096282U patent/JPH0217849U/ja active Pending